CN103602965B - A kind of chemical nickel technique solving plating plating leakage - Google Patents
A kind of chemical nickel technique solving plating plating leakage Download PDFInfo
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- CN103602965B CN103602965B CN201310575788.4A CN201310575788A CN103602965B CN 103602965 B CN103602965 B CN 103602965B CN 201310575788 A CN201310575788 A CN 201310575788A CN 103602965 B CN103602965 B CN 103602965B
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Abstract
The present invention relates to a kind of chemical nickel technique solving plating plating leakage, including activation and change two steps of nickel；The activation liquid medicine that activation step uses is made up of the deionized water of activation open cylinder agent HAR-7900M and 88～92% of 8～12%；Change chemical nickel liquid medicine that nickel step uses by 15% change nickel host HAR-7955M, the chemical nickel host HAR-7955A of 5%, the deionized water of chemical nickel host HAR-7955D and 79.5% of 0.5% are made, and can according to producing circuit board quantity, supplement and add activating additive HAR-7900R in activation liquid medicine, supplement according to the ratio of 5:5:5:1 and add chemical nickel host HAR-7955A, HAR-7955B, HAR-7955C and HAR-7955D in chemical nickel liquid medicine。Solving nickel produces the plating plating leakage problem of highly difficult pcb board, and acceptance rate is high, and cost is low。
Description
[technical field]
The invention belongs to pcb board nickel technical field, particularly relate to a kind of chemical nickel technique solving plating plating leakage。
[background technology]
At present, change nickel gold liquid medicine conventional on the market used in pcb board production industry, production and processing can go out the simple pcb board of stay in grade, but when being used for producing the highly difficult pcb board such as high fine and closely woven property or half consent choosingization plate, all quality problem such as plating, plating leakage easily occur, product qualified rate is low, causes pcb board to scrap, and production cost is higher。
[summary of the invention]
The above-mentioned technical problem that the present invention solves, it is provided that one plating and plating leakage problem can occur by the solution nickel highly difficult pcb board of production, and product qualified rate is high, the chemical nickel technique that production cost is low。
For solving above-mentioned technical problem, the present invention adopts the following technical scheme that
A kind of chemical nickel technique solving plating plating leakage, includes activation and changes two steps of nickel；The activation liquid medicine used in described activation step is formulated by the deionized water of activation open cylinder agent HAR-7900M and 88～92% of 8～12%；The chemical nickel liquid medicine used in describedization nickel step by 15% change nickel host HAR-7955M, 5% chemical nickel host HAR-7955A, 0.5% the deionized water of chemical nickel host HAR-7955D and 79.5% formulated。
Further, described activation liquid medicine is formulated by the deionized water of activation open cylinder agent HAR-7900M and 90% of 10%。
Further, described activation liquid medicine is formulated by the deionized water of activation open cylinder agent HAR-7900M and 90% of 10%, particularly as follows: first injected in drug slot by the deionized water of 80%；Then the activation open cylinder agent HAR-7900M of 10% is added while stirring, until uniformly；It is eventually adding the deionized water of remaining 10%。
Further, the chemical nickel liquid medicine used in describedization nickel step by 15% change nickel host HAR-7955M, 5% chemical nickel host HAR-7955A, 0.5% the deionized water of chemical nickel host HAR-7955D and 79.5% formulated, particularly as follows: first the deionized water of 50% is injected in drug slot；It is subsequently adding the change nickel host HAR-7955M of 15% and stirs；It is subsequently added into the chemical nickel host HAR-7955A of 5% and stirs；Followed by adding the deionized water of remaining 29.5% and stirring；Finally heated to 78～85 DEG C, add the chemical nickel host HAR-7955D of 0.5%。
Further, the composition of described activation open cylinder agent HAR-7900M and percentage by weight are: H2SO410～14%, pdcl20.03～0.04%, surfactant 24P7～8%, deionized water 16.93～77.96%；Composition and the percentage by weight of described chemical nickel host HAR-7955M be: sodium hypophosphite 20～30%, mass percent be 88% lactic acid 10～16%, stabilizer 0.0006～0.0015%, malic acid 3～4%, adipic acid 3～5%, ammonia 6～8% and deionized water 37～58%；Composition and the percentage by weight of described chemical nickel host HAR-7955A be: nickel sulfate 30～50%, mass percent are lactic acid 10～12%, the deionized water 38～60% of 88%；Composition and the percentage by weight of described chemical nickel host HAR-7955D be: brightener 0.1～0.2% and deionized water 99.8～99.9%。
Further, also can according to producing circuit board quantity in chemical nickel technique, supplement and add activating additive HAR-7900R in activation liquid medicine, supplement according to the ratio of 5:5:5:1 and add chemical nickel host HAR-7955A, chemical nickel host HAR-7955B, chemical nickel host HAR-7955C and chemical nickel host HAR-7955D in chemical nickel liquid medicine。
Further, according to often producing 1 square metre of wiring board in chemical nickel technique, supplement the activating additive HAR-7900R of addition 25～35ml in activation liquid medicine, fill into the chemical nickel host HAR-7955D of chemical nickel host HAR-7955C and 75～85ml of the chemical nickel host HAR-7955A of addition 150～170ml, the chemical nickel host HAR-7955B of 150～170ml, 150～170ml in chemical nickel liquid medicine。
Further, the composition of described activating additive HAR-7900R and percentage by weight are: H2SO45～7%, pdcl20.03～0.04%, surfactant 24P3～5% and deionized water 77.96～82.97%；Composition and the percentage by weight of described chemical nickel host HAR-7955B be: sodium hypophosphite 56～70% and deionized water 30～44%；Composition and the percentage by weight of described chemical nickel host HAR-7955C be: NaOH14～16%, malic acid 3～5%, adipic acid 9～10%, stabilizer 0.008～0.015% and deionized water 69～74%。
The invention has the beneficial effects as follows:
Chemical nickel technique of the present invention is by the improvement to activation liquid medicine and chemical nickel liquid medicine formula, activation tank liquor palladium content is made to be reduced to 6～15ppm, open cylinder ratio and be reduced to 100ml/L, working time shortens to 60～180s, directly reduce production cost, and it is divided into activation open cylinder agent easily controllable with activating additive two kinds, activate main salt simultaneously and change Palladous chloride. into, pure water chloride ion is had certain tolerance；And nickel cylinder is activity stabilized, plating speed 6～11u”/min, phosphorus content is maintained at 6～10%, attacks little to green oil, changes nickel maximum duration and can reach 30min；When highly difficult pcb board carrying out nickel is produced, effectively solving plating, plating leakage problem, the rate of pass is greatly improved, and quality is secure。
[detailed description of the invention]
In order to make the purpose of the present invention, technical scheme and advantage clearly understand, below in conjunction with subordinate list and embodiment, the present invention is further elaborated。Should be appreciated that specific embodiment described herein is only in order to explain the present invention, is not intended to limit the present invention。
A kind of chemical nickel technique solving plating plating leakage described in the embodiment of the present invention, includes activation and changes two steps of nickel；The activation liquid medicine used in described activation step is formulated by the deionized water of activation open cylinder agent HAR-7900M and 88～92% of 8～12%, the best is: described activation liquid medicine is formulated by the deionized water of activation open cylinder agent HAR-7900M and 90% of 10%, is specifically as follows: first injected in drug slot by the deionized water of 80%；Then the activation open cylinder agent HAR-7900M of 10% is added while stirring, until uniformly；It is eventually adding the deionized water of remaining 10%。The chemical nickel liquid medicine used in describedization nickel step by 15% change nickel host HAR-7955M, 5% chemical nickel host HAR-7955A, 0.5% the deionized water of chemical nickel host HAR-7955D and 79.5% formulated, be specifically as follows: first the deionized water of 50% is injected in drug slot；It is subsequently adding the change nickel host HAR-7955M of 15% and stirs；It is subsequently added into the chemical nickel host HAR-7955A of 5% and stirs；Followed by adding the deionized water of remaining 29.5% and stirring；Finally heated to 78～85 DEG C, add the chemical nickel host HAR-7955D of 0.5%。
Wherein, the composition of described activation open cylinder agent HAR-7900M and percentage by weight are: H2SO410～14%, pdcl20.03～0.04%, surfactant 24P7～8%, deionized water 16.93～77.96%；Composition and the percentage by weight of described chemical nickel host HAR-7955M be: sodium hypophosphite 20～30%, mass percent be 88% lactic acid 10～16%, stabilizer 0.0006～0.0015%, malic acid 3～4%, adipic acid 3～5%, ammonia 6～8% and deionized water 37～58%；Composition and the percentage by weight of described chemical nickel host HAR-7955A be: nickel sulfate 30～50%, mass percent are lactic acid 10～12%, the deionized water 38～60% of 88%；Composition and the percentage by weight of described chemical nickel host HAR-7955D be: brightener 0.1～0.2% and deionized water 99.8～99.9%。
Additionally, also can according to producing circuit board quantity in chemical nickel technique, supplement add activating additive HAR-7900R to activation liquid medicine in (as: in chemical nickel technique according to often produce 1 square metre of wiring board, supplement the activating additive HAR-7900R of addition 25～35ml in activation liquid medicine), supplement according to the ratio of 5:5:5:1 and add chemical nickel host HAR-7955A, chemical nickel host HAR-7955B, chemical nickel host HAR-7955C and chemical nickel host HAR-7955D in chemical nickel liquid medicine (as: in chemical nickel technique according to often produce 1 square metre of wiring board, fill into the chemical nickel host HAR-7955A of addition 150～170ml, the chemical nickel host HAR-7955B of 150～170ml, the chemical nickel host HAR-7955D of chemical nickel host HAR-7955C and the 75～85ml of 150～170ml is in chemical nickel liquid medicine)。
Wherein, the composition of described activating additive HAR-7900R and percentage by weight are: H2SO45～7%, pdcl20.03～0.04%, surfactant 24P3～5% and deionized water 77.96～82.97%；Composition and the percentage by weight of described chemical nickel host HAR-7955B be: sodium hypophosphite 56～70% and deionized water 30～44%；Composition and the percentage by weight of described chemical nickel host HAR-7955C be: NaOH14～16%, malic acid 3～5%, adipic acid 9～10%, stabilizer 0.008～0.015% and deionized water 69～74%。
1, the present invention is by activating the improvement of liquid medicine formula, improves palladium uniformity on copper face。
In a, common prescription, palladium salt is with palladium sulfate for main salt, requires higher to copper face, and palladium salt aqueous solution is unstable；New formula uses Palladous chloride. instead, and medicinal liquid is stable, and chloride ion in pure water is had certain tolerance。
B, common prescription are single medicinal liquid, slot and are same medicinal liquid with adding, and liquid medicine management-control method is single；New formula changes open cylinder agent and additive two kinds into, and management and control is convenient。
C, common prescription adopt K12(sodium lauryl sulphate) as surfactant；New formula adopts novel code name to be 24P(core ingredient) as surfactant, dispersibility is good, easy cleaning。
2, the present invention is improved by chemical nickel formula, improves liquid medicine activity。
A, improving liquid medicine accelerator in common prescription, chelating agent composition is single, and pH value regulator alkali content is high。
B, improve common prescription use later stage poor activity, open plating time length etc. during production；Defining liquid medicine life cycle is common plate 2～4MTO, choosingization plate 2～3MTO etc. (MTO is for opening cylinder addition multiple)。
C, reduction M agent original liquid concentration, the cylinder ratio of opening of chemical nickel host HAR-7955M, chemical nickel host HAR-7955A and chemical nickel host HAR-7955D is revised as 150:50:5 by 100:50:5。
In sum, chemical nickel technique of the present invention, by the improvement to activation liquid medicine and chemical nickel liquid medicine formula, making activation tank liquor palladium content be reduced to 6～15ppm by 15～25ppm, open cylinder ratio and be reduced to 100ml/L by 120ml/L, the working time is shortened to 60～180s by 60～300s, directly reduce production cost, and it is divided into activation open cylinder agent easily controllable with activating additive two kinds, activate main salt simultaneously and change Palladous chloride. into, pure water chloride ion is had certain tolerance；And nickel cylinder is activity stabilized, plating speed 6～11u”/min, phosphorus content is maintained at 6～10%, attacks little to green oil, changes nickel maximum duration and can reach 30min；When highly difficult pcb board carrying out nickel is produced, effectively solving plating, plating leakage problem, the rate of pass is greatly improved, and quality is secure。
Above content is in conjunction with concrete optimal technical scheme further description made for the present invention, it is impossible to assert that specific embodiment of the invention is confined to these explanations。For general technical staff of the technical field of the invention, without departing from the inventive concept of the premise, it is also possible to make some simple deduction or replace, protection scope of the present invention all should be considered as belonging to。
Claims (5)
1. solve a chemical nickel technique for plating plating leakage, include activation and change two steps of nickel；It is characterized in that, the activation liquid medicine used in described activation step is formulated by the deionized water of activation open cylinder agent HAR-7900M and 90% of 10%；The chemical nickel liquid medicine used in describedization nickel step by 15% change nickel host HAR-7955M, 5% chemical nickel host HAR-7955A, 0.5% the deionized water of chemical nickel host HAR-7955D and 79.5% formulated；
Wherein, described activation liquid medicine is formulated by the deionized water of activation open cylinder agent HAR-7900M and 90% of 10%, particularly as follows: first injected in drug slot by the deionized water of 80%；Then the activation open cylinder agent HAR-7900M of 10% is added while stirring, until uniformly；It is eventually adding the deionized water of remaining 10%；
The chemical nickel liquid medicine used in describedization nickel step by 15% change nickel host HAR-7955M, 5% chemical nickel host HAR-7955A, 0.5% the deionized water of chemical nickel host HAR-7955D and 79.5% formulated, particularly as follows: first the deionized water of 50% is injected in drug slot；It is subsequently adding the change nickel host HAR-7955M of 15% and stirs；It is subsequently added into the chemical nickel host HAR-7955A of 5% and stirs；Followed by adding the deionized water of remaining 29.5% and stirring；Finally heated to 78～85 DEG C, add the chemical nickel host HAR-7955D of 0.5%。
2. the chemical nickel technique of solution plating plating leakage according to claim 1, it is characterised in that composition and the percentage by weight of described activation open cylinder agent HAR-7900M be: H2SO410～14%, pdcl20.03～0.04%, surfactant 24P7～8%, deionized water 16.93～77.96%；Composition and the percentage by weight of described chemical nickel host HAR-7955M be: sodium hypophosphite 20～30%, mass percent be 88% lactic acid 10～16%, stabilizer 0.0006～0.0015%, malic acid 3～4%, adipic acid 3～5%, ammonia 6～8% and deionized water 37～58%；Composition and the percentage by weight of described chemical nickel host HAR-7955A be: nickel sulfate 30～50%, mass percent are lactic acid 10～12%, the deionized water 38～60% of 88%；Composition and the percentage by weight of described chemical nickel host HAR-7955D be: brightener 0.1～0.2% and deionized water 99.8～99.9%。
3. the chemical nickel technique of solution plating plating leakage according to claim 1, it is characterized in that, also can according to producing circuit board quantity in chemical nickel technique, supplement and add activating additive HAR-7900R in activation liquid medicine, supplement according to the ratio of 5:5:5:1 and add chemical nickel host HAR-7955A, chemical nickel host HAR-7955B, chemical nickel host HAR-7955C and chemical nickel host HAR-7955D in chemical nickel liquid medicine。
4. the chemical nickel technique of solution plating plating leakage according to claim 3, it is characterized in that, according to often producing 1 square metre of wiring board in chemical nickel technique, supplement the activating additive HAR-7900R of addition 25～35ml in activation liquid medicine, fill into the chemical nickel host HAR-7955D of chemical nickel host HAR-7955C and 75～85ml of the chemical nickel host HAR-7955A of addition 150～170ml, the chemical nickel host HAR-7955B of 150～170ml, 150～170ml in chemical nickel liquid medicine。
5. the chemical nickel technique of solution plating plating leakage according to claim 3, it is characterised in that composition and the percentage by weight of described activating additive HAR-7900R be: H2SO45～7%, PdCl20.03～0.04%, surfactant 24P3～5% and deionized water 77.96～82.97%；Composition and the percentage by weight of described chemical nickel host HAR-7955B be: sodium hypophosphite 56～70% and deionized water 30～44%；Composition and the percentage by weight of described chemical nickel host HAR-7955C be: NaOH14～16%, malic acid 3～5%, adipic acid 9～10%, stabilizer 0.008～0.015% and deionized water 69～74%。
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Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1837405A (en) * | 2006-04-17 | 2006-09-27 | 武汉理工大学 | Method for surface pretreatment and nickel plating of zirconia ceramics under ultrasonic wave action |
| CN102181848A (en) * | 2011-04-21 | 2011-09-14 | 奇瑞汽车股份有限公司 | Electroless nickel plating compound brightener and use method thereof |
| CN101525744B (en) * | 2009-04-27 | 2011-12-21 | 深圳市创智成功科技有限公司 | Superficial treatment method of printed wiring board |
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| WO2011003116A2 (en) * | 2009-07-03 | 2011-01-06 | Enthone Inc. | Beta-amino acid comprising electrolyte and method for the deposition of a metal layer |
| CN102747345B (en) * | 2012-07-19 | 2013-11-13 | 哈尔滨工业大学 | Method for chemically plating nickel on surface of copper circuit of PCB (printed circuit board) by dipping and activating nickel |
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Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1837405A (en) * | 2006-04-17 | 2006-09-27 | 武汉理工大学 | Method for surface pretreatment and nickel plating of zirconia ceramics under ultrasonic wave action |
| CN101525744B (en) * | 2009-04-27 | 2011-12-21 | 深圳市创智成功科技有限公司 | Superficial treatment method of printed wiring board |
| CN102181848A (en) * | 2011-04-21 | 2011-09-14 | 奇瑞汽车股份有限公司 | Electroless nickel plating compound brightener and use method thereof |
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