CN103558225A - Method for testing complementary metal oxide semiconductor (CMOS) image chip - Google Patents
Method for testing complementary metal oxide semiconductor (CMOS) image chip Download PDFInfo
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- CN103558225A CN103558225A CN201310586530.4A CN201310586530A CN103558225A CN 103558225 A CN103558225 A CN 103558225A CN 201310586530 A CN201310586530 A CN 201310586530A CN 103558225 A CN103558225 A CN 103558225A
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Abstract
The invention discloses a method for testing a complementary metal oxide semiconductor (CMOS) image chip. The method comprises the following steps: (1) providing a CMOS image chip testing system which comprises an upper computer, a test board, a light source and the CMOS image chip; (2) setting a dimming command value by the upper computer, and sending a dimming command to the test board; (3) controlling the brightness of the light source through a digital to analog (D/A) circuit by the test board; (4) when the brightness of the light source starts to change, controlling the CMOS image chip by the upper computer to output an image to the test board; (5) resetting the dimming command value by the upper computer, and repeating the steps (2, 3 and 4); (6) outputting acquired image data to the upper computer by the test board, receiving the image data by the upper computer, and processing the image; and (7) judging whether poor points/lines exist in the CMOS image chip by the upper computer according to an image processing result. According to the CMOS image sensor testing method, by performing program control on the brightness change of the light source, program test and picture brightness change are synchronized, and poor products with dark points and lines during the brightness change of the image can be completely captured through a program.
Description
Technical field
The present invention relates to CMOS chip testing industry, particularly a kind of Novel CMOS picture chip detecting method.
Background technology
Existing method of testing is mainly divided into white light and complete dark two kinds of environmental testings of state: under the test environment of white light, host computer obtains after view data, can the black color dots class/line badness in image be captured, and realizes the judgement of bad product; Under complete dark state, the coloured silk/bright spot in image also can crawledly arrive, and product also can be regarded as bad product.But in actual test process, can there are some lighter Points And lines, in the brightness change procedure of image, present larger grey value difference with normal picture around, to this lighter Points And lines, under white light and complete dark state, software and human eye are all difficult to identification, and under existing method of testing, upper computer software normally starts analysis image under the complete white and complete dark state of image, cause existing the bad product of lighter Points And lines effectively to be captured.
Summary of the invention
For above-mentioned problems of the prior art, the object of the invention is to improve the method for testing of existing cmos image sensor, effectively capture bad product.
In order to realize foregoing invention object, the technical solution used in the present invention is as follows:
A chip detecting method, comprises the steps:
Step 1: a kind of cmos image chip test system is provided, comprises: host computer, test board, light source, cmos image chip;
Step 2: host computer is set dimmer command value, sends dimmer command to test board;
Step 3: test board is controlled light-source brightness by D/A circuit;
Step 4: when light-source brightness starts to change, PC control cmos image chip output image is to test board;
Step 5: host computer is reseted dimmer command value, repeats above-mentioned steps 2-4;
Step 6: test board outputs to host computer by the view data collecting, host computer carries out image processing after receiving view data;
Step 7: host computer judges that according to processing result image whether exist a little/line of cmos image chip is bad.
Preferably, in above-mentioned cmos image chip detecting method, be provided with one group of dimmer command value in the test procedure of described host computer, described dimmer command value is stepped change, by test board and D/A circuit, is realized the stepped change of light-source brightness is controlled.
Preferably, in above-mentioned cmos image chip detecting method, described cmos image chip by test board provide power supply and with test board communication after, view data is sent to test board by parallel port or MIPI interface.
Preferably, in above-mentioned cmos image chip detecting method, described test board is USB test board, and the test procedure by host computer drives, and obtains view data and view data is further carried out to graphical analysis.
Preferably, in above-mentioned cmos image chip detecting method, in described step 6, the view data packing that USB test board produces cmos image chip, is sent to host computer according to usb protocol.
Use cmos image sensor method of testing provided by the invention, by light-source brightness is changed and carries out programmed control, realizing program test and picture brightness changes and synchronously carries out, when being changed, brightness of image exist the bad product of lighter Points And lines also can realize program crawl completely, break away from artificial eye recognition, also evaded the result of determination difference of bringing due to eye recognition.
Accompanying drawing explanation
Fig. 1 is a kind of illustrative diagram of cmos image chip detecting method.
Embodiment
In order to make object of the present invention, technical scheme and advantage clearer, below in conjunction with embodiment and accompanying drawing, the present invention is further elaborated.Should be appreciated that specific embodiment described herein, only in order to explain the present invention, is not intended to limit the present invention.
In chip testing process, chip is by the hardware algorithm of self, the point/line in can the output image of automatic straightening self bad, the result of rectification be the point/line in image become very light.Rectification completes gradually by exporting at chip in a few two field picture processes, and in several images of chip correcting process, feature when the bad relative rectification of point/line completes is (point/line is clearer) more obviously.In original method of testing, host computer procedure wait chip self has been corrected the rear test that just starts, and now, the point/line in image is bad very light, and it is bad very difficult that host computer procedure analyzes wherein very light point/line, only has by human eye and go to distinguish.
Cmos image chip detecting method provided by the present invention, host computer knows when the intensity of light source will change, know when chip starts automatic straightening simultaneously, in the intensity of light source, start the moment changing, gather immediately and analysis image, the hardware of chip itself changes and starts to do the remedial action to point/line according to light source simultaneously, before chip self has been corrected, the obvious image of point/line in chip output image is also captured and analyzes by host computer, host computer can be at an easy rate according to the image identifying all bad problems of point/line in picture of publishing picture.
Figure 1 shows that a kind of cmos image chip detecting method, comprise step: (1) host computer sends dimmer command " 1 " to test board; (2) USB test board is realized light-source brightness " 2 " by D/A circuit; (3) cmos image chip output image is to USB test board " 3 "; (4) host computer starts image processing " 4 " after receiving view data; (5) repeating step (1)～(4), dimmer command value stepped change in step (1); (6) single chips test finishes.
One, more specifically in embodiment, the method for testing of cmos image chip comprises the steps:
Step 1: a kind of cmos image chip test system is provided, comprises: host computer, test board, light source, cmos image chip;
Step 2: host computer is set dimmer command value, sends dimmer command to test board; Wherein, be provided with one group of dimmer command value in the test procedure of described host computer, described dimmer command value is stepped change, by test board and D/A circuit, is realized the stepped change of light-source brightness is controlled;
Step 3: test board is controlled light-source brightness by D/A circuit;
Step 4: when light-source brightness starts to change, PC control cmos image chip output image is to test board; Wherein, described cmos image chip by test board provide power supply and with test board communication after, view data is sent to test board by parallel port or MIPI interface;
Step 5: host computer is reseted dimmer command value, repeats above-mentioned steps 2-4;
Step 6: test board outputs to host computer by the view data collecting, host computer carries out image processing after receiving view data; Wherein, described test board is USB test board, and the test procedure by host computer drives, and obtains view data and to the further graphical analysis of view data; The view data packing that USB test board produces cmos image chip, is sent to host computer according to usb protocol;
Step 7: host computer judges that according to processing result image whether exist a little/line of cmos image chip is bad.
The above embodiment has only expressed embodiments of the present invention, and it describes comparatively concrete and detailed, but can not therefore be interpreted as the restriction to the scope of the claims of the present invention.It should be pointed out that for the person of ordinary skill of the art, without departing from the inventive concept of the premise, can also make some distortion and improvement, these all belong to protection scope of the present invention.Therefore, the protection domain of patent of the present invention should be as the criterion with claims.
Claims (5)
1. a cmos image chip detecting method, is characterized in that, comprises the steps:
Step 1: a kind of cmos image chip test system is provided, comprises: host computer, test board, light source, cmos image chip;
Step 2: host computer is set dimmer command value, sends dimmer command to test board;
Step 3: test board is controlled light-source brightness by D/A circuit;
Step 4: when light-source brightness starts to change, PC control cmos image chip output image is to test board;
Step 5: host computer is reseted dimmer command value, repeats above-mentioned steps 2-4;
Step 6: test board outputs to host computer by the view data collecting, host computer carries out image processing after receiving view data;
Step 7: host computer judges that according to processing result image whether exist a little/line of cmos image chip is bad.
2. cmos image chip detecting method according to claim 1, it is characterized in that, in the test procedure of described host computer, be provided with one group of dimmer command value, described dimmer command value is stepped change, by test board and D/A circuit, is realized the stepped change of light-source brightness is controlled.
3. cmos image chip detecting method according to claim 2, is characterized in that, described cmos image chip by test board provide power supply and with test board communication after, view data is sent to test board by parallel port or MIPI interface.
4. cmos image chip detecting method according to claim 3, is characterized in that, described test board is USB test board, and the test procedure by host computer drives, and obtains view data and view data is further carried out to graphical analysis.
5. cmos image chip detecting method according to claim 4, is characterized in that, in described step 6, the view data packing that USB test board produces cmos image chip, is sent to host computer according to usb protocol.
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Cited By (6)
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| CN104458206A (en) * | 2014-12-08 | 2015-03-25 | 天津大学 | Labview-based image sensor testing system |
| CN104792795A (en) * | 2015-04-30 | 2015-07-22 | 无锡英斯特微电子有限公司 | Image testing method of optical mouse chip |
| CN106899844A (en) * | 2017-02-13 | 2017-06-27 | 张家港市欧微自动化研发有限公司 | A kind of cmos sensor test system |
| CN107191834A (en) * | 2017-06-22 | 2017-09-22 | 北京思比科微电子技术股份有限公司 | The light-source system tested for image chip |
| CN113396316A (en) * | 2019-11-19 | 2021-09-14 | 深圳市海谱纳米光学科技有限公司 | Adjustable glass cavity self-calibration method and spectrum acquisition device with self-calibration function |
| CN116027181A (en) * | 2023-03-30 | 2023-04-28 | 浙江瑞测科技有限公司 | Parallel image processing device and method |
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Cited By (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104458206A (en) * | 2014-12-08 | 2015-03-25 | 天津大学 | Labview-based image sensor testing system |
| CN104792795A (en) * | 2015-04-30 | 2015-07-22 | 无锡英斯特微电子有限公司 | Image testing method of optical mouse chip |
| CN106899844A (en) * | 2017-02-13 | 2017-06-27 | 张家港市欧微自动化研发有限公司 | A kind of cmos sensor test system |
| CN107191834A (en) * | 2017-06-22 | 2017-09-22 | 北京思比科微电子技术股份有限公司 | The light-source system tested for image chip |
| CN113396316A (en) * | 2019-11-19 | 2021-09-14 | 深圳市海谱纳米光学科技有限公司 | Adjustable glass cavity self-calibration method and spectrum acquisition device with self-calibration function |
| US20220099493A1 (en) * | 2019-11-19 | 2022-03-31 | Shenzhen Hypernano Optics Technology Co., Ltd. | Self-calibration method for tuneable fabry-perot cavity and spectrum acquisition device having self-calibration function |
| CN113396316B (en) * | 2019-11-19 | 2023-10-31 | 深圳市海谱纳米光学科技有限公司 | Adjustable method glass cavity self-calibration method and spectrum acquisition device with self-calibration function |
| US11879781B2 (en) * | 2019-11-19 | 2024-01-23 | Shenzhen Hypernano Optics Technology Co., Ltd. | Tuneable Fabry-Perot cavity self-calibration method and spectrum acquisition device with a self-calibration function |
| CN116027181A (en) * | 2023-03-30 | 2023-04-28 | 浙江瑞测科技有限公司 | Parallel image processing device and method |
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Address after: 215411 No. 20, Jian Xiong Road, science and Education Town, Taicang, Suzhou, Jiangsu Patentee after: Howay semiconductor (Taicang) Co.,Ltd. Address before: 215411 No. 20, Jian Xiong Road, science and Education Town, Taicang, Suzhou, Jiangsu Patentee before: TAICANG SUPERPIX MICRO TECHNOLOGY CO.,LTD. |