CN103557969A - Ceramic pressure sensor chip capable of accurately correcting and adjusting temperature drift error, correcting and adjusting system and correcting and adjusting method - Google Patents
Ceramic pressure sensor chip capable of accurately correcting and adjusting temperature drift error, correcting and adjusting system and correcting and adjusting method Download PDFInfo
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- CN103557969A CN103557969A CN201310545795.XA CN201310545795A CN103557969A CN 103557969 A CN103557969 A CN 103557969A CN 201310545795 A CN201310545795 A CN 201310545795A CN 103557969 A CN103557969 A CN 103557969A
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Abstract
The invention relates to a ceramic pressure sensor chip capable of accurately correcting and adjusting the temperature drift error, a correcting and adjusting system and a correcting and adjusting method. An existing ceramic pressure sensor does not correct and adjust the temperature drift error conveniently, and the equipment and technology for industrialization correcting and adjusting are lacked. The ceramic pressure sensor chip comprises a chip body, a Wheatstone bridge circuit inside the chip body is connected with a combined temperature drift compensation resistor, the combined temperature drift compensation resistor comprises an correctable and adjustable resistor and a plurality of rough adjusting resistors, the two ends of each rough adjusting resistor are connected to two printed metal foil wires respectively, and the correctable and adjustable resistor is connected to one metal foil wire in series. The temperature drift correcting and adjusting system comprises a temperature drift sorting system and a temperature drift correcting and adjusting system. The invention further relates to the corresponding temperature drift correcting and adjusting method. The ceramic pressure sensor chip has the advantages of being simple in structure and capable of accurately correcting and adjusting the temperature drift error in an industrialization mode, the correcting and adjusting system and the correcting and adjusting method are scientific in design, high in efficiency, low in cost and suitable for being used by ceramic pressure sensor manufacturing enterprises.
Description
Technical field
The present invention relates to a kind of temperature that can accurately trim floats the ceramic pressure sensor chip of error and trims system and method for repairing and regulating.
Background technology
Ceramic pressure sensor is printed electronic slurry on ceramic matrix elastic body, through sintering, becomes Wheatstone bridge (Wheatstone bridge claims again this same electric bridge of favour, Wheatstone bridge).Because pressure makes the variation of ceramic matrix trace deformation build-up of pressure sensitive resistance, when brachium pontis two ends apply the DC voltage of 5V, thereby realize pressure survey by measuring the variation of two brachium pontis stage casing output end voltages, the amplitude direct proportion of its output voltage is in force value, so be referred to as pressure transducer.
But electric slurry is in printing, sintering process, there is unavoidably nuance, these nuances cause each ceramic pressure sensor output voltage under same temperature different, the difference of the design output voltage of these output voltages and ceramic pressure sensor, be temperature drift error, be called for short temperature and float error, how trimming fast temperature, to float error be the manufacturing bottleneck of restriction ceramic pressure sensor.
Summary of the invention
The technical problem to be solved in the present invention is the above-mentioned defect that how to overcome prior art, provides a kind of temperature that can accurately trim float the ceramic pressure sensor chip of error and trim system and method for repairing and regulating.
For solving the problems of the technologies described above, the present invention can accurately trim the ceramic pressure sensor chip that temperature is floated, comprise chip body, in this chip body, be provided with Wheatstone bridge circuit, it is characterized in that: on the brachium pontis of Wheatstone bridge circuit, be connected to combination temperature drift compensation resistance, this combination temperature drift compensation resistance comprises trimming resistors and a plurality of roughly adjusted rheostat, and each roughly adjusted rheostat two ends are connected to two and print on tinsel cords, and described trimming resistors is serially connected in wherein on a strip metal tinsel cord.So design, making ceramic pressure sensor chip heavy industrialization temperature float accurately to trim becomes possibility.
As optimization, described chip body is provided with locating notch.So design, is convenient to location fixing.
The present invention can accurately trim the temperature of the ceramic pressure sensor chip that temperature floats and float the system of trimming, and comprises that temperature is floated separation system and temperature is floated the system of trimming, wherein:
Temperature is floated separation system and is comprised constant temperature oven, data collector, process of separation controller, grading manipulator and a plurality of separatory vessel, wherein, data collector comprises a plurality of pallets, measurement jig frame and combined data acquisition module, described measurement jig frame comprises M layer supporting plate, wherein on every layer of supporting plate, be equipped with bracket tray positioning apparatus, every layer of supporting plate is provided with a tool dish, tool dish or supporting plate are furnished with lifting drive, each tool dish is provided with N probe groups, each probe groups comprises a plurality of probes, a fixed bit of corresponding its below pallet, every group of probe is connected to respectively an interface of combined data acquisition module, combined data acquisition module is connected with the signal input part of process of separation controller, described grading manipulator is connected with the signal output part of process of separation controller, controlled by it.
Temperature is floated the system of trimming and is comprised probe groups, pallet, laser trimming instrument, temperature compensation programming controller, high accuracy number voltage instrument and tray rack, in temperature compensation programming controller, there are a plurality of pre-set programs that slightly trim, each slightly trims the corresponding separatory vessel of program, and a simultaneously corresponding temperature is floated error range; Ceramic pressure sensor chip is placed on fixed bit, the laser head of probe groups and laser trimming instrument is collectively referred to as and trims working head, trim working head or tray rack and be furnished with X-direction driving mechanism, Y-direction driving mechanism and Z-direction driving mechanism, under the control of temperature compensation programming controller, tray rack with trim working head top to bottom, left and right, front and rear relative displacement occur, ceramic pressure sensor chip on pallet is shifted near one by one and trim working head, probe groups is pressed in the corresponding contacts of ceramic pressure sensor chip.
Temperature floats separation system and temperature is floated in the system of trimming, described pallet is provided with N fixed bit, and each fixed bit is all furnished with limited post or spacing preiection, and ceramic pressure sensor chip is placed on fixed bit, fixing by limited post or spacing preiection location, wherein M, N are positive integer.So design, for ceramic pressure sensor chip heavy industrialization temperature, floating accurately to trim provides equipment Foundations.
The present invention can accurately trim the temperature of the ceramic pressure sensor chip that temperature floats and float method for repairing and regulating, comprises the steps:
(1) temperature is floated sorting: during sorting, measurement jig frame is placed in constant temperature oven, constant temperature oven is adjusted to the working temperature of ceramic pressure sensor chip, on each fixed bit of pallet, locate placing ceramic pressure sensor chip, then pallet is placed on respectively on different supporting plates, process of separation controller is controlled lifting drive action, tool dish and supporting plate are drawn close mutually, until the corresponding contacts of each ceramic pressure sensor chip is pressed with probe, then process of separation controller connects by combined data acquisition module tool dish, collect the temperature of each ceramic pressure sensor chip and float error, and float error range according to temperature, by grading manipulator, each ceramic pressure sensor chip is divided in different separatory vessels,
(2) temperature is floated and is trimmed
Ceramic pressure sensor chip in a certain separatory vessel is packed in pallet, pallet is put on tray rack, start temperature and float the system of trimming,
Under the control of temperature compensation programming controller, tray rack with trim working head top to bottom, left and right, front and rear relative displacement occur, ceramic pressure sensor chip on pallet is shifted near one by one and trim working head, probe groups is pressed in the corresponding contacts of ceramic pressure sensor chip, select slightly the trim program corresponding with separatory vessel, slightly trimming under programmed control, each ceramic pressure sensor chip in corresponding separatory vessel is being carried out to coarse adjustment, to each roughly adjusted rheostat R in combination temperature drift compensation resistance
1, R
2, R
2r
nand two of connecting roughly adjusted rheostat print tinsel cords and carry out corresponding cutting, the combination of each roughly adjusted rheostat, connection in series-parallel relation are changed, carry out coarse adjustment;
Then, temperature compensation programming controller is measured each ceramic pressure sensor chip actual output voltage under atmospheric pressure by high accuracy number voltage instrument, compare with ceramic pressure sensor chip design output voltage, and then show that accurate temperature floats error, laser trimming instrument cuts the trimming resistors in combination temperature drift compensation resistance, during cutting, the probe of probe groups is pressed in ceramic pressure sensor chip corresponding contacts, limit cutting, lateral dominance detects ceramic pressure sensor with high accuracy number voltage instrument, until floating error, ceramic pressure sensor temperature reaches preassigned.
So design, the temperature that can fast, accurately trim ceramic pressure sensor chip is floated error.
The present invention can accurately trim the ceramic pressure sensor chip that temperature is floated error, have advantages of simple in structure, be convenient to heavy industrialization and accurately trim temperature and float error, it is high that it trims system equipment automaticity, its method for repairing and regulating design science, trim precisely, efficiency is high, cost is low, is the indispensable weapon that existing ceramic pressure sensor manufacturing enterprise technology, device upgrade are regenerated.
Accompanying drawing explanation
Below in conjunction with accompanying drawing, to the present invention, can accurately trim temperature floats the ceramic pressure sensor chip of error and trims system and method for repairing and regulating is described further:
Fig. 1 originally can accurately trim the schematic appearance that temperature is floated the ceramic pressure sensor chip of error;
Fig. 2 originally can accurately trim the schematic diagram that temperature is floated the combination temperature drift compensation resistance in the ceramic pressure sensor chip of error;
Fig. 3 is the schematic diagram () combining in Fig. 2 after the trimming of temperature drift compensation resistance;
Fig. 4 is the schematic diagram (two) combining in Fig. 2 after the trimming of temperature drift compensation resistance;
Fig. 5 is the schematic diagram (three) combining in Fig. 2 after the trimming of temperature drift compensation resistance;
Fig. 6 is support holder structure schematic diagram in the present invention;
Fig. 7 is the structural representation that in the present invention, temperature is floated separation system;
Fig. 8 is the working state schematic representation that trims working head in the present invention;
Fig. 9 is that in the present invention, temperature is floated the structural representation of the system of trimming.
In figure: 1 is that chip body, 2 is that contact, 3 is that tinsel cord, 5 is that locating notch, 6 is that constant temperature oven, 7 is that data collector, 8 is that process of separation controller, 9 is that grading manipulator, 10 is that separatory vessel, 11 is that pallet, 12 is that combined data acquisition module, 13 is that supporting plate, 14 is that tool dish, 15 is that probe, 16 is that fixed bit, 17 is that laser trimming instrument, 18 is that temperature compensation programming controller, 19 is that high accuracy number voltage instrument, 20 is that tray rack, 21 is for trimming working head, R
0for trimming resistors, R
1, R
2, R
2r
nfor roughly adjusted rheostat, X, Y, Z represent respectively top to bottom, left and right, front and rear direction.
Embodiment
Embodiment one: as Figure 1-5, originally can accurately trim the ceramic pressure sensor chip that temperature floats and comprise chip body 1, this chip body 1 is provided with four contacts 2, and be provided with Wheatstone bridge circuit, it is characterized in that: on the brachium pontis of Wheatstone bridge circuit, be connected to combination temperature drift compensation resistance, this combination temperature drift compensation resistance comprises trimming resistors R
0with a plurality of roughly adjusted rheostat R
1, R
2, R
2r
n, each roughly adjusted rheostat two ends R
1, R
2, R
2r
nbe connected to two and print on tinsel cord 3, described trimming resistors R
0be serially connected in wherein on a strip metal tinsel cord 3.
As shown in Figure 1, described chip body 1 is provided with locating notch 5.
The present invention can accurately trim the temperature of the ceramic pressure sensor chip that temperature floats and float the system of trimming, and comprises that temperature is floated separation system and temperature is floated the system of trimming, wherein:
As shown in Figure 7, temperature is floated separation system and is comprised constant temperature oven 6, data collector 7, process of separation controller 8, grading manipulator 9 and a plurality of separatory vessel 10.Wherein, data collector comprises a plurality of pallets 11, measurement jig frame and combined data acquisition module 12, as shown in Figure 7, described measurement jig frame comprises M layer supporting plate 13, wherein on every layer of supporting plate 13, be equipped with bracket tray positioning apparatus (not shown, can be detent), every layer of supporting plate 13 is provided with a tool dish 14, tool dish 14 is furnished with lifting drive, supporting plate 13 maintains static (can certainly join lifting drive by supporting plate 13, tool dish 14 maintains static, and figure slightly).
Each tool dish 14 is provided with N probe groups, each probe groups comprises four probes 15, a fixed bit 16 of the pallet 11 of corresponding its below, every group of probe is connected to respectively an interface of combined data acquisition module 12, combined data acquisition module 12 is connected with the signal input part of process of separation controller 8, described grading manipulator 9 is connected with the signal output part of process of separation controller 8, controlled by it.
Each interface of combined data acquisition module 8 includes DC voltage output end and DC voltage input end, DC voltage output end provides 5V driving voltage for ceramic pressure sensor chip, and DC voltage input end receives the actual output voltage of ceramic pressure sensor chip.
The preferred adjustable thermostatic case of described constant temperature oven 6.
As shown in Figure 8,9, temperature is floated the system of trimming and is comprised probe groups, pallet 11, laser trimming instrument 17, temperature compensation programming controller 18, high accuracy number voltage instrument 19 and tray rack 20, in temperature compensation programming controller 18, there are a plurality of pre-set programs that slightly trim, each slightly trims the corresponding a certain separatory vessel 10 of program, and a simultaneously corresponding temperature is floated error range; Ceramic pressure sensor chip is placed on fixed bit 16, the laser head of probe groups and laser trimming instrument 17 is collectively referred to as and trims working head 21, trim working head 21 or tray rack 20 and be furnished with X-direction driving mechanism, Y-direction driving mechanism and Z-direction driving mechanism, under the control of temperature compensation programming controller 18, tray rack 20 with trim working head 21 top to bottom, left and right, front and rear relative displacements occur, ceramic pressure sensor chip on pallet 11 is shifted near one by one and trim working head 21, probe groups comprises four probes 15, and probe 15 is pressed in the corresponding contacts of ceramic pressure sensor chip.
X, Y, Z represent respectively top to bottom, left and right, front and rear direction.
Temperature floats separation system and temperature is floated in the system of trimming, as shown in Figure 6, described pallet 11 is provided with N fixed bit 16, and each fixed bit 16 is all furnished with limited post or spacing preiection, ceramic pressure sensor chip is placed on fixed bit 16, fixing by limited post or spacing preiection location.
Wherein M, N are positive integer.
The present invention can accurately trim the temperature of the ceramic pressure sensor chip that temperature floats and float method for repairing and regulating, comprises the steps:
(1) temperature is floated sorting
As shown in Figure 7, during sorting, measurement jig frame is placed in constant temperature oven 6, constant temperature oven 6 is adjusted to the working temperature of ceramic pressure sensor chip, on pallet 11 each fixed bits 16, locate placing ceramic pressure sensor chip, then M pallet 11 is placed on respectively on different supporting plate 13, process of separation controller is controlled lifting drive action, tool dish and supporting plate are drawn close mutually, until the corresponding contacts 2 of each ceramic pressure sensor chip is pressed with probe 15, then process of separation controller 8 connects by combined data acquisition module 12 tool dishes 14, collect the temperature of each ceramic pressure sensor chip and float error, and float error range according to temperature, by grading manipulator 9, each ceramic pressure sensor chip is divided in different separatory vessel 10.
(2) temperature is floated and is trimmed
As shown in Figure 8,9, the ceramic pressure sensor chip in a certain separatory vessel 10 is packed in pallet 11, pallet 11 is put on tray rack 20, start temperature and float the system of trimming,
Under the control of temperature compensation programming controller 18, tray rack 20 with trim working head 21 top to bottom, left and right, front and rear relative displacements occur, ceramic pressure sensor chip on pallet 11 is shifted near one by one and trim working head 21, probe groups is pressed in the corresponding contacts 2 of ceramic pressure sensor chip, select slightly the trim program corresponding with separatory vessel 10, slightly trimming under programmed control, each ceramic pressure sensor chip in corresponding separatory vessel is carried out to coarse adjustment, to each roughly adjusted rheostat R in combination temperature drift compensation resistance
1, R
2, R
2r
n print tinsel cords 3 for two of end and connection roughly adjusted rheostat and carry out corresponding cutting, the combination of each roughly adjusted rheostat, connection in series-parallel relation are changed, carry out coarse adjustment.
Each roughly adjusted rheostat and adjustable resistance R in Fig. 3
0series connection; R in Fig. 4
1, R
2parallel connection, then with adjustable resistance R
0and other roughly adjusted rheostat series connection; In Fig. 5, remove R
noutward, all the other roughly adjusted rheostats are all cut, roughly adjusted rheostat R
n, adjustable resistance R
0series connection, as in Figure 3-5, only limited for example, actual series-parallel system is not limited to this.
The roughly adjusted rheostat of all ceramic pressure sensor chips in same separatory vessel 10 combines, connection in series-parallel relation is identical, but the adjustable resistance R of each ceramic pressure sensor chip
0cutting mode may be different.
Then, temperature compensation programming controller 18 is measured each ceramic pressure sensor chip actual output voltage under atmospheric pressure by high accuracy number voltage instrument 19, compare with ceramic pressure sensor chip design output voltage, and then show that accurate temperature floats error, the trimming resistors R in 17 pairs of combination temperature drift compensation resistance of laser trimming instrument
0cut, during cutting, the probe 15 of probe groups is pressed in ceramic pressure sensor chip corresponding contacts 2, and limit cutting, lateral dominance detect with 19 pairs of ceramic pressure sensors of high accuracy number voltage instrument, until ceramic pressure sensor chip temperature is floated error, reach preassigned.
Claims (4)
1. one kind can accurately trim the ceramic pressure sensor chip that temperature is floated, comprise chip body, in this chip body, be provided with Wheatstone bridge circuit, it is characterized in that: on the brachium pontis of Wheatstone bridge circuit, be connected to combination temperature drift compensation resistance, this combination temperature drift compensation resistance comprises trimming resistors and a plurality of roughly adjusted rheostat, each roughly adjusted rheostat two ends are connected to two and print on tinsel cords, and described trimming resistors is serially connected in wherein on a strip metal tinsel cord.
2. can accurately trim the ceramic pressure sensor chip that temperature is floated according to claim 1, it is characterized in that: described chip body is provided with locating notch.
3. the temperature that can accurately trim the ceramic pressure sensor chip that temperature floats described in claim 1 or 2 is floated the system of trimming, and comprises that temperature is floated separation system and temperature is floated the system of trimming, wherein:
Temperature is floated separation system and is comprised constant temperature oven, data collector, process of separation controller, grading manipulator and a plurality of separatory vessel, wherein, data collector comprises a plurality of pallets, measurement jig frame and combined data acquisition module, described measurement jig frame comprises M layer supporting plate, wherein on every layer of supporting plate, be equipped with bracket tray positioning apparatus, every layer of supporting plate is provided with a tool dish, tool dish or supporting plate are furnished with lifting drive, each tool dish is provided with N probe groups, each probe groups comprises a plurality of probes, fixed bit of pallet of corresponding its below, every group of probe connects respectively an interface of combined data acquisition module, combined data acquisition module is connected with the signal input part of process of separation controller, described grading manipulator is connected with the signal output part of process of separation controller, controlled by it,
Temperature is floated the system of trimming and is comprised probe groups, pallet, laser trimming instrument, temperature compensation programming controller, high accuracy number voltage instrument and tray rack, in temperature compensation programming controller, there are a plurality of pre-set programs that slightly trim, each slightly trims the corresponding separatory vessel of program, and a simultaneously corresponding temperature is floated error range; The laser head of probe groups and laser trimming instrument is collectively referred to as and trims working head, trim working head or tray rack and be furnished with X-direction driving mechanism, Y-direction driving mechanism and Z-direction driving mechanism, under the control of temperature compensation programming controller, tray rack with trim working head top to bottom, left and right, front and rear relative displacement occur, ceramic pressure sensor chip on pallet is shifted near one by one and trim working head, probe groups is pressed in the corresponding contacts of ceramic pressure sensor chip.
Temperature floats separation system and temperature is floated in the system of trimming, described pallet is provided with N fixed bit, and each fixed bit is all furnished with limited post or spacing preiection, and ceramic pressure sensor chip is placed on fixed bit, fixing by limited post or spacing preiection location, wherein M, N are positive integer.
4. the temperature that can accurately trim the ceramic pressure sensor chip that temperature floats described in claim 1 is floated method for repairing and regulating, comprises the steps:
(1) temperature is floated sorting: during sorting, measurement jig frame is placed in constant temperature oven, constant temperature oven is adjusted to the working temperature of ceramic pressure sensor chip, on each fixed bit of pallet, locate placing ceramic pressure sensor chip, then pallet is placed on respectively on different supporting plates, process of separation controller is controlled lifting drive action, tool dish and supporting plate are drawn close mutually, until the corresponding contacts of each ceramic pressure sensor chip is pressed with probe, then process of separation controller connects by combined data acquisition module tool dish, collect the temperature of each ceramic pressure sensor chip and float error, and float error range according to temperature, by grading manipulator, each ceramic pressure sensor chip is divided in different separatory vessels,
(2) temperature is floated and is trimmed
Ceramic pressure sensor chip in a certain separatory vessel is packed in pallet, pallet is put on tray rack, start temperature and float the system of trimming,
Under the control of temperature compensation programming controller, tray rack with trim working head top to bottom, left and right, front and rear relative displacement occur, ceramic pressure sensor chip on pallet is shifted near one by one and trim working head, probe groups is pressed in the corresponding contacts of ceramic pressure sensor chip, select slightly the trim program corresponding with separatory vessel, slightly trimming under programmed control, each ceramic pressure sensor chip in corresponding separatory vessel is being carried out to coarse adjustment, to each roughly adjusted rheostat R in combination temperature drift compensation resistance
1, R
2, R
2r
nand two of connecting roughly adjusted rheostat print tinsel cords and carry out corresponding cutting, the combination of each roughly adjusted rheostat, connection in series-parallel relation are changed, carry out coarse adjustment;
Then, temperature compensation programming controller is measured each ceramic pressure sensor chip actual output voltage under atmospheric pressure by high accuracy number voltage instrument, compare with ceramic pressure sensor chip design output voltage, and then show that accurate temperature floats error, laser trimming instrument cuts the trimming resistors in combination temperature drift compensation resistance, during cutting, the probe of probe groups is pressed in ceramic pressure sensor chip corresponding contacts, limit cutting, lateral dominance detects ceramic pressure sensor with high accuracy number voltage instrument, until floating error, ceramic pressure sensor temperature reaches preassigned.
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| CN201310545795.XA CN103557969B (en) | 2013-11-07 | 2013-11-07 | Accurately can trim the ceramic pressure sensor chip of temperature drift error and trim system and method for repairing and regulating |
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|---|---|---|---|
| CN201310545795.XA CN103557969B (en) | 2013-11-07 | 2013-11-07 | Accurately can trim the ceramic pressure sensor chip of temperature drift error and trim system and method for repairing and regulating |
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| CN103557969B CN103557969B (en) | 2016-02-24 |
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| CN104535252A (en) * | 2014-11-20 | 2015-04-22 | 武汉中航传感技术有限责任公司 | Automatic compensation device of silicon piezoresistive sensors and parameter coupling program-control switching device |
| CN107063523A (en) * | 2016-02-11 | 2017-08-18 | 摩巴自动控制股份有限公司 | Electronic circuit, measuring cell, load detecting equipment and the vehicle including it |
| CN107544478A (en) * | 2017-10-26 | 2018-01-05 | 北京广利核系统工程有限公司 | Analog quantity automatic testing equipment and method in nuclear power DCS identifications |
| CN107655625A (en) * | 2017-09-22 | 2018-02-02 | 陕西华经微电子股份有限公司 | Thick film ceramic pressure sensor zero-point voltage on-line debugging method |
| CN107687915A (en) * | 2016-08-03 | 2018-02-13 | 麦克罗特尔电子技术股份公司 | The piezoresistive pressure sensor of calibrating resistor provided with biasing |
| CN110926688A (en) * | 2019-11-21 | 2020-03-27 | 歌尔股份有限公司 | Air pressure detection method and system |
| CN114141646A (en) * | 2021-11-16 | 2022-03-04 | 中国科学院上海微系统与信息技术研究所 | Wafer-level trimming method for chip reference voltage temperature drift coefficient |
| CN115855327A (en) * | 2023-02-22 | 2023-03-28 | 成都凯天电子股份有限公司 | Adjustable resistance ceramic substrate applied to silicon piezoresistive pressure sensor and manufacturing method thereof |
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| CN114141646A (en) * | 2021-11-16 | 2022-03-04 | 中国科学院上海微系统与信息技术研究所 | Wafer-level trimming method for chip reference voltage temperature drift coefficient |
| CN114141646B (en) * | 2021-11-16 | 2024-10-18 | 中国科学院上海微系统与信息技术研究所 | Wafer-level trimming method for temperature drift coefficient of reference voltage of chip |
| CN115855327A (en) * | 2023-02-22 | 2023-03-28 | 成都凯天电子股份有限公司 | Adjustable resistance ceramic substrate applied to silicon piezoresistive pressure sensor and manufacturing method thereof |
| CN115855327B (en) * | 2023-02-22 | 2023-06-09 | 成都凯天电子股份有限公司 | Adjustable resistance ceramic substrate applied to silicon piezoresistive pressure sensor and manufacturing method thereof |
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Denomination of invention: Ceramic pressure sensor chip capable of accurately correcting and adjusting temperature drift error, correcting and adjusting system and correcting and adjusting method Effective date of registration: 20170915 Granted publication date: 20160224 Pledgee: Bank of Nanjing, Limited by Share Ltd, Pearl River Bank Pledgor: NANJING HUANKE ELECTRONIC TECHNOLOGY CO., LTD. Registration number: 2017990000879 |
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