CN103578658A - Manufacturing method and manufacturing device for insulated wire - Google Patents
Manufacturing method and manufacturing device for insulated wire Download PDFInfo
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- CN103578658A CN103578658A CN201210336235.9A CN201210336235A CN103578658A CN 103578658 A CN103578658 A CN 103578658A CN 201210336235 A CN201210336235 A CN 201210336235A CN 103578658 A CN103578658 A CN 103578658A
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Abstract
The invention provides a manufacturing method for an insulated wire, wherein an organic solvent soaks through gaps between resin particles indeed to make the gaps disappear, so that the resin particles are dissolved, and the insulated wire which has few pores and an excellent insulation characteristic is obtained. According to the manufacturing method, a conductor 1 is made to move in a plating tank 10 from bottom to top so that the numerous resin particles 11 can be attached to the conductor 1 to form a sparse electroplated envelope, a mixed organic solvent K formed by mixing steam J of the organic solvent with mist spray M of an organic solvent sprayed from a spray nozzle 21 is made to be contacted with the sparse electroplated envelope so that the resin particles 11 of the sparse electroplated envelope can be dissolved to form a dense electroplated envelope, and then the dense electroplated envelope is sintered to the conductor 1 to form an insulating layer on the conductor 1 in a wrapping mode.
Description
The present invention relates to a kind of manufacture method and manufacturing installation of insulated electric conductor.
In the past, the insulated electric conductor such as magnetic wire be widely used insulating barrier coating is formed to the conductors such as copper and insulated electric conductor.As the manufacture method of this insulated electric conductor, make countless resin particles be attached to the conductor passing through in electroplating bath and form plating tunicle, then to electroplating tunicle, carry out sintering, with coating on conductor, form insulating barrier (for example,, with reference to patent documentation 1).
But, if only make it pass through electroplating bath, can only form each other the many thin plating tunicles in gap as the reason of pore at the countless resin particles that adhere to, therefore before sintering processes, carry out resin particle to be dipped in the liquid of organic solvent and to make it to dissolve to reduce the dissolution process (for example,, with reference to patent documentation 2) in gap.
Prior art document
Patent documentation
Patent documentation 1: TOHKEMY 2010-140641 communique
Patent documentation 2: Japanese kokai publication hei 3-241609 communique
Summary of the invention
The technical problem that invention will solve
Yet, even be dipped in the liquid of a large amount of organic solvents being formed with conductor that dredge to electroplate tunicle, also exist surface tension etc. to cause liquid not soak into resin particle gap each other, fully the problem of dissolving resin particulate.In addition, consider that the liquid of organic solvent brings the possibility of baneful influence high to surrounding environment, thereby the reduction of use amount is expected.
Therefore, the object of the invention is to, make organic solvent positively soak into the gap between above-mentioned resin particle, so that the mode dissolving resin particulate that this gap disappears, thereby provide manufacture method and the manufacturing installation of the insulated electric conductor of the excellent in insulation characteristic that pore is few.
And then object is also to reduce the use amount of organic solvent, and air conservation.
The technological means of technical solution problem
To achieve these goals, the manufacture method of insulated electric conductor of the present invention is following method: conductor is moved from bottom to top in electroplating bath, so that countless resin particles are attached to this conductor, form to dredge and electroplate tunicle, the steam of mixed organic solvents is contacted with above-mentioned thin plating tunicle with the mixed organic solvents that the organic solvent spraying being obtained by injection nozzle spraying forms, so that dissolving, the above-mentioned resin particle of above-mentioned thin plating tunicle forms cipher telegram plating tunicle, then, above-mentioned cipher telegram plating tunicle is sintered in to above-mentioned conductor, to form insulating barrier in this conductor coating.
In addition, the manufacturing installation of insulated electric conductor of the present invention has: electroplating bath, forms for making countless resin particles be attached to mobile from bottom to top conductor to dredge and electroplate tunicle; Mixing channel, mixes to make mixed organic solvents by the steam of organic solvent with the spraying of the organic solvent spraying from injection nozzle; Treatment trough, is communicated with, for above-mentioned mixed organic solvents is contacted with above-mentioned thin plating tunicle, forms simultaneously cipher telegram plating tunicle with this mixing channel; And sintering furnace, for above-mentioned cipher telegram plating tunicle is sintered in to above-mentioned conductor, to form insulating barrier in this conductor coating.
In addition, above-mentioned mixing channel has: above-mentioned injection nozzle, hold the hydrops portion of the liquid of organic solvent, and for the aforesaid liquid of the organic solvent in this hydrops portion being heated produce the heater portion of the above-mentioned steam of organic solvent.
In addition, above-mentioned mixing channel also has the containment wall portion for preventing that the above-mentioned spraying that obtains of spraying from directly contacting with above-mentioned thin plating tunicle.
In addition, the top of above-mentioned treatment trough is provided with the suction oral area that aspirates, reclaims for the above-mentioned mixed organic solvents in this treatment trough, and then the position above this suction oral area also has the air jetting device that sprays air downwards.
According to the manufacture method of insulated electric conductor of the present invention and manufacturing installation, resin particle is positively soaked into by organic solvent each other, boundary between resin particle is dissolved in the mode disappearing, can form cipher telegram plating tunicle substantially very close to each other between resin particle, obtain the few high-quality insulated electric conductor of pore.Both can be efficiently and positively reduce the gap between resin particle by a small amount of organic solvent.By using injection nozzle, can easily adjust the amount of organic solvent, use amount and the discharge capacity to atmosphere that can significantly cut down organic solvent.
Accompanying drawing explanation
[Fig. 1] is the simple pie graph of major part of an execution mode that shows the manufacturing installation of insulated electric conductor of the present invention.
[Fig. 2] is the amplification sectional view of major part of the manufacturing installation of insulated electric conductor.
[Fig. 3] is the A-A sectional view of Fig. 2.
[Fig. 4] shows that an example reclaims the simple pie graph of pipe arrangement.
[Fig. 5] is Action Specification figure.
[Fig. 6] is Action Specification figure.
[Fig. 7] is Action Specification figure.
[Fig. 8] is Action Specification figure.
Symbol description
1 conductor
2 dredge plating tunicle
3 cipher telegram plating tunicles
4 insulating barriers
10 electroplating baths
11 resin particles
20 mixing channels
21 injection nozzles
22 hydrops portions
24 heater portions
25 containment wall portions
30 treatment troughs
30a top
36 suction oral areas
40 sintering furnaces
51 air jetting devices
D air
E liquid
J steam
K mixed organic solvents
M spraying
Embodiment
Below, based on illustrated execution mode, describe the present invention in detail.
The manufacturing installation of insulated electric conductor of the present invention, as shown in an execution mode of Fig. 1, have: conductor 1 that (direction of arrow G) moves from bottom to top, when can store electroplate liquid 19, make countless resin particles 11 be attached to the electroplating bath 10 of conductor 1, the varnish of taking out of that varnish removes of not electroplating that covers plated resin particulate 11 is removed to equipment 90, the mixing channel 20 that the steam J of organic solvent and the spraying M of organic solvent is mixed to prepare to mixed organic solvents (fluid-mixing) K, when being communicated with mixing channel 20, be attached to the treatment trough 30 of dissolving of the resin particle 11 of conductor 1, and the sintering furnace 40 that resin particle 11 is sintered in to conductor 1.In addition, although diagram is omitted, also there is the roll out roller of lower position so that conductor 1 is sent that is configured in electroplating bath 10, and the be involved in roller of the top position that is configured in sintering furnace 40 so that conductor 1 is introduced.
Electroplating bath 10 is configured to: when inserting negative electrode 18,18, can store and have countless resin particles 11 as the electroplate liquid (plating varnish) 19 of solute, and the entrance hole by bottom wall portion as anodal conductor 1 is passed through from bottom to top continuously.As illustrated in Figures 5 and 6, make electronegative countless resin particles 11 to surround shape, be plated on the outer peripheral face 1a of conductor 1.
Taking varnish out of removes equipment 90 and has after by electroplating bath 10 and remove a pair of air-brush 91,91 of not electroplating varnish.A pair of air-brush 91,91 is configured to clamp conductor 1 and (in the both sides of conductor 1) setting relatively, and for example, towards the angle of stipulating (oblique below).
As shown in Figure 2, mixing channel 20 have conductor 1 in inside from bottom to top continuously by the mixing chamber 28 of (walking).Have and conductor 1 is imported to the importing oral area 27 of mixing chamber 28 from below, and the connection oral area 29 being communicated with treatment trough 30.Mixing channel 20 is for preventing that mixed organic solvents K is from importing oral area 27 and being communicated with the sealing shape flowing out beyond oral area 29.
In addition, in Fig. 2 and Fig. 3, mixing channel 20 has: the injection nozzle 21 of the spraying M of spraying organic solvent in general horizontal direction (direction substantially vertical with the length direction of conductor 1), hold the hydrops portion 22 of the liquid E of organic solvent, and the heater portion 24 that (below of hydrops portion 22) arranges in bottom wall portion 28c for the liquid E in hydrops portion 22 being heated produce the steam J of organic solvent.Heater portion 24 carries out the temperature adjustment of the vaporized of liquid E and steam J.In addition, in the side wall portion 28b of mixing channel 28, there is too heater portion 24, so that the temperature in groove is adjusted.The heater portion 24 that can say side wall portion 28b is evenly incubated in groove in order to keep.
And then mixing channel 20 also has the planar containment wall portion 25 of vertical wall, its spraying M that prevents ejection and the resin particle 11 that is attached to conductor 1 directly (point-blank) contact.
In addition, although diagram is omitted, preferably heater portion 24 is set to keep more equably the temperature of mixing channel 20 in the inside of containment wall portion 25.
As shown in Figure 3, containment wall portion 25 is configured to: with between parallel (mixing chamber 28) sidewall 28b, 28b of injection direction of spraying M, and (mixing chamber 28) bottom wall portion 28c between and and hydrops portion 22 between partition distance (formation gap), so that the spraying M of ejection is around to containment wall portion 25 back sides, be full of the position of walking that floats on conductor 1.So, by containment wall portion 25, form the circuitous path that leads to conductor 1 side.
As shown in Figure 4, injection nozzle 21 is connected with the tank T that stores the liquid E of organic solvent with pump P by transfer tank t.Under the pressure and normal temperature of regulation, the spraying M that is the organic solvent more than particle diameter 10 μ m and below 100 μ m by the liquid E spraying of organic solvent.
As shown in Figure 2, by heater portion 24, the liquid E of the organic solvent in hydrops portion 22 is heated to 120 ℃～150 ℃, as particle diameter 0.1 μ～be less than the steam of 10 μ m and evaporate.So, in hydrops portion 22, by organic solvent (liquid E) being heated near boiling point, thereby produce steam (gas) J.In addition, the composition of the spraying M of organic solvent and the steam J of organic solvent is identical.
In addition, heater portion 24 is configured to roof 28a and the wall portion that is provided with the mixing chamber 28 beyond the injection side wall portion 28d of injection nozzle 21 to heat that inside is incubated.That is, the heating side wall portion 28b of heater portion 24,28b, bottom wall portion 28c, spray the subtend wall 28e of portion, with by indoor heat insulating.In addition, (being disposed at the below of hydrops portion 22) the heater portion 24 by bottom wall portion 28c, is heated to 120 ℃～150 ℃ by the liquid E of the organic solvent of hydrops portion 22.The steam J producing provides heat energy well to the spraying M efficiency of injection nozzle 21, and the M that will spray heats at once, more than fluid-mixing (mixed organic solvents) K that makes to flow to treatment trough 30 is 50 ℃ and below 80 ℃, more preferably more than 60 ℃ and below 80 ℃.So, in order to control temperature, be preferably communicated with oral area 29 (the bottom 30b for the treatment of trough 30) setting (abridged in figure) temperature sensor, heater portion 24 is carried out to on-off control (temperature regulates and controls).
Air jetting device 51 be arranged on upper opening portion 52 for conductor 1 is drawn to outside from top cover portion 50 near, the air of (top 30a) in top cover 50 is pressed into the mode of below, make air D ejection.By forming such structure, the efficiency that mixed organic solvents K is enclosed in treatment trough 30 improves, and also suppresses mixed organic solvents K simultaneously and flows out from upper opening portion 52.
In addition, there is recovery pipe arrangement 60 as shown in Figure 4.Be provided with the suction pipe arrangement 61 being connected with the suction oral area 36 for the treatment of trough 30, with the valve V that is connected of lower side with suction pipe arrangement 61.In addition, have for by valve V to the recycling pipe arrangement 63 of the organic solvent of the tank T transportation of liquefied being connected with injection nozzle 21, and the organic solvent for the treatment of trough 30 and the interior drippage of mixing channel 20 (liquefaction) is recycled to tank T return to pipe arrangement 64.Should illustrate, although diagram is omitted, at the assigned position of pipe arrangement, be provided with the exhauster(-tor for generation of suction force.In addition, return to pipe arrangement 64 and also preferably add the pipe arrangement portion of branch that is connected with the bottom 30b for the treatment of trough 30 of diagram abridged etc.
Making valve V that the liquid Ka (the liquid part Ka of the mixed organic solvents K of suction) in suction pipe arrangement 61 is delivered to tank T recycles.Make to aspirate gas Kb (the gas part Kb of the mixed organic solvents K of suction) in pipe arrangement 61 after the regeneration such as carry out that concentration adjustment, impurity are removed is processed, turn back to tank T and recycle.
The using method of the manufacturing installation of the insulated electric conductor of the invention described above (effect) and manufacture method are described.
As shown in Figure 1, make conductor 1 interior when mobile at electroplating bath 10 from bottom to top, as shown in Figure 5, countless resin particles 11 can be attached to the outer peripheral face 1a of conductor 1.As shown in Figure 6, be attached between the resin particle 11 of conductor 1 and resin particle 11 and after sintering processes, form minimum gap 12, described minimum gap 12 is the reasons that cause pore.That is to say, countless resin particles 11 are sparsely attached to by the conductor 1 in electroplating bath 10, and form to dredge, electroplate tunicle 2.
By the conductor 1 in electroplating bath 10, be attached with to cover and dredge the not plating varnish of electroplating tunicle 2 (plated resin particulate 11).By air-brush 91,91, this not being electroplated to varnish removes.In addition, by conductor 1 is moved with vertical configuration, compare with the situation with horizontal movement, can make unnecessary electroplate liquid 19 (not electroplating varnish) fall by deadweight, the mode that can make resin particle 11 reach even shape to dredge the thickness of plating tunicle 2 is simultaneously attached to the outer peripheral face 1a of conductor 1.
And, as depicted in figs. 1 and 2, make to be formed with the thin conductor 1 of electroplating tunicle 2 in the interior movement of mixing channel 20.
In mixing channel 20, can before being imported into, conductor 1 (in advance) prepare mixed organic solvents K, and also can be at conductor 1 by preparation continuously in process.
Under the expulsion pressure of regulation, by the spraying M of injection nozzle 21 ejection organic solvents.By containment wall portion 25, the spraying M of ejection is not directly sprayed onto conductor 1, but around to containment wall portion 25 back sides (carrying out roundabout), floats on the shift position of conductor 1 with dense state.For the spraying M of ejection, can expulsion pressure, particle diameter, spray amount fine setting be extremely suitable for most to the state of the dissolution process of resin particle 11 by the operation of injection nozzle 21 or pump P.
Liquid E by the organic solvent in 24 pairs of hydrops portions 22 of heater portion heats, to produce the steam J of organic solvent, but in the mixing channel 20 of sealing state roughly, be full of so (high temperature) steam J through heating, spraying M is ejected to this steam J from injection nozzle 21, mix, and be endowed from the heat energy of (high temperature) steam J and activate, and, follow the volumetric expansion of the generation of steam J to make the pressure in mixing channel 20 also increase, the spraying M (together with steam J) that has been endowed heat energy is supplied to treatment trough 30 from being communicated with oral area 29 as shown in Fig. 3 arrow KO.So, the steam J of organic solvent play by compared with its enough a large amount of spraying M as shown in arrow KO, send into the function (effect) of the carrier in treatment trough 30.
During repeat specification, spraying M is by steam J heating (giving heat energy), and mixing, rises thus for dissolving the activity of organic solvent, compares with the spraying M of normal temperature, carries out more efficiently dissolution process.In addition, E compares with liquid, and mixed organic solvents K is subject to capillary impact less, and positively soaks into gap 12, carries out dissolution process.
In addition, roof 28a is not provided with heater portion 24, thereby mixed organic solvents K drippage (making the liquid of organic solvent be attached to roof 28a and fall), because the concentration of organic solvent is high, so this drop is back to tank T and recycles by returning to pipe arrangement 64.Or, fall in hydrops portion 22 again by vaporized.
Because the above-below direction size (highly) for the treatment of trough 30 is enough large, so in treatment trough 30, the thin plating tunicle 2 of conductor 1 (with comparing in the interior movement of mixing channel 20) contacts with mixed organic solvents K for a long time, thereby positively contacts and obtain dissolution.Organic solvent soaks between resin particle 11,11 gap 12 (with reference to Fig. 6) each other, and resin particle 11 is dissolved, and as shown in Figure 7, forms almost very close to each other 12 cipher telegram plating tunicle 3.
In addition, during the not enough above-mentioned lower limit of the temperature of mixed organic solvents K, the dissolution process spended time of resin particle 11, while surpassing higher limit, the dissolving of resin particle 11 is excessively carried out, the spended time that simultaneously liquefies, organic efficiency reduces.
In addition, by the conductor 1 by treatment trough 30 in the interior movement of sintering furnace 40.In sintering furnace 40, cipher telegram is plated to tunicle 3 and at 200 ℃～300 ℃, be sintered in conductor 1, as shown in Figure 8, to form the few insulating barrier 4 of pore in conductor 1 coating.
In addition, as shown in Figure 4, from the suction oral area 36 for the treatment of trough 30, mixed organic solvents K is sucked, reclaim.The liquid part Ka (directly) of mixed organic solvents K in suction pipe arrangement 61 sends into tank T and recycles.In addition, the gas part Kb in suction pipe arrangement 61 regenerates after processing (concentration adjustment or impurity are removed), sends into tank T and recycles.
By make to spray M and steam J, mix, can efficiency reclaim in a large number well organic solvent.
Suppose only to make the steam J of organic solvent to flow into from the top 30a for the treatment of trough 30, and bottom 30b arrange suction oral area 36 carry out forced exhaust, be difficult to the amount of the organic solvent in treatment trough 30 to be finely tuned, simultaneously because the organic solvent contacting with thin plating tunicle 2 is few, thereby must supply with in a large number, a large amount of exhaust, the waste of organic solvent increases, the recovery of the steam J difficulty (organic efficiency is poor) that becomes, and make being discharged in atmosphere of harmful organic solvent.Compare with the method (device) of above-mentioned only steam J, method of the present invention (device) can cut down approximately 80% by the use amount of organic solvent, also airborne release (discharge) amount can be cut down to approximately 80%.
In addition, in treatment trough 30, even if be full of spraying M, but heat of gasification during due to atomization also can become low temperature or normal temperature, and activity reduces and cannot obtain sufficient dissolution.In addition, be difficult to floating and dredge to electroplate tunicle 2 contact required for a long time.
Should illustrate, design of the present invention can change, and the organic solvents such as roller of for example, can between treatment trough 30 and sintering furnace 40, drying oven be set, removing the liquid of organic solvent are removed equipment.Should illustrate, the shape of cross section of conductor 1 is restriction not, can be also square beyond rectangle, hexagon etc.In addition, preferably with heat-insulating material, surround mixing channel 20 and treatment trough 30, or form surrounding wall portion with heat-insulating material.
As mentioned above, the present invention makes conductor 1 from bottom to top in the interior movement of electroplating bath 10, so that countless resin particles 11 are attached to conductor 1, form to dredge and electroplate tunicle 2, the mixed organic solvents K that the spraying M of the organic solvent that makes the steam J of mixed organic solvents and spray from injection nozzle 21 forms contacts with the thin tunicle 2 of electroplating, so that dredge the resin particle 11 of plating tunicle 2, dissolve and formation cipher telegram plating tunicle 3, then, cipher telegram is plated to tunicle 3 and be sintered in conductor 1, to form insulating barrier 4 in conductor 1 coating, thereby can make organic solvent positively soak into resin particle 11, 11 each other, make resin particle 11, 11 boundaries are each other dissolved in the mode disappearing, and form almost very close to each other 12 cipher telegram, plate tunicle 3, can obtain the high-quality insulated electric conductor of pore few (there is no pore).In addition, can efficiently and positively reduce the gap 12 between resin particle 11,11 by organic solvent.Owing to acting on the thin organic solvent of electroplating tunicle 2, be mainly spraying M, thereby can easily regulate by the setting of injection nozzle 21.Can significantly cut down the use amount of the organic solvent (liquid E) that dissolution process integral body used, and the discharge rate to atmosphere, manufacturing installation can be simplified.
In addition, owing to having for making countless resin particles 11 be attached to mobile from bottom to top conductor 1, form the electroplating bath 10 of dredging plating tunicle 2, the mixing channel 20 that steam J by organic solvent and the spraying M of the organic solvent spraying from injection nozzle 21 is mixed to prepare to mixed organic solvents K, be communicated with mixing channel 20, simultaneously for make mixed organic solvents K with dredging that electric tunicle 2 contacts the treatment trough 30 that forms cipher telegram plating tunicle 3, and be sintered in conductor 1 to form the sintering furnace 40 of insulating barrier 4 in conductor 1 coating for cipher telegram being plated to tunicle 3, thereby can make organic solvent positively soak into resin particle 11, 11 each other, make resin particle 11, 11 boundaries are each other dissolved in the mode disappearing, and form almost very close to each other 12 cipher telegram, plate tunicle 3, can obtain the high-quality insulated electric conductor of pore few (there is no pore).In addition, can efficiently and positively reduce the gap 12 between resin particle 11,11 by organic solvent.Owing to acting on to dredge, electroplate the organic solvent of tunicle 2 as long as be spraying M, thereby can easily regulate by the setting of injection nozzle 21.Can significantly cut down the use amount of (the liquid E) of used organic solvent, and the discharge rate to atmosphere, manufacturing installation can be simplified.
In addition, because mixing channel 20 has injection nozzle 21, hold the hydrops portion 22 of the liquid E of organic solvent, and the heater portion 24 of heating to produce the steam J of organic solvent for the liquid E of the organic solvent in hydrops portion 22, thereby can easily adjust the temperature and pressure of controlling in mixing channel 20, can give the activity (dissolution process effect) of spraying the suitable heat energy of M and improving spraying M, and, can send into suitable quantity delivered by treatment trough 30 upward.And then, while being also provided with heater portion 24 in side wall portion 28b, can keep equably the temperature in mixing channel 20.
In addition, because mixing channel 20 has the containment wall portion 25 for preventing that the spraying M of ejection from directly contacting with thin plating tunicle 2, thereby the spraying M of ejection is at the interior mixed organic solvents K that is fully mixed into of mixing channel 20, and contact equably with the outer peripheral face 1a of conductor 1, can be efficiently and positively carry out dissolution process.And then, while being also provided with heater portion 24 in this containment wall portion 25, can keep more equably the temperature in mixing channel 20.
In addition, because the top 30a for the treatment of trough 30 is provided with the suction oral area 36 that aspirates, reclaims for the mixed organic solvents K in treatment trough 30, and then there is in the top position of suction oral area 36 the air jetting device 51 that sprays air D downwards, thereby can make mixed organic solvents K be full of fully in treatment trough 30, can be by suction oral area 36, efficiently and positively reclaim mixed organic solvents K, and can not be discharged to lavishly in atmosphere (outside air).
In addition, among the mixed organic solvents K from 36 suctions of suction oral area, in suction pipe arrangement 61, liquid Ka person can by valve V and in tank T (directly) recycling, in suction pipe arrangement 61, gas Kb person can process by regeneration that (operation) carries out that impurity is removed, recycle after concentration adjustment.As a result, can significantly cut down the consumption of (the liquid E) of organic solvent.
Claims (5)
1. a manufacture method for insulated electric conductor, is characterized in that,
Make conductor (1) mobile in electroplating bath (10) from bottom to top, so that countless resin particle (11) is attached to this conductor (1), form to dredge and electroplate tunicle (2),
The mixed organic solvents (K) that the steam (J) of mixed organic solvents and the spraying (M) of the organic solvent spraying from injection nozzle (21) are formed contacts with above-mentioned thin plating tunicle (2), so that dissolving, the above-mentioned resin particle (11) of above-mentioned thin plating tunicle (2) forms cipher telegram plating tunicle (3)
Then, above-mentioned cipher telegram plating tunicle (3) is sintered in to above-mentioned conductor (1), to form insulating barrier (4) in this conductor (1) coating.
2. a manufacturing installation for insulated electric conductor, is characterized in that, has:
Electroplating bath (10), forms for making countless resin particles (11) be attached to mobile from bottom to top conductor (1) to dredge and electroplates tunicle (2),
Mixing channel (20), mixes to prepare mixed organic solvents (K) by the steam of organic solvent (J) with the spraying (M) of the organic solvent spraying from injection nozzle (21),
Treatment trough (30), makes above-mentioned mixed organic solvents (K) contact with above-mentioned thin plating tunicle (2) when being communicated with this mixing channel (20) and forms cipher telegram plating tunicle (3), and
Sintering furnace (40), for above-mentioned cipher telegram plating tunicle (3) is sintered in to above-mentioned conductor (1), to form insulating barrier (4) in this conductor (1) coating.
3. the manufacturing installation of insulated electric conductor according to claim 2, wherein, above-mentioned mixing channel (20) has above-mentioned injection nozzle (21), hold the hydrops portion (22) of the liquid (E) of organic solvent, and for the aforesaid liquid (E) of the organic solvent in this hydrops portion (22), heat to produce the heater portion (24) of the above-mentioned steam (J) of organic solvent.
4. the manufacturing installation of insulated electric conductor according to claim 3, wherein, above-mentioned mixing channel (20) has the containment wall portion (25) for preventing that the above-mentioned spraying (M) of ejection from directly contacting with above-mentioned thin plating tunicle (2).
5. according to the manufacturing installation of the insulated electric conductor described in claim 2,3 or 4, wherein, the top (30a) of above-mentioned treatment trough (30) is provided with the suction oral area (36) that aspirates, reclaims for the above-mentioned mixed organic solvents (K) in this treatment trough (30), and then in the top position of this suction oral area (36), has the air jetting device (51) that sprays air (D) downwards.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201210336235.9A CN103578658A (en) | 2012-07-27 | 2012-07-27 | Manufacturing method and manufacturing device for insulated wire |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201210336235.9A CN103578658A (en) | 2012-07-27 | 2012-07-27 | Manufacturing method and manufacturing device for insulated wire |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN103578658A true CN103578658A (en) | 2014-02-12 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201210336235.9A Pending CN103578658A (en) | 2012-07-27 | 2012-07-27 | Manufacturing method and manufacturing device for insulated wire |
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Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US3540990A (en) * | 1966-03-07 | 1970-11-17 | Mitsubishi Electric Corp | Electrocoating process |
| US20090136752A1 (en) * | 2007-11-26 | 2009-05-28 | Hitachi Cable, Ltd. | Insulated wire using a resin composition |
| CN101451257A (en) * | 2007-11-29 | 2009-06-10 | 住友电气工业株式会社 | Electroplating method of flat electric cable and method for manufacturing flat electric cable including the same |
| JP2010140641A (en) * | 2008-12-09 | 2010-06-24 | Mitsubishi Cable Ind Ltd | Manufacturing method of insulated wire |
-
2012
- 2012-07-27 CN CN201210336235.9A patent/CN103578658A/en active Pending
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US3540990A (en) * | 1966-03-07 | 1970-11-17 | Mitsubishi Electric Corp | Electrocoating process |
| US20090136752A1 (en) * | 2007-11-26 | 2009-05-28 | Hitachi Cable, Ltd. | Insulated wire using a resin composition |
| CN101451257A (en) * | 2007-11-29 | 2009-06-10 | 住友电气工业株式会社 | Electroplating method of flat electric cable and method for manufacturing flat electric cable including the same |
| JP2010140641A (en) * | 2008-12-09 | 2010-06-24 | Mitsubishi Cable Ind Ltd | Manufacturing method of insulated wire |
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Application publication date: 20140212 |