CN103557968A - Positioning device and method for welding point of piezoelectric ceramic chip in piezoelectric sensor - Google Patents
Positioning device and method for welding point of piezoelectric ceramic chip in piezoelectric sensor Download PDFInfo
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- CN103557968A CN103557968A CN201310595201.6A CN201310595201A CN103557968A CN 103557968 A CN103557968 A CN 103557968A CN 201310595201 A CN201310595201 A CN 201310595201A CN 103557968 A CN103557968 A CN 103557968A
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Abstract
The invention belongs to the field of piezoelectric sensors, and provides a positioning device and method for a welding point of a piezoelectric ceramic chip in a piezoelectric sensor. The positioning device and method aim to solve the problem that there is no basis for positioning a welding point of a piezoelectric ceramic chip in an existing piezoelectric sensor. According to the positioning device and method for the welding point of the piezoelectric ceramic chip in the piezoelectric sensor, electrical signal data at all contact points between a microseismic spring and the piezoelectric ceramic chip are detected, the sensitivity calculation is carried out on the electrical signal data at all the contact points and sensitivity values of all the contact points are compared to obtain the point with the biggest sensitivity value, and namely the best welding point of the piezoelectric ceramic chip is obtained. According to the welding point, the piezoelectric ceramic chip is welded in the piezoelectric sensor, and the sensitivity of the piezoelectric sensor is improved by 75%, accordingly, the detection scope of the piezoelectric sensor is broadened, and the detection and conversion of small signals through the piezoelectric sensor can be achieved. The positioning device and method are suitable for positioning the welding point of the piezoelectric ceramic chip in the piezoelectric sensor.
Description
Technical field
The invention belongs to piezoelectric sensor field.
Background technology
Sensor is a kind of device with measuring ability that is widely used in the fields such as industry, agricultural, national defence and medical science, is known as " electric face ", by simulating the function of mankind's face, various non electrical quantities is detected.Piezoelectric sensor is the piezoelectric effect of utilizing piezoelectric ceramic piece, converts stress or strain to voltage or electric charge, then the device that is amplified and exported by amplifier.Piezoelectric sensor is by extraneous power being delivered to the mechanical system, piezoelectric ceramic piece of piezoelectric ceramic piece and charge transfer being formed to metering circuit three parts of instrument.Piezoelectric ceramic piece is the critical component of piezoelectric sensor, and from signal translation-angle, piezoelectric ceramic piece is equivalent to a charge generators.Mechanical system is to install and the fixing holder part of piezoelectric ceramic piece, by this system, is directly contacted with the external world, and when being subject to External Force Acting, support produces deformation together with piezoelectric ceramic piece.Piezoelectric ceramic piece produces electric charge by deformation and exports.In piezoelectric sensor, the pad of piezoelectric ceramic piece can be because the difference of geometric position impacts the sensitivity of piezoelectric sensor, adopt fixing pad in the past or chose at random the mode of pad, the position of pad does not have basis on location, cause the sensitivity of sensor can not be guaranteed, limited the range of application of piezoelectric sensor.
Summary of the invention
The present invention does not have the problem of basis on location in order to solve the pad of piezoelectric ceramic piece in existing piezoelectric sensor, locating device and the method for piezoelectric ceramic piece pad in piezoelectric sensor is now provided.
The locating device of piezoelectric ceramic piece pad in piezoelectric sensor, it comprises: intelligent control module, the first digital serial port, the second digital serial port, the first intelligent driver module, the first gear train, the second intelligent driver module, the second gear train, microseism spring assembly and pressure transducer group;
Intelligent control module is connected with the first intelligent driver module by the first digital serial port, the first intelligent driver module is used for driving the first gear train motion, intelligent control module is connected with the second intelligent driver module by the second digital serial port, the second intelligent driver module is used for driving the second gear train motion, the pressure signal output terminal of the pressure detecting signal input end Bonding pressure sensor group of intelligent control module;
Described microseism spring assembly comprises: the first spring assembly and the second spring assembly;
Described the first spring assembly comprises: upper X-axis bar, lower X-axis bar, upper Y-axis plate, lower Y-axis plate, the first fore-set, the second fore-set, the first microseism spring, the second microseism spring, the first knob, the second knob, upper X-axis slide block and lower X-axis slide block;
Upper X-axis bar is provided with X-direction sliding tray along its length, upper X-axis slide block embeds in described upper X-direction sliding tray, upper Y-axis plate is fixed on X-axis slide block, upper Y-axis plate is provided with Y-direction sliding tray, the direction of described upper Y-direction sliding tray is mutually vertical with the direction of upper X-direction sliding tray, the first fore-set and the second fore-set all embed in Y-direction sliding tray, and are all slidably connected with described upper Y-direction sliding tray;
Lower X-axis bar is provided with lower X-direction sliding tray along its length, lower X-axis slide block embeds in described lower X-direction sliding tray, lower Y-axis plate is fixed on lower X-axis slide block, lower Y-axis plate is provided with lower Y-direction sliding tray, the direction of described lower Y-direction sliding tray is mutually vertical with the direction of lower X-direction sliding tray, the first knob and the second knob all embed in lower Y-direction sliding tray, and be all slidably connected with described upper Y-direction sliding tray, the first microseism spring is connected with the first knob, the second microseism spring is connected with the second knob, the first microseism spring is vertical corresponding with the first fore-set, the second microseism spring is vertical corresponding with the second fore-set,
Described the first spring assembly is identical with the structure of the second spring assembly;
Described pressure transducer group comprises four pressure transducers, and four pressure transducers are respectively used to detect the pressure of four microseism springs in microseism spring assembly;
Described the second gear train is identical with the structure of the first gear train,
The first gear train is used for driving the first spring assembly, and the first gear train is used for driving the second spring assembly,
Wherein, the first gear train is for driving the upper Y-axis plate of the first spring assembly along the upper X-direction sliding tray slip of upper X-axis bar; Also for driving the lower Y-axis plate of the first spring assembly along the lower X-direction sliding tray slip of lower X-axis bar; Also for driving the first fore-set and the second fore-set to slide along the upper Y-direction sliding tray of upper Y-axis plate; Also for driving the first knob and the second knob to move along the lower Y-direction sliding tray of lower Y-axis plate.
The localization method of piezoelectric ceramic piece pad in piezoelectric sensor, described localization method comprises the following steps:
Step 1: piezoelectric ceramic piece is clipped between fore-set and microseism spring, makes each fore-set corresponding up and down with a microseism spring, manual adjustments knob, equates the compression distance of four microseism springs, then performs step two;
Step 2: intelligent control module is controlled the first intelligent driver module or the second intelligent driver module simultaneously, makes a microseism spring and the fore-set corresponding with it move to successively the position of each tested point on piezoelectric ceramic piece; When four springs of microseism and the fore-set corresponding with it all move to tested point position, pressure transducer group read four tested points pressure signal data; Then perform step three;
Step 3: the data that step 2 obtained according to Calculation of Sensitivity formula are calculated, obtain the sensitivity of each tested point, and the sensitivity of all tested points is compared, acquisition has the tested point of peak response, the coordinate of the best pad using the coordinate of this tested point as piezoelectric ceramic piece.
The locating device of piezoelectric ceramic piece pad and method in piezoelectric sensor of the present invention, the electrical signal data that has point of contact and locate by detecting microseism spring and piezoelectric ceramic piece, and the electrical signal data at the place of having point of contact is carried out to Calculation of Sensitivity, and by Sensitirity va1ue a little compare, acquisition has the point of peak response value, obtain the best pad of piezoelectric ceramic piece, the present invention simultaneously adopts intelligent control module to make operating process intelligent, reaches the object of accurate measurement.
According to the pad of localization method of the present invention location, piezoelectric ceramic piece is welded in piezoelectric sensor, make the sensitivity of piezoelectric sensor improve 75%, thereby widened the investigative range of piezoelectric sensor, can make piezoelectric sensor realize detection and the conversion of tiny signal.
In piezoelectric sensor of the present invention, the locating device of piezoelectric ceramic piece pad and method are applicable to position for the piezoelectric ceramic piece pad in piezoelectric sensor.
Accompanying drawing explanation
Fig. 1 is the structural representation of the locating device of piezoelectric ceramic piece pad in the piezoelectric sensor described in embodiment one.
Fig. 2 is the front view of the microseism spring assembly described in embodiment one.
Fig. 3 is the vertical view of Fig. 2.
Fig. 4 is the A-A view of Fig. 2.
Fig. 5 is the process flow diagram of the localization method of piezoelectric ceramic piece pad in the piezoelectric sensor described in embodiment two.
Embodiment
Embodiment one: illustrate present embodiment referring to figs. 1 through Fig. 4, the locating device of piezoelectric ceramic piece pad in piezoelectric sensor described in present embodiment, it comprises: intelligent control module 1, the first digital serial port 21, the second digital serial port 22, the first intelligent driver module 31, the first gear train 33, the second intelligent driver module 32, the second gear train 34, microseism spring assembly 4 and pressure transducer group 15;
Intelligent control module 1 is connected with the first intelligent driver module 31 by the first digital serial port 21, the first intelligent driver module 31 is for driving the first gear train 33 motions, intelligent control module 1 is connected with the second intelligent driver module 32 by the second digital serial port 22, the second intelligent driver module 32 is for driving the second gear train 34 motions, the pressure signal output terminal of the pressure detecting signal input end Bonding pressure sensor group 15 of intelligent control module 1;
Described microseism spring assembly 4 comprises: the first spring assembly and the second spring assembly;
Described the first spring assembly comprises: upper X-axis bar 5, lower X-axis bar 6, upper Y-axis plate 7, lower Y-axis plate 8, the first fore-set 9, the second fore-set 10, the first microseism spring 11, the second microseism spring 12, the first knob 13, the second knob 14, upper X-axis slide block and lower X-axis slide block;
Described the first spring assembly is identical with the structure of the second spring assembly;
Described pressure transducer group 15 comprises four pressure transducers, and four pressure transducers are respectively used to detect the pressure of four microseism springs in microseism spring assembly 4;
Described the second gear train 34 is identical with the structure of the first gear train 33,
The first gear train 33 is for driving the first spring assembly, and the first gear train 33 is for driving the second spring assembly,
Wherein, the first gear train 33 is for driving the upper Y-axis plate 7 of the first spring assembly along the upper X-direction sliding tray slip of upper X-axis bar 5; Also for driving the lower Y-axis plate 8 of the first spring assembly along the lower X-direction sliding tray slip of lower X-axis bar; Also for driving the first fore-set 9 and the second fore-set 10 to slide along the upper Y-direction sliding tray of upper Y-axis plate 7; Also for driving the first knob 13 and the second knob 14 to move along the lower Y-direction sliding tray of lower Y-axis plate 8.
Embodiment two: present embodiment is that the locating device of piezoelectric ceramic piece pad in the piezoelectric sensor described in embodiment one is described further, in present embodiment, the elasticity coefficient of four microseism springs is all between 150N/m to 160N/m.
Embodiment three: illustrate present embodiment with reference to Fig. 5, present embodiment adopts the locating device of piezoelectric ceramic piece pad in the piezoelectric sensor described in embodiment one to realize the localization method of piezoelectric ceramic piece pad in piezoelectric sensor, and described localization method comprises the following steps:
Step 1: piezoelectric ceramic piece is clipped between fore-set and microseism spring, makes each fore-set corresponding up and down with a microseism spring, manual adjustments knob, equates the compression distance of four microseism springs, then performs step two;
Step 2: intelligent control module 1 is controlled the first intelligent driver module 31 or the second intelligent driver module 32 simultaneously, makes a microseism spring and the fore-set corresponding with it move to successively the position of each tested point on piezoelectric ceramic piece; When four springs of microseism and the fore-set corresponding with it all move to tested point position, pressure transducer group 15 read four tested points pressure signal data; Then perform step three;
Step 3: the data that step 2 obtained according to Calculation of Sensitivity formula are calculated, obtain the sensitivity of each tested point, and the sensitivity of all tested points is compared, acquisition has the tested point of peak response, the coordinate of the best pad using the coordinate of this tested point as piezoelectric ceramic piece.
Embodiment four: present embodiment is that the localization method of piezoelectric ceramic piece pad in the piezoelectric sensor described in embodiment three is described further, in present embodiment, before step 1, first to intelligent control module 1 preheating, be 30 minutes preheating time.
Embodiment five: present embodiment is that the localization method of piezoelectric ceramic piece pad in the piezoelectric sensor described in embodiment three is described further, in present embodiment, before step 1, first start the first digital serial port 21 and the second digital serial port 22, according to the performance of piezoelectric ceramics, switch the data channel of the first digital serial port 21 and the second digital serial port 22, wait for 5 minutes and make signal stabilization.
Embodiment six: present embodiment is that the localization method of piezoelectric ceramic piece pad in the piezoelectric sensor described in embodiment three, four or five is described further, in present embodiment, the material of described piezoelectric ceramic piece is the stupalith of BT perovskite structure.
When the certain mechanical oscillation signal of the stupalith that gives BT perovskite structure, ceramic surface can produce certain charge variation, thereby exports certain electric signal.
Claims (6)
1. the locating device of piezoelectric ceramic piece pad in piezoelectric sensor, it comprises: intelligent control module (1), the first digital serial port (21), the second digital serial port (22), the first intelligent driver module (31), the first gear train (33), the second intelligent driver module (32), the second gear train (34), microseism spring assembly (4) and pressure transducer group (15);
Intelligent control module (1) is connected with the first intelligent driver module (31) by the first digital serial port (21), the first intelligent driver module (31) is for driving the first gear train (33) motion, intelligent control module (1) is connected with the second intelligent driver module (32) by the second digital serial port (22), the second intelligent driver module (32) is for driving the second gear train (34) motion, the pressure signal output terminal of the pressure detecting signal input end Bonding pressure sensor group (15) of intelligent control module (1);
Described microseism spring assembly (4) comprising: the first spring assembly and the second spring assembly;
Described the first spring assembly comprises: upper X-axis bar (5), lower X-axis bar (6), upper Y-axis plate (7), lower Y-axis plate (8), the first fore-set (9), the second fore-set (10), the first microseism spring (11), the second microseism spring (12), the first knob (13), the second knob (14), upper X-axis slide block and lower X-axis slide block;
Upper X-axis bar (5) is provided with X-direction sliding tray along its length, upper X-axis slide block embeds in described upper X-direction sliding tray, upper Y-axis plate (7) is fixed on X-axis slide block, upper Y-axis plate (7) is provided with Y-direction sliding tray, the direction of described upper Y-direction sliding tray is mutually vertical with the direction of upper X-direction sliding tray, the first fore-set (9) and the second fore-set (10) all embed in Y-direction sliding tray, and are all slidably connected with described upper Y-direction sliding tray;
Lower X-axis bar (6) is provided with lower X-direction sliding tray along its length, lower X-axis slide block embeds in described lower X-direction sliding tray, lower Y-axis plate (8) is fixed on lower X-axis slide block, lower Y-axis plate (8) is provided with lower Y-direction sliding tray, the direction of described lower Y-direction sliding tray is mutually vertical with the direction of lower X-direction sliding tray, the first knob (13) and the second knob (14) all embed in lower Y-direction sliding tray, and be all slidably connected with described upper Y-direction sliding tray, the first microseism spring (11) is connected with the first knob (13), the second microseism spring (12) is connected with the second knob (14), the first microseism spring (11) is vertical corresponding with the first fore-set (9), the second microseism spring (12) is vertical corresponding with the second fore-set 1,
Described the first spring assembly is identical with the structure of the second spring assembly;
Described pressure transducer group (15) comprises four pressure transducers, and four pressure transducers are respectively used to detect the pressure of four microseism springs in microseism spring assembly (4);
Described the second gear train (34) is identical with the structure of the first gear train (33),
The first gear train (33) is for driving the first spring assembly, and the first gear train (33) is for driving the second spring assembly,
Wherein, the first gear train (33) is for driving the upper Y-axis plate (7) of the first spring assembly along the upper X-direction sliding tray slip of upper X-axis bar (5); Also for driving the lower Y-axis plate (8) of the first spring assembly along the lower X-direction sliding tray slip of lower X-axis bar; Also for driving the first fore-set (9) and the second fore-set (10) to slide along the upper Y-direction sliding tray of upper Y-axis plate (7); Also for driving the first knob (13) and the second knob (14) along the lower Y-direction sliding tray motion of lower Y-axis plate (8).
2. the locating device of piezoelectric ceramic piece pad in piezoelectric sensor according to claim 1, is characterized in that, the elasticity coefficient of four microseism springs is all between 150N/m to 160N/m.
3. adopt the locating device of piezoelectric ceramic piece pad in piezoelectric sensor claimed in claim 1 to realize the localization method of piezoelectric ceramic piece pad in piezoelectric sensor, it is characterized in that, described localization method comprises the following steps:
Step 1: piezoelectric ceramic piece is clipped between fore-set and microseism spring, makes each fore-set corresponding up and down with a microseism spring, manual adjustments knob, equates the compression distance of four microseism springs, then performs step two;
Step 2: intelligent control module (1) is controlled the first intelligent driver module (31) or the second intelligent driver module (32) simultaneously, makes a microseism spring and the fore-set corresponding with it move to successively the position of each tested point on piezoelectric ceramic piece; When four springs of microseism and the fore-set corresponding with it all move to tested point position, pressure transducer group (15) read four tested points pressure signal data; Then perform step three;
Step 3: the data that step 2 obtained according to Calculation of Sensitivity formula are calculated, obtain the sensitivity of each tested point, and the sensitivity of all tested points is compared, acquisition has the tested point of peak response, the coordinate of the best pad using the coordinate of this tested point as piezoelectric ceramic piece.
4. the localization method of piezoelectric ceramic piece pad in piezoelectric sensor according to claim 3, is characterized in that, before step 1, first, to intelligent control module (1) preheating, be 30 minutes preheating time.
5. the localization method of piezoelectric ceramic piece pad in piezoelectric sensor according to claim 3, it is characterized in that, before step 1, first start the first digital serial port (21) and the second digital serial port (22), according to the performance of piezoelectric ceramics, switch the data channel of the first digital serial port (21) and the second digital serial port (22), wait for 5 minutes and make signal stabilization.
6. according to the localization method of piezoelectric ceramic piece pad in the piezoelectric sensor described in claim 3,4 or 5, it is characterized in that, the material of described piezoelectric ceramic piece is the stupalith of BT perovskite structure.
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| CN201310595201.6A CN103557968B (en) | 2013-11-22 | 2013-11-22 | Positioning device and method for welding point of piezoelectric ceramic chip in piezoelectric sensor |
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| CN201310595201.6A CN103557968B (en) | 2013-11-22 | 2013-11-22 | Positioning device and method for welding point of piezoelectric ceramic chip in piezoelectric sensor |
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| CN103557968B CN103557968B (en) | 2015-06-17 |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108362438A (en) * | 2018-04-16 | 2018-08-03 | 无锡盛赛传感科技有限公司 | A kind of ceramic pressure sensor signal detection cubing |
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| US5486820A (en) * | 1992-12-18 | 1996-01-23 | The Whitaker Corporation | Traffic sensor having piezoelectric sensors which distinguish lanes |
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| CN202817031U (en) * | 2012-09-19 | 2013-03-20 | 杨义根 | Piezoelectric transducer |
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2013
- 2013-11-22 CN CN201310595201.6A patent/CN103557968B/en not_active Expired - Fee Related
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5486820A (en) * | 1992-12-18 | 1996-01-23 | The Whitaker Corporation | Traffic sensor having piezoelectric sensors which distinguish lanes |
| CN102195595A (en) * | 2010-03-17 | 2011-09-21 | 王伟 | Ultrasonic flat type piezoelectric vibrator |
| CN202817031U (en) * | 2012-09-19 | 2013-03-20 | 杨义根 | Piezoelectric transducer |
Non-Patent Citations (1)
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| 中国科学院上海硅酸盐所电陶瓷组: "压电陶瓷动态抗张强度的测试", 《无机材料学报》, no. 04, 30 April 1974 (1974-04-30), pages 46 - 53 * |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
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| CN108362438A (en) * | 2018-04-16 | 2018-08-03 | 无锡盛赛传感科技有限公司 | A kind of ceramic pressure sensor signal detection cubing |
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Inventor after: Chi Qingguo Inventor after: Yang Fengyou Inventor after: Tian Shuo Inventor after: Ren Xiongfei Inventor after: Cui Yang Inventor after: Zhang Changhai Inventor after: Wang Xinxin Inventor after: Ma Tao Inventor before: Chi Qingguo Inventor before: Yang Fengyou Inventor before: Cui Yang Inventor before: Zhang Changhai Inventor before: Wang Xinxin Inventor before: Ma Tao |
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