Surface collapse monitoring device and monitoring method
Technical field
The present invention relates to a kind of monitoring technology for geological hazards, more particularly, to a kind of surface collapse monitoring device and monitoring method.
Background technology
Every year a lot of surface collapse disasters all can occur throughout the country, particularly subsiding in karst area correlation, disaster is even more frequent to be occurred, and causes heavy losses to people life property safety;Because karst soil cave is all in below ground, and buried depth is different, and great disguise brings great difficulty to disaster monitoring.
The monitoring meanss being presently used for surface collapse disaster mainly have geological radar(GPR)、TDR(BOTDR)Technology and water(Gas)The operating cost of pressure monitoring, geological radar and TDR is very high, is not suitable for promoting on a large scale, water(Gas)Pressure monitoring is difficult to draw accurate conclusion again, and three kinds of methods also all have the poor defect of simple operation.
Content of the invention
For the problem in background technology, the present invention proposes a kind of surface collapse monitoring method, and its scheme is:Involved hardware has:Support, vertical weight body, cable, processing module, Magnetic Sensor(I.e. Hall element), the communications cable and inductance loop;Wherein, support, the supporting construction of hang down weight body and cable formation monitoring device, support is used for hanging vertical heavy body from above in monitoring hole, and the weight body that hangs down is for by cable tensioning, cable is used for arranging Magnetic Sensor;Magnetic Sensor, the communications cable and inductance loop form the transducing part of monitoring device, and inductance loop is used for sensing geological transformation, and Magnetic Sensor is used for the state of induction monitoring device, and the communications cable is used for the signal transmission collecting Magnetic Sensor to processing module;Apply the concrete operations that aforesaid plurality of device is monitored as follows:
1)In monitored area boring, form the monitoring hole vertical with horizontal direction;
2)Support is fixed at the openings position in monitoring hole, hangs down and is fixedly connected by cable between weight body and support, and the weight body that hangs down hangs from above in monitoring hole;Magnetic Sensor is fixed in the middle part of cable, is electrically connected by the communications cable between Magnetic Sensor and processing module;
Monitoring hole is column structure under normal circumstances, and inductance loop passes through the hole wall clamping of elastic mechanism and monitoring hole, and the position of inductance loop is located between Magnetic Sensor and support, and inductance loop is provided with permanent magnet;
3)After Study on Soil Collapse, the inwall in monitoring hole is destroyed, and elastic mechanism loses supporting part, sensing ring monitoring hole bottom landing;During inductance loop landing, the magnetic line of force that permanent magnet sends is overlapped with the search coverage of Magnetic Sensor, processing module perceives inductance loop landing by Magnetic Sensor, by being demarcated in advance to the rational height of inductance loop, you can know that the depth subsided in the soil body.
Preceding method is easy to implement, and required hardware unit is very common thing, and inductance loop is very sensitive to geological transformation, and monitoring result is accurate.
Surface collapse disaster is usually to develop to ground apparent bearing at earth's surface deep place,This feature based on surface collapse disaster,Also the quantity of inductance loop can be set to multiple,Multiple inductance loops axially set gradually along monitoring hole,Demarcated in advance by the multiple inductance loops of setting and to the distributed depth of multiple inductance loops,When surface collapse disaster has influence on the monitoring hole of inductance loop position,Inductance loop starts landing,Processing module senses that to Magnetic Sensor the number of times in magnetic field counts,May know that how many inductance loop landing,This can not only be monitored to surface collapse disaster,The development progress of surface collapse disaster can also be monitored,And multistage early warning mechanism can be worked out accordingly,The development depth of surface collapse can be judged by monitoring the quantity of inductance loop landing,If the depth of surface collapse is also not enough to threateningly table safety,Then only need to pay close attention to,Thus improving the accuracy of disaster alarm further.
On the basis of aforesaid monitoring method, the invention allows for a kind of surface collapse monitoring device, its structure is:Described surface collapse monitoring device is made up of support, hang down weight body, cable, processing module, Magnetic Sensor, the communications cable and inductance loop;
Cable upper end is fixedly connected with support, and cable lower end is fixedly connected with the weight body that hangs down;Magnetic Sensor is fixed in the middle part of cable, is electrically connected by the communications cable between Magnetic Sensor and processing module;Inductance loop is arranged at the position between cable upper bracket and Magnetic Sensor, and inductance loop can slide along cable;
Described inductance loop is made up of outer tube, inner core, permanent magnet, multiple snap arm and multiple spring;Described outer tube and inner core are the cylindrical structure of both ends open, and inner core is socketed in outer tube, is fixed by tie-beam between outer tube and inner core;Mounting groove is provided with inner core inwall, permanent magnet is embedded in mounting groove;Multiple snap arm are rotated with outer drum outer wall and are connected, and snap arm can be along outer tube axial rotation;Each snap arm all corresponds to a spring, and one end of spring is connected with the middle part of snap arm, and the other end of spring is connected with outer drum outer wall;During naturalness, to outer tube surfaces came close under the pulling force effect of spring, and the outer end of multiple snap arm is towards identical for snap arm outer end;When laying inductance loop, firmly rotate snap arm, snap arm outer end is made to rotate towards the direction in opposite direction with spring contraction, and make the periphery of snap arm be less than the diameter monitoring hole, then snap arm is transported to after correspondence position in monitoring hole, unclamp snap arm, snap arm just rotates backward under the action of the spring and the hole wall in final monitored hole blocks, thus completing the laying of inductance loop.
Cable passes through from the inner core endoporus of inductance loop, leaves gap between cable and inner core.
In aforementioned structure, involved modular construction is simple, and installation settings is easy and simple to handle, and test result is accurately and reliably.
Preferably, described outer tube and inner core are coaxially disposed;The quantity of described tie-beam is 3 or 4, and each tie-beam is uniformly distributed along outer tube circumference.In addition, outer tube and inner core acting as played in this inductance loop supports snap arm and permanent magnet, this mainly considers length that is cost-effective and reducing inductance loop deadweight and reduce snap arm(Namely improve the motility of snap arm);Again, why the Another reason using the loop configuration body being made up of outer tube and inner core is the inductance loop of the present invention:Circulus can be with block structure(The internal diameter of vertical heavy body can be arranged larger, when can be caught by vertical heavy body after inductance loop landing)Cooperation, it is to avoid be difficult to take out after inductance loop landing to monitoring hole bottom.
Identical with the reasons why arranging multiple inductance loop in aforementioned monitoring method, during concrete application, may also set up multiple inductance loops, multiple inductance loops are axially sequentially arranged along cable.
Preferably, the quantity of described snap arm is 8;Wherein 4 snap arm are designated as the first snap arm group, 4 snap arm in first snap arm group are in outer tube axially first-class high setting, other 4 snap arm are designated as the second snap arm group, and, in outer tube axially first-class high setting, the first snap arm group is different with the rational height of the second snap arm group for 4 snap arm in the second snap arm group.
Preferably, the circumferential position of 4 snap arm in the first snap arm group is uniformly distributed along outer tube circumference;The circumferential position of 4 snap arm in the second snap arm group is uniformly distributed along outer tube circumference.
Preferably, the circumferential position of 4 snap arm in the circumferential position of 4 snap arm and the second snap arm group in the first snap arm group corresponds.
Preferably, described support is using the disc-shaped structure body with mesopore.During using discoidal support, the external diameter of support can be made to be more than monitoring hole dia, so that support is connected at hole, hole all can also be closed simultaneously, it is to avoid foreign body is fallen in monitoring hole.
Preferably, the external footpath of described vertical weight is more than inner core internal diameter.After being improved using this, the inductance loop of landing just can be caught by the weight body that hangs down, and is easy to take out inductance loop, to reuse.
The method have the benefit that:Required hardware is simple, and it is convenient that device is laid, and data processing is easy, and monitoring result is accurately and reliably.
Brief description
Fig. 1, the use state schematic diagram of the present invention;
Fig. 2, inductance loop cross-sectional view;
Fig. 3, inductance loop shaft section schematic diagram;
Part corresponding to each labelling of in figure is respectively:Support A, vertical weight body B, cable C, processing module D, Magnetic Sensor E, inductance loop F, outer tube 1, inner core 2, permanent magnet 3, snap arm 5, spring 6.
Specific embodiment
A kind of surface collapse monitoring device, its structure is:Described surface collapse monitoring device is made up of support A, hang down weight body B, cable C, processing module D, Magnetic Sensor E, the communications cable and inductance loop F;
Cable C upper end is fixedly connected with support A, and cable C lower end is fixedly connected with the weight body B that hangs down;Magnetic Sensor E is fixed in the middle part of cable C, is electrically connected by the communications cable between Magnetic Sensor E and processing module D;Inductance loop F is arranged at the position between cable C upper bracket A and Magnetic Sensor E, and inductance loop F can slide along cable C;
Described inductance loop F is made up of outer tube 1, inner core 2, permanent magnet 3, multiple snap arm 5 and multiple spring 6;Described outer tube 1 and inner core 2 are the cylindrical structure of both ends open, and inner core 2 is socketed in outer tube 1, is fixed by tie-beam between outer tube 1 and inner core 2;Mounting groove is provided with inner core 2 inwall, permanent magnet 3 is embedded in mounting groove;Multiple snap arm 5 are rotated with outer tube 1 outer wall and are connected, and snap arm 5 can be along outer tube 1 axial rotation;Each snap arm 5 all corresponds to a spring 6, and one end of spring 6 is connected with snap arm 5 middle part, and the other end of spring 6 is connected with outer tube 1 outer wall;During naturalness, to outer tube 1 surfaces came close under the pulling force effect of spring 6, and the outer end of multiple snap arm 5 is towards identical for snap arm 5 outer end;
Cable C passes through from inner core 2 endoporus of inductance loop F, leaves gap between cable C and inner core 2.
Further, described outer tube 1 and inner core 2 are coaxially disposed;The quantity of described tie-beam is 3 or 4, and each tie-beam is uniformly distributed along outer tube 1 circumference.
Further, the quantity of described inductance loop F is multiple, and multiple inductance loop F are axially sequentially arranged along cable C.
Further, the quantity of described snap arm 5 is 8;Wherein 4 snap arm 5 are designated as the first snap arm group, 4 snap arm 5 in first snap arm group are in outer tube 1 axially first-class high setting, other 4 snap arm 5 are designated as the second snap arm group, and, in outer tube 1 axially first-class high setting, the first snap arm group is different with the rational height of the second snap arm group for 4 snap arm 5 in the second snap arm group.
Further, the circumferential position of 4 snap arm 5 in the first snap arm group is uniformly distributed along outer tube 1 circumference;The circumferential position of 4 snap arm 5 in the second snap arm group is uniformly distributed along outer tube 1 circumference.
Further, the circumferential position of 4 snap arm 5 in the circumferential position of 4 snap arm 5 and the second snap arm group in the first snap arm group corresponds.
Further, described support A is using the disc-shaped structure body with mesopore.
Further, described vertical weight body B external diameter is more than inner core 2 internal diameter.
A kind of surface collapse monitoring method, involved hardware has:Support A, vertical weight body B, cable C, processing module D, Magnetic Sensor E, the communications cable and inductance loop F;
The operation of described surface collapse monitoring method is:
1)In monitored area boring, form the monitoring hole vertical with horizontal direction;
2)Support A is fixed at the openings position in monitoring hole, hangs down and is fixedly connected by cable C between weight body B and support A, and the weight body B that hangs down hangs from above in monitoring hole;Magnetic Sensor E is fixed in the middle part of cable C, is electrically connected by the communications cable between Magnetic Sensor E and processing module D;
Monitoring hole is column structure under normal circumstances, and inductance loop F passes through the hole wall clamping of elastic mechanism and monitoring hole, and the position of inductance loop F is located between Magnetic Sensor E and support A, and inductance loop F is provided with permanent magnet 3;
3)After Study on Soil Collapse, the inwall in monitoring hole is destroyed, and elastic mechanism loses supporting part, and inductance loop F is to monitoring hole bottom landing;During inductance loop F landing, the magnetic line of force that permanent magnet 3 sends is overlapped with the search coverage of Magnetic Sensor E, processing module D perceives inductance loop F landing by Magnetic Sensor E, by being demarcated in advance to the rational height of inductance loop F, you can know that the depth subsided in the soil body.
Further, the quantity of described inductance loop F is multiple, and multiple inductance loop F axially set gradually along monitoring hole.