CN103642456B - For sqtructural adhesive for being buried after honeycomb panel lightweight and preparation method thereof - Google Patents
For sqtructural adhesive for being buried after honeycomb panel lightweight and preparation method thereof Download PDFInfo
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- CN103642456B CN103642456B CN201310589948.0A CN201310589948A CN103642456B CN 103642456 B CN103642456 B CN 103642456B CN 201310589948 A CN201310589948 A CN 201310589948A CN 103642456 B CN103642456 B CN 103642456B
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Abstract
The invention discloses a kind of sqtructural adhesive for being used to after honeycomb panel lightweight bury and preparation method thereof；The sqtructural adhesive includes each component of following parts by weight：80~99 parts of structure glue, 1~20 part of glass microballoon are buried after normal temperature；The glass microballoon is the glass microballoon after organic solvent pretreatment.The glass microballoon after organic solvent pretreatment can be further through coupling processing liquid impregnation；The coupling processing liquid is mixed by coupling agent and diluent；The glass microballoon, coupling agent, the weight ratio of diluent are 100: 1~10: 50~100.Compared with prior art, the present invention have the advantages that normal temperature cure, density it is low and can modulation, glue-joint strength it is high and applied widely.
Description
Technical field
The present invention relates to a kind of sqtructural adhesive, more particularly, to a kind of structure glue for being used to after honeycomb panel lightweight bury
Stick and preparation method thereof.
Background technology
Structure glue is a kind of new connecting material, has that wide application, consumption be small, fast-growth, high financial profit
The features such as, it is used widely in industry, agricultural, traffic, medical treatment, national defence, sophisticated technology and daily life.Using structure
The method that glue is attached is referred to as being glued, and because it is the connection of face border, stress distribution is uniform, in light weight, cost is low, has close
The effect of insulation is sealed, suitable for unlike material and complex configuration, so using extremely wide.
The characteristics of cementing structure maximum is high-strength light, and its intensity is all higher than any metal, and this is that aerospace industry must can not
Few performance requirement, additionally split with resistance, vibration damping, heat-insulated, sound insulation the special effects such as.In general can instead of riveting with splicing
Body weight is set to mitigate 25%, intensity improves 35% than riveting, and cost declines about 20%, connects, keeps away for face border due to being glued
Stress concentration is exempted from, its fatigue behaviour can improve more than 10 times, and decay resistance also increases substantially.
The composite relevant with splicing, should similarly have the performance of high-strength light.Honeycomb sandwich construction part is to defend
Important composite material structural member in star body construction, its cementing position is a lot, for example, between panel and reinforcing plate, end frame it
Between, the splicing between cellular sandwich and panel, cellular sandwich, and local strengthening and filled and process glue etc..
Technique is buried in order to solve the defects of pre-buried technique, on cellular board after structural detail to obtain in Satellite Product
Extremely it is widely applied.Buried due to after in technical process, after to bury number of elements huge, and secondary high-temperature solidification by cement causes honeycomb
The buckling deformation of plate, thus need to develop normal temperature cure, lightweight and glue-joint strength it is high after bury sqtructural adhesive.Now often make
Structure glue system is mainly derived from business glue series, and concrete model and characteristic are shown in Table 1.
The pattern of trade glue system of table 1
| Model | Solidification temperature (DEG C) | Apparent density (g/cm3) |
| J-145 | 125~130 | 0.45 |
| J-47 | 130 | 0.6~0.8 |
| J-78 | 90 | 0.6~0.8 |
| J-133 | Room temperature | 1.2 |
From table 1 it follows that the scope that the series structure adhesive curing temperature mainly covers is high temperature (125~130
DEG C), and buried for after and room temperature setting adhesives system J-133 is commonly used in technique, its density is higher, can not meet that the lightweight of structural slab will
Ask.In order to meet high request of the satellite of new generation in terms of scanning accuracy and image quality, and it is suitable in space temperature environment
Under conditions of complexity, the installation accuracy and stability of payload, urgent need exploitation normal temperature cure, lightweight, splicing are improved
The structure glue system of technological requirement is buried after intensity height and satisfaction.
The content of the invention
It is an object of the present invention to overcome the above-mentioned drawbacks of the prior art and provide a kind of normal temperature cure, close
Spend low and can the high sqtructural adhesive for being used to after honeycomb panel lightweight bury of modulation, glue-joint strength and preparation method thereof.
The purpose of the present invention is to be achieved through the following technical solutions：
The present invention relates to a kind of sqtructural adhesive for being used to after honeycomb panel lightweight bury, the sqtructural adhesive is included such as
The each component of lower parts by weight：
80~99 parts of structure glue is buried after normal temperature,
1~20 part of glass microballoon；
The glass microballoon is the glass microballoon after organic solvent pretreatment.
Preferably, the organic solvent includes ethanol, acetone or ether.
Preferably, the glass microballoon after organic solvent pretreatment is further through coupling processing liquid impregnation；Institute
Coupling processing liquid is stated to be mixed by coupling agent and diluent；The glass microballoon, coupling agent, the weight ratio of diluent are 100:
1~10: 50~100.
Preferably, the coupling agent be silane coupler (such as：KH550, KH560 or KH570), titante coupling agent or
Aluminate coupling agent.
Preferably, the diluent includes glycerine, ethanol or ether.
Preferably, the glass microballoon is that density is 0.1g/cm3~0.5g/cm3Hollow glass micropearl.
Preferably, the density that structure glue is buried after the normal temperature is more than or equal to 1.2g/cm3。
The invention further relates to a kind of preparation method of the above-mentioned sqtructural adhesive for being used to after honeycomb panel lightweight bury, bag
Include following steps：
A, glass microballoon is placed in impregnation in organic solvent, is cooled to less than 40 DEG C after taking out drying, hermetically drying
Preserve；
B, knot is buried after the glass microballoon substep obtained by the step A of 1~20 parts by weight being added into the normal temperature of 80~99 parts by weight
In structure glue, 1~60s is stirred rapidly, produces the sqtructural adhesive for being used to after honeycomb panel lightweight bury.
Preferably, in step A, the hermetically drying also comprises the following steps after preserving：By the coupling agent of 1~10 parts by weight
Coupling processing liquid is mixed to form with the diluent of 50~100 parts by weight；The glass microballoon for taking the hermetically drying of 100 parts by weight to preserve
Substep is added in the coupling processing liquid, is stirred, and impregnates 20~120min, takes out drying.
Preferably, the substep in step A, B, which adds, is specially：Each addition is up to the 1/2 of surplus, until
When surplus is up to the 1/10 of total amount, all add.
Compared with prior art, the present invention has advantages below：
(1) structure glue is buried after this, and relative to being buried after existing unmodified business, glue density is lower (to be less than 1.2g/cm3)；
(2) it is flexibly adjustable within the specific limits that structure glue density is buried after this；
(3) structure glue is buried after this can be in normal temperature cure；
(4) it is higher relative to glue glue-joint strength is buried after existing unmodified business that structure glue is buried after this；
(5) to bury structure glue after this applied widely.
Embodiment
With reference to specific embodiment, the present invention is described in detail.Following examples will be helpful to the technology of this area
Personnel further understand the present invention, but the invention is not limited in any way.It should be pointed out that the ordinary skill to this area
For personnel, without departing from the inventive concept of the premise, various modifications and improvements can be made.These belong to the present invention
Protection domain.
Embodiment 1
The present embodiment is related to a kind of sqtructural adhesive for burying after being used for satellite cellular structural slab lightweight, the adhesive include with
Lower component and content：Glue 49.5g (density 1.2g/cm are buried after business3), hollow glass micropearl 0.5g (density 0.2g/cm3)。
The preparation method that glue is buried after above-mentioned comprises the following steps：
(1) 20g glass microballoons are put into beaker, pour into 100ml acetone and be impregnated with it completely, placed 5 minutes.By glass
Microballon takes out to be put into stainless steel disc and spread out from beaker.Baking oven is gone straight up to 110 DEG C, glass microballoon is put into baking oven and dries 2h；
Dress plastic bag sealing preserves after cooling to less than 40 DEG C with the furnace.
(2) glue each component will be buried after 49.5g business to be put into container and be stirred；
(3) after mixing, it is kept stirring for glass microballoon after 0.5g is handled and is quickly poured into container, and stir rapidly, stirs
60s will be less than by mixing the time；
(4) it is to be mixed uniformly after, produce product.
It is 0.88g/cm to be modified by this method and bury glue density after preparing3, the adhesive that is measured using GB7124-1986
Tensile shear strength is 29.1MPa.
The density that glue is buried after business is 1.2g/cm3, the tensile shear of glue is buried after the business measured using GB7124-1986
Intensity is 34.5MPa.
It can be seen that being buried after being prepared using the present invention, glue density is lower, and tensile shear strength is slightly less than business adhesive, but still
Index (>=25MPa) the requirement that technique buries glue tensile shear strength to after is buried after satellite structure part can be met.
Embodiment 2
The present embodiment is related to a kind of sqtructural adhesive for burying after being used for satellite cellular structural slab lightweight, the adhesive include with
Lower component and content：Glue 49.5g (density 1.2g/cm are buried after business3), hollow glass micropearl 0.5g (density 0.2g/cm3)。
The preparation method that glue is buried after above-mentioned comprises the following steps：
(1) 20g glass microballoons are put into beaker, pour into 100ml acetone and be impregnated with it completely, placed 5 minutes.By glass
Microballon takes out to be put into stainless steel disc and spread out from beaker.Baking oven is gone straight up to 110 DEG C, glass microballoon is put into baking oven and dries 2h；
Dress plastic bag sealing preserves after cooling to less than 40 DEG C with the furnace.
(2) by the addition of 20g glass microballoons substep, (each addition is up to the 1/2 of remaining microballon, until surplus is most
For total amount 1/10 when, all add) in 0.2gKH550,16g alcohol mixeding liquid (now, three's weight ratio is 100: 1: 80),
Stir while adding, 20~120min is placed after stirring.
(3) glass microballoon is taken out and divided in stainless steel disc, be put into baking oven, go straight up to 110 DEG C, 110 DEG C of dry 3h, with
Dress plastic bag sealing is put into sealing container after preserving and to place drier after stove cools down less than 40 DEG C.
(4) glue each component will be buried after 49.5g business to be put into container and be stirred；After mixing, be kept stirring for by
The modified glass microballoons of 0.5g are quickly poured into container, and are stirred rapidly, and mixing time will be less than 60s；
(5) it is to be mixed uniformly after, produce product.
It is 0.83g/cm to be modified by this method and bury glue density after preparing3, the adhesive that is measured using GB7124-1986
Tensile shear strength is 34.4MPa.
The density that glue is buried after business is 1.2g/cm3, the tensile shear of glue is buried after the business measured using GB7124-1986
Intensity is 34.5MPa.
It can be seen that glue tensile shear strength is buried after being prepared using silane coupler modified glass microballoon relatively using unmodified
Glass microballoon prepare after bury glue and be significantly increased, and reached the tensile shear strength that glue is buried after business.
Embodiment 3
The present embodiment is related to a kind of sqtructural adhesive for burying after being used for satellite cellular structural slab lightweight, the adhesive include with
Lower component and content：Glue 4.0g (density 1.2g/cm are buried after business3), hollow glass micropearl 1.0g (density 0.5g/cm3)。
The preparation method that glue is buried after above-mentioned comprises the following steps：
(1) 20g glass microballoons are put into beaker, pour into 100ml ethanol and be impregnated with it completely, placed 5 minutes.By glass
Microballon takes out to be put into stainless steel disc and spread out from beaker.Baking oven is gone straight up to 110 DEG C, glass microballoon is put into baking oven and dries 2h；
Dress plastic bag sealing preserves after cooling to less than 40 DEG C with the furnace.
(2) by the addition of 20g glass microballoons substep, (each addition is up to the 1/2 of remaining microballon, until surplus is most
For total amount 1/10 when, all add) 0.2g titante coupling agents, in 16g ether mixed liquors, stir while adding, stir
20~120min is placed after uniformly.
(3) glass microballoon is taken out and divided in stainless steel disc, be put into baking oven, go straight up to 110 DEG C, 110 DEG C of dry 3h, with
Dress plastic bag sealing is put into sealing container after preserving and to place drier after stove cools down less than 40 DEG C.
(4) glue each component will be buried after 4.5g business to be put into container and be stirred；After mixing, it is kept stirring for 0.5g
Modified glass microballoon is quickly poured into container, and is stirred rapidly, and mixing time will be less than 60s；
(5) it is to be mixed uniformly after, produce product.
It is 0.81g/cm to be modified by this method and bury glue density after preparing3, the adhesive that is measured using GB7124-1986
Tensile shear strength is 28.5MPa.
The density that glue is buried after business is 1.2g/cm3, the tensile shear of glue is buried after the business measured using GB7124-1986
Intensity is 34.5MPa.
The stretching of glue is buried after business cut it can be seen that burying glue after being prepared using silane coupler modified glass microballoon and having reached
Shearing stress.
Embodiment 4
The present embodiment is related to a kind of sqtructural adhesive for burying after being used for satellite cellular structural slab lightweight, the adhesive include with
Lower component and content：Glue 47.5g (density 1.2g/cm are buried after business3), hollow glass micropearl 2.5g (density 0.1g/cm3)。
The preparation method that glue is buried after above-mentioned comprises the following steps：
(1) 20g glass microballoons are put into beaker, pour into 100ml acetone and be impregnated with it completely, placed 5 minutes.By glass
Microballon takes out to be put into stainless steel disc and spread out from beaker.Baking oven is gone straight up to 110 DEG C, glass microballoon is put into baking oven and dries 2h；
Dress plastic bag sealing preserves after cooling to less than 40 DEG C with the furnace.
(2) by the addition of 20g glass microballoons substep, (each addition is up to the 1/2 of remaining microballon, until surplus is most
For total amount 1/10 when, all add) in 0.2gKH550,16g alcohol mixeding liquid, stir while adding, placed after stirring
20~120min.
(3) glass microballoon is taken out and divided in stainless steel disc, be put into baking oven, go straight up to 110 DEG C, 110 DEG C of dry 3h, with
Dress plastic bag sealing is put into sealing container after preserving and to place drier after stove cools down less than 40 DEG C.
(4) glue each component will be buried after 47.5g business to be put into container and be stirred；After mixing, be kept stirring for by
The modified glass microballoons of 2.5g are quickly poured into container, and are stirred rapidly, and mixing time will be less than 60s；
(5) it is to be mixed uniformly after, produce product.
It is 0.72g/cm to be modified by this method and bury glue density after preparing3, the adhesive that is measured using GB7124-1986
Tensile shear strength is 30.6MPa.
The density that glue is buried after business is 1.2g/cm3, the tensile shear of glue is buried after the business measured using GB7124-1986
Intensity is 34.5MPa.
It can be seen that using the present invention prepare after bury glue density can modulation, after bury glue tensile shear strength can still meet will
Ask.
The specific embodiment of the present invention is described above.It is to be appreciated that the invention is not limited in above-mentioned
Particular implementation, those skilled in the art can make various deformations or amendments within the scope of the claims, this not shadow
Ring the substantive content of the present invention.
Claims (5)
- A kind of 1. preparation method for the sqtructural adhesive for being used to after honeycomb panel lightweight bury, it is characterised in that the structure glue Stick includes each component of following parts by weight：80~99 parts of structure glue is buried after normal temperature,1~20 part of glass microballoon；The glass microballoon is the glass microballoon after organic solvent pretreatment；The organic solvent includes ethanol, acetone or second Ether；Methods described comprises the following steps：A, glass microballoon is placed in impregnation in organic solvent, is cooled to less than 40 DEG C after taking out drying, hermetically drying preserves；B, structure glue is buried after the glass microballoon substep obtained by the step A of 1~20 parts by weight being added into the normal temperature of 80~99 parts by weight In, 1~60s is stirred rapidly, produces the sqtructural adhesive for being used to after honeycomb panel lightweight bury；The glass microballoon is that density is 0.1g/cm3~0.5g/cm3Hollow glass micropearl；Structure glue is buried after the normal temperature Density is more than or equal to 1.2g/cm3。
- 2. being used for after honeycomb panel lightweight the preparation method of sqtructural adhesive buried as claimed in claim 1, its feature exists In the substep in step A, B, which adds, is specially：Each addition is up to the 1/2 of surplus, until surplus is up to Total amount 1/10 when, all add.
- 3. being used for after honeycomb panel lightweight the preparation method of sqtructural adhesive buried as claimed in claim 1, its feature exists In the glass microballoon after organic solvent pretreatment is further through coupling processing liquid impregnation；The coupling processing liquid Mixed by coupling agent and diluent；The glass microballoon, coupling agent, the weight ratio of diluent for 100: 1~10: 50~ 100。
- 4. being used for after honeycomb panel lightweight the preparation method of sqtructural adhesive buried as claimed in claim 3, its feature exists In the coupling agent is silane coupler, titante coupling agent or aluminate coupling agent.
- 5. being used for after honeycomb panel lightweight the preparation method of sqtructural adhesive buried as claimed in claim 3, its feature exists In the diluent includes glycerine, ethanol or ether.
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201310589948.0A CN103642456B (en) | 2013-11-20 | 2013-11-20 | For sqtructural adhesive for being buried after honeycomb panel lightweight and preparation method thereof |
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| Application Number | Priority Date | Filing Date | Title |
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| CN201310589948.0A CN103642456B (en) | 2013-11-20 | 2013-11-20 | For sqtructural adhesive for being buried after honeycomb panel lightweight and preparation method thereof |
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| CN103642456A CN103642456A (en) | 2014-03-19 |
| CN103642456B true CN103642456B (en) | 2018-02-16 |
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Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1332208A (en) * | 2001-08-28 | 2002-01-23 | 北京空心微珠技术发展中心 | Hollow microsphere composite material and preparation method thereof |
| CN1468165A (en) * | 2000-08-08 | 2004-01-14 | 莫尔德特有限公司 | Composite material with microsphere particles |
-
2013
- 2013-11-20 CN CN201310589948.0A patent/CN103642456B/en active Active
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1468165A (en) * | 2000-08-08 | 2004-01-14 | 莫尔德特有限公司 | Composite material with microsphere particles |
| CN1332208A (en) * | 2001-08-28 | 2002-01-23 | 北京空心微珠技术发展中心 | Hollow microsphere composite material and preparation method thereof |
Non-Patent Citations (1)
| Title |
|---|
| J-153室温固化低粘度灌注结构胶粘剂;付刚等;《CHINA ADHESIVES》;19991231;第8卷(第2期);摘要 * |
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| CN103642456A (en) | 2014-03-19 |
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