CN103612007B - A kind of preparation method of high-temperature alloy three-dimensional lattice sandwich structure - Google Patents
A kind of preparation method of high-temperature alloy three-dimensional lattice sandwich structure Download PDFInfo
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- CN103612007B CN103612007B CN201310594990.1A CN201310594990A CN103612007B CN 103612007 B CN103612007 B CN 103612007B CN 201310594990 A CN201310594990 A CN 201310594990A CN 103612007 B CN103612007 B CN 103612007B
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23P—METAL-WORKING NOT OTHERWISE PROVIDED FOR; COMBINED OPERATIONS; UNIVERSAL MACHINE TOOLS
- B23P15/00—Making specific metal objects by operations not covered by a single other subclass or a group in this subclass
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K20/00—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating
- B23K20/02—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating by means of a press ; Diffusion bonding
- B23K20/021—Isostatic pressure welding
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K20/00—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating
- B23K20/14—Preventing or minimising gas access, or using protective gases or vacuum during welding
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K20/00—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating
- B23K20/24—Preliminary treatment
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
- B23K35/36—Selection of non-metallic compositions, e.g. coatings, fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest
- B23K35/3612—Selection of non-metallic compositions, e.g. coatings, fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest with organic compounds as principal constituents
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
- B23K35/36—Selection of non-metallic compositions, e.g. coatings, fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest
- B23K35/362—Selection of compositions of fluxes
Abstract
The invention discloses a kind of preparation method of high-temperature alloy three-dimensional lattice sandwich structure, the method by the central layer of panel and the with grid of well cutting by high temperature insostatic pressing (HIP) spread be connected after the method for superplastic forming again prepare difficult three-dimensional lattice sandwich structure spread connecting material such as high temperature alloy, the method can the existing method of Accurate Shaping be difficult to preparation, there is the material three-dimensional dot matrix sandwiches such as complex appearance, function admirable and stable high temperature alloy.After the present invention adopts high temperature insostatic pressing (HIP), the method for superplastic forming prepares the high-temperature alloy three-dimensional lattice sandwich structure with complex appearance, the high-temperature alloy three-dimensional lattice sandwich structure of preparation has appearance and size and stable performance advantage, the method has stable performance, efficiency advantages of higher, has a wide range of applications in aircraft, guided missile and high thrust-weight ratio engine thereof.
Description
Technical field
The present invention relates to a kind of high temperature alloy structure formation technology, particularly relate to a kind of preparation method of high-temperature alloy three-dimensional lattice sandwich structure.
Background technology
At present, it is high than powerful feature that metal three-dimensional lattice structure (English name is metalthreedimensionallatticestructure) not only has lightweight, and there is electromagnetic wave absorption, absorb blast and impact energy, thermal control, clunk management, catalyst support, filtration, electrical power storage, delay chemical reaction and fire prevention, biological tissue the several functions such as growth.Result of study shows, the intensity of lattice material is apparently higher than the corrugated plating of same density and metallic aluminium foamed material.Compare with cellular material, the intensity of lattice material also has some superiority, and especially when relative density is lower, the strength advantage of lattice material is more obvious.In addition, compare with foaming structure with honeycomb, space in the middle of lattice structure is also for increasing the multi-functional space that provides, and such as, space in the middle of network as heat radiation (its radiating efficiency is 7 times of passage heat radiation) or active refrigeration, can store the passage of fuel oil, circuit or oil circuit.As shown in Figure 1 and Figure 2, existing metal three-dimensional lattice structure supports by metal decking and space truss the structure formed.
Adopt high-temperature alloy material to prepare three-dimensional lattice structure, both there is good mechanical property, there is again resistant to elevated temperatures characteristic, in the jet pipe of hypersonic vehicle and high thrust-weight ratio engine, there is important application.At present, the Measures compare for the preparation of high temperature alloy lattice structure is few, mainly contains investment casting, this mainly due to high temperature alloy be difficult to be shaped, resistance of deformation is relevant greatly, also due to the diffusion poor connectivity of high temperature alloy.
As shown in Figure 3, for existing employing investment casting prepares preparation method's schematic diagram of high temperature alloy lattice structure, the method makes the molten metal of melting enter in model hole then heating or remove Web materials with solvent with materials such as the polyurethane foams of tridimensional network as model.But adopting the tissue preparing three-dimensional lattice structure is in this way as-cast structure, toughness and intensity lower.
In the prior art, also has and adopt three-dimensional lattice interlayer preliminary shaping method to prepare sandwich, but it also has following deficiency:
1, due to the diffusion poor connectivity of high temperature alloy, the wire three-dimensional lattice structure adopting diffusion connection method to prepare is difficult to;
2, adopt the method for model casting to prepare high temperature alloy lattice structure, owing to being cast structure, easily produce defect, mechanical property is low, particularly poor toughness.The material that some mobility are poor is then difficult to realize model casting.
Therefore, for the some shortcomings of three-dimensional lattice sandwich structure in preparation of the difficult diffusion connecting materials such as existing high temperature alloy, the diffusion that the present invention proposes to be realized between sheet material by high temperature insostatic pressing (HIP) connects, and then superplastic forming goes out the preparation method of the three-dimensional lattice structure of the difficult diffusion connecting materials such as high temperature alloy.
Summary of the invention
The object of this invention is to provide one and accurately can control high temperature alloy lattice structure complex appearance, the composite pressure that diffusion connects is higher, and interface diffusion connects the preparation method in conjunction with good high-temperature alloy three-dimensional lattice sandwich structure.
For achieving the above object, the present invention proposes a kind of preparation method of high-temperature alloy three-dimensional lattice sandwich structure, and described preparation method comprises:
Be processed to form the central layer of the network be made up of the multiple ribs intersected in length and breadth, described multiple rib in length and breadth crossover location form multiple node, described node is comprised multiple predetermined node and to be positioned at around each predetermined node and to be directly connected the neighbouring node of this predetermined node by described rib;
Be processed to form top panel and lower panel, described top panel and lower panel are all identical with the appearance profile of described central layer;
Coating is solder flux only, does not apply only solder flux on a surface of the predetermined node of described central layer, its opposed surface coating only solder flux; And on the neighbouring node of this predetermined node, do not apply only solder flux with this predetermined node apply only solder flux in the same way on the surface, its reflecting surface does not apply and stops solder flux; On two surfaces of described central layer, removing does not apply the node surface location of only solder flux, and remaining surface all applies only solder flux;
Correspond at the lower surface of described top panel the position that described central layer upper surface do not apply the node surface of only solder flux and do not apply only solder flux, the remaining surface of the lower surface of described top panel all applies only solder flux, correspond at the upper surface of described lower panel the position that described central layer lower surface do not apply the node surface of only solder flux and do not apply only solder flux, remaining surface all applies only solder flux;
Described central layer spreads with described top panel and lower panel and is connected, and is held on by described central layer between described upper and lower panel, and soldering and sealing after formation lamination shape, carries out Vacuum Package after vacuum degassing, puts into hot isostatic apparatus and carries out diffusion connection;
Superplastic forming, the prefabricated component after diffusion being connected is put in superplastic forming die and is carried out superplastic forming;
The method of water under high pressure, Linear cut or machining is adopted to process high-temperature alloy three-dimensional lattice sandwich structure.
The preparation method of high-temperature alloy three-dimensional lattice sandwich structure as above, wherein, described only solder flux is made up of acetone, ethyl acetate, yttria, and its mass percent is 90:5:5.
The preparation method of high-temperature alloy three-dimensional lattice sandwich structure as above, wherein, described hot isostatic apparatus technological parameter is: temperature range is 1000 DEG C ~ 1100 DEG C; Pressure limit is 100MPa ~ 150MPa; Working time is 2h ~ 4h.
The preparation method of high-temperature alloy three-dimensional lattice sandwich structure as above, wherein, SPF Technology is: temperature range is 920 DEG C ~ 960 DEG C; Pressure limit is 3MPa ~ 6MPa; Working time is 2h ~ 4h.
Compared with prior art, the present invention has following characteristics and advantage:
1, of the present inventionly heat and other static pressuring processes is incorporated in the preparation process of the sandwich structure pieces such as high temperature alloy dot matrix, the diffusion utilizing the hyperpressure of high temperature insostatic pressing (HIP) (maximum pressure reaches 200MPa) and high temperature (maximum temperature reaches 2000 DEG C) to realize between sheet material connects, thus solves a difficult problem for difficult diffusion connecting material forming clip Rotating fields;
2, adopt superplastic forming to have near-net-shape, formation of parts fine microstructures and the feature such as stable, Accurate Shaping can go out have the high-performance high-temperature alloy three-dimensional lattice sandwich structure of complex appearance;
3, compared with preparing high temperature alloy lattice structure with existing employing investment casting, after employing high temperature insostatic pressing (HIP), the method for superplastic forming, can obtain intensity and the toughness of lower relative density and Geng Gao.
4, after the present invention adopts high temperature insostatic pressing (HIP), the method for superplastic forming prepares the high-temperature alloy three-dimensional lattice sandwich structure with complex appearance, the high-temperature alloy three-dimensional lattice sandwich structure of preparation has appearance and size and stable performance advantage, the method has stable performance, efficiency advantages of higher, has a wide range of applications in aircraft, guided missile and high thrust-weight ratio engine thereof.
Accompanying drawing explanation
Accompanying drawing described here only for task of explanation, and is not intended to limit scope disclosed by the invention by any way.In addition, the shape of each parts in figure and proportional sizes etc. are only schematic, for helping the understanding of the present invention, are not the shape and the proportional sizes that specifically limit each parts of the present invention.Those skilled in the art, under guidance of the present invention, can select various possible shape and proportional sizes to implement the present invention as the case may be.
Fig. 1 is the schematic diagram of existing metal three-dimensional lattice structure;
Fig. 2 is partial enlargement structural representation in Fig. 1;
Fig. 3 is preparation method's schematic diagram that existing employing investment casting prepares high temperature alloy lattice structure;
Fig. 4 is the structural representation of the central layer of network of the present invention;
Fig. 5 is schematic diagram top panel lower surface of the present invention not applying only solder flux position;
Fig. 6 is schematic diagram lower panel upper surface of the present invention not applying only solder flux position;
Fig. 7 is high-temperature alloy three-dimensional lattice sandwich structure shaped structure schematic diagram of the present invention.
Description of reference numerals:
1-central layer; The predetermined node of 2-(node be connected with top panel); 3-neighbouring node (node be connected with lower panel); 4-top panel; 5-lower panel; 6-panel does not apply the position of only solder flux.
Detailed description of the invention
By reference to the accompanying drawings with the description of the specific embodiment of the invention, can clearly understand details of the present invention.But the specific embodiment of the present invention described here, only for explaining object of the present invention, and can not to be understood as by any way be limitation of the present invention.Under the teachings of the present invention, technical staff can conceive based on distortion possible arbitrarily of the present invention, and these all should be regarded as belonging to scope of the present invention.
Please refer to Fig. 4, Fig. 5, Fig. 6, Fig. 7, be respectively the structural representation of the central layer of network of the present invention, top panel lower surface do not apply and only solder flux position view, lower panel upper surface do not apply only solder flux position view, high-temperature alloy three-dimensional lattice sandwich structure shaped structure schematic diagram.The preparation method of high-temperature alloy three-dimensional lattice sandwich structure provided by the invention, comprises the following steps:
Steps A: as shown in Figure 4, process the central layer 1 of the network be made up of the multiple ribs intersected in length and breadth, due to the network of central layer 1 in right-angled intersection, multiple rib in length and breadth crossover location form multiple node, multiple node is comprised multiple predetermined node 2 and to be positioned at around each predetermined node 2 and to be directly connected the neighbouring node 3 of this predetermined node 2 by rib; Neighbouring node 3 around with the predetermined node 2 corresponding to it, the particular location of predetermined node 2 can need select according to actual condition, and to the selection of predetermined node 2, this is prior art, no longer describes in detail at this.Be processed to form top panel 4 and lower panel 5, top panel 4 and lower panel 5 are all identical with the appearance profile of central layer 1; In the present embodiment, predetermined node 2 is the node be connected with top panel; Neighbouring node 3 is the node be connected with lower panel.Certain predetermined node 2 also can be set to the node be connected with lower panel; Neighbouring node 3 is set to the node be connected with top panel.Be described for the present embodiment below:
Step B: coating is solder flux only, does not apply only solder flux at the upper surface of each predetermined node 2 of central layer 1, its lower surface coating only solder flux; Further, apply only solder flux at the upper surface (be same surface with the upper surface of predetermined node 2) of the neighbouring node 3 of predetermined node 2 correspondence, neighbouring node 3 lower surface does not apply only solder flux.Or, can not apply only solder flux at the lower surface of each predetermined node 2 of central layer 1, its upper surface coating only solder flux yet; Further, only solder flux is not applied at neighbouring node 3 upper surface of correspondence, its lower surface coating only solder flux.Like this, predetermined node 2 does not apply only solder flux surface and corresponding neighbouring node 3, and not apply only solder flux surface be opposed surface, and predetermined node 2 applies the surperficial and corresponding neighbouring node 3 of only solder flux and applies that to stop solder flux surface be opposed surface.On two surfaces of central layer, removing does not apply the node surface location of only solder flux, and remaining surface all applies only solder flux.
As shown in Figure 5, the position 6 that the lower surface of top panel 4 corresponds to the upper surface of the predetermined node 2 central layer 1 upper surface not applying only solder flux does not apply only solder flux, and the lower surface remaining surface of top panel 4 all applies only solder flux.As shown in Figure 6, below the upper surface of plate 5 correspond to central layer 1 lower surface on do not apply the lower surface of the neighbouring node 3 of only solder flux position 6 do not apply only solder flux, remaining surface all applies only solder flux.In fact, the position 6 top panel and lower panel not applying only solder flux is identical;
Step C: central layer 1 spreads with top panel 4 and lower panel 5 and is connected, and is held on by central layer 1 between top panel 4 and lower panel 5, soldering and sealing after formation lamination shape, carries out Vacuum Package after vacuum degassing, puts into hot isostatic apparatus and carries out diffusion connection;
Step D: superplastic forming, the prefabricated component after diffusion being connected is put in superplastic forming die and is carried out superplastic forming;
Step e: adopt the method for water under high pressure, Linear cut or machining to process high-temperature alloy three-dimensional lattice sandwich structure (as shown in Figure 7).
Further, only solder flux is made up of acetone, ethyl acetate, yttria, and wherein the percentage of acetone, ethyl acetate, yttria shared quality is successively 90:5:5.
Further, hot isostatic apparatus technological parameter is: temperature range is 1000 DEG C ~ 1100 DEG C; Pressure limit is 100MPa ~ 150MPa; Working time is 2h ~ 4h.
Further, SPF Technology is: temperature range is 920 DEG C ~ 960 DEG C; Pressure limit is 3MPa ~ 6MPa; Working time is 2h ~ 4h.
The principle of preparation method of the present invention is, central layer 1 carries out diffusion with top panel 4 and lower panel 5 and is connected in hot isostatic apparatus, adjacent each node is spread with upper and lower panel respectively and is connected.Because reverse side is contrary with the diffusion connection of panel with the node in front, when superplastic forming, the upper surface spreading the node 2 linked together with top panel 4 in position 6 moves upward with top panel 4, and the lower surface of be adjacent four nodes 3 and lower panel 5 spread in position 6 and link together, therefore can move downward with lower panel 5 in superplastic forming process, after superplastic forming, the lattice structure of pyramid (as shown in Figure 7) or other shape can be pulled out.
Now be described for the preparation method of GH4169 type high temperature alloy three-dimensional lattice structure, process of preparing is as follows:
Sheet material high-pressure water cutting; As shown in Figure 4, the size of two-layer panel is identical with the outer profile size of central layer for central layer cutting pattern, and thickness is 1.8mm, and core thickness is 0.8mm;
Only solder flux coating; All be coated with on the two sides of central layer 1 and be covered with only solder flux, when coating stops solder flux, coating principle is that the coating situation of surrounding's four neighbouring nodes 3 on a coupled same surface of predetermined node 2 is contrary, and the coating situation on central layer 1 two sides is contrary.On two surfaces of central layer 1, removing does not apply the node surface location of only solder flux, and other surface location all applies only solder flux.On the lower surface of the top panel 4 contacted with central layer 1 upper surface, the position corresponding with the node upper surface not applying only solder flux on central layer 1, does not apply only solder flux, and other surface location all applies only solder flux.On the upper surface of the lower panel 5 contacted with central layer 1 lower surface, the position corresponding with the node lower surface not applying only solder flux on central layer 1, does not apply only solder flux, and other surface location all applies only solder flux; It stops solder flux and is made up of acetone, ethyl acetate, yttria, and mass percent is: 90:5:5;
Central layer is connected with panel dispersion; By soldering and sealing after panel and central layer lamination, after vacuum degassing, carry out Vacuum Package, put into hot isostatic apparatus and carry out diffusion connection, the technological parameter of high temperature insostatic pressing (HIP) is: temperature 1100 DEG C, pressure 100MPa; Working time 2h,
Superplastic forming; Prefabricated component after diffusion being connected is put in superplastic forming die and is carried out superplastic forming, and technological parameter is: temperature 940 DEG C; Pressure: 4MPa; Working time: 2h;
High-pressure water cutting is adopted to go out high-temperature alloy three-dimensional lattice sandwich structure;
External Shape, Analysis on Microstructure.
The high temperatures typical alloy three-dimensional dot matrix sandwich component that the present invention adopts superplastic forming and diffusion connecting process to prepare, appearance and size controls accurately, and internal structure meets designing requirement, and obtain good diffusion linkage interface, welded rate is greater than more than 95%.In the present invention, after adopting high temperature insostatic pressing (HIP), the method for superplastic forming prepares the high-temperature alloy three-dimensional lattice sandwich structure with complex appearance, the high-temperature alloy three-dimensional lattice sandwich structure of preparation has appearance and size and stable performance advantage, the method has stable performance, efficiency advantages of higher, has a wide range of applications in aircraft, guided missile and high thrust-weight ratio engine thereof.
For the detailed explanation of the respective embodiments described above, its object is only to make an explanation to the present invention, so that the present invention can be understood better, but, it is limitation of the present invention that these descriptions can not become with any explanation, particularly, each feature described in various embodiments also can be combined mutually, thus form other embodiments, except there being clearly contrary description, these features should be understood to can be applied in any one embodiment, and are also not only confined to described embodiment.
Claims (3)
1. a preparation method for high-temperature alloy three-dimensional lattice sandwich structure, described high temperature alloy is GH4169 type high temperature alloy, it is characterized in that, described preparation method comprises:
Be processed to form the central layer of the network be made up of the multiple ribs intersected in length and breadth, described multiple rib in length and breadth crossover location form multiple node, described node is comprised multiple predetermined node and to be positioned at around each predetermined node and to be directly connected the neighbouring node of this predetermined node by described rib;
Be processed to form top panel and lower panel, described top panel and lower panel are all identical with the appearance profile of described central layer;
Coating is solder flux only, does not apply only solder flux on a surface of the predetermined node of described central layer, its opposed surface coating only solder flux; And on the neighbouring node of this predetermined node, do not apply only solder flux with this predetermined node apply only solder flux in the same way on the surface, its reflecting surface does not apply and stops solder flux; On two surfaces of described central layer, removing does not apply the node surface location of only solder flux, and remaining surface all applies only solder flux;
Correspond at the lower surface of described top panel the position that described central layer upper surface do not apply the node surface of only solder flux and do not apply only solder flux, the remaining surface of the lower surface of described top panel all applies only solder flux, correspond at the upper surface of described lower panel the position that described central layer lower surface do not apply the node surface of only solder flux and do not apply only solder flux, remaining surface all applies only solder flux;
Described central layer spreads with described top panel and lower panel and is connected, and is held on by described central layer between described upper and lower panel, and soldering and sealing after formation lamination shape, carries out Vacuum Package after vacuum degassing, puts into hot isostatic apparatus and carries out diffusion connection; Described hot isostatic apparatus technological parameter is: temperature range is 1000 DEG C ~ 1100 DEG C; Pressure limit is 100MPa ~ 150MPa; Working time is 2h ~ 4h;
Superplastic forming, the prefabricated component after diffusion being connected is put in superplastic forming die and is carried out superplastic forming;
The method of water under high pressure, Linear cut or machining is adopted to process high-temperature alloy three-dimensional lattice sandwich structure.
2. the preparation method of high-temperature alloy three-dimensional lattice sandwich structure as claimed in claim 1, is characterized in that, described only solder flux is made up of acetone, ethyl acetate, yttria, and its mass percent is 90:5:5.
3. the preparation method of high-temperature alloy three-dimensional lattice sandwich structure as claimed in claim 1, it is characterized in that, SPF Technology is: temperature range is 920 DEG C ~ 960 DEG C; Pressure limit is 3MPa ~ 6MPa; Working time is 2h ~ 4h.
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| CN106623923A (en) * | 2016-12-07 | 2017-05-10 | 中北大学 | Enhanced foamed aluminum composite board selective laser smelting forming method |
| CN108326525B (en) * | 2016-12-10 | 2020-11-17 | 中国航空制造技术研究院 | Preparation method of aerogel-filled titanium alloy three-dimensional lattice heat-proof structure |
| CN110087441B (en) * | 2019-05-24 | 2020-09-29 | 上海理工大学 | Radiator with lattice structure |
| CN111069860B (en) * | 2019-12-31 | 2022-10-25 | 航天海鹰(哈尔滨)钛业有限公司 | Preparation method of high-temperature alloy four-layer lattice lightweight structure |
| CN111139413B (en) * | 2020-02-19 | 2021-06-08 | 南京理工大学 | Method for improving service performance of superplastic forming part |
| CN112792153A (en) * | 2020-12-18 | 2021-05-14 | 北京航星机器制造有限公司 | Diffusion, stretching, chemical milling and composite forming method for aluminum alloy multilayer plate |
| CN113071158A (en) * | 2021-04-12 | 2021-07-06 | 中国航空制造技术研究院 | Composite armor protection structure and preparation method thereof |
| CN114542208A (en) * | 2022-02-23 | 2022-05-27 | 中国航发沈阳发动机研究所 | Dot-matrix containing casing of aircraft engine |
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