CN1035533A - Nickel plating solution and nickel plating method - Google Patents
Nickel plating solution and nickel plating method Download PDFInfo
- Publication number
- CN1035533A CN1035533A CN 89100440 CN89100440A CN1035533A CN 1035533 A CN1035533 A CN 1035533A CN 89100440 CN89100440 CN 89100440 CN 89100440 A CN89100440 A CN 89100440A CN 1035533 A CN1035533 A CN 1035533A
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- Prior art keywords
- nickel plating
- acid
- plating solution
- nickel
- complexing agent
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- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D3/00—Electroplating: Baths therefor
- C25D3/02—Electroplating: Baths therefor from solutions
- C25D3/12—Electroplating: Baths therefor from solutions of nickel or cobalt
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- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Electrochemistry (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Electroplating And Plating Baths Therefor (AREA)
Abstract
A kind of quick electronickelling solution and nickel plating method.Nickel plating solution is made up of nickeliferous ionic master salt, complexing agent and auxiliary complex-former.Complexing agent is hydroxycarboxylic acid or its esters.In order to improve the complex ni-ion performance, also added auxiliary complex-former.Auxiliary complex-former is an alkyl carboxylic acid.Except that above-mentioned three kinds of compositions, also, add the stress reduction agent as required, tensio-active agent at the difference of electroplating object.The nickel plating method is to use insoluble anode, pH value 6～10,80～250 amperes/decimeter of anodic current densities
2But cathode and anode relative movement.Plating bath also can move with respect to yin, yang.
Description
The present invention is metal deposition material and the plating technic that a kind of nickel plating solution and nickel plating method belong to metal material surface.
Along with the development of electroplating technology, brush plating, stream plating appear in succession.The relative position of cathode and anode is changed to relative movement by static, and the form of plating also leaves standstill from bath and is changed to mobile plating bath, the workpiece relative movement.It is fast that this requires plating bath to have electrochemical precipitation process speed, and anodic current density is big.Existing nickel plating solution is all incompatible.Though Japanese kokai publication sho 57-26188 has proposed a kind of nickel plating solution and method, but the needs of incompatibility high speed electrochemical precipitation process.
Task of the present invention is to propose a kind of nickel plating solution and nickel plating method that can make workpiece obtain the high-speed plating nickel dam that be applicable to, nickel layer and workpiece surface are combined, the intensity height, and surface luster is smooth, improves the use properties and the life-span of workpiece.
Technical scheme of the present invention is: nickel plating solution is made up of the main salt and the complexing agent that contain nickel ion.This main salt that contains nickel ion can be that single nickel salt or nickel ammonium sulfate or nickelous chloride also can be other nickel salts.Nickel ion content is 90～120 grams per liters in the solution.Complexing agent is hydroxycarboxylic acid or its esters.The content of complexing agent is 100～150 grams per liters in the solution.In order to improve the complex ni-ion performance of complexing agent, added the auxiliary complex-former alkyl carboxylic acid.The content of alkyl carboxylic acid auxiliary complex-former is 5～30 grams per liters.The complexing agent hydroxycarboxylic acid can be an oxyacetic acid, citric acid, and tartrate, Whitfield's ointment, one of oxysuccinic acid also can be the compound of them.
The auxiliary complex-former alkyl carboxylic acid can also can be the compound of them with one of formic acid, acetate, propionic acid, oxalic acid, Succinic Acid.
The nickel plating method is to use insoluble anode, 80～250 amperes/decimeter of anodic current densities
2, pH value is 6～10.
Nickel plating solution of the present invention and nickel plating method are through implementing confirmation: obtain good nickel layer, nickel layer and workpiece are combined, the intensity height, and good corrosion resistance has been finished the invention task.
Be described in detail the present invention to get off:
Nickel plating solution of the present invention is partly formed by containing nickel ion master salt, complexing agent and auxiliary complex-former three.Containing nickel ion master salt can be single nickel salt, nickel ammonium sulfate, nickelous chloride or other nickel salt.That a kind of nickeliferous main salt no matter, requiring to make the nickel ion content in solution is that 90～120 grams per liters get final product.Complexing agent is a hydroxycarboxylic acid, and content is 100～150 grams per liters.Auxiliary complex-former is an alkyl carboxylic acid, and content is 5～30 grams per liters.Complexing agent plays a part complex ni-ion, and the complexing agent hydroxycarboxylic acid can be one of oxyacetic acid, citric acid, tartrate, oxalic acid, Succinic Acid, also can be the compound of them.The auxiliary complex-former alkyl carboxylic acid can be one of formic acid, acetate, propionic acid, oxalic acid, Succinic Acid, also can be them compound.
For some workpiece, can in solution, add promoting agent for making workpiece material surface increase activity, promoting agent can select the oxysalt of the oxysalt of the oxysalt of boron or silicon or selenium for use or theirs is compound.The content of active additive is 0.01～0.5 grams per liter.
In the time of after nickel plating, can making workpiece surface and coating produce big unrelieved stress for some, for eliminating unrelieved stress, can add the stress reduction agent, the stress reduction agent can asccharin, one of naphthalene trisulfonic acid, tonka bean camphor, butynediol, also can be the compound of them.The content of stress reduction agent is 0.2～2 grams per liter.
Above-mentioned two class additives: whether active additive and stress reduction agent can decide interpolation according to the difference of workpiece material and processing condition, also can add one of them, also can all add, and also can not add.
Nickel plating method of the present invention is: keep certain clearance between the positive and negative utmost point, anode adopts insoluble material, for example graphite, stainless steel, platinum.Anodic current density is 80～250 amperes/decimeter
2, pH value 6～10.Can relative movement between the anode and cathode, but keep relative distance constant.Nickel plating solution from the liquid holding box sucking-off, is injected into workpiece (negative electrode) by pump.The anodic current density of nickel plating method of the present invention and the optimum range of pH value are: pH value 7～9,100.5～150 amperes/decimeter of anodic current densities
2
Embodiment 1,
Nickel plating solution:
Main salt: single nickel salt, nickel ion content 90 grams per liters
Complexing agent: citric acid 100 grams per liters
Auxiliary complex-former: oxalic acid 10 grams per liters
The nickel plating method:
Insoluble anode: graphite
Anodic current density: 80 amperes/decimeter
2
PH value: 7
Embodiment 2,
Main salt: nickel ammonium sulfate, nickel ion content 100 grams per liters
Complexing agent: oxyacetic acid content 150 grams per liters
Auxiliary complex-former: acetic acid content 30 grams per liters
The nickel plating method:
Insoluble anode: stainless steel
Anodic current density: 200 amperes/decimeter
2
PH value: 6
Embodiment 3,
Main salt: single nickel salt, nickel ion content 120 grams per liters
Complexing agent: oxysuccinic acid, content 130 grams per liters
Auxiliary complex-former: formic acid content 5 grams per liters
Stress reduction agent: asccharin content 0.2 grams per liter
The nickel plating method:
Insoluble anode: platinum
PH value: 10
Anodic current density: 250 amperes/decimeter
2
Embodiment 4:
Nickel plating solution:
Main salt: nickelous chloride; Nickel ion content 110 grams per liters
Complexing agent: Whitfield's ointment 130 grams per liters
Auxiliary complex-former: Succinic Acid 25 grams per liters
Tensio-active agent: sodium selenate 0.01 grams per liter
The nickel plating method:
Insoluble anode: graphite
PH value: 9
Anodic current: 140 amperes/decimeter
2
Embodiment 5:
Nickel plating solution:
Main salt: single nickel salt, nickel ion content 110 grams per liters
Complexing agent: citric acid content 130 grams per liters
Auxiliary complex-former: acetic acid content 20 grams per liters
Tensio-active agent: borax content 0.5 grams per liter
The nickel plating method:
Insoluble anode: graphite
PH value: 10
Anodic current density: 100.5 amperes/decimeter
2
Embodiment 6:
Main salt: single nickel salt, nickel ion content 105 grams per liters
Complexing agent: oxyacetic acid, content 120.5 grams per liters
Auxiliary complex-former: propionic acid, content 15 grams per liters
Stress reduction agent: naphthalene trisulfonic acid sodium, content 2 grams per liters
Active additive: water glass content 0.4 grams per liter
The nickel plating method:
Insoluble anode: graphite
PH value: 9
Anodic current density: 110 amperes/decimeter
2
Implementation of an application example 1:
Use above-mentioned nickel plating solution, the cylinder crosshead pin of the type locomotive that advances is carried out the nickel plating reparation.Repair the back loading operation, respond well.
Implementation of an application example 2: use above-mentioned nickel plating solution, 16V240 diesel locomotive aluminium piston first annular groove after the wearing and tearing is carried out the nickel plating reparation.The nickel plating method is the graphite insoluble anode, and pH value is 8,120 amperes/decimeter of anodic current densities
2, repairing the back service testing, the result is good, facts have proved that nickel plating solution of the present invention and nickel plating method are to be suitable for fully, have fabulous effect.
Claims (10)
1, a kind of nickel plating solution is made up of the main salt and the complexing agent that contain nickel ion, it is characterized in that: nickel ion content is 90～120 grams per liters in I, the solution, and II, complexing agent are hydroxycarboxylic acids, also has the auxiliary complex-former alkyl carboxylic acid in III, the solution.
2, by the nickel plating solution shown in the claim 1, it is characterized in that the complexing agent hydroxycarboxylic acid can be one of oxyacetic acid, citric acid, tartrate, Whitfield's ointment, oxysuccinic acid, also can be the compound of them.
3, by the nickel plating solution shown in the claim 1, the content that it is characterized in that the complexing agent hydroxycarboxylic acid is 100～150 grams per liters.
4, by the nickel plating solution shown in the claim 1, it is characterized in that the auxiliary complex-former alkyl carboxylic acid can be one of formic acid, acetate, propionic acid, oxalic acid, Succinic Acid, also can be the compound of them.
5, by the nickel plating solution shown in the claim 1, the content that it is characterized in that the auxiliary complex-former alkyl carboxylic acid is 5～30 grams per liters.
6, by the nickel plating solution shown in the claim 1, it is characterized in that containing in the solution surfactant additive, surfactant additive can be one of oxysalt of borosilicate, selenium.
7, by claim 1, the nickel plating solution shown in 6, the oxysalt that it is characterized in that boron, silicon, selenium are Sodium Tetraborate, potassium borate, water glass, potassium silicate, sodium selenate, potassium selenate.
8, by the nickel plating solution shown in the claim 1, it is characterized in that also containing in the solution stress reduction agent, the stress reduction agent can be one of asccharin, naphthalene trisulfonic acid, tonka bean camphor, butynediol, also can be that they are compound.
9, a kind of application contains the nickel plating method of the nickel plating solution of the main salt of nickel ion and complexing agent, adopts insoluble anode, and it is characterized in that: pH value is 6～10,80～250 amperes/decimeter of anodic currents
2
10, by the nickel plating method shown in the claim 9, it is characterized in that pH value is 7～9, anodic current density is 100.5～150 amperes/decimeter
2
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 89100440 CN1011316B (en) | 1989-01-19 | 1989-01-19 | Ni-plating solution and method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 89100440 CN1011316B (en) | 1989-01-19 | 1989-01-19 | Ni-plating solution and method |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN1035533A true CN1035533A (en) | 1989-09-13 |
| CN1011316B CN1011316B (en) | 1991-01-23 |
Family
ID=4853866
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN 89100440 Expired CN1011316B (en) | 1989-01-19 | 1989-01-19 | Ni-plating solution and method |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN1011316B (en) |
Cited By (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1940145B (en) * | 2005-09-27 | 2010-12-08 | 日立电线株式会社 | Nickel plating solution and its preparation method, nickel plating method and printed wiring board copper foil |
| CN102268658A (en) * | 2011-07-22 | 2011-12-07 | 深圳市精诚达电路有限公司 | Chemical nickel-plating solution and chemical nickel-plating process |
| CN102453944A (en) * | 2010-10-19 | 2012-05-16 | 上海嘉捷通电路科技有限公司 | Novel removable electroplating device |
| CN103415653A (en) * | 2011-03-09 | 2013-11-27 | 麦克德米德尖端有限公司 | Semi-bright nickel plating bath and method of using same |
| CN110093049A (en) * | 2018-01-28 | 2019-08-06 | 吴军 | A kind of chemical pump wear-resistant paint and preparation method thereof |
| CN110093085A (en) * | 2018-01-28 | 2019-08-06 | 吴军 | A kind of corrosion-resistant chemical pump surface lacquer and its application method |
| CN111020647A (en) * | 2019-12-20 | 2020-04-17 | 常州极太汽车配件有限公司 | Composition for surface treatment of aluminum flexible connection |
| CN112680757A (en) * | 2020-12-11 | 2021-04-20 | 浙江华晶整流器有限公司 | Electroplating nickel plating process of electrode |
| CN113073364A (en) * | 2021-03-26 | 2021-07-06 | 深圳市崇辉表面技术开发有限公司 | Electroplating solution for LED bracket and preparation method thereof |
-
1989
- 1989-01-19 CN CN 89100440 patent/CN1011316B/en not_active Expired
Cited By (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1940145B (en) * | 2005-09-27 | 2010-12-08 | 日立电线株式会社 | Nickel plating solution and its preparation method, nickel plating method and printed wiring board copper foil |
| CN102453944A (en) * | 2010-10-19 | 2012-05-16 | 上海嘉捷通电路科技有限公司 | Novel removable electroplating device |
| CN103415653A (en) * | 2011-03-09 | 2013-11-27 | 麦克德米德尖端有限公司 | Semi-bright nickel plating bath and method of using same |
| CN102268658A (en) * | 2011-07-22 | 2011-12-07 | 深圳市精诚达电路有限公司 | Chemical nickel-plating solution and chemical nickel-plating process |
| CN110093049A (en) * | 2018-01-28 | 2019-08-06 | 吴军 | A kind of chemical pump wear-resistant paint and preparation method thereof |
| CN110093085A (en) * | 2018-01-28 | 2019-08-06 | 吴军 | A kind of corrosion-resistant chemical pump surface lacquer and its application method |
| CN111020647A (en) * | 2019-12-20 | 2020-04-17 | 常州极太汽车配件有限公司 | Composition for surface treatment of aluminum flexible connection |
| CN112680757A (en) * | 2020-12-11 | 2021-04-20 | 浙江华晶整流器有限公司 | Electroplating nickel plating process of electrode |
| CN113073364A (en) * | 2021-03-26 | 2021-07-06 | 深圳市崇辉表面技术开发有限公司 | Electroplating solution for LED bracket and preparation method thereof |
Also Published As
| Publication number | Publication date |
|---|---|
| CN1011316B (en) | 1991-01-23 |
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