CN103555248A - Modified epoxy resin adhesive and preparation method thereof - Google Patents
Modified epoxy resin adhesive and preparation method thereof Download PDFInfo
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- CN103555248A CN103555248A CN201310546320.2A CN201310546320A CN103555248A CN 103555248 A CN103555248 A CN 103555248A CN 201310546320 A CN201310546320 A CN 201310546320A CN 103555248 A CN103555248 A CN 103555248A
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Abstract
The invention discloses a modified epoxy resin adhesive and a preparation method thereof. The adhesive comprises the following components in parts by weight: 100-140 parts of epoxy resin, 20-30 parts of diisononyl phthalate, 15-20 parts of p-phenylenediamine, 10-20 parts of triethoxyisobutylsilane, 5-8 parts of tetramisole hydrochloride and 10-15 parts of talcum powder. The preparation method of the modified epoxy resin adhesive comprises the following steps: mixing hydroxy-terminated polysiloxane and diisocyanate in a mass ratio of (1-1.5): 1 for 40-50 minutes at the temperature of 60-90 DEG C so as to prepare an isocyanate-terminated polysiloxane polyurethane prepolymer, then mixing the polysiloxane polyurethane prepolymer and epoxy resin in a mass ratio of (5-10): 1, then adding diisononyl phthalate, p-phenylenediamine, triethoxyisobutylsilane, tetramisole hydrochloride and the talcum powder, and mixing for 1-3 hours at the temperature of 50-80 DEG C, thus producing the product. The modified epoxy resin adhesive has the beneficial effects of good high-temperature resistance property, low brittleness, good toughness and high reaction activity.
Description
Technical field
The present invention relates to a kind of preparation method of tackiness agent, relate in particular to a kind of preparation method of modified epoxide resin adhesive.
Background technology
Along with the proposition in succession of the various gluing theories of 20 middle of century, and the deep progress of the basic research work such as tackiness agent chemistry, tackiness agent rheology and gluing failure mechanisms, make Adhensive performance, kind and application have the development of advancing by leaps and bounds.Epoxy resin and curing system thereof be also with the continuing to bring out of its uniqueness, excellent performance and neo-epoxy resin, Novel curing agent and additive, and becomes excellent performance, kind is numerous, adaptability the is extensive important tackiness agent of a class.But the general epoxyn that we commonly use at present also exists fragility high, the shortcoming that temperature tolerance is poor, this uses epoxyn to produce great limitation to us, therefore, needs a kind of new technical scheme to address the above problem.
Summary of the invention
The invention provides a kind of fragility low, the preparation method of the modified epoxide resin adhesive that resistance to elevated temperatures is good.
The technical solution used in the present invention: a kind of modified epoxide resin adhesive comprises each composition of following weight part:
Epoxy resin 100-140 part
Diisononyl phthalate 20-30 part
Ursol D 15-20 part
Isobutyl triethoxy silane 10-20 part
Four salt imidazole acid 5-8 parts
Talcum powder 10-15 part
Epoxy resin is the mixture of dihydroxyphenyl propane tetraglycidel ether epoxy resin, Hydrogenated Bisphenol A diglycidylether and bisphenol S two shrink Licorice oil ethers.
This preparation method is: hydroxy-terminated polysiloxane and vulcabond are pressed to (1-1.5): 1 mass ratio mixes 40-50min under the condition of temperature 60-90 ℃, the polysiloxane polyurethane prepolymer of the isocyanate groups end-blocking of making, again by polysiloxane polyurethane prepolymer and epoxy resin according to (5-10): 1 mass ratio mixes, add again diisononyl phthalate, Ursol D, isobutyl triethoxy silane, four salt imidazole acid and talcum powder, under the condition of temperature 50-80 ℃, mix 1-3h, generate finished product.
Beneficial effect of the present invention: the epoxyn resistance to elevated temperatures of modification is good, fragility is low, good toughness, reactive behavior are large.
Embodiment
Embodiment 1
A kind of modified epoxide resin adhesive comprises each composition of following weight part: 10 parts of 15 parts of 20 parts of 100 parts, mixture, diisononyl phthalate, Ursol D, isobutyl triethoxy silanes, 5 parts of four salt imidazole acids, 10 parts of the talcum powder of dihydroxyphenyl propane tetraglycidel ether epoxy resin, Hydrogenated Bisphenol A diglycidylether and bisphenol S two shrink Licorice oil ethers.
Preparation method is: hydroxy-terminated polysiloxane and vulcabond are mixed to 40min by the mass ratio of 1:1 under the condition of temperature 60 C, the polysiloxane polyurethane prepolymer of the isocyanate groups end-blocking of making, again polysiloxane polyurethane prepolymer is mixed according to the mass ratio of 5:1 with epoxy resin, add again diisononyl phthalate, Ursol D, isobutyl triethoxy silane, four salt imidazole acid and talcum powder, under the condition of temperature 50 C, mix 1h, generate finished product.
The epoxyn resistance to elevated temperatures of modification is good, fragility is low, good toughness, reactive behavior are large.
Embodiment 2
A kind of modified epoxide resin adhesive comprises each composition of following weight part: 15 parts of 17 parts of 25 parts of 120 parts, mixture, diisononyl phthalate, Ursol D, isobutyl triethoxy silanes, 6 parts of four salt imidazole acids, 13 parts of the talcum powder of dihydroxyphenyl propane tetraglycidel ether epoxy resin, Hydrogenated Bisphenol A diglycidylether and bisphenol S two shrink Licorice oil ethers.
Preparation method is: hydroxy-terminated polysiloxane and vulcabond are mixed to 45min by the mass ratio of 1.3:1 under the condition of 75 ℃ of temperature, the polysiloxane polyurethane prepolymer of the isocyanate groups end-blocking of making, again polysiloxane polyurethane prepolymer is mixed according to the mass ratio of 7:1 with epoxy resin, add again diisononyl phthalate, Ursol D, isobutyl triethoxy silane, four salt imidazole acid and talcum powder, under the condition of temperature 70 C, mix 2h, generate finished product.
The epoxyn resistance to elevated temperatures of modification is good, fragility is low, good toughness, reactive behavior are large.
Embodiment 3
A kind of modified epoxide resin adhesive comprises each composition of following weight part: 20 parts of 20 parts of 30 parts of 140 parts, mixture, diisononyl phthalate, Ursol D, isobutyl triethoxy silanes, 8 parts of four salt imidazole acids, 15 parts of the talcum powder of dihydroxyphenyl propane tetraglycidel ether epoxy resin, Hydrogenated Bisphenol A diglycidylether and bisphenol S two shrink Licorice oil ethers.
Preparation method is: hydroxy-terminated polysiloxane and vulcabond are mixed to 50min by the mass ratio of 1.5:1 under the condition of 90 ℃ of temperature, the polysiloxane polyurethane prepolymer of the isocyanate groups end-blocking of making, again polysiloxane polyurethane prepolymer is mixed according to the mass ratio of 10:1 with epoxy resin, add again diisononyl phthalate, Ursol D, isobutyl triethoxy silane, four salt imidazole acid and talcum powder, under the condition of 80 ℃ of temperature, mix 3h, generate finished product.
The epoxyn resistance to elevated temperatures of modification is good, fragility is low, good toughness, reactive behavior are large.
Claims (3)
1. a modified epoxide resin adhesive, is characterized in that this epoxyn comprises each composition of following weight part:
Epoxy resin 100-140 part;
Diisononyl phthalate 20-30 part;
Ursol D 15-20 part;
Isobutyl triethoxy silane 10-20 part;
Four salt imidazole acid 5-8 parts;
Talcum powder 10-15 part.
2. a kind of modified epoxide resin adhesive according to claim 1, is characterized in that: described epoxy resin is the mixture of dihydroxyphenyl propane tetraglycidel ether epoxy resin, Hydrogenated Bisphenol A diglycidylether and bisphenol S two shrink Licorice oil ethers.
3. the preparation method of a kind of modified epoxide resin adhesive according to claim 1 and 2, it is characterized in that this preparation method is: hydroxy-terminated polysiloxane and vulcabond are pressed to (1-1.5): 1 mass ratio mixes 40-50min under the condition of temperature 60-90 ℃, the polysiloxane polyurethane prepolymer of the isocyanate groups end-blocking of making, again by polysiloxane polyurethane prepolymer and epoxy resin according to (5-10): 1 mass ratio mixes, add again diisononyl phthalate, Ursol D, isobutyl triethoxy silane, four salt imidazole acid and talcum powder, under the condition of temperature 50-80 ℃, mix 1-3h, generate finished product.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201310546320.2A CN103555248A (en) | 2013-11-07 | 2013-11-07 | Modified epoxy resin adhesive and preparation method thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201310546320.2A CN103555248A (en) | 2013-11-07 | 2013-11-07 | Modified epoxy resin adhesive and preparation method thereof |
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| CN103555248A true CN103555248A (en) | 2014-02-05 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN201310546320.2A Pending CN103555248A (en) | 2013-11-07 | 2013-11-07 | Modified epoxy resin adhesive and preparation method thereof |
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Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105482751A (en) * | 2015-12-30 | 2016-04-13 | 安徽律正科技信息服务有限公司 | High-performance polyurethane pressure-sensitive adhesive |
| CN108493469A (en) * | 2018-03-13 | 2018-09-04 | 中国科学院上海有机化学研究所 | A kind of cross-linking type high temperature proton exchange film and preparation method thereof |
| CN112646525A (en) * | 2020-12-25 | 2021-04-13 | 烟台德邦科技股份有限公司 | High-adhesion low-modulus epoxy adhesive and preparation method thereof |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1670109A (en) * | 2005-05-11 | 2005-09-21 | 李洁华 | Modified epoxy resin adhesive and its preparation process |
| CN101544807A (en) * | 2009-04-30 | 2009-09-30 | 中国科学技术大学 | Epoxy anti-fouling material and preparation method and use of same |
| CN101824133A (en) * | 2010-04-28 | 2010-09-08 | 天津大学 | Preparation method for waterborne polyurethane modified epoxy resin curing agent |
| CN103374115A (en) * | 2013-06-28 | 2013-10-30 | 南京市荣达树脂有限公司 | Preparation method of modified epoxy resin |
-
2013
- 2013-11-07 CN CN201310546320.2A patent/CN103555248A/en active Pending
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1670109A (en) * | 2005-05-11 | 2005-09-21 | 李洁华 | Modified epoxy resin adhesive and its preparation process |
| CN101544807A (en) * | 2009-04-30 | 2009-09-30 | 中国科学技术大学 | Epoxy anti-fouling material and preparation method and use of same |
| CN101824133A (en) * | 2010-04-28 | 2010-09-08 | 天津大学 | Preparation method for waterborne polyurethane modified epoxy resin curing agent |
| CN103374115A (en) * | 2013-06-28 | 2013-10-30 | 南京市荣达树脂有限公司 | Preparation method of modified epoxy resin |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105482751A (en) * | 2015-12-30 | 2016-04-13 | 安徽律正科技信息服务有限公司 | High-performance polyurethane pressure-sensitive adhesive |
| CN108493469A (en) * | 2018-03-13 | 2018-09-04 | 中国科学院上海有机化学研究所 | A kind of cross-linking type high temperature proton exchange film and preparation method thereof |
| CN108493469B (en) * | 2018-03-13 | 2020-08-07 | 中国科学院上海有机化学研究所 | Cross-linked high-temperature proton exchange membrane and preparation method thereof |
| CN112646525A (en) * | 2020-12-25 | 2021-04-13 | 烟台德邦科技股份有限公司 | High-adhesion low-modulus epoxy adhesive and preparation method thereof |
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Application publication date: 20140205 |