CN103562627B - LED light device - Google Patents

Abstract

The present invention relates to a kind of LED light device, it has: circuit board (13), on described circuit board, the axial direction along LED light device is provided with multiple light emitting diode (2)；Upper casing (5,28) and lower casing (6,40,50,60,71), described upper casing and described lower casing are connected to each other under the mounted state of LED light device and are securely maintained between described upper casing and described lower casing by circuit board (13).

Description

LED light device

Technical field

The present invention is based on a kind of LED light device, and described LED light device such as can be used as The substitute of fluorescent tube and use LED element (light emitting diode) as light source.

Background technology

WO 2011/012381 A1 discloses a kind of LED light device, wherein has substantially It is provided with multiple light emitting diode within the housing of circular cross section.Set in one form There are reflector and lens for beam-shaping.

Generally, LED light device to meet the safety about voltage contacts protection to want Ask, this is only used safety extra low voltage (SELV) SELV (Safety Extra Low Voltage, safety Extra Low Voltage) or the corresponding insulation to higher voltage is provided.Additionally, LED illumination dress The little weight put is desired.

Summary of the invention

It is an object of the invention to, it is provided that a kind of LED light device, described LED light device It is characterised by simple structure and high functional reliability.

Described purpose is realized by the feature illustrated in the present invention.

Particularly advantageous design is present in explained below.

Additionally, provide a kind of method for manufacturing LED light device, described side by the present invention Method can perform according to the feature of explained below alternatively.

According to an aspect of the LED light device according to the present invention, multiple light emitting diode edges The axial direction of LED light device is arranged on circuit boards.Upper casing and lower casing fill in LED illumination It is connected to each other under the mounted state put and circuit board is securely maintained at therebetween.This allows Simply with the most stable installation and light structures.

LED light device can comprise by thermal interfacial material, alternatively by silicone oilOintment based on silicone oil or there is the particles of packing material such as oxygen of heat conduction Changing the band (Bahn) that the material based on polymer of aluminum or boron nitride is made, described band can be extremely Partially or the most fully wrap up (gewickelt) circuit board and preferably have The hole passed for light emitting diode.Thus, it is ensured that light emitting diode and electronic unit had The cooling of effect.

Lower casing can have the cavity of the inside for accommodating electric device or electronic device.Upper Shell can exist the pillar of slant dilation, the end regions of described pillar can with circuit board or by The band contact that thermal interfacial material is made is fixed for position.Thus, the circuit board with band is firm Fix and be pressed in cooling body, without other clamping part.

LED light device can have in upper casing in lower casing or the most also penetrating part with For device pass into lower casing or in the hollow inner chamber of upper casing.Therefore, spatially stretch The device gone out can dispose to a certain extent in the way of sagging, to such an extent as to generally speaking achieves Greater compactness of structure.

LED light device preferably have at least one, optional two seal bootrs, described seal bootr can It is placed on the axial end portion of LED light device and can be connected with LED light device, such as Lockable, can be bonding or can tighten.At least one seal bootr can have part conic alternatively The section stretched, described section can guide from the circumferential zones of seal bootr until circuit board or band also And light can be provided to guide for the light loss avoided in enclosure interior.

At least one seal bootr can have one or more locking projections or other locking member Lock for upper casing and/or lower casing.This simple and stable allowing to need not other auxiliary body And the connection that also can again take apart.

The upper casing of LED light device can have the side pocket in axial direction stretched, and described side is recessed Portion can carry out gauge by the pillar of slant dilation and the upper casing section being parallel to circuit board stretching, extension.By This, form handle slot, to such an extent as to can easily and stably be caught by upper casing and keep in side, This simplify installation.Additionally, draw and alleviate weight and free gratifying appearance design.

Lower casing can the most such as with have the V-arrangement of internal cavities form or To have the form shaping of the triangle of internal cavities, to such an extent as to dispose in the cavities by by parts Probability effective cooling is provided.But, lower casing also is able to such as to have gelled T The form of shape is constituted, and this brings high cooling power.

Alternatively, the axial length of lower casing can be less than the axial length of circuit board and/or the axle of upper casing To length, wherein electric device and/or electronic device can be arranged on the axial end portion of lower casing and upper In region between the axial end portion of shell.Cross section is semicircular hollow housing parts alternatively Can covering device, to such an extent as to protection device and guarantee electrical contact protection.

Further aspect is that a kind of for manufacture LED light device, particularly have one or more Hereinbefore or the method for the LED light device of feature that is described below, wherein circuit board The band being made up of thermal interfacial material alternatively is wound around (umwickelt), and will have alternatively The circuit board of band is placed in the housing region between upper casing and lower casing, and upper casing and lower casing are subsequently Such as it is connected to each other by locking.Thereby, it is possible to will there is the circuit board of band alternatively with position Fixing mode keeps, without tightening or bonding.

One or two seal bootr can be applied to upper casing and lower casing or additional housing section On the axial end portion divided, to such an extent as to close these structures in the axial direction.

According to an aspect of the present invention, using cooling body, described cooling body can be fully by can The plastics of good heat conductive are constituted.This cooling body such as with squeezing and pressing method manufacture, but can also be able to According to other manufacture method, such as manufacture by means of foundry engieering.Cooling body allows whole cold But the good thermally coupled on body length and electric insulation, because need not necessarily exist the cooling body of metal Part.

Thus, draw light structure, to such an extent as to limit less than specific weight.Furthermore, it is possible to , with the higher voltage power supply higher than safety extra low voltage (SELV) (SELV), to such an extent as to can Use so-called NON-SELV structure.

Another aspect according to an embodiment of the invention, drive electronics can be arranged on and send out On the circuit board that optical diode (LED) is identical.Thereby, it is possible to guarantee that there is the pass that position is stable The compact structure of connection relation.Simplify total in this case, because circuit board applies To light emitting diode and the dual bearing function of drive electronics, i.e. any independence need not be arranged Holding structure.

Thus, it is also possible to, light emitting diode is set until two lamp holder ends, to such an extent as to bag The whole length including marginal area can provide the layout for light emitting diode.Electronic installation, example As drive electronics can be arranged on after light emitting diode, such as at the rear side of circuit board On.

Another aspect according to an embodiment of the invention, it is achieved the most large-area heat transfer, That is, it is ensured that effectively cool down.To this end, thermal interfacial material (TIM=Thermal can be arranged Interface Material), described thermal interfacial material guarantees to connect with the large-area of plastics cooling body Touch thus realize efficient heat transfer.For the most large-area heat transfer, it is preferably provided with From circuit board and each light emitting diode via big copper face to the big band being made up of TIM material And subsequently further to the hot-fluid of large-area plastics cooling body.

Accompanying drawing explanation

Hereinafter can elaborate the present invention according to embodiment.Accompanying drawing illustrates:

Fig. 1 illustrates the three-dimensional view of the embodiment of the LED light device according to the present invention；

Fig. 2 illustrates the cross section running through the LED light device according to Fig. 1；

Fig. 3 illustrates the layer being made up of thermal interfacial material (TIM) in the unfolded state or band；

What Fig. 4 was shown under the most unfolded state has device and is positioned at the thermal interfacial material of lower section The top view of rear side of circuit board；

Fig. 5 illustrates the top view of the circuit board according to Fig. 4 with contrary position；

Fig. 6 illustrate the end regions of an embodiment of the LED light device according to the present invention together with The seal bootr (extremity piece) being still not inserted into；

Fig. 7 illustrates another view of the end regions of the embodiment of LED light device；

Fig. 8 illustrates the embodiment of cooling body；

Fig. 9 to 13 illustrates another embodiment of the LED light device according to the present invention；

Figure 14 to 16 illustrate the embodiment of the LED light device according to the present invention cooling body or under The form of implementation of the change of housing；

Figure 17 to 19 illustrates regarding of another embodiment of the LED light device according to the present invention Figure.

It is embodied as form

Shown in Fig. 1 to 8, the first embodiment of LED light device 1 according to the present invention is vertical Body figure, wherein figure 2 illustrates the cross-sectional view running through LED light device 1.LED illumination Device 1 has the shape of the fluorescent lamp with substantially circular cross section in outside, and can It is used as the substitute of this fluorescent lamp.

To this end, the electrical contacts in the end regions of LED light device 1 can have and fluorescence Lamp connect the identical structure of contact site.LED light device 1 has multiple light emitting diode (LED) 2, described light emitting diode with a row or multi-row or figure according to other axially Arrange to distribution in the whole length of LED light device 1 successively on direction.In LED illumination Seal bootr 3 is set on the axial end portion of device 1.

As seen from Figure 2, LED light device 1 has upper casing 5 and is configured to cooling body 6 Lower casing, described upper casing has the most semicircular cross section, and the cross section of described lower casing is same There is the most semicircular structure.Upper casing 5 and cooling body 6 in its marginal area directly the most each other Recline and such as lock or connect in another manner, to such an extent as to real when assembling Existing substantially circular cross section.But, substitute circular cross section, it is also possible to realize arbitrarily its Its any applicable shape of cross section, such as ellipse or polygonal shape.

Cooling body 6, i.e. lower casing have protuberance 7 in it points to the marginal area of upper casing, described prominent Go out portion and there is the head of thickening, in described engagement to the portion of leaving a blank accordingly 8 of upper casing 5 and Hook with hook-shaped protuberance 9 corresponding, that protrude inwardly from and lock there.Thus, exist Guarantee in upper casing 5 and cooling body 6 in LED light device whole or at least most length Between stable mutual supporting.

Upper casing 5 has the inner leg 11 of V-arrangement, and described inner leg is by lateral struts 12 Stable.Between the lowest point kept at a certain distance away of inner leg, rows of light emitting diode 2 Position in the way of as can be seen from Fig. 2.The lowest point of inner leg 11 concurrently forms for holding The circuit board of load light emitting diode 2 carries out the bearing-surface accommodating and supporting, and described circuit board is fully Or at least in part by by thermal boundary layer material or thermal interfacial material (TIM, Thermal Interface Material) band made or layer 14 surround.The band being made up of thermal interfacial material 14 ointment that can be impregnated with by silicone oil, silicone oil alternatively or such as by have can heat conduction Particles of packing material, such as aluminium oxide or boron nitride material based on polymer constitute.Band 14 can wrap up circuit board 13 at least in part or the most fully and preferably have For the hole 16 that light emitting diode 2 passes.

The downside of circuit board 13 is provided with one or more electric device or electronic device 15.

Upper casing 5 and/or cooling body 6 are configured to working of plastics, described plastics in the embodiment illustrated Part can be with injection molding method manufacture.Plastics upper casing 5 forms LED together with plastics cooling body 6 The housing of illuminator and act as the cooling body for the heat produced on circuit board 14. By the upper casing 5 being made up of light transmissive material at least in part or fully, by light emitting diode 2 The light of radiation outwards penetrates.Upper casing 5 also is able to undertake alternatively the task of Optical devices, by institute State Optical devices, the light beam sent bunchy in a desired manner or deflection.

In order to will to the greatest extent may be used by light emitting diode 2 and electronic installation, heat that i.e. electronic device 15 produces Can be delivered in large area in the two cooling body 5,6, whole circuit board 13 is by by hot interface material Band or layer 14 that material is made are wound around.In order to make thermal interfacial material 15 (see Fig. 3, launch In view) it is matched with structure, by hole 16 such as with the form punching of perforation band or perforation figure Pressure or introducing.Light emitting diode 2 can be through the hole 16 of perforation figure, to such an extent as to unhinderedly Send light.Whole assembly including circuit board 13, light emitting diode 2 and electronic device 15 is being given birth to It is presented to when producing LED light device 1 in these perforation bands formed by thermal interfacial material. This figure 4 illustrates.Circuit board 13 is by being arranged on front side of it carry on 14, to such an extent as to has device Point to upper (according to Fig. 4) on rear side of the circuit board of part 15.With 14 and then around circuit board 13 Lateral edges folds, to such an extent as to circuit board fully or at least most ofly by band 14 surrounds.Band 14 also are able to have the portion of leaving a blank for electronic device 15 alternatively, to such an extent as to band 14 can be without folding Wrinkle ground is around folding on rear side of circuit board and covering rear side in large area.Thus, it is ensured that at circuit Plate 13 and and with between the parts of the contact outside of 14, particularly arrive cooling body 6 and upper casing 5 Very effective heat transfer.

As shown in Figure 2, cooling body 6 has transverse wall 20, and described transverse wall is used as In circuit board 13 and the bearing-surface of the band 14 of parcel circuit board 13.Thus, it is ensured that band 14 Hes Large-area contact between the transverse wall 20 of cooling body 6, to such an extent as to ensure that cooling body 6 Outwards cooling perimeter, particularly to arrive its cross section be the effective of semicircular outer wall Hot-fluid.

As seen in Figure 2, lateral struts 12 is configured to so that thereunder form cavity 21, It is likely to be present in the device on circuit board 13, the device of the such as wiring in the device-side of circuit board Part can be contained in described cavity.This allow by wiring device use according to Fig. 2 on top Board side on, to such an extent as to there is on the LED side, i.e. carrying Light-Emitting Diode 2 The free space of the terminals on side.By the outside of lateral struts 12, reclinate district Territory and the lowest point of inner leg 11, circuit board 13 and the band 14 wrapping up described circuit board are protected Hold position stablize and be pressed onto on the transverse wall 20 of cooling body 6, to such an extent as to there is good heat and connect Touch and will not occur that position offsets in circuit board 13.

Figure 5 illustrates for manufacturing the embodiment according to the LED light device 1 of the present invention Each production stage.Fig. 5 is shown on front side 2 has light emitting diode 2 and at circuit board 13 Rear side on there is the circuit board 13 of electronic device 15.

In order to be wound around circuit board 13 with the band 14 being made up of thermal interfacial material, band 14 is around circuit Plate 13 and bending around electronic unit, i.e. device 15.In order to will prepare by this way The circuit board 13 with 14 that has be combined with lower casing, i.e. cooling body 6, portion 22 of leaving a blank is corresponding In the layout punching press of electronic device 15 or be incorporated in lower casing and more precisely punching press or Person is incorporated in transverse wall 20, to such an extent as to device 15 can be passed down through transverse wall 20 and have Have with can flatly lie in transverse wall 20 on rear side of the circuit board of 14 in the way of bump contact On.

In one or more embodiments of the invention, portion 22 of leaving a blank remains slightly larger than electronics device Part 15, to such an extent as to 14 thermal interfacial material at electronic device 15 and lower casing, i.e. cooling body 6 Between do not cause any problem.In other one or more forms of implementation, by thermal interfacial material The band 14 constituted is stamped into shape corresponding to electronic device 15.In other design, band 14 only in side, be preferably applied on circuit board 13 according on the upside in Fig. 2 sensing at it.

With the portion of leaving a blank 22 also be able to also by two or more, such as four openings 23 introduce In cooling body 6, i.e. lower casing, it is preferably introduced in transverse wall 20, in two seal bootrs 3 One can be snapped in described opening respectively.By this way it can be avoided that each seal bootr 3 Tighten or bonding.

Seal bootr 3 provide to light emitting diode 2 and to the neat closing of Optical devices side and Guarantee the desired contact protection at the transition part between lamp holder and conductive component.Alternatively, The common metal lamp holder (not shown) being used for fluorescent tube can be press fit into seal bootr 3, with Just the electrical contact between illuminator and feeder equipment is realized.

Figure 8 illustrates lower casing, i.e. cooling body 6 together with the portion of leaving a blank 22 and the detail view in hole 23.

Fig. 6 illustrates seal bootr 3 and upper casing 5 and the phase of lower casing, i.e. cooling body 6 with decomposition view The marginal area of the side answered.Seal bootr 3 is in axial direction set to the marginal zone of upper casing and lower casing It is stably locked at institute on territory and there via the corresponding lock hook of hole 23 and seal bootr 3 In desired target location.

Fig. 7 illustrates the state completing to install of seal bootr 3.Seal bootr has funnel shaped or cone Shape or parabola shaped region 25, described region forms circumferential edge and the circuit board of seal bootr Transition part between the marginal area of 13 and can pasting with inner leg 11 in the mounted state Lean on.Thus, in the case of avoiding edge penalty, stable light injection it is able to ensure that, because on limit The light of edge side radiation also upward deflects and penetrates from LED light device 1.

According in the view of Fig. 7, upper casing 5 is also fitted without, does not the most also have buckle.

The inner leg 11 stretched by taper, also provides for light guiding surface simultaneously, to such an extent as to by luminous two The light beam that pole pipe 2 produces can have the injection profile of taper.Inner leg 11 if desired can Internal mirror reflection on the direction towards light emitting diode 11, to such an extent as to realize produced light Fully reflective so that it is guaranteed that towards outside light completely penetrate.

Another embodiment of LED light device 1 according to the present invention shown in Fig. 9 to 13. Embodiment according to Fig. 9 has the lower casing of cooling body 6, device 15, is having by thermal interfacial material The circuit board 13 of the band 14 made and the design aspect of light emitting diode 2 with according to Fig. 1's Embodiment is consistent completely.But, the molding of upper casing 28 is different, and described upper casing is different from root Semicircle (in cross-section) it is not configured to according to the upper casing 5 of Fig. 1, but by the phase of upper casing 25 The recess answered and there is lateral free space 26.By described lateral free space 26, heat Amount exports to extraneous air with direct path, to such an extent as to realizes more effectively cooling.In this feelings Under condition, the wall of upper casing 25 has and starts to be parallel to the district that transverse wall 20 inwardly stretches from ' locked ' zone Territory 27, described region is transitioned in the inner leg 11 (see Fig. 9) of conical expansion subsequently.

In fig .9, the wall region 27 being parallel to circuit board 13 stretching, extension of the outer wall of upper casing 28 is symmetrical Ground is present on the both sides of upper casing 28 and is transitioned into respectively in inner leg region 11, described interior Bilge cod region is according to also defining outer wall area in the embodiment of Fig. 9.By this design Scheme, can not only guarantee effectively to cool down power, and also be able to realization simultaneously and alleviate weight. The light angle of emergence is also as the most like that by the luminescence of light emitting diode 2 Diode characteristic limits and coordinates so that the opening angle of the taper of post area 11 is with desired Radioactive nature be consistent or described radioactive nature be defined, such as by post area 11 Be chosen as the internal reflection on the wall side of direct reflection in inner side.At least upper casing 28 luminous two The zone of action of the top of pole pipe 2 or the region pair between the external terminal of post area 11 It it is transparent or at least part of light-permeable for light penetrates.

Figure 10 illustrates the three-dimensional view of whole LED light device, but the most do not have and fill On seal bootr 3.The cross section that figure 9 illustrates is in the whole axial length of LED light device Extend on degree, to such an extent as to side pocket 26 stretches on whole axial length.Described recess 26 is simultaneously Also when assembling or the whole LED light device completing to install is being arranged on desired use The grippability of the improvement of upper casing is provided time on position.

Figure 11 illustrates another embodiment of seal bootr 31, described seal bootr can be with closing That cover 3 is configured to same type and be also suitable for especially using there is the upper casing shape of change According in the LED light device of Fig. 9.

Seal bootr 31 has semicircular hollow lamp holder section 32, and described lamp holder section is thereon Two locking projections 33 are carried on side.The quantity of locking projections also is able to more than or less than two. In order to end shield 31 is arranged on according to Fig. 9,10 LED light device on, by seal bootr 31 Axially it is set to according in the axial edge of the LED light device of Figure 10, wherein lamp holder protuberance 32 enter into and are locked in the portion of leaving a blank 23 (example in cooling body 6 and there by locking projections 33 As seen Fig. 7) in and recline with flushing subsequently.Seal bootr 31 has equally as seal bootr 3 The bending area 34 on top, parabola shaped section 25 is limited by described bending area in upside Boundary and can being inserted in upper casing 28 with lamp holder protuberance 32, wherein said region or The lateral marginal area of protuberance 34 can be posted by pillar 11.

Figure 12 is shown in the embodiment according to Fig. 9 to 11 in following state, wherein seal bootr 31 It is installed together with cooling body 6 and circuit board 13 together with light emitting diode 2 and carries 14 the most It is placed in cooling body 6.Here, circuit board 13 need not ad hoc fix, such as tighten or Bonding, but can dispose simply.The fixing of circuit board 13 is preferably realized by upper casing 28, Circuit board is clamped in desired position by described upper casing in mounted condition.Upper casing 28 The most also it is fitted without.Locking projections 33 snaps in depressed part 23, to such an extent as to closes Cover 31 anti-lost lost territories (verlierfest) to install.

Figure 13 illustrates the LED completing to install according to Fig. 9 to 12 with mounted upper casing 28 The marginal area of lamp.

The different variations of lower casing (6), i.e. cooling body shown in Figure 14 to 16.At root In embodiment according to Figure 14 to 16, upper casing 28 is to be consistent with according to the embodiment of Fig. 9 respectively Mode constructs.As an alternative, upper casing also be able to the upper casing 5 according to the embodiment according to Fig. 1 or Person constructs the most in another manner.

The embodiment that figure 14 illustrates has lower casing 40, and described lower casing is in being provided with reference 43 The V-arrangement shape with internal cavities 44, described lower casing is relative to the centre of LED light device Face is substantially symmetrically constituted.Lower casing 40 comprises the lateral supporting leg 41 of horizontal stretching, described laterally Supporting leg by close contact in the way of be bearing directly against circuit board 13 or band 14 on, ensure that from Circuit board 13 is via with the effective conduction of heat in 14 to the lower casing 40 being used as cooling body.Under Shell 40 can be snapped in upper casing 28 via the thickening part 42 of edge side thus with dismountable side Formula is connected with described upper casing securely.The cavity 44 of mid portion 43 at the V-arrangement of lower casing 40 In can be mounted with one or more device, such as electronic device 15.By described design, Achieve compact, the light structures with good heat radiating.

According in the embodiment of Figure 15, lower casing 50 with the formal construction of the supporting body 51 of T-shaped, Described supporting body comprise be parallel to circuit board 13 stretch and closely abut in on 14 collateral Lower limb 52 and supporting leg 53 at a right angle with described side leg, that arrange in centre.Scattered in order to increase Hot side amass, exist two symmetrically arranged, favour circuit board 13 orientation, be used as heat radiation Sheet grand go out portion 54.

By the hot path of the shortening in the embodiment according to Figure 14 to 16, again improve heat Learn performance, i.e. further reduce running temperature.According in the embodiment of Figure 15 or Person also according to Figure 14,16 other embodiments in, electronic installation can be placed in by plastics system In housing parts that become, that produce especially, such as this is as in the embodiment according to Figure 17 to 19 As shown in.

The fixing of outer housing 3,31 such as can be via being tightened to passage (such as seeing Figure 17, passage 70) In, via bonding or carry out in another manner, described outer housing can be according to described before And shown design constitute.

In other embodiments, all of design of the form of implementation discussed before basis In, thermal interfacial material, i.e. band 14 also are able to only be applied to circuit board or printed circuit board (PCB) in side On (PCB=Printed Circuit Board) 14.As an alternative, in other embodiments, also The band 14 being made up of thermal interfacial material can be abandoned completely.This be particularly suitable for housing parts 1,6, 28,40,50,60, described housing parts is designed as so that described housing parts can be by certain Pressure be applied on circuit board 13, such as this is as in the embodiment according to Figure 14 and 16 Situation is such.

The variations being described and form of implementation meet such as in LED retrofit pipe (Retro Fit Whole main tasks of the possible follow-on LED light device of form Tubes).To this First include NON-SELV (non-security Extra Low Voltage) structure, i.e. there is the electricity higher than 50V Design, totally continuous LED light device, light (plastics) and the low cost of pressure Structure.Additionally, thermal interfacial material allows abandon that be such as made up of pottery or have metal-cored Additional circuit board, and also abandon aluminum cooling body.

According in the design of Figure 16, lower casing 60 is with the triangle of cross-sectional configuration forming V-shape Form design, described triangle comprises the triangular cavity 61 of V-arrangement of inside, described three Dihedral cavity is by outside, V-arrangement, symmetrically arranged wall 62 and is parallel to circuit board 13, tight Thickly abut in and carry out gauge with the horizontal support legs 63 on 14.

Another embodiment shown in Figure 17 to 19, described embodiment can have according to above-mentioned Illustrate upper casing 28 or also be able to that there is other type of upper casing.By circuit board 13 together with parcel The band 14 being made up of thermal interfacial material of described circuit board is encased in upper casing 28, wherein will be in electricity The device 15 of the form of subassembly or other element is placed on the rear side of circuit board 13, as Shown in Figure 17.Lower casing designs with the form of lower casing 71, and described lower casing can have according to figure The configuration of 16, however also such as be able to the design according to Figure 14 or 15 or with other Mode is constituted.From according to unlike the embodiment of Figure 16, lower casing 71 is not in whole lamp length Upper the most directed until the marginal area of illuminator, but as figure 17 illustrates away from Terminating at a certain distance from the marginal area of LED light device, described lower casing is corresponding to upper casing 28 Axial marginal end.Device 15 is placed in the end of the edge side of lower casing 71 and circuit board 13 In free space between the end of edge side.In the embodiment according to Figure 17 to 19, it is provided with The housing parts 72 produced especially being made of plastics, described housing parts such as can be configured to half Circle, described semicircle is at interior open and surrounds device 15.The lateral edge of housing parts 72 sets Counting into the lateral edge with lower casing 71 is same type, to such an extent as to housing parts 72 can buckle Or be locked in upper casing 28.The length allocation of housing parts 72 becomes so that described housing parts from The end of the edge side of lower casing 71 is risen until arriving the edge of LED light device (without seal bootr) The end of side.As an alternative, housing parts 72 also is able to constitute longerly, to such an extent as to described housing Part is by lower casing 71 over-tension at least in part.End shield 31 fixing can be by being tightened on In the passage 70 of shell 28 (Figure 17,18) or the most in another manner, such as by bonding come Carry out.

Claims (20)

1. there is a LED light device for circuit board (13), along institute on described circuit board The axial direction stating LED light device is provided with multiple light emitting diode (2), and described LED shines Bright device has upper casing (5,28) and a lower casing (6,40,50,60,71), described upper casing and Described lower casing is connected to each other and by described under the mounted state of described LED light device Circuit board (13) is securely maintained between described upper casing and described lower casing, it is characterised in that institute State band (14) and described circuit board (13) that LED light device includes being made up of thermal interfacial material It is wound around by described band (14).

LED light device the most according to claim 1, wherein said band (14) is at least Partly wrap up described circuit board (13).

LED light device the most according to claim 1, wherein said band (14) is by having The material based on polymer or the silicone oil that have the particles of packing material of energy heat conduction are made.

LED light device the most according to claim 1, wherein said band (14) is by having Aluminium oxide or the material based on polymer of boron nitride or silicone oil is had to make.

LED light device the most according to claim 1, wherein said band (14) is basic On fully wrap up described circuit board (13).

LED light device the most according to claim 1, wherein said band (14) has For the hole (16) that described light emitting diode (2) passes.

7. according to the LED light device described in any one in claim 1 to 6, Qi Zhongsuo State lower casing to have for accommodating electric device or the internal cavities of electronic device (15), and wherein Described upper casing (5) comprises the pillar (11) of slant dilation, and the end regions of described pillar is with described Circuit board (13) or described band (14) contact being made up of thermal interfacial material are fixed for position.

LED light device the most according to claim 7, wherein said lower casing (6) has There is penetrating part (22), pass into institute for described electric device or electronic device (15) State in the hollow inner space of lower casing (6).

9. according to the LED light device described in any one in claim 1 to 6, have to A few seal bootr (3,31), described seal bootr can be arranged to described LED light device On axial end portion and can be connected with described LED light device.

LED light device the most according to claim 9, wherein said seal bootr (3, 31) can lock with described LED light device, can bonding maybe can tighten.

11. LED light device according to claim 9, wherein said seal bootr (3, 31) having the section (25) that taper is stretched, described section is from the week of described seal bootr (3,31) Directed to region until described circuit board (13) or described band (14).

12. LED light device according to claim 9, wherein said seal bootr (3, 31) have one or more locking projections (33) for described lower casing (6) and/or described Upper casing locks.

13. LED light device according to claim 7, it is characterised in that on described Shell has the side pocket (26) stretched in the axial direction, and described side pocket is by slant dilation Pillar (11) and be parallel to described circuit board stretch upper casing section (27) carry out gauge.

14. according to the LED light device described in any one in claim 1 to 6, wherein Described lower casing (40,50,60,71) on cross section to have the V-arrangement of internal cavities (44) Form, there is the form of the triangle (62) of internal cavities (61) or to have heat radiation The form of the T-shaped of sheet (53,54) is constituted.

15. according to the LED light device described in any one in claim 1 to 6, wherein The axial length of described lower casing (71) is less than axial length and/or the institute of described circuit board (13) Stating the axial length of upper casing (28), wherein electric device and/or electronic device (15) are arranged on In region between axial end portion and the axial end portion of described upper casing (28) of described lower casing (71), The housing parts (72) of its hollow core covers described device (15).

16. LED light device according to claim 15, wherein said housing parts (72) cross section is semicircle.

For the method manufacturing LED light device, wherein circuit board (13) is used for 17. 1 kinds The band (14) being made up of thermal interfacial material is wound around, and will have the described circuit of band (14) Plate (13) is placed in the appearance between upper casing (5,28) and lower casing (6,40,50,60,71) Receive in region, and described upper casing and described lower casing are connected to each other subsequently, thus will have band (14) described circuit board keeps in the way of position is fixing.

18. methods according to claim 17, wherein said method is for manufacturing according to right Require the LED light device according to any one of 1 to 16.

19. methods according to claim 17, wherein pass through described upper casing and described lower casing Locking is connected to each other.

20. according to the method described in any one in claim 17 to 19, wherein by one or Two seal bootrs (3,31) are applied on the axial end portion of described upper casing and lower casing or additional On housing parts (72).