CN103627358A - Epoxy resin sealing adhesive - Google Patents
Epoxy resin sealing adhesive Download PDFInfo
- Publication number
- CN103627358A CN103627358A CN201310596102.XA CN201310596102A CN103627358A CN 103627358 A CN103627358 A CN 103627358A CN 201310596102 A CN201310596102 A CN 201310596102A CN 103627358 A CN103627358 A CN 103627358A
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- China
- Prior art keywords
- lead
- epoxy resin
- parts
- rare earth
- resin sealant
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- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Abstract
The invention provides an epoxy resin sealing adhesive, relating to the technical field of adhesives. The adhesive is characterized by comprising the following components in parts by weight: 100 parts of epoxy resin, 10 parts of diluter, 30 parts of hexabromo-benzene, 15 parts of antimony trioxide, 150 parts of aluminum hydroxide, 80 parts of silicon micropowder, 90 parts of liquid methyl tetrahydrophthalic anhydride and 2 parts of 2-ethyl-4-methylimidazole. The components are cured by heating. The adhesive is simple in formula and convenient to manufacture, and has the advantages of excellent curing property and favorable technical properties.
Description
Technical field:
The present invention relates to glue paste technical field, the specifically glutinous agent of a kind of epoxy resin sealant.
Background technology:
Since the 1950's, along with electronic industry is to miniaturization, lightweight, precise treatment future development, the agent of epoxy sealing gluing is widely used in electronic devices and components production, and becomes the important insulating material of electronic industry.To epoxy sealing gluing, agent has the following requirement.
1. viscosity is lower, infiltration property is good, can be full of between element and line.
2. working life longer, adapt to the production operation of automatic production line industry.
3. in embedding and solidification process, the inorganic filler in joint sealant is free settling not, can layering.
4. curing exotherm amount is low, and shrinking percentage is little.
5. cured article electrical property is excellent, good mechanical performance, and good heat resistance, water-absorbent and thermal expansivity are little.Sometimes also to meet the requirements such as fire-retardant, heat conduction, high-low temperature resistant alternation, weathering resistance.
But epoxy pouring sealant of the prior art is generally two-pack, ambient temperature curable, but use and performance are all not ideal enough, and manufacturability is poor, and curing over-all properties is poor.
Summary of the invention:
Technical problem to be solved by this invention is to provide a kind of curing performance processing excellent, the glutinous agent of epoxy resin sealant that processing performance is good.
The object that will reach in order to realize the present invention, adopts following technical scheme:
Epoxy resin sealant sticks an agent, it is characterized in that: comprise following ingredients:
Mentioned component is by being heating and curing.
Described temperature when curing is 150 ℃, and be 2 hours set time.
Described thinner is bisphenol F epoxy resin.
The bi-component epoxy joint sealant good manufacturability being heating and curing, cured article excellent combination property, is applicable to high-pressure electronic element automatic production line.In the last few years, developed again single-component epoxy joint sealant, though need be heating and curing, can embedding steady quality.Be used for the fire-retardant embedding of transformer etc.
The invention has the beneficial effects as follows: the present invention fills a prescription simply, be convenient to make, curing performance is excellent, and processing performance is good.
Embodiment:
For technique means, creation characteristic that the present invention is realized, reach object and effect is easy to understand, below in conjunction with specific examples, further set forth the present invention.
Epoxy resin sealant sticks an agent, comprises following ingredients:
Mentioned component is by being heating and curing.
Temperature while solidifying is 150 ℃, and be 2 hours set time.
Thinner is bisphenol F epoxy resin.
More than show and described ultimate principle of the present invention and principal character and advantage of the present invention.The technician of the industry should understand; the present invention is not restricted to the described embodiments; that in above-described embodiment and specification sheets, describes just illustrates principle of the present invention; without departing from the spirit and scope of the present invention; the present invention also has various changes and modifications, and these changes and improvements all fall in the claimed scope of the invention.The claimed scope of the present invention is defined by appending claims and equivalent thereof.
Claims (4)
1. the glutinous agent of epoxy resin sealant, is characterized in that: comprise the following steps: that (1) lead makes flower bulb lead pour cold water into rapidly after fusing at 670 ℃ of temperature in; (2) flower bulb lead under oxidation promotor through being oxidized to obtain lead hydroxide; (3) make plumbic acetate with 4%～5% acetic acid reaction; (4) in lead carbonate, add rare earth element; (5) lead carbonate and rare earth element pass at normal temperatures carbonic acid gas and make lead carbonate precipitation; (6) lead carbonate precipitates calcination red lead processed at 470 ℃ of temperature after filtration.
2. the glutinous agent of a kind of epoxy resin sealant according to claim 1, is characterized in that: described rare earth element comprises one or more in rare earth oxide, rare earth nitrate or rare earth organism.
3. the glutinous agent of a kind of epoxy resin sealant according to claim 1 and 2, is characterized in that: described flower bulb lead is oxidized 2h under the environment of oxidation promotor.
4. the glutinous agent of a kind of epoxy resin sealant according to claim 3, is characterized in that: the concentration of described described acetic acid is 4%～5%.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201310596102.XA CN103627358A (en) | 2013-11-21 | 2013-11-21 | Epoxy resin sealing adhesive |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201310596102.XA CN103627358A (en) | 2013-11-21 | 2013-11-21 | Epoxy resin sealing adhesive |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN103627358A true CN103627358A (en) | 2014-03-12 |
Family
ID=50208815
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201310596102.XA Pending CN103627358A (en) | 2013-11-21 | 2013-11-21 | Epoxy resin sealing adhesive |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN103627358A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109247003A (en) * | 2018-04-12 | 2019-01-18 | 庆鼎精密电子（淮安）有限公司 | Electromagnetic shielding film and preparation method thereof |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1583928A (en) * | 2004-05-27 | 2005-02-23 | 哈尔滨工程大学 | Epoxy resin pouring sealant |
| CN102181252A (en) * | 2011-05-30 | 2011-09-14 | 烟台德邦科技有限公司 | Low-halogen single-component flame-retardant epoxy adhesive |
| CN102942889A (en) * | 2012-11-29 | 2013-02-27 | 宜兴市江南药用化工厂 | Low-halogen epoxy potting adhesive, and preparation method and application thereof |
-
2013
- 2013-11-21 CN CN201310596102.XA patent/CN103627358A/en active Pending
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1583928A (en) * | 2004-05-27 | 2005-02-23 | 哈尔滨工程大学 | Epoxy resin pouring sealant |
| CN102181252A (en) * | 2011-05-30 | 2011-09-14 | 烟台德邦科技有限公司 | Low-halogen single-component flame-retardant epoxy adhesive |
| CN102942889A (en) * | 2012-11-29 | 2013-02-27 | 宜兴市江南药用化工厂 | Low-halogen epoxy potting adhesive, and preparation method and application thereof |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109247003A (en) * | 2018-04-12 | 2019-01-18 | 庆鼎精密电子（淮安）有限公司 | Electromagnetic shielding film and preparation method thereof |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| C05 | Deemed withdrawal (patent law before 1993) | ||
| WD01 | Invention patent application deemed withdrawn after publication |
Application publication date: 20140312 |