CN103616419A - Organic matter and slurry for chip oxygen sensor insulating layer - Google Patents

Organic matter and slurry for chip oxygen sensor insulating layer Download PDF

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Publication number
CN103616419A
CN103616419A CN201310590066.6A CN201310590066A CN103616419A CN 103616419 A CN103616419 A CN 103616419A CN 201310590066 A CN201310590066 A CN 201310590066A CN 103616419 A CN103616419 A CN 103616419A
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CN
China
Prior art keywords
oxygen sensor
insulating layer
chip oxygen
slurry
organic matter
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Pending
Application number
CN201310590066.6A
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Chinese (zh)
Inventor
李敏
王田军
徐斌
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HUIZHOU FUJI ELECTRONIC MATERIAL CO Ltd
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HUIZHOU FUJI ELECTRONIC MATERIAL CO Ltd
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Priority to CN201310590066.6A priority Critical patent/CN103616419A/en
Publication of CN103616419A publication Critical patent/CN103616419A/en
Pending legal-status Critical Current

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Abstract

The invention relates to an oxygen sensor, and in particular relates to a material of a chip oxygen sensor insulating layer. An organic matter for the chip oxygen sensor insulating layer is sepiolite, talcum, or mica. Slurry for the chip oxygen sensor insulating layer is prepared by adding the inorganic matter to an organic matter binding agent and an organic solvent, and implementing three-roller mixing and grinding, wherein the material of a chip oxygen sensor insulating layer comprises the following components in percentage by mass: 50-80% of the inorganic matter, 5-10% of the organic matter binding agent and 10-45% of the organic solvent. The inorganic matter, which uses sepiolite, talcum, or mica as an insulating layer of a chip oxygen sensor, can achieve purposes of high-temperature insulation and helping aluminum oxide sintering to form a dense layer.

Description

Inorganics and slurry thereof for chip oxygen sensor insulation course
Technical field
The present invention relates to lambda sensor, particularly the material of chip oxygen sensor insulation course.
Background technology
In lambda sensor, between heating electrode and induction electrode, clip skim insulation course, the working temperature that this insulation course can prevent lambda sensor when more than 300 ℃, the voltage influence output voltage signal of heating electrode.In patent CN102455311, disclosed a kind of composition of insulation course, 75 parts, aluminium oxide, 3 parts of monox, 5 parts, magnesium oxide, 15 parts of terpinols, 2 parts of ethyl celluloses, in this composition, three kinds of oxides are all dystectic oxides, during sintering cannot with zirconia matrix generation co-sintering, therefore after burning, still there is very macropore, reduced the thermal shock resistance of lambda sensor; The patent also having has added low-temperature glaze and aluminium oxide in insulation course, low-temperature glaze can reduce the sintering temperature of aluminium oxide, but also can bring a series of problem, as low-temperature glaze has electron conduction when the working temperature of lambda sensor, so insulation course cannot insulate, output voltage is greater than 1.0V; In other patent, disclosed BaAl 2si 2o 8replace low-temperature glaze, but synthesize the BaAl of suitable crystal formation 2si 2o 8the twists and turns of spending money.
The present inventor analyzes some mineral and can be used as insulation course use, can meet high-temperature insulation and help alumina sintering to form the object of tight zone.
Summary of the invention
Technical matters to be solved by this invention is to provide a kind of chip oxygen sensor insulation course inorganics, and a kind of chip oxygen sensor insulation course slurry is also provided.
Technical matters to be solved by this invention is achieved by the following technical programs:
A kind of chip oxygen sensor insulation course inorganics is sepiolite or talcum or mica.Sepiolite has Mg 8(H 2o) 4[Si 6o 16] 2(OH) 48H 2the structure of O, talcum has [Mg 3(Si 4o 10) (OH) 2] structure, mica has KAl 2(AlSi 3o 10) (OH) 2structure.These inorganicss have the silicate sturcture of stratiform or sheet, sintering temperature and yttrium doping ZrO 2approach, can with its co-sintering.The silicate sturcture in addition with stratiform or sheet is unfavorable for the conduction of ion, so insulativity is good, can meet the needs of insulation course.
A chip oxygen sensor insulation course slurry, is mixed and finely ground and makes for above-mentioned inorganics adds organic matter binding agent and organic solvent to carry out three rollers.
Further, each constituent mass number percent is inorganics 50-80%, organic matter binding agent 5-10%, organic solvent 10-45%.
The present invention has following beneficial effect:
The present invention uses sepiolite, talcum or three kinds of mineral of mica to use as the insulation course of chip oxygen sensor, can meet high-temperature insulation and help alumina sintering to form the object of tight zone.
Embodiment
Below in conjunction with embodiment, the present invention will be described in detail, and embodiment is only the preferred embodiment of the present invention, is not limitation of the invention.
Embodiment 1
Get 60 grams of sepiolites, 8 grams of acrylic PMMA cementing agents, 32 grams of isophorones, first preliminary mixing is carried out three roller mixer mills again and is fine into the slurry that is applicable to serigraphy.This slurry is printed as to the insulation course of sheet type sensor and with all the other all stacked pressures, burn altogether the normal lambda sensor of picked up signal.When heating electrode place applies the external voltage of 16-18V, it is normal that the signal of sensor keeps, and maximum voltage is not more than 1.0V, illustrates that applied voltage does not affect normal signal output.
Embodiment 2
Get 50 grams, talcum, 5 grams of acrylic PMMA cementing agents, 45 grams of isophorones, first preliminary mixing is carried out three roller mixer mills again and is fine into the slurry that is applicable to serigraphy.This slurry is printed as to the insulation course of sheet type sensor and with all the other all stacked pressures, burn altogether the normal lambda sensor of picked up signal.When heating electrode place applies the external voltage of 16-18V, it is normal that the signal of sensor keeps, and maximum voltage is not more than 1.0V, illustrates that applied voltage does not affect normal signal output.
Embodiment 3
80 grams, mica, 5 grams of acrylic PMMA cementing agents, 15 grams of isophorones, first preliminary mixing is carried out three roller mixer mills again and is fine into the slurry that is applicable to serigraphy.This slurry is printed as to the insulation course of sheet type sensor and with all the other all stacked pressures, burn altogether the normal lambda sensor of picked up signal.When heating electrode place applies the external voltage of 16-18V, it is normal that the signal of sensor keeps, and maximum voltage is not more than 1.0V, illustrates that applied voltage does not affect normal signal output.

Claims (3)

1. a chip oxygen sensor insulation course inorganics, is characterized in that: be sepiolite or talcum or mica.
2. a chip oxygen sensor insulation course slurry, is characterized in that: for inorganics described in claim 1 adds organic matter binding agent and organic solvent to carry out three rollers, be mixed and finely ground and make.
3. chip oxygen sensor insulation course slurry according to claim 2, is characterized in that each constituent mass number percent is inorganics 50-80%, organic matter binding agent 5-10%, organic solvent 10-45%.
CN201310590066.6A 2013-11-22 2013-11-22 Organic matter and slurry for chip oxygen sensor insulating layer Pending CN103616419A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN201310590066.6A CN103616419A (en) 2013-11-22 2013-11-22 Organic matter and slurry for chip oxygen sensor insulating layer

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN201310590066.6A CN103616419A (en) 2013-11-22 2013-11-22 Organic matter and slurry for chip oxygen sensor insulating layer

Publications (1)

Publication Number Publication Date
CN103616419A true CN103616419A (en) 2014-03-05

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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN113237789A (en) * 2021-05-12 2021-08-10 雅安百图高新材料股份有限公司 Method for detecting content of organic modifier on surface of alumina powder

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20020073763A1 (en) * 2000-12-15 2002-06-20 Donelon Matthew J. Oxygen sensor for multiple port applications
JP2004338964A (en) * 2003-05-13 2004-12-02 Matsushita Electric Ind Co Ltd Oxygen pump
CN101995426A (en) * 2009-08-14 2011-03-30 比亚迪股份有限公司 Chip type oxygen sensor and preparation method thereof
CN102005254A (en) * 2010-09-15 2011-04-06 合肥左天电子科技有限公司 Electric insulation material for lamellar detection element of gas sensor and preparation method thereof
CN102482139A (en) * 2009-09-17 2012-05-30 圣戈班石英有限公司 Glass for insulating composition
CN102786294A (en) * 2012-07-16 2012-11-21 中国科学院宁波材料技术与工程研究所 Insulating layer slurry of chip-type oxygen sensor and insulating layer preparation method

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20020073763A1 (en) * 2000-12-15 2002-06-20 Donelon Matthew J. Oxygen sensor for multiple port applications
JP2004338964A (en) * 2003-05-13 2004-12-02 Matsushita Electric Ind Co Ltd Oxygen pump
CN101995426A (en) * 2009-08-14 2011-03-30 比亚迪股份有限公司 Chip type oxygen sensor and preparation method thereof
CN102482139A (en) * 2009-09-17 2012-05-30 圣戈班石英有限公司 Glass for insulating composition
CN102005254A (en) * 2010-09-15 2011-04-06 合肥左天电子科技有限公司 Electric insulation material for lamellar detection element of gas sensor and preparation method thereof
CN102786294A (en) * 2012-07-16 2012-11-21 中国科学院宁波材料技术与工程研究所 Insulating layer slurry of chip-type oxygen sensor and insulating layer preparation method

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
汪镜亮: "镁质硫酸盐矿物的性质及应用", 《矿产综合利用》, no. 4, 31 August 1987 (1987-08-31), pages 39 - 45 *

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN113237789A (en) * 2021-05-12 2021-08-10 雅安百图高新材料股份有限公司 Method for detecting content of organic modifier on surface of alumina powder

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Application publication date: 20140305