CN103594766B - Miniaturization coplanar compact type electromagnetic band gap structure - Google Patents

Miniaturization coplanar compact type electromagnetic band gap structure Download PDF

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CN103594766B
CN103594766B CN201310584977.8A CN201310584977A CN103594766B CN 103594766 B CN103594766 B CN 103594766B CN 201310584977 A CN201310584977 A CN 201310584977A CN 103594766 B CN103594766 B CN 103594766B
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inductance
arm
electric capacity
arms
intersection
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CN103594766A (en
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陈彭
陈朝阳
朱炜
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XIAMEN FOUR-FAITH COMMUNICATION TECHNOLOGY CO LTD
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Jimei University
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Abstract

The invention discloses a kind of Miniaturization coplanar compact type electromagnetic band gap structure, it is made up of the metal patch of medium substrate and special construction; Described metal patch is attached on medium substrate; It is characterized in that: described metal patch is made up of four inductance arms and four electric capacity arms; Article four, one end of inductance arm and one end of four electric capacity arms cross in center and are connected, and the other end of the other end of four inductance arms and four electric capacity arms is radially spaced, and between the inductance arm that intersection is adjacent and electric capacity arm, angle is 45 degree.Because four inductance arms of the present invention and four electric capacity arms are radially spaced, between the inductance arm that intersection is adjacent and electric capacity arm, angle is 45 degree, has larger inductance capacitance amount.Structure of the present invention is simple, and single layer printed circuit plate technique can realize, and planar dimension is small and exquisite to be convenient to Wireless Telecom Equipment integrated, is applicable to the improvement of the high-frequency element such as antenna, filter electromagnetic property.

Description

Miniaturization coplanar compact type electromagnetic band gap structure
Technical field
The present invention relates to a kind of electromagnetic bandgap structure, particularly relate to a kind of Miniaturization coplanar compact type electromagnetic band gap structure preventing from transmitting special frequency band range signals.
Background technology
EBG structure has band gap properties and reflection characteristic in the same way, and its band gap properties can suppress the surface wave of micro-strip paster antenna.Along with the development of large scale integrated circuit and the progress of production technology, people wish circuit, active device and radiant element etc. to be integrated on one piece of circuit board, are beneficial to produce on a large scale and reduce costs.Micro-strip paster antenna has characteristic easy of integration, this mentality of designing is made to become feasible, but general IC substrate adopts the material (as: Si, GaAs and InP) of high-k, due to the loss of surface wave and medium mode, the radiation efficiency being positioned at the micro-strip paster antenna on these high-k substrates is very low.In some cases, the power loss that surface wave produces accounts for more than 60% of whole radiant power, this greatly reduces the radiation efficiency of micro-strip paster antenna.In this micro-strip paster antenna design process, the surface wave in substrate propagation using EBG material that radiation patch can be suppressed to evoke and medium mode, reduce the loss of surface wave and the generation of medium mode, increase the radiant power that paster antenna is coupled to free space, improve antenna efficiency.EBG material can also reduce secondary lobe that surface wave produces at edges of substrate and back lobe level, increases the front and back ratio of antenna, improves antenna pattern, improve antenna gain.In array antenna design process, use EBG structure can reduce the mutual coupling between unit, eliminates the scan blind spot of array antenna.EBG is except having the function of suppression micro-strip paster antenna surface wave, reduce the function of printed circuit board (PCB) (PrintedCircuitBoard:PCB) ground bounce noise (GroundBounceNoise:GBN) in addition, the problem of signal integrity in printed circuit board high speed design process can be solved.
Electromagnetic bandgap structure kind is a lot, and wherein coplanar compact type electromagnetic bandgap structure has good high impedance surface characteristic, homophase reflection characteristic and suppresses Characteristic of Surface Wave, receives the concern of a lot of scholar and professional.Along with the continuous lifting of the small form factor requirements of communication system, the Miniaturization Design improving the electromagnetic bandgap structure of system electromagnetic property becomes inevitable, and the present invention designs based on above-mentioned purpose just.
Summary of the invention
The object of the present invention is to provide one to be easy to produce, process, production cost is low, electric capacity, the Miniaturization coplanar compact type electromagnetic band gap structure that inductance capacitance amount is large.
For achieving the above object, technical scheme of the present invention is a kind of Miniaturization coplanar compact type electromagnetic band gap structure, and it is made up of the metal patch of medium substrate and special construction; Described metal patch is attached on medium substrate; Described metal patch is made up of four inductance arms and four electric capacity arms; Article four, one end of inductance arm and one end of four electric capacity arms cross in center and are connected, and the other end of the other end of four inductance arms and four electric capacity arms is radially spaced, and between the inductance arm that intersection is adjacent and electric capacity arm, angle is 45 degree.
Four described inductance arm configurations are measure-alike, but mirror image each other in structure, between the inductance arm that intersection is adjacent, angle is 90 degree, and every bar inductance arm is all that the microstrip line of fixed width is bent to form.
Four described electric capacity arm configurations are measure-alike, but mirror image each other in structure, angle 90 degree between the electric capacity arm that intersection is adjacent, every bar inductance arm is all that the microstrip line helically coiling of fixed width is formed.
After adopting technique scheme, due to the special inductance of the present invention and capacitance structure, can make to produce larger inductance and capacitance between this coplanar compact type electromagnetic bandgap structure unit, reduce the resonance frequency of this electromagnetic bandgap structure, realize miniaturized.Structure of the present invention is simple, and single layer printed circuit plate technique can realize, and planar dimension is small and exquisite to be convenient to Wireless Telecom Equipment integrated, is applicable to the improvement of the high-frequency element such as antenna, filter electromagnetic property.The invention process is simple, and technical maturity, automaticity is high, low production cost, and its range of application is wider.
Below in conjunction with the drawings and specific embodiments, the present invention is further illustrated.
Accompanying drawing explanation
Fig. 1 is vertical view of the present invention;
Fig. 2 is end view of the present invention;
Fig. 3 is the present invention 2 × 2 cell array form figure;
Fig. 4 is the present invention 2 × 4 unit electro-magnetic bandgap transfer curve utilizing Transmission line method to test;
Fig. 5 is 2 × 4 unit electromagnetic bandgap structure schematic diagrames;
Fig. 6 is suspending microstrip method test schematic diagram.
Embodiment
As shown in Figure 1 and Figure 2, the present invention is a kind of Miniaturization coplanar compact type electromagnetic band gap structure.What this structure realized is electro-magnetic bandgap characteristic at C-band.It is made up of metallic copper paster 1 and polytetrafluoroethylene microwave-medium substrate 2.Metallic copper paster 1 is fitted in polytetrafluoroethylene microwave-medium substrate 2 upper surface, and its structure can adopt PCB technology to realize.Medium substrate 2 thickness 1.5mm is polytetrafluoroethylene microwave-medium substrate, dielectric constant 4.Metallic copper paster 1 thickness is 0.035mm.
Described metallic copper paster 1 is made up of four inductance arms, 11,13,15,17 and four electric capacity arms 12,14,16,18.Article four, one end of inductance arm 11,13,15,17 and one end of four electric capacity arms 12,14,16,18 cross in center and are connected, article four, the other end of inductance arm 11,13,15,17 and the other end of four electric capacity arms 12,14,16,18 are radially spaced, namely, around joint, sequential inductance arm 11, electric capacity arm 12, inductance arm 13, electric capacity arm 14, inductance arm 15, electric capacity arm 16, inductance arm 17, electric capacity arm 18, between the inductance arm that intersection is adjacent and electric capacity arm, angle is 45 degree.
Article four, inductance arm configuration is measure-alike, but mirror image each other in structure.Between the inductance arm that intersection is adjacent, angle is 90 degree.Every bar inductance arm is all that the microstrip line of fixed width is bent to form, to obtain larger inductance value.
Article four, electric capacity arm configuration is measure-alike, but mirror image each other in structure.Angle 90 degree between the electric capacity arm that intersection is adjacent.Every bar electric capacity arm is all the single pole plate of the electric capacity that the microstrip line spiral winding of fixed width is made, according to the periodicity of electromagnetic bandgap structure, another pole plate of electric capacity can be realized by an electric capacity arm of adjacent electromagnetic bandgap structure unit, the parallel spiral coiling of two electric capacity arms, larger capacitance can be obtained in unit are, realize miniaturized spiral capacitance.For the design feature of adjacent cells electromagnetic bandgap structure composition spiral capacitance is described, can see Fig. 3.
As shown in Figure 3, the present invention 2 × 2 cell array form, the electric capacity arm 10 of adjacent Unit four constitutes 2 groups of spiral capacitances jointly.
Wide by the arm of debugging spiral capacitance arm, electric capacity gap spacing, broken line inductance arm are wide, after inductance gap spacing and the number of turn, equivalent capacity and equivalent inductance can be changed, thus the centre frequency of the band gap of coplanar compact type electromagnetic bandgap structure is arranged on default frequency.Fig. 4 is 2 × 4 unit electro-magnetic bandgap transfer curves utilizing suspending microstrip method to test, and has obvious band gap properties as seen in the 600MHz bandwidth of center frequency point 5.35GHz.Wherein, Fig. 5 is 2 × 4 unit electromagnetic bandgap structure schematic diagrames, and Fig. 6 is suspended mictrostrip test schematic diagram, and it comprises 2 × 4 unit electromagnetic bandgap structure 61,50ohm microstrip lines 62 of the present invention, Supporting Media 63, SMA seat 64.
Certainly; the present invention can also have other various embodiments; when not deviating from the present invention's spirit and essence thereof, those of ordinary skill in the art can according to the various corresponding distortion of the invention process, but these change accordingly and distortion all should belong to the protection range of the claims in the present invention.

Claims (1)

1. a Miniaturization coplanar compact type electromagnetic band gap structure, it is made up of the metal patch of medium substrate and special construction; Described metal patch is attached on medium substrate; It is characterized in that: described metal patch is made up of four inductance arms and four electric capacity arms; Article four, one end of inductance arm and one end of four electric capacity arms cross in center and are connected, and the other end of the other end of four inductance arms and four electric capacity arms is radially spaced, and between the inductance arm that intersection is adjacent and electric capacity arm, angle is 45 degree;
Four described inductance arm configurations are measure-alike, but mirror image each other in structure, between the inductance arm that intersection is adjacent, angle is 90 degree, and every bar inductance arm is all that the microstrip line of fixed width is bent to form;
Four described electric capacity arm configurations are measure-alike, but mirror image each other in structure, angle 90 degree between the electric capacity arm that intersection is adjacent, every bar electric capacity arm is all that the microstrip line helically coiling of fixed width is formed.
CN201310584977.8A 2013-11-20 2013-11-20 Miniaturization coplanar compact type electromagnetic band gap structure Active CN103594766B (en)

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CN105225906B (en) * 2015-09-10 2017-03-01 电子科技大学 A kind of miniaturization gainequalizer based on micro-strip defect sturcture

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101626108A (en) * 2008-07-11 2010-01-13 西北工业大学 2-3GHz band microstrip antenna with negative permeability material
CN102938488A (en) * 2011-08-16 2013-02-20 深圳光启高等理工研究院 Resonant cavity

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US7071889B2 (en) * 2001-08-06 2006-07-04 Actiontec Electronics, Inc. Low frequency enhanced frequency selective surface technology and applications

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101626108A (en) * 2008-07-11 2010-01-13 西北工业大学 2-3GHz band microstrip antenna with negative permeability material
CN102938488A (en) * 2011-08-16 2013-02-20 深圳光启高等理工研究院 Resonant cavity

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Effective date of registration: 20230327

Address after: 361000 3f-a129, Zone C, innovation building, software park, torch high tech Zone, Xiamen, Fujian

Patentee after: XIAMEN FOUR-FAITH COMMUNICATION TECHNOLOGY Co.,Ltd.

Address before: Yinjiang road in Jimei District of Xiamen City, Fujian Province, No. 185 361021

Patentee before: JIMEI University