CN103567291A - Stamping die - Google Patents
Stamping die Download PDFInfo
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- CN103567291A CN103567291A CN201210267721.XA CN201210267721A CN103567291A CN 103567291 A CN103567291 A CN 103567291A CN 201210267721 A CN201210267721 A CN 201210267721A CN 103567291 A CN103567291 A CN 103567291A
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- fixed
- plate
- die
- pin
- die base
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Abstract
The invention relates to a stamping die comprising an upper support plate, an upper block, an upper die base, a lower die base, a lower block and a lower support plate. The upper block is fixed between the upper support plate and the upper die base. The lower block is fixed between the lower support plate and the lower die base. An upper clamp plate is fixed below the upper die base. Upper die plates are fixed at two ends of the bottom of the upper clamp plate. An upper stripping plate is fixed between the upper die plates. A lower clamp plate is fixed above the lower die base. Lower stripping plates are fixed at two ends of the top of the lower clamp plate. A lower die plate is fixed between the lower stripping plates. The stamping die has the advantages that the structure is simple, production cost is low, and product flatness is improved greatly.
Description
Technical field
The present invention relates to a kind of punch forming module.
Background technology
Along with automobile and electrical equipment development, intensity to its part is more and more stricter, the part strength of the drawing part quite intensity of other molding mode is best, but drawing part is other molding mode difficulty relatively, and the molding mode that adopted in the market, is according to digital-to-analogue forming height designing mould, do not reach often theoretical level, the flatness of molding flat is also difficult to reach requirement, and the maintenance repeatedly of correcting mould has extended manufacturing cycle of mould greatly.
Summary of the invention
The invention provides a kind of punch forming module.
The present invention is directed to the technical scheme that above-mentioned technological deficiency proposes is:
A kind of punch forming module, comprise mounting plate, patrix pin, upper bolster, die shoe, counterdie pin and bottom plate, between described mounting plate and upper bolster, be fixed with patrix pin, between described bottom plate and die shoe, be fixed with counterdie pin, the downside of described upper bolster is fixed with train wheel bridge, the downside two ends of described train wheel bridge are fixed with cope match-plate pattern, between described cope match-plate pattern, be fixed with de-plate, the upside of described die shoe is fixed with lower plate, the two ends of the upside of described lower plate are fixed with lower de-plate, between described lower de-plate, are fixed with lower bolster.
The invention has the beneficial effects as follows: simple in structure, cost of manufacture is lower, greatly improved the flatness of product.
Accompanying drawing explanation
Fig. 1 is structural representation of the present invention.
Wherein: 1, mounting plate, 2, patrix pin, 3, upper bolster, 4, train wheel bridge, 5, cope match-plate pattern, 6, upper de-plate, 7, lower bolster, 8, lower de-plate, 9, lower plate, 10, die shoe, 11, counterdie pin, 12, bottom plate.
The specific embodiment
A kind of punch forming module as shown in Figure 1, comprise mounting plate 1, patrix pin 2, upper bolster 3, die shoe 10, counterdie pin 11 and bottom plate 12, between described mounting plate 12 and upper bolster 3, be fixed with patrix pin 2, between described bottom plate 12 and die shoe 10, be fixed with counterdie pin 11, the downside of described upper bolster 3 is fixed with train wheel bridge 4, the downside two ends of described train wheel bridge 4 are fixed with cope match-plate pattern 5, between described cope match-plate pattern 5, be fixed with de-plate 6, the upside of described die shoe 10 is fixed with lower plate 9, the two ends of the upside of described lower plate 9 are fixed with lower de-plate 8, between described lower de-plate 8, be fixed with lower bolster 7.The invention has the beneficial effects as follows: simple in structure, cost of manufacture is lower, greatly improved the flatness of product.
Claims (1)
1. a punch forming module, comprise mounting plate, patrix pin, upper bolster, die shoe, counterdie pin and bottom plate, between described mounting plate and upper bolster, be fixed with patrix pin, between described bottom plate and die shoe, be fixed with counterdie pin, it is characterized in that: the downside of described upper bolster is fixed with train wheel bridge, the downside two ends of described train wheel bridge are fixed with cope match-plate pattern, between described cope match-plate pattern, be fixed with de-plate, the upside of described die shoe is fixed with lower plate, the two ends of the upside of described lower plate are fixed with lower de-plate, between described lower de-plate, are fixed with lower bolster.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201210267721.XA CN103567291A (en) | 2012-07-30 | 2012-07-30 | Stamping die |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201210267721.XA CN103567291A (en) | 2012-07-30 | 2012-07-30 | Stamping die |
Publications (1)
Publication Number | Publication Date |
---|---|
CN103567291A true CN103567291A (en) | 2014-02-12 |
Family
ID=50040493
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN201210267721.XA Pending CN103567291A (en) | 2012-07-30 | 2012-07-30 | Stamping die |
Country Status (1)
Country | Link |
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CN (1) | CN103567291A (en) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN104859177A (en) * | 2015-05-22 | 2015-08-26 | 苏州飞宇精密科技股份有限公司 | High-temperature thermal shield die |
CN106040860A (en) * | 2016-07-21 | 2016-10-26 | 东莞市豪顺精密科技有限公司 | Drawing die and drawing method |
Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2004136306A (en) * | 2002-10-16 | 2004-05-13 | Matsushita Electric Ind Co Ltd | Method and apparatus for forming magnesium alloy parts by warm pressing |
CN201329389Y (en) * | 2008-12-31 | 2009-10-21 | 广州市华冠精冲零件有限公司 | Sensor gear ring drawing die |
CN201455110U (en) * | 2009-08-17 | 2010-05-12 | 天津华舜汽配制造有限公司 | Stamping die for stretching shock absorber pallet |
CN201565516U (en) * | 2009-11-06 | 2010-09-01 | 深圳市同洲电子股份有限公司 | Punch and hardware punching die using punch |
CN202028693U (en) * | 2011-04-20 | 2011-11-09 | 上海汽车制动器有限公司 | Improved riveting multi-station die |
-
2012
- 2012-07-30 CN CN201210267721.XA patent/CN103567291A/en active Pending
Patent Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2004136306A (en) * | 2002-10-16 | 2004-05-13 | Matsushita Electric Ind Co Ltd | Method and apparatus for forming magnesium alloy parts by warm pressing |
CN201329389Y (en) * | 2008-12-31 | 2009-10-21 | 广州市华冠精冲零件有限公司 | Sensor gear ring drawing die |
CN201455110U (en) * | 2009-08-17 | 2010-05-12 | 天津华舜汽配制造有限公司 | Stamping die for stretching shock absorber pallet |
CN201565516U (en) * | 2009-11-06 | 2010-09-01 | 深圳市同洲电子股份有限公司 | Punch and hardware punching die using punch |
CN202028693U (en) * | 2011-04-20 | 2011-11-09 | 上海汽车制动器有限公司 | Improved riveting multi-station die |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN104859177A (en) * | 2015-05-22 | 2015-08-26 | 苏州飞宇精密科技股份有限公司 | High-temperature thermal shield die |
CN106040860A (en) * | 2016-07-21 | 2016-10-26 | 东莞市豪顺精密科技有限公司 | Drawing die and drawing method |
CN106040860B (en) * | 2016-07-21 | 2018-08-24 | 东莞市豪顺精密科技有限公司 | A kind of cupping tool and method for drawing |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
C06 | Publication | ||
PB01 | Publication | ||
SE01 | Entry into force of request for substantive examination | ||
SE01 | Entry into force of request for substantive examination | ||
C02 | Deemed withdrawal of patent application after publication (patent law 2001) | ||
WD01 | Invention patent application deemed withdrawn after publication |
Application publication date: 20140212 |