CN103568150A - Method for manufacturing epoxy molding compound powder - Google Patents
Method for manufacturing epoxy molding compound powder Download PDFInfo
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- CN103568150A CN103568150A CN201310499084.3A CN201310499084A CN103568150A CN 103568150 A CN103568150 A CN 103568150A CN 201310499084 A CN201310499084 A CN 201310499084A CN 103568150 A CN103568150 A CN 103568150A
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- Prior art keywords
- dry ice
- epoxy
- epoxy molding
- molding plastic
- powder
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- Processing And Handling Of Plastics And Other Materials For Molding In General (AREA)
Abstract
The invention relates to a method for manufacturing epoxy molding compound powder. The method comprises the following steps: preparing an epoxy module plastic piece, namely fully mixing epoxy resin and additional agents with determined components so as to obtain a mixture through fusion and trituration, mixing the mixture subjected to fusion and trituration and dry ice so as to form a thin plate, and pre-grinding to form the epoxy module plastic piece; preparing a dry ice piece, namely preparing the dry ice piece from dry ice in a dry ice feeding device; grinding the dry ice piece and the epoxy module plastic piece to powder in a grinding machine according to the flow rate ratio of 1:10; and removing the dry ice through sublimation so as to obtain the epoxy molding compound powder.
Description
Technical field
The invention belongs to macromolecular material and manufacture field, refer to especially a kind of method for the manufacture of epoxy molding plastic powder.
Background technology
Epoxy molding plastic (epoxy molding compounds, " EMCs ") refers to the same with thermosetting compound material being formed by epoxy resin and additive etc.Epoxy molding plastic is for sealing and/or sealing semiconductor device and semiconductor and other electron component.
Traditional epoxy molding plastic EMC is mixed into uniform mixture by epoxy resin and at least one additive, rotation and shear stress by screw and blade grind this mixture, and according to the desired use of EMC, the mixture melting grinding is ground to form to predetermined shape and size, for example, powder, sheet etc.
The routine of EMCs is ground and can be produced latent heat, causes sclerosis, and the powder of caking cannot be incorporated into compressing tablet process, thereby produces defective electronic component.
Prior art proposes to introduce liquid nitrogen or anti-caking agent in process of lapping, and these technology can cause the safety of EMC when grinding and the final quality problem of product, and production cost is high.Now also there is technology to propose to introduce the technical scheme of dry ice in process of lapping, dry ice in process of production, safer, and can not affect the quality of EMC, but still there is certain defect in the dry ice that existing technology is introduced, the sublimation temperature that is exactly dry ice is lower, and the temperature of EMC before entering into grinder is higher than the sublimation temperature of dry ice, does not reach desirable effect.
Summary of the invention
The object of the invention is existing employing in epoxy molding plastic powder production process, to introduce the deficiency of dry ice technical scheme, improvement project is proposed, pass through the technical program, the quality that can effectively improve dry ice epoxy molding plastic powder when epoxy molding plastic powder process of lapping, there will not be hardening phenomenon.
The present invention is achieved by the following technical solutions:
A kind of method of manufacturing epoxy molding plastic powder, its step comprises: prepare epoxy mold tablet, to determine that after the epoxy resin of component and additive fully mix, carrying out melting grinds and obtain mixture, melting is ground and obtains after mixture mixes with dry ice being processed into thin plate, and pre-grinding forms epoxy mold tablet;
Prepare dry ice sheet, dry ice is prepared in dry ice feeder to the dry ice sheet that average diameter is 10mm-20mm;
The ratio that is 1:10 in velocity ratio by dry ice sheet and epoxy mold tablet enters into grinder and carries out grind into powder;
By distillation, remove dry ice, obtain epoxy molding plastic powder.
Be 1.5% to prepare epoxy mold tablet after adding dry ice by weight percentage.
The present invention's beneficial effect is compared with the existing technology:
Add dry ice by the epoxy mold tablet stage of preparing in the technical program, can be reduced in the epoxy mold tablet feeding temperature while finally grinding, suppress the distillation of dry ice, improve the quality of product, reduce the use amount of dry ice.
The specific embodiment
Describe by the following examples technical scheme of the present invention in detail, should be understood that, following embodiment is only example, only can be used for explaining and technical scheme of the present invention being described, and can not to be interpreted as is the restriction to technical solution of the present invention.
In the present invention, in epoxy mold tablet except dry ice, remaining material composition is prior art, composition and content for the additive adding do not improve, therefore, at this, be not just described in detail, so long as each in original production process forms, all can be suitable for technical scheme of the present invention.
For dry ice feeder in the present invention and manufacture the technical scheme of dry ice sheet, and the technical scheme of dry ice sublimation, recovery is all prior aries, at this, is not also elaborated.
It is exactly to add dry ice in manufacturing epoxy mold tablet that key technology of the present invention is improved, its objective is initial temperature when can reduce epoxy mold tablet enters grinder, and the dry ice in epoxy mold tablet can reduce hardness and the intensity of epoxy mold tablet, the grinding effect of raising epoxy molding plastic powder and reduction particle diameter in sublimation process.
A kind of method of manufacturing epoxy molding plastic powder, its step comprises: prepare epoxy mold tablet, to determine that after the epoxy resin of component and additive fully mix, carrying out melting grinds and obtain mixture, melting is ground and obtains after mixture mixes with dry ice being processed into thin plate, be 1.5% to prepare epoxy mold tablet after adding dry ice by weight percentage, pre-grinding forms epoxy mold tablet;
Prepare dry ice sheet, dry ice is prepared in dry ice feeder to the dry ice sheet that average diameter is 10mm-20mm;
The ratio that is 1:10 in velocity ratio by dry ice sheet and epoxy mold tablet enters into grinder and carries out grind into powder;
By distillation, remove dry ice, obtain epoxy molding plastic powder.
Do not deviating from as the situation of the spirit and scope of following claims of the present invention, those of ordinary skills understand technical scheme of the present invention.
Claims (2)
1. a method of manufacturing epoxy molding plastic powder, it is characterized in that: its step comprises: prepare epoxy mold tablet, to determine that after the epoxy resin of component and additive fully mix, carrying out melting grinds and obtain mixture, melting is ground and obtains after mixture mixes with dry ice being processed into thin plate, and pre-grinding forms epoxy mold tablet;
Prepare dry ice sheet, dry ice is prepared in dry ice feeder to the dry ice sheet that average diameter is 10mm-20mm;
The ratio that is 1:10 in velocity ratio by dry ice sheet and epoxy mold tablet enters into grinder and carries out grind into powder;
By distillation, remove dry ice, obtain epoxy molding plastic powder.
2. the method for manufacture epoxy molding plastic powder according to claim 1, is characterized in that: be 1.5% to prepare epoxy mold tablet after adding dry ice by weight percentage.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201310499084.3A CN103568150A (en) | 2013-10-21 | 2013-10-21 | Method for manufacturing epoxy molding compound powder |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201310499084.3A CN103568150A (en) | 2013-10-21 | 2013-10-21 | Method for manufacturing epoxy molding compound powder |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN103568150A true CN103568150A (en) | 2014-02-12 |
Family
ID=50041279
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201310499084.3A Pending CN103568150A (en) | 2013-10-21 | 2013-10-21 | Method for manufacturing epoxy molding compound powder |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN103568150A (en) |
Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2000077851A1 (en) * | 1999-06-15 | 2000-12-21 | Sumitomo Bakelite Company Limited | Method of producing epoxy for molding semiconductor device, molding material, and semiconductor device |
| JP2002059418A (en) * | 2000-08-16 | 2002-02-26 | Sumitomo Bakelite Co Ltd | Method and apparatus for manufacturing thermosetting resin compound |
| CN101130176A (en) * | 2006-08-21 | 2008-02-27 | 第一毛织株式会社 | Method of protecting blocking and flow-ability drop for epoxy molding compound |
| CN101555343A (en) * | 2008-04-10 | 2009-10-14 | 德州市华兴塑胶制品有限公司 | Preparation method of high-fluidity amino molding plastic |
| CN101758570A (en) * | 2008-12-23 | 2010-06-30 | 张桂英 | Preparation process of epoxy resin composition for semiconductor packaging |
| CN102941140A (en) * | 2012-12-07 | 2013-02-27 | 江苏中鹏新材料股份有限公司 | Granularity sorting method for epoxy molding compound powder material |
| JP2013091253A (en) * | 2011-10-26 | 2013-05-16 | Kyocera Chemical Corp | Method of manufacturing epoxy resin molding material for sealing semiconductor, epoxy resin molding material for sealing semiconductor, and electronic component device |
-
2013
- 2013-10-21 CN CN201310499084.3A patent/CN103568150A/en active Pending
Patent Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2000077851A1 (en) * | 1999-06-15 | 2000-12-21 | Sumitomo Bakelite Company Limited | Method of producing epoxy for molding semiconductor device, molding material, and semiconductor device |
| JP2002059418A (en) * | 2000-08-16 | 2002-02-26 | Sumitomo Bakelite Co Ltd | Method and apparatus for manufacturing thermosetting resin compound |
| CN101130176A (en) * | 2006-08-21 | 2008-02-27 | 第一毛织株式会社 | Method of protecting blocking and flow-ability drop for epoxy molding compound |
| CN101555343A (en) * | 2008-04-10 | 2009-10-14 | 德州市华兴塑胶制品有限公司 | Preparation method of high-fluidity amino molding plastic |
| CN101758570A (en) * | 2008-12-23 | 2010-06-30 | 张桂英 | Preparation process of epoxy resin composition for semiconductor packaging |
| JP2013091253A (en) * | 2011-10-26 | 2013-05-16 | Kyocera Chemical Corp | Method of manufacturing epoxy resin molding material for sealing semiconductor, epoxy resin molding material for sealing semiconductor, and electronic component device |
| CN102941140A (en) * | 2012-12-07 | 2013-02-27 | 江苏中鹏新材料股份有限公司 | Granularity sorting method for epoxy molding compound powder material |
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Application publication date: 20140212 |