CN103582369A - Novel pouring sealant electronic product - Google Patents
Novel pouring sealant electronic product Download PDFInfo
- Publication number
- CN103582369A CN103582369A CN201310035098.XA CN201310035098A CN103582369A CN 103582369 A CN103582369 A CN 103582369A CN 201310035098 A CN201310035098 A CN 201310035098A CN 103582369 A CN103582369 A CN 103582369A
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- China
- Prior art keywords
- electronic product
- casting glue
- glue
- dielectric layer
- novel casting
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Abstract
The invention relates to a novel pouring sealant electronic product which comprises a novel LED water-proof power supply, an IC bonding product, a pouring sealant packing module and an electronic product comprising a coil or coil winding. A protective layer is arranged on the surface of an element wrapped or covered with pouring sealant. According to the novel pouring sealant electronic product, damage to the element or a part caused by dissembling a pouring sealant layer can be avoided by adding the protective layer for covering the element between a traditional pouring sealant layer and the element, and maintenance, rework or disassembly of the pouring sealant electronic product are achieved.
Description
Technical field
The electronic product that the present invention relates to a kind of novel casting glue, especially comprises: a kind of novel LED waterproof power supply ,IC nation fixed output quota product, encapsulating encapsulation module, the casting glue electronic product that is or comprises coil or coil windings.The protective layer that has one deck organic solvent-resistant or organic substance to corrode on the components and parts of casting glue parcel.
Technical background
Along with scientific and technological development, the electronic product of casting glue has obtained use widely, and electronic product is used casting glue encapsulation according to its structure or instructions for use.
In casting glue electronic product, or shell all the time, inject casting glue (also having the encapsulating of being called) or will assemble components and parts embedding with casting glue.Because casting glue wrap up components and parts, part solidify after injecting, simultaneously for reach certain encapsulating material after requiring these curing very firm be difficult to dissolve.Therefore, when casting glue product needs to do over again in process of production, cannot keep in repair, do over again and whole product can only be abandoned and causes great waste and pollution while there is guarantee or maintenance in maintenance or use procedure.There is at present certain method curing casting glue material can be removed, but the method for removing curing casting glue is can use such as the various chemical substances such as halogenated hydrocarbons, acetone, benzinum, ester class that comprise carrene, chloroform, therefore can cause corrosion and damage that maintenance is done over again to components and parts, part nonsensical, or use additive method to remove casting glue, but components and parts are wrapped up and gluingly by external force, toll breakdown and can damage components and parts because of casting glue.So increased production and the use cost of casting glue electronic product owing to can not doing over again, can not keeping in repair.
Summary of the invention
The object of this invention is to provide a kind of novel casting glue electronic product that can realize the maintenance of doing over again.
To achieve these goals, the present invention adopts following technical scheme:
It comprises components and parts and the embedding glue-line of casting glue parcel, and casting glue is all frozen into the solid of certain degree of hardness and intensity conventionally.Its improvement is: between described casting glue glue-line and components and parts, part, increase and have dielectric layer or deielectric-coating, the surface that described dielectric layer or film first covered or wrapped up components and parts is then at surface coverage or parcel casting glue or the encapsulating of medium, dielectric layer is can be from the dielectric layer of removing, after removing this layer of medium, thereby casting glue or encapsulating just lose, the parcel of components and parts or covering are realized casting glue or the removal of encapsulating glue.Such as managing that casting glue or encapsulating surface are opened to the opening of a circle certain depth until just expose dielectric layer, because medium can be at the surface removal of components and parts, casting glue or encapsulating just can be separated from components and parts surface, realize the maintenance to electronic product.Again such as, when Di Heijiao embedding nation determines IC, black glue Hui JiangICHe nation alignment parcel, when one of the black Jiao Shi Hui JiangICHe of dismounting nation alignment is removed from substrate, so occurring after sealing that bad product IC cannot keep in repair can only abandon, but as long as first determine IC (comprising silver-colored line) with medium sealing nation before sealing, on dielectric surface drips, black glue seals medium together with IC again, like this, when rooting out black glue, because being easy to remove simultaneously IC and silver-colored line from dielectric surface, black glue is subject to the protection of medium therefore to remove black glue can not produce infringement to IC and silver-colored line, then the nation of removing black glue is determined to IC and put into certain liquid, medium is dissolved and removes by liquid, so IC and silver-colored line are just preserved by intact, so just likely keep in repair.A kind of situation is that dielectric layer is all easy to remove for components and parts and casting glue.The removal of medium comprises: the dissolving of medium or melting also comprise that decomposition also comprises that medium loses adhesion to components and parts.A kind of situation, when using a kind of solvent to comprise that double solvents is removed casting glue or encapsulating, this layer can select the material that this solvent or the relative casting glue of double solvents or encapsulating is had more to tolerance to be used as dielectric layer or film from the medium of components and parts surface removal, and this layer material preferably can also be isolated the erosion to components and parts of this solvent or double solvents.Preferably the existence of dielectric layer or this structure of film can be to components and parts when removing embedding glue-line, part damages, for making dielectric layer or film, not only can but also can realize certain functional purpose from components and parts surface removal, as heat conduction/insulation, resistance to solvent or components and parts are played to this layer of dielectric layer of the objects such as protection or film can be composite bed or composite membrane, this layer of dielectric layer or film can have or be compounded with material or the composite material of high thermal conductivity, include but not limited to: various metal oxides or nitride, carbon nano-tube, carbide, dielectric layer or film preferably select containing polyvinyl alcohol or containing the material of polyvinyl alcohol modification thing, polyvinyl alcohol modification thing comprises: polyvinyl alcohol graft copolymerized modification by copolymerization thing or polyvinyl alcohol blending modifier, while this layer of protective layer or film can be composite bed or composite membrane, this layer of protective layer or film can be the composite beds that polyvinyl alcohol and its modifier form in a certain way, this layer of protective layer or film can have or be compounded with material or the composite material of high thermal conductivity, include but not limited to: various metals or nonmetal oxide or nitride, carbon nano-tube, carbide, simultaneously this layer of dielectric layer or film are preferably easy to by such as water, materials such as alcohol or to components and parts non-corrosiveness, nondestructive liquid dissolving or swelling and remove or simple physical method, chemical method is removed, thereby making casting glue electronic product can or be easy to realize does over again and keeps in repair and reduced production and use cost.To sum up state, key as the material of dielectric layer or film is to remove, can remove and comprise: be easy to dissolve, be easy to melt, be easy under certain condition decompose as be heated, light, radiation or contact Cucumber and chemical reaction occurs and decompose, for using, a kind ofly in some aspects the prejudicial material of components and parts is done to medium and can use two or more Material claddings to use, compound material comprises natural or synthetic material, as natural resin or synthetic resin, metal, paper, animals and plants product or deep processed product, can remove and comprise under certain method and can remove, such as: with a certain thickness paper, components and parts are wrapped up, casting glue is executed on surface at paper, casting glue solidifies the firm embedding glue-line of rear formation one, while removing casting glue, can along casting glue, within one week, scratch a circle with blade or milling cutter, therefore because paper is easy to tear and is easy to separatedly at this moment can easily casting glue be separated with components and parts adhesion.For preventing that composition infiltration paper and the components and parts of casting glue from sticking together and can first with plastic film, components and parts be wrapped up to then casting glue of coated papers again.For making product work stable, the heat producing in the time of can using heat-transfer device that components and parts are worked is derived, can set temperature transducer or temperature detect switch (TDS) prevented from working in the situation of design work temperature.In order to make, product is reliability and durability or attractive in appearance or heat radiation is good, the shell of novel casting glue electronic product can adopt organic or inorganic material or composite material, the shell of the electronic product of novel casting glue can adopt the ceramic material of tool high thermal conductivity coefficient, if: metal oxide, nitride ceramics are as beryllium oxide ceramics, also can adopt the material that covers diamond film, also can adopt composite diamond film ceramic material.In order to make product reliability and durability or attractive in appearance, the shell of novel casting glue product can protective mulch or decorative layer.
Preferably, the dielectric layer that described novel casting glue product use can be removed or film are by casting glue and components and parts or part isolation.
Preferably, described dielectric layer or film can tolerate the erosion of the materials such as carrene.
Preferably, described dielectric layer or film can tolerate the erosion of encapsulating layer.
Preferably, described dielectric layer or film can be composite bed or composite membrane.
Preferably, described dielectric layer or film can have or be compounded with material or the composite material of high thermal conductivity.
Preferably, described dielectric layer or film are or containing polyvinyl alcohol or polyvinyl alcohol modification thing.
Preferably, described protective layer or film can be that polyvinyl alcohol is or/and the composite bed that polyvinyl alcohol modification thing forms in a certain way or film.
Preferably, described dielectric layer or film are between embedding glue-line and components and parts or part.
Preferably, described dielectric layer or film can make water, alcohol, simple physics or mechanical means remove.
Preferably, described dielectric layer comprises: the dielectric layer of ease of solubility, fusible dielectric layer, decomposable dielectric layer.
Preferably, the electronic product casing of described novel casting glue can adopt organic or inorganic material or composite material.
Preferably, can protective mulch or decorative layer on the electronic product casing of described novel casting glue.
Preferably, the electronic product of described novel casting glue configuration temperature sensor or temperature detect switch (TDS).
Preferably, the electronic product of described casting glue configuration heat-transfer device
Owing to having adopted such scheme, the electronic product of casting glue of the present invention is when producing, using, can be easy to by doing over again, keep in repair or realizing production, the use cost that the wherein continuation utilization of various materials has reduced the electronic product of casting glue significantly, electronic product universal that is beneficial to casting glue is that prior art can not be accomplished.
Accompanying drawing explanation
Accompanying drawing is modular structure schematic diagram of the present invention;
Embodiment
As shown in the figure, comprise: a kind of LED waterproof power supply HuoIC nation fixed output quota product, encapsulating encapsulation module, the casting glue electronic product that is or comprises coil or coil windings or the electronic product of other casting glues, at the surface of the components and parts 1 containing temperature detect switch (TDS) parcel one deck dielectric layer 2, the erosion of dielectric layer 2 ability carrene is soluble in water again, the surface parcel casting glue glue-line 3 of dielectric layer, embedding glue-line 3 is easy to dissolve by carrene or containing the double solvents of carrene, there is insulating material 4 on the surface of casting glue glue-line 3, the outside of insulating material 4 is aluminum shells 5, there is the baking vanish layer 6 of a protection and decoration the outside of aluminum shell 5, the heat that heat-transfer device 7 produces heating element on circuit board exports to shell 5 housings.Through above improvement, can first with solvent, casting glue be removed, then make water that medium is removed, just can keep in repair, do over again or regeneration components and parts or raw material wherein, the invention solves that people expect to solve and the maintenance problem of unsolved casting glue electronic product always, production, the use cost of the electronic product of casting glue have been reduced significantly, be beneficial to electronic product universal of casting glue, realize again the reconstituted circularly of components and parts or raw material, can save ample resources and be conducive to environmental protection.
The foregoing is only the preferred embodiments of the present invention; not thereby limit the scope of the claims of the present invention; every equivalent structure or conversion of equivalent flow process that utilizes specification of the present invention and accompanying drawing content to do; or be directly or indirectly used in other relevant technical fields, be all in like manner included in scope of patent protection of the present invention.
Claims (10)
1. an electronic product for novel casting glue, comprising: components and parts, the embedding glue-line of casting glue parcel.It is characterized in that: between described embedding glue-line and components and parts, have removable dielectric layer by components and parts and casting glue isolation.
2. as claim
1the electronic product of novel casting glue, it is characterized in that: described dielectric layer partly covers components and parts.
3. the electronic product of novel casting glue as claimed in claim 1, is characterized in that: described medium is film layer by layer.
4. the electronic product of novel casting glue as claimed in claim 1, is characterized in that: described dielectric layer comprises: the dielectric layer of ease of solubility, fusible dielectric layer, decomposable dielectric layer.
5. the electronic product of the novel casting glue as described in claim 1,23 or 4, is characterized in that: described protective layer or film are composite bed or composite membrane, and described protective layer or film can have the insulating material of heat conductivility.
6. the electronic product of the novel casting glue as described in claim 1,2,3 or 4, is characterized in that: described embedding glue-line is between dielectric layer and housing.
7. the electronic product of the novel casting glue as described in claim 1,2,3 or 4, is characterized in that: between described embedding glue-line and housing, can have insulating material or other materials.
8. the electronic product of the novel casting glue as described in claim 1,2,3 or 4, it is characterized in that: the electronic product of described novel casting glue is provided with temperature sensor or temperature detect switch (TDS), can be under dielectric layer or film or surface or centre be provided with temperature sensor or temperature detect switch (TDS).
9. the electronic product of the novel casting glue as described in claim 1,2,3 or 4, is characterized in that: have the heat-transfer device through protective layer or diaphragm.
10. the electronic product of the novel casting glue as described in claim 1,2,3 or 4, is characterized in that: the shell of the electronic product of described novel casting glue can be the ceramic material of high thermal conductivity coefficient.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201310035098.XA CN103582369A (en) | 2012-08-09 | 2013-01-23 | Novel pouring sealant electronic product |
Applications Claiming Priority (5)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201220391269 | 2012-08-09 | ||
| CN201220391269.3 | 2012-08-09 | ||
| CN201220445986.X | 2012-08-25 | ||
| CN201220445986 | 2012-08-25 | ||
| CN201310035098.XA CN103582369A (en) | 2012-08-09 | 2013-01-23 | Novel pouring sealant electronic product |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN103582369A true CN103582369A (en) | 2014-02-12 |
Family
ID=50052944
Family Applications (2)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201310035098.XA Pending CN103582369A (en) | 2012-08-09 | 2013-01-23 | Novel pouring sealant electronic product |
| CN201320053989.3U Expired - Fee Related CN203554840U (en) | 2012-08-09 | 2013-01-23 | Novel potting electronic product |
Family Applications After (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201320053989.3U Expired - Fee Related CN203554840U (en) | 2012-08-09 | 2013-01-23 | Novel potting electronic product |
Country Status (1)
| Country | Link |
|---|---|
| CN (2) | CN103582369A (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110401086A (en) * | 2019-07-24 | 2019-11-01 | 苏州祥龙嘉业电子科技股份有限公司 | A kind of forming method of plug-in connector for electric connection |
| CN111446348A (en) * | 2020-04-06 | 2020-07-24 | 深圳市洲明科技股份有限公司 | Packaging method and L ED lamp panel |
| CN113345320A (en) * | 2021-06-28 | 2021-09-03 | 业成科技（成都）有限公司 | Anti-disassembly packaging structure and anti-disassembly packaging method |
-
2013
- 2013-01-23 CN CN201310035098.XA patent/CN103582369A/en active Pending
- 2013-01-23 CN CN201320053989.3U patent/CN203554840U/en not_active Expired - Fee Related
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110401086A (en) * | 2019-07-24 | 2019-11-01 | 苏州祥龙嘉业电子科技股份有限公司 | A kind of forming method of plug-in connector for electric connection |
| CN111446348A (en) * | 2020-04-06 | 2020-07-24 | 深圳市洲明科技股份有限公司 | Packaging method and L ED lamp panel |
| CN111446348B (en) * | 2020-04-06 | 2021-04-13 | 深圳市洲明科技股份有限公司 | Packaging method and LED lamp panel |
| CN113345320A (en) * | 2021-06-28 | 2021-09-03 | 业成科技（成都）有限公司 | Anti-disassembly packaging structure and anti-disassembly packaging method |
Also Published As
| Publication number | Publication date |
|---|---|
| CN203554840U (en) | 2014-04-16 |
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|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C02 | Deemed withdrawal of patent application after publication (patent law 2001) | ||
| WD01 | Invention patent application deemed withdrawn after publication |
Application publication date: 20140212 |