CN103633234A - LED (light emitting diode) package structure and method - Google Patents
LED (light emitting diode) package structure and method Download PDFInfo
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- CN103633234A CN103633234A CN201310698456.5A CN201310698456A CN103633234A CN 103633234 A CN103633234 A CN 103633234A CN 201310698456 A CN201310698456 A CN 201310698456A CN 103633234 A CN103633234 A CN 103633234A
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- 238000000034 method Methods 0.000 title claims description 22
- 239000000463 material Substances 0.000 claims abstract description 104
- 239000003292 glue Substances 0.000 claims abstract description 9
- 238000004806 packaging method and process Methods 0.000 claims description 65
- 238000012856 packing Methods 0.000 claims description 11
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims description 3
- 239000000853 adhesive Substances 0.000 claims description 3
- 238000004026 adhesive bonding Methods 0.000 claims description 3
- 230000001070 adhesive effect Effects 0.000 claims description 3
- 239000000203 mixture Substances 0.000 claims description 3
- 239000000741 silica gel Substances 0.000 claims description 3
- 229910002027 silica gel Inorganic materials 0.000 claims description 3
- 230000015572 biosynthetic process Effects 0.000 claims description 2
- 230000003287 optical effect Effects 0.000 abstract description 5
- 239000000843 powder Substances 0.000 abstract description 4
- 238000004519 manufacturing process Methods 0.000 description 6
- 239000004065 semiconductor Substances 0.000 description 5
- 238000010586 diagram Methods 0.000 description 3
- 238000005516 engineering process Methods 0.000 description 3
- 238000012986 modification Methods 0.000 description 3
- 230000004048 modification Effects 0.000 description 3
- 239000011049 pearl Substances 0.000 description 3
- 239000011248 coating agent Substances 0.000 description 2
- 238000000576 coating method Methods 0.000 description 2
- 239000012141 concentrate Substances 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 238000005538 encapsulation Methods 0.000 description 2
- 238000005215 recombination Methods 0.000 description 2
- 206010021033 Hypomenorrhoea Diseases 0.000 description 1
- 241000276425 Xiphophorus maculatus Species 0.000 description 1
- 230000003321 amplification Effects 0.000 description 1
- 238000013459 approach Methods 0.000 description 1
- 230000005540 biological transmission Effects 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 238000013461 design Methods 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- 239000002360 explosive Substances 0.000 description 1
- 238000003199 nucleic acid amplification method Methods 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/62—Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/50—Wavelength conversion elements
- H01L33/501—Wavelength conversion elements characterised by the materials, e.g. binder
- H01L33/502—Wavelength conversion materials
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- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Led Device Packages (AREA)
Abstract
The invention provides an LED (light emitting diode) package structure. The LED package structure comprises a base material, at least one LED chip, a first bonding wire, a second bonding wire, package glue and a lens, wherein the base material is provided with at least one groove, the depth of each groove is greater than the thickness of each chip, and the size of each groove is greater than or equal to that of each chip; the LED chips are correspondently arranged inside the grooves one by one; an anode of the chip is electrically connected with the base material through the first bonding wire, and a junction point between the first bonding wire and the base material is arranged outside the groove; a cathode of the chip is electrically connected with the base material through the second bonding wire, and a junction point between the second bonding wire and the base material is arranged outside the groove; the package glue is filled in each groove, and covers the surface, away from the bottom of the groove, of each chip, and is internally provided with fluorescent powder; the lens is arranged on the base material, and the package glue, the first bonding wire and the second bonding wire are coated with the lens. According to the LED package structure, the package glue only covers the chip and incompletely covers the bonding wires, so that the optical path difference of light rays is identical or similar, the problem that the light color is non-uniform can be solved, and the consumption of the fluorescent powder can be reduced.
Description
Technical field
The present invention relates to LED lighting technical field, more particularly, relate to a kind of LED encapsulating structure and method for packing.
Background technology
LED(Light-Emitting Diode, light-emitting diode) be a kind of semiconductor device that can be directly luminous energy by electric energy conversion, there is the plurality of advantages such as power consumption is little, brightness is high, the life-span is long, be the study hotspot of lighting field, be widely used in light source and the lighting device of large-scale billboard, traffic lights, mobile phone, scanner, facsimile machine etc.
As shown in Figure 1, conventional LED encapsulating structure comprises: base material 100, has two electrodes on this base material 100; Be arranged at the lip-deep LED chip 101 of base material 100; The first bonding wire 102 that connects the anode of LED chip 101 and an electrode on base material 100 be connected the negative electrode of LED chip 101 and the second bonding wire 103 of another electrode on base material 100; The packaging plastic 104 of coated LED chip 101, the first bonding wire 102 and the second bonding wire 103, this packaging plastic 104 mixes for glue and fluorescent material.
Because two bonding wires are positioned at the two ends that LED chip is relative, the packaging plastic that contains fluorescent material need all be coated bonding wire and LED chip, this causes the light of exporting directly over LED chip surface in encapsulating structure different from the optical path difference of the light of the two ends output at bonding wire place, therefore the color of luminous rear LED chip top is different from the two ends color at bonding wire place, causes the problem of glow color inequality.As: LED encapsulating structure adopts blue led chip to excite yellow fluorescent powder with output white light conventionally, but the glow color at its two ends can be partially yellow.
Summary of the invention
The invention provides a kind of LED encapsulating structure and method for packing, to solve the problem of LED encapsulating structure glow color inequality.
For achieving the above object, the invention provides following technical scheme:
A kind of LED encapsulating structure, comprise: base material, described base material has at least one groove, and the degree of depth of described groove is greater than the thickness of LED chip, and described groove is more than or equal to described LED chip in the size perpendicular on self thickness direction in the size perpendicular on self depth direction; Be arranged at one to one at least one LED chip in described groove; Be electrically connected to the anode of described LED chip and the first bonding wire of described base material, the tie point of described the first bonding wire and described base material is positioned at the outside of described groove; Be electrically connected to the negative electrode of described LED chip and the second bonding wire of described base material, the tie point of described the second bonding wire and described base material is all positioned at the outside of described groove; Be filled in the packaging plastic in described groove, described packaging plastic covers the surface that described LED chip deviates from described bottom portion of groove, and has fluorescent material in described packaging plastic; Be arranged at the lens on described base material, described lens are coated described packaging plastic, described the first bonding wire and described the second bonding wire.
Preferably, the scope of the difference of the degree of depth of described groove and the thickness of described LED chip is: 0.2mm～0.5mm.
Preferably, described groove the size perpendicular on self depth direction and described LED chip the size perpendicular on self thickness direction difference be less than or equal to 0.1mm * 0.1mm.
Preferably, described base material is structure as a whole.
Preferably, described base material comprises: the first of plane tabular structure; The second portion with at least one opening, described opening penetrates described second portion, the thickness of described second portion is greater than the thickness of described LED chip, and the size of described opening on the thickness direction perpendicular to described second portion is more than or equal to described LED chip in the size perpendicular on self thickness direction; For the adhesive linkage of bonding described first and described second portion, described first and described second portion formation have the structure of groove described at least one.
Preferably, when described groove is while being a plurality of, described groove is uniformly distributed on described base material.
Preferably, described packaging plastic is the mixture of fluorescent material and glue.
Preferably, described lens are planar lens or toroidal lens.
Preferably, the material of described lens is silica gel.
The present invention also provides a kind of LED method for packing, comprise: base material is provided, described base material has at least one groove, the degree of depth of described groove is greater than the thickness of LED chip to be packaged, and described groove is more than or equal to described LED chip in the size perpendicular on self thickness direction in the size perpendicular on self depth direction; LED chip described at least one is arranged in described groove one to one; Utilize the first bonding wire to be electrically connected to anode and the described base material of described LED chip, utilize the second bonding wire to be electrically connected to negative electrode and the described base material of described LED chip, the tie point of the tie point of described the first bonding wire and described base material and described the second bonding wire and described base material is all positioned at the outside of described groove; In described groove, fill packaging plastic, make described packaging plastic cover the surface that described LED chip deviates from described bottom portion of groove, in described packaging plastic, there is fluorescent material; On described base material, lens are set, make described lens be coated described packaging plastic, described the first bonding wire and described the second bonding wire.
Preferably, describedly in described groove, fill packaging plastic and be specially: adopt gluing process to fill packaging plastic in described groove.
Preferably, describedly on described base material, lens are set and are specially: adopt stamping technique, on described base material, lens are set.
Compared with prior art, technical scheme provided by the present invention at least has the following advantages:
LED encapsulating structure provided by the present invention and method for packing, on base material, there is groove, the degree of depth of groove is greater than the thickness of LED chip, size is not less than the size of LED chip, LED chip is positioned at groove, the tie point of bonding wire and base material is all positioned at outside groove, is filled with packaging plastic in groove, and lens are all coated bonding wire and packaging plastic.In said structure, packaging plastic is coated LED chip only, and not exclusively coated bonding wire, be that packaging plastic major part all covers the surface that LED chip deviates from bottom portion of groove, can't distance L ED chip far away especially, thereby after making LED encapsulating structure luminous, the optical path difference of light is identical or close, improved the problem of LED encapsulating structure glow color inequality everywhere.
And packaging plastic does not need to be all coated bonding wire in the LED encapsulating structure that this provides, therefore the consumption with respect to prior art fluorescent material reduces, thereby has saved production cost.
Accompanying drawing explanation
In order to be illustrated more clearly in the embodiment of the present invention or technical scheme of the prior art, to the accompanying drawing of required use in embodiment or description of the Prior Art be briefly described below, apparently, accompanying drawing in the following describes is only some embodiments of the present invention, for those of ordinary skills, do not paying under the prerequisite of creative work, can also obtain according to these accompanying drawings other accompanying drawing.
Fig. 1 is the profile of LED encapsulating structure in prior art;
The stereogram of the LED encapsulating structure that Fig. 2 provides for the embodiment of the present invention one;
The explosive view of the base material of the LED encapsulating structure that Fig. 3 provides for the embodiment of the present invention one;
The process sequence diagram of the LED method for packing that Fig. 4～Fig. 7 provides for the embodiment of the present invention two.
Embodiment
For above-mentioned purpose of the present invention, feature and advantage can be become apparent more, below in conjunction with accompanying drawing, the specific embodiment of the present invention is described in detail.
A lot of details have been set forth in the following description so that fully understand the present invention, but the present invention can also adopt other to be different from alternate manner described here and implement, those skilled in the art can do similar popularization without prejudice to intension of the present invention in the situation that, so the present invention is not subject to the restriction of following public specific embodiment.
Secondly, the present invention is described in detail in conjunction with schematic diagram, when the embodiment of the present invention is described in detail in detail; for ease of explanation; the profile that represents device architecture can be disobeyed general ratio and be done local amplification, and described schematic diagram is example, and it should not limit the scope of protection of the invention at this.The three-dimensional space that should comprise in addition, length, width and the degree of depth in actual fabrication.
Embodiment mono-
The present embodiment provides a kind of LED encapsulating structure, as shown in Figure 2, comprising: base material 200, LED chip 201, the first bonding wire 202, the second bonding wire 203, packaging plastic 204 and lens 205.
Wherein, have at least one groove on base material 200, the degree of depth of groove is greater than the thickness of LED chip 201, and groove is more than or equal to LED chip 201 in the size perpendicular on self thickness direction in the size perpendicular on self depth direction; LED chip 201 is at least one, and arranges one to one with groove; The first bonding wire 202 is electrically connected to anode and the base material 200 of LED chip 201, and the tie point of the first bonding wire 202 and base material 200 is positioned at the outside of groove; The second bonding wire 203 is electrically connected to negative electrode and the base material 200 of LED chip 201, and the tie point of the second bonding wire 203 and base material 200 is positioned at the outside of groove; Packaging plastic 204 is filled in groove, and packaging plastic 204 covers LED chip 201 and deviates from the surface of bottom portion of groove, and has fluorescent material in packaging plastic 204; Lens 205 are arranged on base material 200, and coated packaging plastic 204, described the first bonding wire 202 and the second bonding wire 203.
It should be noted that, LED chip 201 is comprised of two parts, and one end is the prevailing P type semiconductor in hole, and the other end is the prevailing N type semiconductor of electronics.When these two kinds of semiconductors couple together, between the two, form a PN junction, when electric current acts on this chip by bonding wire (i.e. the first bonding wire 202 and the second bonding wire 203), electrons is pushed to P type semiconductor region, with hole-recombination, can be with the form of photon when electronics and hole-recombination outside emittance, thereby make LED chip luminous.
In addition, packaging plastic 204 contains fluorescent material, is preferably the mixture of fluorescent material and glue.LED chip 201 outside radiant light period of the day from 11 p.m. to 1 a.m under the effect of voltage, can excitated fluorescent powder, the final synthetic light that needs color, therefore, the color of fluorescent material need with the matching of LED chip 201.
In prior art, when LED chip needs are luminous, to apply voltage to negative electrode and the anode of chip, therefore need to utilize bonding wire that the negative electrode of chip and anode are electrically connected to the electrode on base material respectively, and during packaging LED chips, need again LED chip and bonding wire to be all coated, packaging plastic distance L ED chip distant that this just causes coated bonding wire after encapsulation, causes the problem of encapsulating structure non-uniform light.
The LED encapsulating structure that the present embodiment provides, avoid utilizing packaging plastic all coated bonding wire and LED chip, but utilize packaging plastic 204 only LED chip to be coated, the first bonding wire 202 only has the sub-fraction being connected with chip in packaging plastic 204 with the second bonding wire 203, all the other major parts are positioned at outside packaging plastic 204, then utilize lens 205 that the bonding wire and the packaging plastic that are exposed to outside packaging plastic 204 are together coated, realized the encapsulation of LED chip.
Realization for said structure, in the present embodiment, utilize the reeded base material of tool, LED chip 201 is placed in groove, then connect bonding wire, and the tie point of bonding wire and base material 200 is positioned at outside groove, in groove, fill afterwards packaging plastic 204, thereby realized packaging plastic 204, be only coated the sub-fraction of LED chip 201 and bonding wire, the structure of the major part of bonding wire outside packaging plastic 204.
In the encapsulating structure of the LED that the present embodiment provides, packaging plastic 204 is not whole coating chips and bonding wire, therefore there is not the fluorescent material far away apart from chip (packaging plastic 204 contains fluorescent material), packaging plastic 204 major parts all concentrate on LED chip surface (surface that deviates from bottom portion of groove) towards the outside, thereby when luminous, the optical path difference of light is consistent or approach everywhere, fabulous improvement the inhomogeneous problem of glow color that exists of LED encapsulating structure; And, because packaging plastic 204 is without all coated bonding wire, major part concentrates on surrounding's (especially deviating from the surface of bottom portion of groove) of LED chip 201, has therefore saved the consumption of packaging plastic, save the consumption of fluorescent material, thereby reduced production cost.
In the present embodiment, the packaging plastic 204 of filling is all positioned at groove, packaging plastic 204 needs to cover the surface of LED chip 201, therefore, the degree of depth of groove is greater than the thickness of LED chip 204, the degree that depth of groove is larger than the thickness of LED chip 204 needs according to being that actual needs is set, and provides a preferable range: the scope of the difference of the thickness of the degree of depth of groove and LED chip 201 can be 0.2mm～0.5mm, comprises endpoint value at this.
In order to make to cover lip-deep packaging plastic 204 that LED chip 201 deviates from bottom portion of groove, to account for the ratio of overall package glue amount higher, further reduce the packaging plastic that covers LED chip 201 sides, in the present embodiment, groove preferably equals LED chip 201 in the size perpendicular on self thickness direction in the size perpendicular on self depth direction.Consider the precision of production equipment and the feasibility problem of production, groove can be slightly larger than LED chip 201, if but groove is too large, can affect the present embodiment and improve luminous effect, therefore groove is unsuitable excessive, the concrete size of groove can be when producing the size of LED chip 201, according to actual conditions, design.The present embodiment provides a preferred upper limit: groove the size perpendicular on self depth direction and LED chip 201 the size perpendicular on self thickness direction difference can be less than or equal to 0.1mm * 0.1mm, comprise endpoint value.
It should be noted that, the present embodiment only be take square LED chip and is described as example, based on inventive concept of the present invention, technical solution of the present invention is applicable to difform LED chip, the shape of groove preferably should be identical with the shape of LED chip, and its size should be slightly larger than or equal the size of LED chip.
The reeded base material of tool adopting in the present embodiment can be structure as a whole, and also can be Split type structure.
As shown in Figure 3, when being Split type structure, base material can comprise: the first 301 of plane tabular structure; The second portion 302 with at least one opening 303, opening 303 penetrates second portion 302, the thickness of second portion 302 is greater than the thickness of LED chip, and the size of opening 303 on the thickness direction perpendicular to second portion 302 is more than or equal to LED chip in the size perpendicular on self thickness direction; For the adhesive linkage (not shown) of bonding first 301 and second portion 302, first 301 and second portion 302 form the structure with groove described at least one.
The light ratio that single led lamp pearl sends is fainter, when reality is used, is therefore generally that a plurality of LED lamp pearls are used in combination.While needing to encapsulate a plurality of LED chip on a base material, need corresponding a plurality of grooves with similar number on base material, groove preferably can be uniformly distributed on base material.
On base material, also need to arrange at least two electrodes, for the first bonding wire 202, connect the anode of LED chip 201 and an electrode on base material, and connect the negative electrode of LED chip 201 and another electrode on base material for the second bonding wire 203.
The LED encapsulating structure that the present embodiment provides does not limit the shape of lens 205, and lens 205 can be planar lens or toroidal lens etc.The material of lens 205 need be selected the material of light transmission and good insulating, is preferably silica gel.
Embodiment bis-
The LED encapsulating structure providing for embodiment mono-, the present embodiment provides a kind of LED method for packing, and with the example that is encapsulated as of single LED lamp pearl, as shown in Figure 4 to 7, the method comprises:
Step S1: base material 400 is provided, this base material 400 has at least one groove 4001, the degree of depth of groove 4001 is greater than the thickness of LED chip to be packaged, and groove 4001 is more than or equal to LED chip in the size perpendicular on self thickness direction in the size perpendicular on self depth direction;
The base material 400 of said structure can be structure as a whole, and also can be combined into for two boards material.As shown in Figure 4, base material 400 can be had by first 4002 monoblock, platy structure and that the second portion 4003 of opening is bonding to be formed, and wherein, the opening on second portion 4003 preferably can adopt etching technics to form.
The shape of groove 4001 preferably can be identical with the shape of LED chip to be packaged, and the size of groove 4001 preferably can or be slightly larger than the size of LED chip to be packaged with the measure-alike of LED chip to be packaged.
Step S2: at least one LED chip 501 is arranged in groove one to one;
Step S3: utilize the first bonding wire 502 to be electrically connected to anode and the base material 400 of LED chip 501, utilize the negative electrode of the second bonding wire 503 electrical connection LED chips 501 and the tie point of base material 400, the first bonding wires 501 and base material 400 and the second bonding wire 503 and the tie point of base material 400 to be all positioned at the outside of groove;
While connecting the first bonding wire 502 and the second bonding wire 503, preferably adopt solder technology.
Step S4: fill packaging plastic 601 in groove, make packaging plastic 601 cover LED chip 501 and deviate from the surface of bottom portion of groove, there is fluorescent material in packaging plastic 601;
Fill packaging plastic 601 and can adopt gluing process, also can adopt printing or fill with the techniques such as mould.
Step S5: lens 701 are set on base material 400, make lens 701 coated packaging plastic 601, the first bonding wire 502 and the second bonding wire 503.
Lens 701 are set and preferably can adopt stamping technique, the shape of lens 701 can be selected according to different application, can be planar lens, also can be toroidal lens etc.
The formed LED encapsulating structure of above-mentioned LED method for packing, avoided in prior art for bonding wire is all coated, and make the packaging plastic distance L ED chip problem excessively far away of coated bonding wire, make the packaging plastic with fluorescent material only be coated the bonding wire of LED chip and small part, and the bonding wire at incomplete coating chip two ends, the overwhelming majority is positioned at the surface of LED chip, thereby while making encapsulating structure luminous, the optical path difference of light is identical or close, has improved the uniformity of glow color; Because packaging plastic is without coated bonding wire, so the consumption of packaging plastic reduces compared with prior art, and the consumption of fluorescent material reduces, thereby has saved to a certain extent production cost.
Although the present invention discloses as above with preferred embodiment, yet not in order to limit the present invention.Any those of ordinary skill in the art, do not departing from technical solution of the present invention scope situation, all can utilize method and the technology contents of above-mentioned announcement to make many possible changes and modification to technical solution of the present invention, or be revised as the equivalent embodiment of equivalent variations.Therefore, every content that does not depart from technical solution of the present invention,, all still belongs in the scope of technical solution of the present invention protection any simple modification made for any of the above embodiments, equivalent variations and modification according to technical spirit of the present invention.
Claims (12)
1. a LED encapsulating structure, is characterized in that, comprising:
Base material, described base material has at least one groove, and the degree of depth of described groove is greater than the thickness of LED chip, and described groove is more than or equal to described LED chip in the size perpendicular on self thickness direction in the size perpendicular on self depth direction;
Be arranged at one to one at least one LED chip in described groove;
Be electrically connected to the anode of described LED chip and the first bonding wire of described base material, the tie point of described the first bonding wire and described base material is positioned at the outside of described groove;
Be electrically connected to the negative electrode of described LED chip and the second bonding wire of described base material, the tie point of described the second bonding wire and described base material is all positioned at the outside of described groove;
Be filled in the packaging plastic in described groove, described packaging plastic covers the surface that described LED chip deviates from described bottom portion of groove, and has fluorescent material in described packaging plastic;
Be arranged at the lens on described base material, described lens are coated described packaging plastic, described the first bonding wire and described the second bonding wire.
2. LED encapsulating structure according to claim 1, is characterized in that, the scope of the difference of the degree of depth of described groove and the thickness of described LED chip is: 0.2mm～0.5mm.
3. LED encapsulating structure according to claim 1, is characterized in that, described groove is less than or equal to 0.1mm * 0.1mm at the size perpendicular on self depth direction and described LED chip in the difference of the size perpendicular on self thickness direction.
4. LED encapsulating structure according to claim 1, is characterized in that, described base material is structure as a whole.
5. LED encapsulating structure according to claim 1, is characterized in that, described base material comprises:
The first of plane tabular structure;
The second portion with at least one opening, described opening penetrates described second portion, the thickness of described second portion is greater than the thickness of described LED chip, and the size of described opening on the thickness direction perpendicular to described second portion is more than or equal to described LED chip in the size perpendicular on self thickness direction;
For the adhesive linkage of bonding described first and described second portion, described first and described second portion formation have the structure of groove described at least one.
6. according to the LED encapsulating structure described in claim 4 or 5, it is characterized in that, when described groove is while being a plurality of, described groove is uniformly distributed on described base material.
7. LED encapsulating structure according to claim 1, is characterized in that, described packaging plastic is the mixture of fluorescent material and glue.
8. LED encapsulating structure according to claim 1, is characterized in that, described lens are planar lens or toroidal lens.
9. LED encapsulating structure according to claim 1, is characterized in that, the material of described lens is silica gel.
10. a LED method for packing, is characterized in that, comprising:
Base material is provided, described base material has at least one groove, the degree of depth of described groove is greater than the thickness of LED chip to be packaged, and described groove is more than or equal to described LED chip in the size perpendicular on self thickness direction in the size perpendicular on self depth direction;
LED chip described at least one is arranged in described groove one to one;
Utilize the first bonding wire to be electrically connected to anode and the described base material of described LED chip, utilize the second bonding wire to be electrically connected to negative electrode and the described base material of described LED chip, the tie point of the tie point of described the first bonding wire and described base material and described the second bonding wire and described base material is all positioned at the outside of described groove;
In described groove, fill packaging plastic, make described packaging plastic cover the surface that described LED chip deviates from described bottom portion of groove, in described packaging plastic, there is fluorescent material;
On described base material, lens are set, make described lens be coated described packaging plastic, described the first bonding wire and described the second bonding wire.
11. LED method for packing according to claim 10, is characterized in that, describedly in described groove, fill packaging plastic and are specially: adopt gluing process to fill packaging plastic in described groove.
12. LED method for packing according to claim 10, is characterized in that, describedly on described base material, lens are set and are specially: adopt stamping technique, on described base material, lens are set.
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| Application Number | Priority Date | Filing Date | Title |
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| CN201310698456.5A CN103633234A (en) | 2013-12-18 | 2013-12-18 | LED (light emitting diode) package structure and method |
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| Application Number | Priority Date | Filing Date | Title |
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| CN201310698456.5A CN103633234A (en) | 2013-12-18 | 2013-12-18 | LED (light emitting diode) package structure and method |
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| CN103633234A true CN103633234A (en) | 2014-03-12 |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107101095A (en) * | 2017-05-31 | 2017-08-29 | 陆春生 | A kind of LED disjunctors Frame lamp and its production technology |
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| CN202871854U (en) * | 2012-09-13 | 2013-04-10 | 江门市华恒灯饰有限公司 | LED substrate structure |
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| CN107101095A (en) * | 2017-05-31 | 2017-08-29 | 陆春生 | A kind of LED disjunctors Frame lamp and its production technology |
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