CN102990300B - Preparation method of titanium alloy three-dimensional lattice sandwich structure - Google Patents
Preparation method of titanium alloy three-dimensional lattice sandwich structure Download PDFInfo
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Abstract
The invention belongs to a titanium alloy structure forming technology, and in particular relates to a preparation method of a titanium alloy three-dimensional lattice sandwich structure. According to the invention, a titanium alloy three-dimensional lattice sandwich member is prepared by adopting a superplastic forming method, and the method of preparing the titanium alloy three-dimensional lattice sandwich structure by adopting a superplastic forming/diffusion connection process is proposed for the first time, therefore on one hand, the shape of a formed part, in particular to the titanium alloy three-dimensional lattice structure with a complex shape, can be accurately controlled, and on the other hand, the technical problem that a titanium alloy three-dimensional lattice sandwich layer is difficult to form is solved. The structure which is prepared by superplastic forming/diffusion connection has higher bonding strength because the three-dimensional lattice sandwich layer and upper and lower panels are bonded together by a diffusion connection method.
Description
Technical field
The invention belongs to titanium alloy structure forming technique, relate to a kind of preparation method of titanium alloy three-dimensional lattice sandwich structure.
Background technology
Titanium alloy three-dimensional lattice structure can be adopted and be prepared in the following method, as shown in Figure 1, first be laying that titanium silk is successively interlocked at an angle, then under the high temperature conditions, apply fixing pressure, heat-insulation pressure keeping certain hour, makes the titanium alloy wire phase counterdiffusion between different layers link together, then (TiCuNi-60, with 20 DEG C of min to adopt soldering
-1speed be warming up to 550 DEG C, insulation 5min, being then warming up to 975 DEG C, is 10 in vacuum
-7under Torr condition, insulation 30min) method, panel and lattice structure are linked together, thus prepare titanium alloy three-dimensional lattice sandwich structure.
Titanium alloy three-dimensional lattice sandwich structure also can adopt the method for Quick-forming to prepare, and as shown in Figure 2, is the three-dimensional lattice structure prepared by electron beam, laser rapid-forming method.
Also have employing as shown in Figure 3 metal lath punching press after prepared the three-dimensional lattice sandwich structure of Ti-6Al-4V with the method for panel soldering again.
Above-mentioned three kinds of methods have following deficiency:
(1) the wire three-dimensional lattice structure adopting diffusion connection method to prepare, the spacing of interlayer is less, and adjustable range is little, and generally can only have the size of titanium alloy wire diameter, designability is poor;
(2) wire between different layers links together by the method adopting diffusion to connect, and in diffusion connection procedure, under there is the effect of overall structure pressurized, cause the height of structure to decline, the structure height required for acquisition, has certain difficulty;
(3) for the wire that diameter is less, when carrying out diffusion and connecting, wire easily bends, and needs to adopt stainless steel lag screws to fix;
(4) preparation is when having the metal lattice structure of complex profile, need wire is bending after carry out diffusion and connect, control difficulty is larger;
(5) cost is high.Electron beam rapid shaping needs special electron beam, laser equipment to become lattice structure, and cost is higher;
(6) the part tissue after electron beam, laser fast shaping is as-cast structure, and the performance of material is lower;
(7) the upper and lower panel surface roughness after electron beam, laser fast shaping is higher, also needs follow-up processing process;
Summary of the invention
The object of the invention is, for the some shortcomings of existing titanium alloy three-dimensional lattice sandwich structure preparation technology, to propose a kind of preparation method of titanium alloy three-dimensional lattice sandwich structure.
Technical solution of the present invention is,
(1) process the network of the hollow out of central layer, adopt the mode of high-pressure water cutting or digital control processing titanium alloy plate to be processed into the network of hollow out, as the grid part in Fig. 4 is openwork part;
(2) panel machining, adopts the mode of high-pressure water cutting or digital control processing titanium alloy plate to be processed into the flat board adapted with core configuration size;
(3) surface chemistry cleaning, removes the oxide layer of central layer and panel surface;
(4) only solder flux coating, central layer two surface hollow-outs grid on coating only solder flux, the principle that coating stops solder flux is that the coating situation at four node places of a surrounding that node is coupled (is coated with and is not coated with) on the contrary, the coating situation at corresponding node place, central layer two surfaces is contrary (be coated with and be not coated with), namely apply on central layer grid and the i-th row jth row node or do not apply only solder flux, i-th-1 row jth row of central layer grid, i-th+1 row jth row, the node of the i-th row jth-1 row and the i-th row jth+1 row does not all apply or applies only solder flux, rib surface between each node all applies only solder flux, , the coating state of the only solder flux at the node place on another surface of central layer is contrary with the coating state of corresponding node, the principle of in fact above coating is: surrounding's four nodes coating situations contrary (be coated with and be not coated with) on the same surface that node is coupled, the coating situation difference (be coated with and be not coated with) that central layer two is surperficial,
(5) central layer is connected with panel dispersion, according to the order lamination of panel, central layer panel again, edge sealing weldering is carried out to the sheet edge after lamination, and the sheet edge welding exhaust tube of reserved 6-10mm width, the prefabricated blank of edge sealing postwelding is put in the diffusion connecting mold connected for diffusion of pressurizeing, vacuumized prefabricated blank by exhaust tube, vacuum is 1.0 × 10
-1pa ~ 1.0 × 10
-3pa, to diffusion connecting mold and prefabricated blank heating, is warming up to 900 DEG C ~ 920 DEG C, and to the pressurization of diffusion connecting mold, the diffusion of the panel and central layer that realize prefabricated blank is connected, and the technological parameter that diffusion connects is: 900 DEG C ~ 920 DEG C/2MPa/2h.After completing diffusion connection, the position of uncoated only solder flux combines with panel respectively;
(6) superplastic forming, prefabricated blank after diffusion being connected is taken out from diffusion connecting mold, puts into superplastic forming die, is warming up to 900 DEG C ~ 920 DEG C, in exhaust tube, pass into argon gas carry out superplastic forming, SPF Technology parameter is: 900 DEG C ~ 920 DEG C/2MPa/2h.In superplastic forming process, the site position of uncoated only solder flux is mobile with one of them panel forming, four nodes on the same surface adjacent with this node are not connected with this panel, four nodes on another surface adjacent with this node are then connected with another panel, in superplastic forming process, four nodes on another surface move towards the direction contrary with this node along with another panel, so just by superplastic forming, rib are pulled out the three-dimensional lattice structure of a pyramid form;
(7) from superplastic forming die, take out the prefabricated blank after being shaped, adopt the method for high-pressure water cutting or digital control processing to process titanium alloy three-dimensional lattice sandwich structure.
The advantage that the present invention has and beneficial effect, the advantage that the present invention adopts superplastic forming method to prepare titanium alloy three site battle array sandwich component can be summarized as follows:
(1) Accurate Shaping can go out have the titanium alloy three-dimensional lattice sandwich structure of complex appearance;
(2) prepare compared with the method for three-dimensional lattice structure with employing to titanium alloy wire materials diffusion connection method, the height of rib can adjust according to designing requirement, design freedom angle, and Coating combination is good, and performance is high and stable;
(3) compared with quick forming method, the titanium alloy structure structure and properties adopting superplastic forming method to prepare is stablized, and performance is better than the as-cast structure that quick forming method is formed;
The present invention proposes to adopt superplastic forming/diffusion connecting process phase, prepare the three-dimensional lattice sandwich structure of titanium alloy, the profile of shaping rear part can be controlled on the one hand accurately, more particularly there is the titanium alloy three-dimensional lattice structure of complex appearance, solve the technical barrier that the shaping of titanium alloy three-dimensional lattice interlayer is difficult simultaneously.And adopt superplastic forming/diffusion to connect the structure of preparation, due to three-dimensional lattice interlayer be by spreading together with the methods combining that connects between upper and lower panel, therefore, there is higher bond strength.
Accompanying drawing explanation
Fig. 1 is the silk material diffusion connection method preparation process schematic diagram of existing three-dimensional lattice sandwich structure;
Fig. 2 is the increment shaping preparation process schematic diagram of existing three-dimensional lattice sandwich structure;
Fig. 3 is existing Ti-6Al-4V expanded metals punching press/soldering tech schematic diagram, wherein, and (a) pyramid core body, (b) X-type core body;
Fig. 4 is that the structural representation of hollow out central layer of the present invention applies figure with the only solder flux of wherein one side;
Fig. 5 is that the structural representation of hollow out central layer of the present invention and the only solder flux of another side apply figure;
Fig. 6 is titanium alloy three-dimensional lattice sandwich structure schematic diagram of the present invention;
Fig. 7 is titanium alloy three-dimensional lattice sandwich structure partial enlarged drawing of the present invention.
Detailed description of the invention
The process technology scheme utilizing superplastic forming/Diffusion bonding techniques to prepare titanium alloy three-dimensional lattice structure is:
(1) process the network of the hollow out of central layer, adopt the mode of high-pressure water cutting or digital control processing titanium alloy plate to be processed into the network of hollow out;
(2) panel machining, adopts the mode of high-pressure water cutting or digital control processing titanium alloy plate to be processed into the flat board adapted with core configuration size;
(3) surface chemistry cleaning, remove the oxide layer of central layer and panel surface, surface cleaning liquid used is the mixed solution of nitric acid, hydrofluoric acid, water, and volume proportion is: 10%:5%:85%;
(4) only solder flux coating, coating only solder flux on the grid of two surface hollow-outs of central layer, the principle that coating stops solder flux is that the coating situation at four node places of a surrounding that node is coupled (is coated with and is not coated with) on the contrary, the coating situation at corresponding node place, central layer two surfaces is contrary (be coated with and be not coated with), namely on central layer grid and the i-th row jth row node, apply (or not applying) only solder flux, i-th-1 row jth row of central layer grid, i-th+1 row jth row, the node of the i-th row jth-1 row and the i-th row jth+1 row does not all apply (or coating) only solder flux, rib surface between each node all applies only solder flux, the coating state of the only solder flux at the node place on another surface of central layer is contrary with the coating state of corresponding node.Only after solder flux coating, and dry, the only solder flux after oven dry can not come off;
(5) central layer is connected with panel dispersion, according to the order lamination of panel, central layer panel again, edge sealing weldering is carried out to the sheet edge after lamination, and the sheet edge welding exhaust tube of reserved 6-10mm width, the prefabricated blank of edge sealing postwelding is put in the diffusion connecting mold connected for diffusion of pressurizeing, vacuumized prefabricated blank by exhaust tube, vacuum is 1.0 × 10
-1pa ~ 1.0 × 10
-3pa, by resistance furnace to diffusion connecting mold and prefabricated blank heating, be warming up to 900 DEG C ~ 920 DEG C, by the upper and lower mould pressurization of press to diffusion connecting mold, thus the prefabricated blank panel that realization is positioned between the upper and lower mould spreading connecting mold is connected with the diffusion of central layer, the technological parameter that diffusion connects is: 900 DEG C ~ 920 DEG C 1-1/2M Pa/2h;
(6) superplastic forming, prefabricated blank after diffusion being connected is taken out from diffusion connecting mold, put into the upper and lower mould of superplastic forming die, by resistance furnace to superplastic forming die and prefabricated blank heating, be warming up to 900 DEG C ~ 920 DEG C, by press, the upper and lower mould of superplastic forming die is pressurizeed, to prevent when the internal pocket air inlet of prefabricated blank, the upper and lower mould of superplastic forming die is backed down, then pass into argon gas in the exhaust tube in prefabricated blank and carry out superplastic forming, within 0.5h ~ 1.0h time cycle, argon pressure rises to 2.0MPa by 0.1MPa, the technological parameter of final superplastic forming is: 900 DEG C ~ 920 DEG C/2M Pa/2h,
(7) from superplastic forming die, take out the prefabricated blank after being shaped, adopt the method for high-pressure water cutting or digital control processing to process titanium alloy three-dimensional lattice sandwich structure.
Embodiment
Preparation technology's scheme of TC4 titanium alloy three-dimensional lattice structure is as follows:
(1) process the network of the hollow out of central layer, adopt the mode of high-pressure water cutting or digital control processing TC4 titanium alloy plate to be processed into the network of hollow out, the thickness of central layer is 0.8mm;
(2) panel machining, adopt the mode of high-pressure water cutting or digital control processing TC4 titanium alloy plate to be processed into the flat board adapted with core configuration size, the thickness of panel is 2.0mm;
(3) surface chemistry cleaning, remove the oxide layer of central layer and panel surface, surface cleaning liquid used is the mixed solution of nitric acid, hydrofluoric acid, water, and volume proportion is: 10%:5%:85%;
(4) only solder flux coating, coating only solder flux on the grid of two surface hollow-outs of central layer, the principle that coating stops solder flux is that the coating situation at four node places of a surrounding that node is coupled (is coated with and is not coated with) on the contrary, the coating situation contrary (be not coated with and be coated with) at corresponding node place, central layer two surfaces, namely on central layer grid and the i-th row jth row node, apply (or not applying) only solder flux, i-th-1 row jth row of central layer grid, i-th+1 row jth row, the node of the i-th row jth-1 row and the i-th row jth+1 row does not all apply (or coating) only solder flux, rib surface between each node all applies only solder flux, the coating state of the only solder flux at the node place on another surface of central layer is contrary with the coating state of corresponding node.Only after solder flux coating, and dry, the only solder flux after oven dry can not come off;
(5) central layer is connected with panel dispersion, according to the order lamination of panel, central layer panel again, edge sealing weldering is carried out to the sheet edge after lamination, and the sheet edge welding exhaust tube of reserved 6mm width, the prefabricated blank of edge sealing postwelding is put in the diffusion connecting mold connected for diffusion of pressurizeing, vacuumized prefabricated blank by exhaust tube, vacuum is 1.0 × 10
-1pa, by resistance furnace to diffusion connecting mold and prefabricated blank heating, be warming up to 920 DEG C, by the upper and lower mould pressurization of press to diffusion connecting mold, thus the prefabricated blank panel that realization is positioned between the upper and lower mould spreading connecting mold is connected with the diffusion of central layer, the technological parameter that diffusion connects is: 920 DEG C/2M Pa/2h;
(6) superplastic forming, prefabricated blank after diffusion being connected is taken out from diffusion connecting mold, put into the upper and lower mould of superplastic forming die, by resistance furnace to superplastic forming die and prefabricated blank heating, be warming up to 920 DEG C, by press, the upper and lower mould of superplastic forming die is pressurizeed, to prevent when the internal pocket air inlet of prefabricated blank, the upper and lower mould of superplastic forming die is backed down, then pass into argon gas in the exhaust tube in prefabricated blank and carry out superplastic forming, within the time of 0.5h, argon pressure rises to 2.0MPa by 0.1MPa, the technological parameter of final superplastic forming is: 920 DEG C/2M Pa/2h,
(7) from superplastic forming die, take out the prefabricated blank after being shaped, adopt the method for high-pressure water cutting or digital control processing to process titanium alloy three-dimensional lattice sandwich structure.
Claims (1)
1. a preparation method for titanium alloy three-dimensional lattice sandwich structure, its preparation method is,
(1) process the network of the hollow out of central layer, adopt the mode of high-pressure water cutting or digital control processing titanium alloy plate to be processed into the network of hollow out;
(2) panel machining, adopts the mode of high-pressure water cutting or digital control processing titanium alloy plate to be processed into the flat board adapted with core configuration size;
(3) surface chemistry cleaning, removes the oxide layer of central layer and panel surface;
(4) only solder flux coating, central layer two surface hollow-outs grid on coating only solder flux, the principle that coating stops solder flux is, i-th row jth row node of one of them surface mesh of central layer applies or does not apply only solder flux, i-th-1 row jth row of central layer grid, the i-th+1 row jth arrange, the i-th row jth-1 arranges and the node of the i-th row jth+1 row does not all apply or apply only solder flux, and the rib surface between each node all applies only solder flux; The coating state of the only solder flux at the node place on another surface of central layer is contrary with the coating state of corresponding node;
(5) central layer is connected with panel dispersion, according to the order lamination of panel, central layer panel again, edge sealing weldering is carried out to the sheet edge after lamination, and the sheet edge welding exhaust tube of reserved 6-10mm width, the prefabricated blank of edge sealing postwelding is put in the diffusion connecting mold connected for diffusion of pressurizeing, vacuumized prefabricated blank by exhaust tube, vacuum is 1.0 × 10
-1pa ~ 1.0 × 10
-3pa, to diffusion connecting mold and prefabricated blank heating, is warming up to 900 DEG C ~ 920 DEG C, and to the pressurization of diffusion connecting mold, the diffusion of the panel and central layer that realize prefabricated blank is connected, and the technological parameter that diffusion connects is: 900 DEG C ~ 920 DEG C/2MPa/2h;
(6) superplastic forming, prefabricated blank after diffusion being connected is taken out from diffusion connecting mold, puts into superplastic forming die, is warming up to 900 DEG C ~ 920 DEG C, in exhaust tube, pass into argon gas carry out superplastic forming, SPF Technology parameter is: 900 DEG C ~ 920 DEG C/2MPa/2h;
(7) from superplastic forming die, take out the prefabricated blank after being shaped, adopt the method for high-pressure water cutting or digital control processing to process titanium alloy three-dimensional lattice sandwich structure.
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