CN103606420A - Method for preparing metal conductive film - Google Patents

Method for preparing metal conductive film Download PDF

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CN103606420A
CN103606420A CN201310553554.XA CN201310553554A CN103606420A CN 103606420 A CN103606420 A CN 103606420A CN 201310553554 A CN201310553554 A CN 201310553554A CN 103606420 A CN103606420 A CN 103606420A
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metal film
conductive metal
substrate
alginate
coated
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CN103606420B (en
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金云霞
肖斐
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Fudan University
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Fudan University
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Abstract

The invention relates to the field of an electronic material and discloses a method for preparing a metal conductive film. The method comprises: first of all, respectively preparing a sea alginate aqueous solution and a metal particle dispersion liquid; then coating the sea alginate aqueous solution on a substrate; then coating the metal particle dispersion liquid on the substrate so as to prepare a metal conductive film; immersing the substrate coated with the metal conductive film into an inorganic salting liquid; and finally cleaning the metal conductive film by use of deionized water after the substrate is taken out of the inorganic salting liquid. Compared to the prior art, the method for preparing the metal conductive film improves the adhesiveness between the metal conductive film and the substrate while increasing the conductivity of the metal conductive film by 1-4 times. Besides, the process temperature is low, the operation process is simple, and the cost is low.

Description

The method of preparing conductive metal film
Technical field
The present invention relates to field of electronic materials, particularly a kind of method of preparing conductive metal film, the especially preparation method of metal transparent conductive film.
Background technology
Transparent conductive film has satisfactory electrical conductivity, and has high transmission rate in visible-range, is widely used in the fields such as flat panel display, thin-film solar cells, transducer, touch-screen and extending electronics.Based on conductivity, consider, metal transparent conductive film, especially nano silver wire transparent conductive film are to be expected to one of candidate scheme replacing commercialization tin indium oxide ITO most.But because of the stabilizer of the peripheral parcel conventionally of nano silver wire one deck decomposition temperature up to 350-400 degree, as polyvinylpyrrolidone (PVP), line Contact resistance is larger, conventionally needs 200 degree high-temperature process, and some low costs, base material that glass transition temperature is low cannot be used.In addition, the adhesiveness of nano silver wire and substrate is effectively improved always, and its commercial applications is restricted.
The related work of report is main mainly with promoting conductivity separately at present, and the work that adhesiveness is improved is less, improves conductivity and adhering work still less simultaneously.The method that solves the adhesion issues of nano silver wire conductive film and substrate is generally in the dispersion liquid of nano silver wire, to add the agent of polymer gluing, polymer gluing agent film forming together with nano silver wire, after solvent seasoning, the agent of polymer gluing is tightly sticked together nano silver wire conductive film and substrate.The method has strengthened the adhesiveness between nano silver wire conductive film and substrate, but, because the polymer gluing agent adding is attached to the periphery of nano silver wire, the contact resistance between silver-colored line in nano silver wire is sharply increased, seriously reduced the conductivity of nano silver wire conductive film; Secondly because nano silver wire General Decentralized is in lower boiling ethanol or isopropyl alcohol, the polymer gluing agent therefore adding must can be dispersed or dissolved in these solvents.Yet its opposing solvent of material and the wet environment ability that can be dissolved in polar solvent are often poor.Therefore, the long-term reliability that adds membership reduction product of polymer gluing agent.
For reducing silver-colored line Contact resistance, part Study person carrys out Processing Ag nano wire film with high energy pulse irradiation etc.Use high energy source is processed, although film conductivity increases, efficiency is also higher, only needs several microseconds, easily occurs oversintering, and conductivity peak point is also that conductivity starts the point declining conventionally, so more difficult control during practical operation.
Also there is no so far a kind of effective, low-cost, high efficiency, can improve the method for nano silver wire conductive film adhesiveness and conductivity simultaneously.
Summary of the invention
The object of the present invention is to provide a kind of method of preparing conductive metal film, can, when improving the conductivity of conductive metal film, improve the adhesiveness between conductive metal film and substrate.
For solving the problems of the technologies described above, the invention provides a kind of method of preparing conductive metal film, comprise following steps:
Prepare the alginate aqueous solution and metallic dispersion liquid;
The described alginate aqueous solution is coated in substrate;
Described metallic dispersion liquid is coated in described substrate, makes described conductive metal film;
The described substrate that is coated with described conductive metal film is immersed in inorganic salt solution;
Described substrate is taken out from described inorganic salt solution rear with conductive metal film described in deionized water rinsing.
In terms of existing technologies, first technical process can be controlled in room temperature and carries out embodiment of the present invention, and energy consumption is little, can meet the user demand of low-cost polymer flexibility substrate.And at present, due to the stabilizer polyvinylpyrrolidone PVP of the peripheral parcel conventionally of metallic one deck decomposition temperature up to 350~400 degrees Celsius, line Contact resistance is larger, conventionally need 200 celsius temperatures to process, some low costs, base material that glass transition temperature is low cannot be used.Secondly, embodiment of the present invention can improve the adhesiveness of conductive metal film and substrate when improving conductive metal film conductivity.And at present, the adhesiveness of metallic and substrate is effectively improved always, or improve adhesiveness to sacrifice conductivity, or reduced adhesiveness when enhancing conductivity.And in the present invention, before conductive metal film forms in substrate, first with the alginate aqueous solution, substrate surface is carried out to pre-treatment, because the alginate aqueous solution contains carboxyl and hydroxyl, character is active, and these groups can form water-fast metal alginate with most of divalence or polyvalent metal ion generation coordination.So, after prepared by conductive metal film, while carrying out reprocessing with inorganic salt solution again, inorganic salt solution can be effectively by PVP from metallic surface desorption, thereby significantly reduce the contact resistance between metallic, improve the conductivity of conductive metal film, inorganic salt solution also can adhere to substrate surface by metallic with sodium alginate aqueous solution generation gelation reaction simultaneously, and then reached when improving conductive metal film conductivity, improve the adhesiveness of conductive metal film and substrate.Moreover alginate has extraordinary biocompatibility, the conductive metal film that can facilitate preparation is in the application in the field such as biological, medical.Finally, than tradition, with inorganic salts, metallic film is carried out to reprocessing merely, conductive metal film better reliability prepared by this execution mode.After metal current conductive film is processed with inorganic salt solution, PVP is by desorption, the adhesiveness of conductive metal film and substrate is poorer, when water cleans, metallic likely departs from substrate surface, reduces conductivity, and if do not clean inorganic salts and will remain in conductive metal film surface, metal is had to stronger corrosiveness, seriously reduce the chemical stability of conductive metal film.But present embodiment is owing to having good adhesiveness, thus after available water rinsing, rinse, and do not worry the problem that metallic comes off.
Preferably, described the alginate aqueous solution is coated in to suprabasil step after, described, metallic dispersion liquid is coated in described substrate, before making the step of described conductive metal film, also comprise following steps:
Described in heating, be coated with the substrate of the alginate aqueous solution.
After heating in substrate alginate layer because of dehydration finer and close, in the time of in immersing inorganic salt solution, can not be partly dissolved in moment in inorganic salt solution, but need certain hour, thereby be conducive to the gelation of alginate under inorganic salts effect, improve the adhesiveness with its last layer metallic.
Preferably, when the described substrate that is coated with the alginate aqueous solution is heated, described heating-up temperature is for being less than or equal to 120 degrees Celsius.
Preferably temperature is 80 degrees Celsius.
Preferably, when the described substrate that is coated with the alginate aqueous solution is heated, be 0.01-5 hour described heating time.
Heating time is corresponding with heating-up temperature, and the high time of temperature is short, if heating-up temperature is 80 degrees Celsius, and preferably 10 minutes heating time.
Preferably, described conductive metal film comprises metal transparent conductive film.
Transparent conductive film has satisfactory electrical conductivity, and has high transmission rate in visible-range, is widely used in the fields such as flat panel display, thin-film solar cells, transducer, touch-screen and extending electronics.Based on conductivity, consider, metal transparent conductive film is to be expected to one of candidate scheme replacing commercialization tin indium oxide ITO most.
Preferably, described, the alginate aqueous solution is coated in suprabasil step, the mass fraction of the described alginate aqueous solution is 0.01-5%, and the rotating speed of described substrate is that 1500-4000 turns per minute.
The alginate aqueous solution is in the process of coating and substrate, should be according to the concentration of alginate, control the rotating speed of substrate within the specific limits, so that effectively control alginate aqueous solution thickness in substrate, in the time of in the scope that is 0.01-5% at alginate mass fraction, the rotating speed of controlling substrate turns per minute at 1500-4000, and in the present invention, preferred mass mark is 0.1%.Preferably rotating speed is 3000 to turn per minute.
Preferably, described, the alginate aqueous solution is coated in suprabasil step, the thickness that the described alginate aqueous solution applies is 1 nanometer~1 millimeter.
Preferred thickness is below 1 micron.Thickness is too thin to be difficult to play and to improve adhering effect, the too thick alginate that can residue can not be reacted away of thickness, and can make upper strata metallic by embedding wherein, affect conductivity.
Preferably, the alginate in the described alginate aqueous solution is sodium alginate, potassium alginate, alginic acid magnesium, alginic acid zinc, ammonium alginate or ferric alginate.
The available alginate aqueous solution is of a great variety.
Preferably, described, metallic dispersion liquid is coated in described substrate, makes in the step of described conductive metal film, the temperature of described substrate is 1~100 degree Celsius.
At metallizing particle dispersion, in substrate time, the temperature of controlling substrate can make the conductive metal film that forms more even, and adhesiveness is better.
Preferably, described metallic dispersion liquid comprises metallic particles dispersion liquid or metal nanometer line dispersion liquid.
Preferably, described, the described substrate that is coated with described conductive metal film is immersed in the step of inorganic salt solution, the temperature of described inorganic salt solution is 1~100 degree Celsius.
The temperature of the preferred inorganic salt solution of the present invention is below 35 degrees Celsius.It is suitable that the temperature of inorganic salt solution is controlled, and is conducive to the gelation reaction of suprabasil alginate and inorganic salts.
Preferably, described, the described substrate that is coated with described conductive metal film is immersed in the step of inorganic salt solution, the time of described submergence is 0.001~1 hour.
Preferably the time of submergence is 5 minutes.
Preferably, the mass fraction of described inorganic salt solution is 0.01~50%.
Preferred mass mark is 1-5%.
Preferably, described inorganic salt solution is the metal ion inorganic salt solution of divalence or multivalence.
Preferably, the anion in described inorganic salt solution is halide ion.
In the present invention, preferably inorganic salt solution is calcium chloride CaCl 2solution, because CaCl 2can generate calcium alginate with alginate, and calcium alginate is water insoluble, and has extraordinary biocompatibility, make the conductive metal film of preparation can be applicable to the fields such as medical treatment, wearable electronics.
Preferably, described conductive metal film is transparent or opaque conductive metal film.
Preferably, the mode of described coating comprise following any one:
Spin coating, droplet painting, blade coating and roll-to-roll printing.
The mode of the preferred spin coating of sodium alginate soln of the present invention, spin coating can control by controlling the speed of substrate rotation the thickness applying easily.The preferred blade coating mode of metallic dispersion liquid, because blade coating and extensive roll-to-roll typography are similar, than being easier to realize industrialization.
Preferably, described substrate is transparent, translucent or opaque flexibility or rigidity material.
Accompanying drawing explanation
Fig. 1 is the method flow diagram of preparing conductive metal film in first embodiment of the invention;
Fig. 2 is the method flow diagram of preparing conductive metal film in second embodiment of the invention;
Fig. 3 is the SEM image of nano silver wire conductive film in second embodiment of the invention;
Fig. 4 is the method flow diagram of preparing conductive metal film in third embodiment of the invention;
Fig. 5 is the method flow diagram of preparing conductive metal film in four embodiment of the invention.
Embodiment
For making the object, technical solutions and advantages of the present invention clearer, below in conjunction with accompanying drawing, the embodiments of the present invention are explained in detail.Yet, persons of ordinary skill in the art may appreciate that in each execution mode of the present invention, in order to make reader understand the application better, many ins and outs have been proposed.But, even without these ins and outs and the many variations based on following execution mode and modification, also can realize each claim of the application technical scheme required for protection.
The first execution mode of the present invention relates to a kind of method of preparing conductive metal film.Be illustrated in figure 1 the flow chart of preparing the method for conductive metal film in present embodiment, below in conjunction with Fig. 1, whole preparation flow described in detail.
First be step 101: prepare the alginate aqueous solution and metallic dispersion liquid.
In present embodiment, alginate can be selected sodium alginate, potassium alginate, alginic acid magnesium, alginic acid zinc, ammonium alginate or ferric alginate etc.The alginate that can select is of a great variety.
In addition, the mass fraction of the alginate aqueous solution is for being controlled within the scope of 0.01-5%.
Above-mentioned metallic dispersion liquid comprises metallic particles dispersion liquid or metal nanometer line dispersion liquid.Preferable alloy nano wire dispersion liquid in the present embodiment.
Then be step 102: the alginate aqueous solution is coated in substrate.
The mode applying comprise following any one: spin coating, drip painting, blade coating and roll-to-roll printing.In present embodiment, preferably the mode of spin coating applies, because spin coating can control by controlling the speed of substrate rotation the thickness applying easily.
In this step, the alginate aqueous solution is in being coated on the process of substrate, according to the concentration of the alginate of preparation in step 101, control the rotating speed of substrate within the specific limits, so that effectively control the alginate aqueous solution at suprabasil thickness, in the time of in the scope that is 0.01-5% at alginate mass fraction in present embodiment, the rotating speed of controlling substrate turns per minute at 1500-4000, to control the alginate aqueous solution at suprabasil thickness in the scope in 1 nanometer~1 millimeter.
In addition, above-mentioned substrate can be transparent, translucent or opaque flexibility or rigidity material.
Follow step 103: metallic dispersion liquid is coated in substrate, makes conductive metal film.
The mode of blade coating is preferably used in coating in this step, because blade coating and extensive roll-to-roll typography are similar, than being easier to realize industrialization.
Above-mentioned conductive metal film is transparent or opaque conductive metal film.
Then enter step 104: substrate is immersed in inorganic salt solution.
Inorganic salt solution is the metal ion inorganic salt solution of divalence or multivalence herein, the preferred halide ion of anion in inorganic salt solution, and mass fraction is controlled in 0.1~50% scope.
In this step, the time of submergence also will be controlled within the scope of 0.001~1 hour because need to have one section of submergence time chien shih alginate and inorganic salts gelation reaction abundant, be beneficial to and improve conductive metal film performance.
In addition, in present embodiment, the temperature of inorganic salt solution should be controlled within the scope of 1~100 degree Celsius.
Then enter step 105: take out substrate and use deionized water clean metal conductive film.
Because have product after alginate and inorganic salt reaction, residue in conductive metal film, by washed with de-ionized water, residue can be washed off, leave well behaved conductive metal film.
So far, whole preparation process finishes.
In terms of existing technologies, first technical process can be controlled in room temperature and carries out embodiment of the present invention, and energy consumption is little, can meet the user demand of low-cost polymer flexibility substrate.And at present, due to the stabilizer of the peripheral parcel conventionally of metallic one deck decomposition temperature up to 350~400 degrees Celsius, as polyvinylpyrrolidone PVP, line Contact resistance is larger, conventionally need 200 celsius temperatures to process, some low costs, base material that glass transition temperature is low cannot be used.Secondly, embodiment of the present invention can improve the adhesiveness of conductive metal film and substrate when improving conductive metal film conductivity.And at present, the adhesiveness of metallic and substrate is effectively improved always, or improve adhesiveness to sacrifice conductivity, or reduced adhesiveness when enhancing conductivity.And in the present invention, before conductive metal film forms in substrate, first with the alginate aqueous solution, substrate surface is carried out to pre-treatment, because the alginate aqueous solution contains carboxyl and hydroxyl, character is active, and these groups can form water-fast metal alginate with most of divalence or polyvalent metal ion generation coordination.So, after prepared by conductive metal film, while carrying out reprocessing with inorganic salt solution again, inorganic salt solution can be effectively by PVP from metallic surface desorption, thereby significantly reduce the contact resistance between metallic, improve the conductivity of conductive metal film, inorganic salt solution also can adhere to substrate surface by metallic with sodium alginate aqueous solution generation gelation reaction simultaneously, and then reached when improving conductive metal film conductivity, improve the adhesiveness of conductive metal film and substrate.Moreover alginate has extraordinary biocompatibility, the conductive metal film that can facilitate preparation is in the application in the field such as biological, medical.Finally, than tradition, with inorganic salts, metallic film is carried out to reprocessing merely, conductive metal film better reliability prepared by this execution mode.After metal current conductive film is processed with inorganic salt solution, PVP is by desorption, the adhesiveness of conductive metal film and substrate is poorer, when water cleans, metallic likely departs from substrate surface, reduces conductivity, and if do not clean inorganic salts and will remain in conductive metal film surface, metal is had to stronger corrosiveness, seriously reduce the chemical stability of conductive metal film.But present embodiment is owing to having good adhesiveness, thus after available water rinsing, rinse, and do not worry the problem that metallic comes off.
The step of the whole bag of tricks is divided above, just in order being described clearly, can to merge into a step or some step is split while realizing, and is decomposed into a plurality of steps, as long as comprise identical logical relation, all in the protection range of this patent.
The second execution mode of the present invention relates to a kind of method of preparing conductive metal film.The second execution mode is the further optimization of the first execution mode.Concrete manufacturing process as shown in Figure 2.
Step 201: under room temperature, the calcium chloride solution that the sodium alginate aqueous solution that preparation quality mark is 0.1%, nano silver wire dispersion liquid and mass fraction are 5%.
Step 202: sodium alginate aqueous solution room temperature is spun in polyethylene terephtalate substrate.
Above-mentioned substrate rotating speed is 3000 to turn per minute, continues 60 seconds, is prepared into the sodium alginate layer of approximately 1 micron of thickness.
Preferred thickness is below 1 micron.Thickness is too thin to be difficult to play and to improve adhering effect, the too thick alginate that can residue can not be reacted away of thickness, and can make upper strata metallic by embedding wherein, affect conductivity.
Step 203: under room temperature by nano silver wire dispersion liquid blade coating in substrate, make nano silver wire transparent conductive film.
Above-mentioned substrate rotating speed is 3000 to turn per minute.
Step 204: it is in the calcium chloride solution of 35 degrees Celsius 5 minutes that substrate is immersed in to temperature.
Step 205: take out substrate and use deionized water cleaning silver nano wire transparent conductive film.
So far, whole preparation process finishes.
The scanning electron microscope image of the nano silver wire transparent conductive film preparing with said method as shown in Figure 3.As can be seen from Figure 3, the nano silver wire in the nano silver wire transparent conductive film preparing, embeds mutually in conjunction with fully in lap-joint, and conductivity improves.After adhesive tape test, sheet resistance is changed to 4~30%, illustrates that the adhesiveness of nano silver wire transparent conductive film and substrate is better.
In addition, after tested, the nano silver wire transparent conductive film preparing by the scheme providing in present embodiment improves 1~4 times than the nano silver wire transparent conductive film conductivity of using prior art scheme to prepare.
Be not difficult to find, present embodiment is the embodiment of the optimization of the first execution mode.The correlation technique details of mentioning in the first execution mode is still effective in the present embodiment, in order to reduce repetition, repeats no more here.Correspondingly, the correlation technique details of mentioning in present embodiment also can be applicable in the first execution mode.
The 3rd execution mode of the present invention relates to a kind of method of preparing conductive metal film.The 3rd execution mode is the further improvement of the first execution mode.Main improvements are in the first embodiment in " step 102: the alginate aqueous solution is coated in substrate " afterwards, just directly enter the step of " step 103: metallic dispersion liquid is coated in substrate; make conductive metal film ", and in the present embodiment, after step 102, need to add a step that substrate is heated, specifically as shown in the step 403 in Fig. 4.
Step 403: heating substrate.Heating-up temperature is less than or equals 120 degrees Celsius, is controlled at heating time within 0.01-5 hour.
Substrate is heated to the evaporation that is conducive to moisture in sodium alginate layer, accelerate the formation of sodium alginate layer, after heating in substrate alginate layer because of dehydration finer and close, in the time of in immersing inorganic salt solution, can not be partly dissolved in moment in inorganic salt solution, but need certain hour, heating time is corresponding with heating-up temperature, and the high time of temperature is short.Heating is conducive to the gelation of alginate under inorganic salts effect, improves the adhesiveness with its last layer metallic.
Be not difficult to find, step 401 in present embodiment Fig. 4,402 and 404~406 with step 101 in first execution mode Fig. 1,102 and 103~105 identical, the correlation technique details of mentioning in the first execution mode is still effective in the present embodiment, in order to reduce repetition, repeat no more here.Correspondingly, the correlation technique details of mentioning in present embodiment also can be applicable in the first execution mode.
The 4th execution mode of the present invention relates to a kind of method of preparing conductive metal film.The 4th execution mode is the further improvement of the second execution mode.Main improvements are, in the second execution mode in " step 202: sodium alginate aqueous solution room temperature is spun in PETG (PET) substrate " afterwards, just directly enter " step 203: under room temperature by nano silver wire dispersion liquid blade coating in substrate; make nano silver wire transparent conductive film " step, and in the present embodiment, after step 202, need to add a step that substrate is heated, specifically as shown in the step 503 in Fig. 5.
Under step 503:80 degree Celsius, substrate is heated 10 minutes.
Be not difficult to find, step 501 in present embodiment Fig. 5,502 and 504~506 with step 201 in second execution mode Fig. 2,202 and 203~205 identical, the correlation technique details of mentioning in the second execution mode is still effective in the present embodiment, in order to reduce repetition, repeat no more here.Correspondingly, the correlation technique details of mentioning in present embodiment also can be applicable in the second execution mode.
The step of the whole bag of tricks is divided above, just in order being described clearly, can to merge into a step or some step is split while realizing, and is decomposed into a plurality of steps, as long as comprise identical logical relation, all in the protection range of this patent.
Persons of ordinary skill in the art may appreciate that the respective embodiments described above are to realize specific embodiments of the invention, and in actual applications, can to it, do various changes in the form and details, and without departing from the spirit and scope of the present invention.

Claims (17)

1. a method of preparing conductive metal film, is characterized in that, comprises following steps:
Prepare respectively the alginate aqueous solution, metallic dispersion liquid and inorganic salt solution;
The described alginate aqueous solution is coated in substrate;
Described metallic dispersion liquid is coated in described substrate, makes described conductive metal film;
The described substrate that is coated with described conductive metal film is immersed in described inorganic salt solution;
Described substrate is taken out from described inorganic salt solution rear with conductive metal film described in washed with de-ionized water.
2. the method for preparing conductive metal film according to claim 1, it is characterized in that, described the alginate aqueous solution is coated in to suprabasil step after, described, metallic dispersion liquid is coated in described substrate, before making the step of described conductive metal film, also comprise following steps:
Described in heating, be coated with the substrate of the alginate aqueous solution.
3. the method for preparing conductive metal film according to claim 2, is characterized in that, described heating-up temperature is for being less than or equal to 120 degrees Celsius.
4. the method for preparing conductive metal film according to claim 2, is characterized in that, be 0.01-5 hour described heating time.
5. the preparation method of conductive metal film according to claim 1 prepares the method for conductive metal film, it is characterized in that, described, the alginate aqueous solution is coated in suprabasil step, the mass fraction of the described alginate aqueous solution is 0.01-5%, and the rotating speed of described substrate is 1500-4000 rpm.
6. the method for preparing conductive metal film according to claim 1, is characterized in that, described, the alginate aqueous solution is coated in suprabasil step, and the thickness that the described alginate aqueous solution applies is 1 nanometer~1 millimeter.
7. the method for preparing conductive metal film according to claim 1, is characterized in that, the alginate in the described alginate aqueous solution is sodium alginate, potassium alginate, alginic acid magnesium, alginic acid zinc, ammonium alginate or ferric alginate.
8. the method for preparing conductive metal film according to claim 1, is characterized in that, described, metallic dispersion liquid is coated in described substrate, makes in the step of described conductive metal film, and the temperature of described substrate is 1~100 degree Celsius.
9. the method for preparing conductive metal film according to claim 1, is characterized in that, described metallic dispersion liquid is metallic particles dispersion liquid or metal nanometer line dispersion liquid.
10. the method for preparing conductive metal film according to claim 1, is characterized in that, described, the described substrate that is coated with described conductive metal film is immersed in the step of inorganic salt solution, and the temperature of described inorganic salt solution is 1~100 degree Celsius.
11. methods of preparing conductive metal film according to claim 1, is characterized in that, described, the described substrate that is coated with described conductive metal film are immersed in the step of inorganic salt solution, and the time of described submergence is 0.001~1 hour.
12. methods of preparing conductive metal film according to claim 1, is characterized in that, the mass fraction of described inorganic salt solution is 0.01-50%.
13. methods of preparing conductive metal film according to claim 1, is characterized in that, described inorganic salt solution is the metal ion inorganic salt solution of divalence or multivalence.
14. methods of preparing conductive metal film according to claim 1, is characterized in that, the anion in described inorganic salt solution is halide ion.
15. methods of preparing conductive metal film according to claim 1, is characterized in that, described conductive metal film is transparent or opaque conductive metal film.
16. according to the method for preparing conductive metal film described in any one in claim 1 to 15, it is characterized in that, the mode of described coating comprise following any one:
Spin coating, droplet painting, blade coating and roll-to-roll printing.
17. according to the method for preparing conductive metal film described in any one in claim 1 to 15, it is characterized in that, described substrate is transparent, translucent or opaque flexibility or rigidity material.
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CN104934094B (en) * 2015-05-27 2018-10-16 复旦大学 A kind of metal nanometer line compound transparent electricity conductive film, preparation method and application
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CN110283347A (en) * 2019-05-08 2019-09-27 广东石油化工学院 A kind of elasticity electromagnetic shielding film and preparation method thereof
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CN110294857B (en) * 2019-05-08 2022-02-01 广东石油化工学院 Synergistic enhanced electromagnetic shielding film and preparation method thereof
CN110283347B (en) * 2019-05-08 2022-02-01 广东石油化工学院 Elastic electromagnetic shielding film and preparation method thereof
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