CN103617821B - A kind of solaode back aluminum slurry of low printing weight in wet base - Google Patents
A kind of solaode back aluminum slurry of low printing weight in wet base Download PDFInfo
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- CN103617821B CN103617821B CN201310621286.0A CN201310621286A CN103617821B CN 103617821 B CN103617821 B CN 103617821B CN 201310621286 A CN201310621286 A CN 201310621286A CN 103617821 B CN103617821 B CN 103617821B
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Abstract
The present invention relates to the solaode back aluminum slurry of a kind of low printing weight in wet base, its component includes in percentage by weight: aluminium powder 60 ~ 78%, lead-free glass powder 0.5 ~ 7%, organic carrier 20 ~ 39.4%, alloy powder 0.1 ~ 5%；Wherein said alloy powder includes silicon, aluminum and the 3rd metal, and the fusing point of the 3rd metal < 577 DEG C, percetage by weight content≤18% of silicon.Compared with prior art, advantages of the present invention and have the beneficial effects that the production cost reducing solar battery sheet, can also suppress the generation of aluminum bud in the case of low printing weight in wet base simultaneously.It addition, alloy powder also can add rare earth element, the rare earth element of trace can improve alloy grain, makes alloy property be more uniformly distributed, and then the aluminum film properties making sintering obtain is more uniformly distributed.
Description
Technical field
The present invention relates to a kind of electrocondution slurry, be specifically related to the solaode back aluminum slurry of a kind of low printing weight in wet base.
Background technology
It is one important operation in manufacture of solar cells technique that back of the body electric field makes.When manufacturing crystal silicon solar energy battery, utilize silk screen that aluminium paste is printed on the back side of silicon chip, through being dried, sinter, the technique such as cooling, formation silicon-aluminum alloy layer can be formed between silicon substrate and aluminium lamination, to eliminate the Schottky barrier between silicon chip and electrode, it is achieved form the silicon epitaxial layer doped with aluminum on the silicon chip after good Ohmic contact, and cooling, i.e. back surface field layer, to improve the open-circuit voltage of battery and to improve photoelectric transformation efficiency.Therefore the properties of product of aluminium paste are in close relations with conversion efficiency.
A high-quality and efficient aluminium paste product, cost performance wants height.The cost of aluminium paste to be reduced, one of main path is to reduce printing weight in wet base.Further, since the coefficient of expansion of silicon and aluminum has big difference, excessive printing weight in wet base can increase the warpage of cell piece after sintering；And current development trend is that the silicon wafer thickness used is more and more thinner, the thin silicon wafer warping phenomenon the most thus brought is by even more serious.Reduction aluminium paste cost reduces the printing weight in wet base of aluminium paste with overcoming silicon warp phenomenon to be desirable that as far as possible.But, the printing weight in wet base reducing aluminium paste is easily caused the generation of aluminum bud.Back-surface-field (BSF) paste prints the thinnest so that the most too much silicon is dissolved in aluminum.Energy spectrum analysis also illustrate that aluminum bud is solid, and the silicone content at aluminum bud is more than the silicone content at flat surface.
Therefore, for low printing weight in wet base solaode back aluminum slurry, aluminum bud how is eliminated most important.
Summary of the invention
The technical issues that need to address of the present invention are to overcome the deficiencies in the prior art, it is provided that the solaode back aluminum slurry of a kind of low printing weight in wet base, this slurry the aluminum film obtained is not likely to produce aluminum bud.
The technical issues that need to address of the present invention are achieved through the following technical solutions:
A kind of solaode back aluminum slurry of low printing weight in wet base, its component includes in percentage by weight:
Aluminium powder
60~78%
Lead-free glass powder
0.5~7%
Organic carrier
20~39.4%
Alloy powder 0.1 ~ 5%；
Wherein said alloy powder includes silicon, aluminum and the 3rd metal, and the fusing point of the 3rd metal < 577 DEG C, percetage by weight content≤18% of silicon.< the 3rd metal of 577 DEG C can reduce the eutectic temperature of silico-aluminum powder to add fusing point；In the sintering process of back aluminum slurry, this alloy powder can before reaching the eutectic temperature of silicon substrate and aluminium powder, i.e. the fusing point of this alloy flow about to silicon substrate, form aluminum back surface field or the major part of aluminum back surface field.By contrast, add the back aluminum slurry of conventional silico-aluminum, silicon substrate and aluminium powder require heat at least 577 DEG C of temperature and just start to occur in its interface contacted congruent melting, and the silico-aluminum added is also required to melted at least 577 DEG C of ability and flow to into silicon substrate subsequently, therefore the silico-aluminum of routine can not be supplemented to the interface of silicon substrate in time, to suppress the generation of aluminum bud in the case of low printing weight in wet base.
The most described 3rd metal is zinc or stannum.Preferably, the composition of described alloy powder is included by its percetage by weight: silicon 0.1 ~ 18%, aluminum 75 ~ 99.80% and zinc or stannum 0.1 ~ 7%.
The most described alloy powder also includes at least one rare earth element.Preferably, the composition of described alloy powder is included by its percetage by weight: silicon 0.1 ~ 18%, aluminum 75 ~ 99.79%, zinc or stannum 0.1 ~ 6.5% and rare earth element 0.01 ~ 0.5%.The rare earth element of trace can improve alloy grain, makes alloy property be more uniformly distributed, and then the aluminum film properties making sintering obtain is more uniformly distributed.
Preferably, the component of described organic carrier calculates according to percetage by weight and includes: 50 ~ 70% organic solvents, 5 ~ 20% binding agents, 1 ~ 10% levelling agent, 1 ~ 5% surfactant, surplus are wetting dispersing agent.
It is further preferable that described organic solvent is the one in terpineol, butyl acetate, propylene glycol, butyl glycol ether, methoxypropanol and diisobutyl ketone；Described binding agent is the one in ethyl cellulose, hydroxymethyl cellulose, nitrocellulose, acrylic resin, alkyd resin and rosin resin；Described levelling agent is triethanolamine, polyethyl acrylate, butyl polyacrylate, polyacrylic acid 2-Octyl Nitrite, ethyl acrylate and the one in butyl acrylate copolymer and silicone-modified polyacrylate；Described surfactant is the one in lecithin, glyceryl monostearate, Polysorbate and oleic acid；Described wetting dispersing agent is the one in modification acrylate block interpolymers, long-chain polyamine amide, unsaturated polycarboxylic acid polymers and modified polyorganosiloxane copolymer.Adjuvant used system can improve wettability, reduces process of lapping required time and makes slurry decentralized stabilization, it is also possible to reducing system viscosity, improve mobility.
It is further preferable that the particle diameter of described lead-free glass powder is 1.3 ~ 1.6 μm, the particle diameter of described aluminium powder is 1.3 ~ 2.6 μm.The particle diameter reducing aluminium powder and lead-free glass powder can improve mobility, in the case of low printing weight in wet base, is conducive to avoiding the generation of aluminum bud.
It is further preferable that the component of described lead-free glass powder is included by its percetage by weight: 5 ~ 15%B2O3、50~70%Bi2O3、0~2%Al2O3、2~8%ZnO、1~10%Na2O、15.5~29%SiO2、0.5~5%MoO3、0~5%ZrO2, wherein glass dust each component weight percentage sum is 100%；And it is the surface lead-free glass powder through coupling agent treatment.
Compared with prior art, advantages of the present invention and having the beneficial effects that:
1, solaode back aluminum slurry of the present invention is suitable for low printing weight in wet base, reduces the production cost of solar battery sheet, can also suppress the generation of aluminum bud in the case of low printing weight in wet base simultaneously.
2, the solaode back aluminum slurry of the present invention low printing weight in wet base additionally uses the alloy powder including silicon, aluminum, the 3rd metal and rare earth element, the rare earth element of trace can improve alloy grain, make alloy property be more uniformly distributed, and then the aluminum film properties making sintering obtain is more uniformly distributed.
Detailed description of the invention
Below in conjunction with embodiment, the detailed description of the invention of the present invention is described further.Following example are only used for clearly illustrating technical scheme, and can not limit the scope of the invention with this.
Embodiment 1
The present invention is the solaode back aluminum slurry of a kind of low printing weight in wet base, and its component includes in percentage by weight: particle diameter be the aluminium powder 60% of 1.3 ~ 2.6 μm, particle diameter be the lead-free glass powder 0.5% of 1.3 ~ 1.6 μm, organic carrier 39.4%, alloy powder 0.1%.Wherein, the component of lead-free glass powder is included by its percetage by weight: 5%B2O3、70%Bi2O3、8%ZnO、1%Na2O、15.5%SiO2、0.5%MoO3.The component of organic carrier calculates according to percetage by weight and includes: 50% terpineol, 20% hydroxymethyl cellulose, 10% triethanolamine, 1% lecithin, 19% modification acrylate block interpolymers.The composition of alloy powder is included by its percetage by weight: silicon 18%, aluminum 75% and zinc 7%.
Embodiment 2
The present invention is the solaode back aluminum slurry of a kind of low printing weight in wet base, and its component includes in percentage by weight: particle diameter be the aluminium powder 65% of 1.3 ~ 2.6 μm, particle diameter be the lead-free glass powder 7% of 1.3 ~ 1.6 μm, organic carrier 23%, alloy powder 5%.Wherein, the component of lead-free glass powder is included by its percetage by weight: 15%B2O3、50%Bi2O3、2%Al2O3、2%ZnO、1%Na2O、29%SiO2、0.5%MoO3、0.5%ZrO2；And it is the surface lead-free glass powder through coupling agent treatment.The component of organic carrier calculates according to percetage by weight and includes: 70% butyl acetate, 5% ethyl cellulose, 1% ethyl acrylate, 5% oleic acid, 19% long-chain polyamine amide.The composition of alloy powder is included by its percetage by weight: silicon 0.1%, aluminum 99.8% and stannum 0.1%.
Embodiment 3
The present invention is the solaode back aluminum slurry of a kind of low printing weight in wet base, and its component includes in percentage by weight: particle diameter be the aluminium powder 78% of 1.3 ~ 2.6 μm, particle diameter be the lead-free glass powder 1% of 1.3 ~ 1.6 μm, organic carrier 20%, alloy powder 1%.Wherein, the component of lead-free glass powder is included by its percetage by weight: 6%B2O3、53%Bi2O3、1%Al2O3、3%ZnO、10%Na2O、17%SiO2、5%MoO3、5%ZrO2；And it is the surface lead-free glass powder through coupling agent treatment.The component of organic carrier calculates according to percetage by weight and includes: 65% propylene glycol, 15% nitrocellulose, 7% butyl polyacrylate, 3 glyceryl monostearates, unsaturated polycarboxylic acid polymers.The composition of alloy powder is included by its percetage by weight: silicon 1.2%, aluminum 97% and zinc 1.8%.
Embodiment 4
The present invention is the solaode back aluminum slurry of a kind of low printing weight in wet base, and its component includes in percentage by weight: particle diameter be the aluminium powder 60% of 1.3 ~ 2.6 μm, particle diameter be the lead-free glass powder 0.5% of 1.3 ~ 1.6 μm, organic carrier 39.4%, alloy powder 0.1%.Wherein, the component of lead-free glass powder is included by its percetage by weight: 7%B2O3、60%Bi2O3、1.5%Al2O3、3%ZnO、1.5%Na2O、25%SiO2、1%MoO3、1%ZrO2；And it is the surface lead-free glass powder through coupling agent treatment.The component of organic carrier calculates according to percetage by weight and includes: 60% butyl glycol ether, 15% acrylic resin, 5% polyacrylic acid 2-Octyl Nitrite, 3% glyceryl monostearate, 15% modified polyorganosiloxane copolymer.The composition of alloy powder is included by its percetage by weight: silicon 18%, aluminum 75%, zinc 6.5% and La0.5%.
Embodiment 5
The present invention is the solaode back aluminum slurry of a kind of low printing weight in wet base, and its component includes in percentage by weight: particle diameter be the aluminium powder 65% of 1.3 ~ 2.6 μm, particle diameter be the lead-free glass powder 7% of 1.3 ~ 1.6 μm, organic carrier 23%, alloy powder 5%.Wherein, the component of lead-free glass powder is included by its percetage by weight: 6%B2O3、64%Bi2O3、1%Al2O3、3%ZnO、2%Na2O、20%SiO2、2%MoO3、2%ZrO2；And it is the surface lead-free glass powder through coupling agent treatment.The component of organic carrier calculates according to percetage by weight and includes: 70% methoxypropanol, 5% alkyd resin, 1% ethyl acrylate and butyl acrylate copolymer, 1% Polysorbate, 23% modified polyorganosiloxane copolymer.The composition of alloy powder is included by its percetage by weight: silicon 0.1%, aluminum 99.79%, stannum 0.1% and Ce0.01%.
Embodiment 6
The present invention is the solaode back aluminum slurry of a kind of low printing weight in wet base, and its component includes in percentage by weight: particle diameter be the aluminium powder 78% of 1.3 ~ 2.6 μm, particle diameter be the lead-free glass powder 1% of 1.3 ~ 1.6 μm, organic carrier 20%, alloy powder 1%.Wherein, the component of lead-free glass powder is included by its percetage by weight: 7%B2O3、65%Bi2O3、1%Al2O3、4%ZnO、3%Na2O、18%SiO2、1%MoO3、1%ZrO2；And it is the surface lead-free glass powder through coupling agent treatment.The component of organic carrier calculates according to percetage by weight and includes: 50% diisobutyl ketone, 20% rosin resin, 10% silicone-modified polyacrylate, 5% oleic acid, 15% modified polyorganosiloxane copolymer.The composition of alloy powder is included by its percetage by weight: silicon 1.2%, aluminum 96.95%, zinc 1.8% and La0.05%.
Comparative example 1
Except with conventional silicon aluminium alloy powder last reign of a dynasty for embodiment 1 in alloy powder in addition to, prepare according to the formula in embodiment 1 and compare slurry, the composition of alloy powder includes silicon 18% and aluminum 92% by its percetage by weight.
After back aluminum slurry above-described embodiment 1 ~ 6 formula and comparative example 1 made is on probation on monocrystalline 125 silicon chip, print weightening finish 0.6 ± 0.1g, dry under the temperature conditions of 200 ~ 240 DEG C, sinter under conditions of sintering peak value is 830 DEG C.Find, the back aluminum slurry printing of comparative example 1 there is some aluminum bud in the aluminium film surface obtained, and the aluminium film surface that embodiment 1 ~ 6 back aluminum slurry printing obtains all does not finds aluminum bud.It addition, the aluminum film electrical property obtained by the back aluminum slurry printing of embodiment 4 ~ 6 formula is more uniformly distributed.
Above-mentioned each embodiment is further illustrating of making of the foregoing to the present invention, but the scope that should not be construed as the above-mentioned theme of the present invention is only limitted to above-described embodiment.It should be pointed out that, for those skilled in the art, on the premise of without departing from the technology of the present invention principle, it is also possible to make some improvements and modifications, these improvements and modifications also should be regarded as protection scope of the present invention.
Claims (9)
1. the solaode back aluminum slurry of one kind low printing weight in wet base, it is characterised in that its component includes in percentage by weight:
Aluminium powder 60 ~ 78%
Lead-free glass powder 0.5 ~ 7%
Organic carrier 20 ~ 39.4%
Alloy powder 0.1 ~ 5%；
Wherein said alloy powder includes silicon, aluminum and the 3rd metal, and the fusing point of the 3rd metal < 577 DEG C, percetage by weight content≤18% of silicon；The component of described organic carrier calculates according to percetage by weight and includes: 50 ~ 70% organic solvents, 5 ~ 20% binding agents, 1 ~ 10% levelling agent, 1 ~ 5% surfactant, surplus are wetting dispersing agent；Described wetting dispersing agent is the one in modification acrylate block interpolymers, long-chain polyamine amide, unsaturated polycarboxylic acid polymers and modified polyorganosiloxane copolymer.
The heavy solaode back aluminum slurry of low printing weight in wet base the most as claimed in claim 1, it is characterised in that described 3rd metal is zinc or stannum.
The solaode back aluminum slurry of low printing weight in wet base the most as claimed in claim 2, it is characterised in that the composition of described alloy powder is included by its percetage by weight: silicon 0.1 ~ 18%, aluminum 75 ~ 99.80% and zinc or stannum 0.1 ~ 7%.
The solaode back aluminum slurry of low printing weight in wet base the most as claimed in claim 2, it is characterised in that described alloy powder also includes at least one rare earth element.
The solaode back aluminum slurry of low printing weight in wet base the most as claimed in claim 4, it is characterised in that the composition of described alloy powder is included by its percetage by weight: silicon 0.1 ~ 18%, aluminum 75 ~ 99.79%, zinc or stannum 0.1 ~ 6.5% and rare earth element 0.01 ~ 0.5%.
The solaode back aluminum slurry of low printing weight in wet base the most as claimed in claim 1, it is characterised in that: described organic solvent is the one in terpineol, butyl acetate, propylene glycol, butyl glycol ether, methoxypropanol and diisobutyl ketone；Described binding agent is the one in ethyl cellulose, hydroxymethyl cellulose, nitrocellulose, acrylic resin, alkyd resin and rosin resin.
The solaode back aluminum slurry of low printing weight in wet base the most as claimed in claim 1, it is characterised in that: described levelling agent is triethanolamine, polyethyl acrylate, butyl polyacrylate, polyacrylic acid 2-Octyl Nitrite, ethyl acrylate and the one in butyl acrylate copolymer and silicone-modified polyacrylate；Described surfactant is the one in lecithin, glyceryl monostearate, Polysorbate and oleic acid.
The solaode back aluminum slurry of low printing weight in wet base the most as claimed in claim 1, it is characterised in that the particle diameter of described lead-free glass powder is 1.3 ~ 1.6 μm, the particle diameter of described aluminium powder is 1.3 ~ 2.6 μm.
The solaode back aluminum slurry of low printing weight in wet base the most as claimed in claim 8, it is characterised in that the component of described lead-free glass powder is included by its percetage by weight: 5 ~ 15%B2O3、50~70%Bi2O3、0~2%Al2O3、2~8%ZnO、1~10%Na2O、15.5~29%SiO2、0.5~5%MoO3、0~5%ZrO2, wherein glass dust each component weight percentage sum is 100%；And it is the surface lead-free glass powder through coupling agent treatment.
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| CN106928497A (en) * | 2017-02-20 | 2017-07-07 | 江苏瑞德新能源科技有限公司 | A kind of electrode of solar battery organic carrier and preparation method thereof |
| CN107240437A (en) * | 2017-06-30 | 2017-10-10 | 江苏瑞德新能源科技有限公司 | A kind of passivation emitter solar cell aluminium paste |
| CN115101236A (en) * | 2022-07-12 | 2022-09-23 | 浙江奕成科技有限公司 | Silver paste containing coated glass powder and crystalline silicon solar cell manufactured by silver paste |
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