CN103542940B - A kind of infrared imaging detection chip measured based on wave vector - Google Patents
A kind of infrared imaging detection chip measured based on wave vector Download PDFInfo
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Abstract
The invention discloses a kind of infrared imaging detection chip measured based on wave vector, comprise face battle array infrarefraction lenticule, face battle array non-refrigerated infrared detector and drive control pretreatment module; Wherein, face battle array non-refrigerated infrared detector is positioned at described the lenticular focal plane place of battle array infrarefraction, be divided into the sub-face battle array non-refrigerated infrared detector of multiple array distribution, every height face battle array non-refrigerated infrared detector comprises the photosensitive unit of the quantity multiple array distribution identical with arrangement mode; Face battle array infrarefraction lenticule comprises the unit infrarefraction lenticule of multiple array distribution, and every unit infrarefraction lenticule is corresponding with a sub-face battle array non-refrigerated infrared detector.The mobility scale in the measurable infrared wave vector direction of infrared imaging detection chip of the present invention is large, and measuring accuracy is high, compact conformation, good environmental adaptability, easily mates with conventional infrared optical system, electronics and mechanical hook-up and is coupled.
Description
Technical field
The invention belongs to infrared imaging detection technical field, more specifically, relate to a kind of infrared imaging detection chip measured based on wave vector.
Background technology
Generally speaking, show as when the multi-direction infrared wave beam of target outgoing transmits in an atmosphere and gradually disperse so a kind of space distribution form.The difference of wave beam in energy transmission usefulness that wave vector direction is different, reflects target and different parts delivers ability this attribute different of infrared energy in spatial domain towards periphery.This attribute can be integrated into transmission beam because of its wave vector direction and change the direction otherness of the light field energy flow point cloth caused.That is closely-related with the structure of target, pattern, attitude, orientation and distance etc., its energy flow field variation in space distribution and evolution of infrared outgoing light wave, with the infrared space distribution of its wave vector of wave beam and the otherness of communication form, there is cause and effect or recursion association.Above-mentioned otherness or relevance are by conventional imaging exploration operation, and the form of the plane electronics pose presentation changed to some extent with feature of interest feature is reproduced out, thus constitute physics and the technical foundation of carrying out imaging detection based on wave vector measurement.
Carrying out this one side of imaging detection based on wave vector measurement, current work mainly concentrates on visible ray spectral domain.Show by measurement target light wave based on the three-dimensional distribution of wave vector and evolution, obtain the electronic target image corresponding to wave vector bunch only with trickle direction difference, and the sequence electronic target image corresponding to many wave vectors bunch; Developing High-speed highly effective algorithm is sorted out electronic image information, expand, refinement and modification etc.Progress in critical imaging detection framework and digital image information process is very rapid at present.Typical technology feature comprises: (one) rebuilds based on the three-dimensional electronic target image of sequence plane electronics pose presentation; (2) expand electronic image sequence based on digital means and obtain more complete and fine and smooth electronic target image set; (3) choose a certain (class) image by concentrating at electronic image, the electronics realizing digital image objects is focused again, further sharpening or blurred image; (4) in electronic target scene, by choosing in zones of different or the depth of field, to be equivalent in object space far and near different new object as focusing sharpening or desalination or obfuscation scenery; (5) by selecting specific image sequence to adjust electronic target attitude, the stereoeffect etc. similar with conventional three-dimensional image is formed.Based on the imaging detection technology that wave vector is measured, just carry out fast establishing target image even in real time towards strengthening based on the hardware modifications of super large face battle array optical/optoelectronic framework and algorithm, thus advance in the direction significantly improving imaging detection usefulness.
Up to now, although infrared imaging detection technology obtains widespread use, because the wavelength of infrared electromagnetic radiation is much larger than visible wavelength, cause imaging facula on infrared focus plane much larger than visible ray situation, make infrared image in sharpness, contrast and details performance etc., present intrinsic gap compared with visible images and make image deterioration.In addition, consider that the energy state that infra-red electromagnetic good fortune is penetrated is lower, based on the photoelectric sensitivity of the face such as infrared CCD, CMOS or FPAs battle array photosensitive structure still much smaller than visible ray situation.For obtaining enough photoelectric response signal intensities, the photosensitive unit of unit still needs to have enough large face shape size, and this structural requirement makes the array scale of current array infrared light sensing structure much smaller than visible ray situation.The image picture element that above-mentioned factor causes the infrared imaging detection based on focal plane framework to obtain is far below visible images, and this situation will maintain the quite a long time.Therefore, how the imaging detection framework that visible ray spectral domain is measured based on wave vector is extended to infrared spectral domain, find to make up and even overcome above-mentioned defect to promote the technical measures of infrared picture element and imaging detection usefulness, still belong to blank at present, also be the Focal point and difficult point problem that the advanced infrared imaging detection technology of development faces, in the urgent need to new breakthrough.
Summary of the invention
For above defect or the Improvement requirement of prior art, the invention provides a kind of infrared imaging detection chip measured based on wave vector, the mobility scale in measurable infrared wave vector direction is large, measuring accuracy is high, compact conformation, good environmental adaptability, easily mates with conventional infrared optical system, electronics and mechanical hook-up and is coupled.
For achieving the above object, the invention provides a kind of infrared imaging detection chip, it is characterized in that, comprise face battle array infrarefraction lenticule, face battle array non-refrigerated infrared detector and drive control pretreatment module; Wherein, described battle array non-refrigerated infrared detector is positioned at described the lenticular focal plane place of battle array infrarefraction, be divided into the sub-face battle array non-refrigerated infrared detector of multiple array distribution, every height face battle array non-refrigerated infrared detector comprises the photosensitive unit of the quantity multiple array distribution identical with arrangement mode; Described battle array infrarefraction lenticule comprises the unit infrarefraction lenticule of multiple array distribution, and every unit infrarefraction lenticule is corresponding with a sub-face battle array non-refrigerated infrared detector; Described battle array infrarefraction lenticule is used for focus objects infrared waves, every unit infrarefraction lenticule makes the incident light wave discretize in different wave vector direction arrange, orientation converges in the corresponding photosensitive unit of the sub-face battle array non-refrigerated infrared detector corresponding to this unit infrarefraction lenticule, and described battle array infrarefraction lenticule makes the incident ray directional focusing in same wave vector direction in the photosensitive unit of multiple sub-faces battle array non-refrigerated infrared detector same position; Described battle array non-refrigerated infrared detector for converting the light wave focused on the battle array non-refrigerated infrared detector of multiple sub-faces to electric signal, the infrared electro response signal of the array that the infrared wave beam obtaining different wave vector direction is corresponding separately; Described control pretreatment module of driving, for the infrared electro response signal of array being quantized and carrying out Nonuniformity Correction, obtains and the sequential infrared image data that the wave vector of target outgoing beam distributes and space propagation situation is corresponding.
Preferably, described sub-face battle array non-refrigerated infrared detector is m × n unit, and wherein, m, n are the integer being greater than 1.
Preferably, described in drive control pretreatment module the infrared electro response signal of array is quantized, it is resolved and carries out Nonuniformity Correction.
Preferably, the structure that control pretreatment module adopts SoC and FPGA to combine is driven described in.
Preferably, described in drive control pretreatment module also for providing driving and adjustment signal for described battle array non-refrigerated infrared detector, drive the work of described battle array non-refrigerated infrared detector, and the electric signal of described battle array non-refrigerated infrared detector conversion regulated and controled.
Preferably, ceramic package and metallic support heat sink is also comprised, wherein, described ceramic package is positioned at the top of described metallic support heat sink, described metallic support heat sink and described ceramic package connect firmly, for supporting and heat radiation, describedly drive control pretreatment module, described battle array non-refrigerated infrared detector and described battle array infrarefraction lenticule are coaxially sequentially placed in described ceramic package, wherein, the top of control pretreatment module is driven described in described battle array non-refrigerated infrared detector is positioned at, described battle array infrarefraction lenticule is positioned at the top of described battle array non-refrigerated infrared detector, and described the lenticular light entrance face of battle array infrarefraction is outside exposed by the facial perforate of described ceramic package.
Preferably, described in drive control pretreatment module be provided with the second port and the second pilot lamp, described battle array non-refrigerated infrared detector is provided with the 3rd port and the 3rd pilot lamp; Described second port drives driving and the adjustment signal that control pretreatment module is supplied to described battle array non-refrigerated infrared detector described in exporting, described second port also for input described battle array non-refrigerated infrared detector be supplied to described in drive control pretreatment module infrared electro response signal, described second port also for receiving the work order of external unit to described infrared large depth field imaging detection chip input, driving control pretreatment module and whether being in normal operating conditions described in described second pilot lamp is used to indicate; Described 3rd port drives driving and the adjustment signal that control pretreatment module is supplied to described battle array non-refrigerated infrared detector described in inputting, described 3rd port also for export described battle array non-refrigerated infrared detector be supplied to described in drive control pretreatment module infrared electro response signal, described 3rd pilot lamp is used to indicate described non-refrigerated infrared detector and whether is in normal operating conditions.
Preferably, described control pretreatment module of driving is provided with the 4th port and the 4th pilot lamp, described 4th port is used for described sequential infrared image data to export from described control pretreatment module of driving, and drives control pretreatment module and whether be in normal data output state described in described 4th pilot lamp is used to indicate.
Preferably, described in drive control pretreatment module be provided with the first port and the first pilot lamp, described first port is for accessing power lead to connect external power source, and whether described first pilot lamp is used to indicate power supply and connects.
In general, the above technical scheme conceived by the present invention compared with prior art, has following beneficial effect:
1, the single-chip imaging detection of its three dimensions feature of target.By battle array infrarefraction lenticule in face is coupled with face battle array non-refrigerated infrared detector, realizes catching of the infrared radiation in different wave vector direction and operate with imaging detection, have the advantages that to obtain sequence target image based on monolithic functionalization Infrared Detection Array.
2, measuring accuracy is high.The present invention adopts face battle array refractive micro lenses and face battle array non-refrigerated infrared detector, and they all have high array scale and mixed integrated and have high structural stability.
3, the measurement range in infrared wave vector direction is large.Owing to present invention employs infrarefraction lenticule and sub-face battle array non-refrigerated infrared detector detects framework one to one, there is target light wave-wave and vow the advantage that the measurable range in direction is large.
4, good environmental adaptability.Owing to present invention employs the non-refrigerated infrared detector based on thermal effect, and there is the infrarefraction lenticule of fixing pattern, measure spectral coverage wider, be operated in room temperature environment, so the present invention has the advantage of good environmental adaptability.
5, easy to use.Of the present invention battle array infrarefraction lenticule, face battle array non-refrigerated infrared detector and drive control pretreatment module and be integrated on one single chip, have and patch conveniently, easily mate with conventional infrared optical system, electronics and mechanical hook-up the advantage be coupled.
Accompanying drawing explanation
Fig. 1 is the structural representation of the infrared imaging detection chip of the embodiment of the present invention;
Fig. 2 is the fundamental diagram of the infrared imaging detection chip of the embodiment of the present invention, and wherein, (A) is the fundamental diagram for intense radiation target; (B) be fundamental diagram for weak radiation target; (C) be focal spot distribution example that the infrared wave beam in different wave vector directions is formed on the battle array non-refrigerated infrared detector of sub-face.
In Fig. 1: 1-first pilot lamp, 2-first port, 3-second pilot lamp, 4-the 3rd pilot lamp, 5-second port, 6-the 3rd port, 7-drives control pretreatment module, 8-face battle array non-refrigerated infrared detector, 9-face battle array infrarefraction lenticule, 10-the 4th pilot lamp, 11-the 4th port, 12-metallic support heat sink, 13-ceramic package.
Embodiment
In order to make object of the present invention, technical scheme and advantage clearly understand, below in conjunction with drawings and Examples, the present invention is further elaborated.Should be appreciated that specific embodiment described herein only in order to explain the present invention, be not intended to limit the present invention.In addition, if below in described each embodiment of the present invention involved technical characteristic do not form conflict each other and just can mutually combine.
Generally speaking, the infrared outgoing light wave of target scatters and propagates in a spatial domain gradually increased.The difference of wave beam in energy transmission usefulness in different wave vector direction, reflect ability this attribute different of target or its different parts spatial domain delivery towards periphery infrared energy, this attribute can be integrated into the direction otherness of the light field energy flow point cloth that transmission light field causes because of its wave vector direction difference.This otherness is operated by infrared imaging detection, and the sequence electronic image mode changed to some extent with target signature presents.The infrared target at different object distances place similarly, also by based on its wave vector of outgoing light field space distribution and transmission form in otherness, the system of being imaged is converted to the sequence electronic target image that feature changes to some extent.In other words, with the structure of target, pattern, attitude, the closely-related infrared variation of emergent light wave energy flow field in space distribution and evolution such as orientation and distance, the space distribution of vowing with target light field wave there is cause and effect with the otherness of communication form or recursion associates.Above-mentioned otherness is operated by imaging detection, and the form of the sequence electronic image changed to some extent with target signature is reproduced out.Therefore, by obtaining the electronic image to its multi-beam transmission orientation-sensitive of target light field, building objective and spatial movement behavior thereof based on sequence image information, constituting the basis of carrying out infrared imaging detection based on wave vector measurement.
As shown in Figure 1, infrared imaging detection chip of the present invention comprises: drive control pretreatment module 7, face battle array non-refrigerated infrared detector 8, face battle array infrarefraction lenticule 9, ceramic package 13 and metallic support heat sink 12.
Ceramic package 13 is positioned at the top of metallic support heat sink 14.Metallic support heat sink 14 and ceramic package 13 connect firmly, for supporting and heat radiation.Drive the coaxial order of control pretreatment module 7, face battle array non-refrigerated infrared detector 8 and face battle array infrarefraction lenticule 9 to be placed in ceramic package 13.Wherein, drive the structure that control pretreatment module 7 adopts SoC and FPGA to combine, face battle array non-refrigerated infrared detector 8 is positioned at the top of driving control pretreatment module 7, and face battle array infrarefraction lenticule 9 is positioned at the top of face battle array non-refrigerated infrared detector 8 and its light entrance face is outside exposed by the facial perforate of ceramic package 13.
Face battle array non-refrigerated infrared detector 8 is positioned at the focal plane place of face battle array infrarefraction lenticule 9.Face battle array non-refrigerated infrared detector 8 is divided into the sub-face battle array non-refrigerated infrared detector of multiple array distribution, and every height face battle array non-refrigerated infrared detector comprises the photosensitive unit of the quantity multiple array distribution identical with arrangement mode.Face battle array infrarefraction lenticule 9 comprises the unit infrarefraction lenticule of multiple array distribution, every unit infrarefraction lenticule is corresponding with a sub-face battle array non-refrigerated infrared detector, sub-face battle array non-refrigerated infrared detector is m × n unit, wherein, m, n are the integer being greater than 1, such as, sub-face battle array non-refrigerated infrared detector can be 2 × 2 yuan, 4 × 4 yuan, 8 × 8 yuan even more large scale arrays.
Battle array infrarefraction lenticule 9 in face is for focus objects infrared waves, every unit infrarefraction lenticule makes the incident ray discretize in different wave vector direction arrange, orientation converges in the corresponding photosensitive unit of the sub-face battle array non-refrigerated infrared detector corresponding to this unit infrarefraction lenticule, and face battle array infrarefraction lenticule 9 makes the incident ray in same wave vector direction orientation converge in the photosensitive unit of multiple sub-faces battle array non-refrigerated infrared detector same position.
Face battle array non-refrigerated infrared detector 8 for converting the light wave converged on the battle array non-refrigerated infrared detector of multiple sub-faces to electric signal, the infrared electro response signal of the array that the infrared wave beam obtaining different wave vector direction is corresponding separately.
Drive control pretreatment module 7 for the infrared electro response signal of array being quantized, and carry out Nonuniformity Correction, obtain and the sequential infrared image data that the wave vector of target outgoing beam distributes and space propagation situation is corresponding.
Drive control pretreatment module 7 also for providing driving and adjustment signal for face battle array non-refrigerated infrared detector 8, drive surface battle array non-refrigerated infrared detector 8 works, and the electric signal of opposite battle array non-refrigerated infrared detector 8 conversion regulates and controls.
Drive control pretreatment module 7 and be provided with the first port 2, second port 5, the 4th port one 1, first pilot lamp 1, second pilot lamp 3 and the 4th pilot lamp 10.Wherein, first port 2 is for accessing power lead to connect external power source, second port 5 drives for exporting driving and the adjustment signal that control pretreatment module 7 is supplied to face battle array non-refrigerated infrared detector 8, the infrared electro response signal of driving control pretreatment module 7 is also supplied to for input face battle array non-refrigerated infrared detector 8, also for receiving the work order that external unit inputs to detector, 4th port one 1 is for exporting sequential infrared image data from driving control pretreatment module 7, whether the first pilot lamp 1 is used to indicate power supply and connects, then the first pilot lamp 1 is bright in power supply connection, otherwise extinguish, second pilot lamp 3 be used to indicate drive control pretreatment module 7 whether be in normal operating conditions, drive control pretreatment module 7 be in normal operating conditions then the second pilot lamp 3 glimmer, otherwise extinguish, 4th pilot lamp 10 be used to indicate drive control pretreatment module 7 whether be in normal data output state, drive control pretreatment module 7 and be in normal data output state, then the 4th pilot lamp 10 glimmers, otherwise extinguish.
Face battle array non-refrigerated infrared detector 8 is provided with the 3rd port 6 and the 3rd pilot lamp 4.Wherein, 3rd port 6 drives for inputting driving and the adjustment signal that control pretreatment module 7 is supplied to face battle array non-refrigerated infrared detector 8, the infrared electro response signal of driving control pretreatment module 7 is also supplied to for output face battle array non-refrigerated infrared detector 8,3rd pilot lamp 4 is used to indicate face battle array non-refrigerated infrared detector 8 and whether is in normal operating conditions, non-refrigerated infrared detector 8 be in normal operating conditions then the 3rd pilot lamp 4 glimmer, otherwise extinguish.
Above-mentioned first port 2, second port 5, the 3rd port 6, the 4th port one 1, first pilot lamp 1, second pilot lamp 3, the 3rd pilot lamp 4 and the 4th pilot lamp 10 are all outside exposed by the facial perforate of ceramic package 13.
The course of work of the infrared imaging detection chip of the embodiment of the present invention is described below in conjunction with Fig. 1.
First connect the second port 5 and the 3rd port 6 with parallel signal line, connect parallel communication line to the second port 5 simultaneously, connect parallel data line to the 4th port one 1, connecting power line is to the first port 2.Send into electric power starting instruction by parallel communication line by the second port 5, detector starts self-inspection, now the first pilot lamp 1, second pilot lamp 3, the 3rd pilot lamp 4, the 4th pilot lamp 10 hook switch flash.Self-inspection is bright by rear first pilot lamp 1, the second pilot lamp 3, the 3rd pilot lamp 4, and the 4th pilot lamp 10 extinguishes, and detector enters duty.After sending into by the second port 5 instruction of starting working by parallel communication line, detector starts to carry out photoelectric response signal measurement.Drive control pretreatment module 7 through the second port 5 and the 3rd port 6 to face battle array non-refrigerated infrared detector 8 input queued switches and adjustment signal, face battle array non-refrigerated infrared detector 8 exports infrared electro response signal, now the second pilot lamp 3 and the 3rd pilot lamp 4 hook switch flash again through the second port 5 and the 3rd port 6 to driving control pretreatment module 7.Infrared electro response signal is exported by the 4th port one 1 through driving the sequential infrared image data obtained after control pretreatment module 7 processes, now the 4th pilot lamp 10 hook switch flash again.
Fig. 2 is the fundamental diagram of infrared imaging detection chip when detecting infrared image target of the embodiment of the present invention, for making those skilled in the art understand the present invention better, describes the principle of work of infrared imaging detection chip of the present invention below in conjunction with Fig. 2 in detail.
As shown in Figure 2 (A) shows, any object point on image object all towards periphery spatial domain launches radial multi-direction conical beam, and the relatively-stationary light of advancing of the transmission direction be evolved into, and its sensing is wave vector direction.Battle array infrarefraction lenticule in face is mated with face battle array non-refrigerated infrared detector and is coupled, form the infrared imaging detection framework measured based on wave vector.Under set array scale or spatial resolution pattern, every unit infrarefraction lenticule correspondence 4 × 4 yuan of sub-face battle array non-refrigerated infrared detectors.For intense radiation target, by every unit infrarefraction lenticule to the directional focusing effect of specific wave vector incident wave beam, by its trickle wave vector direction difference of cone-shaped beam of linearize, manifested by the discretize arrangement of lenticule to incident wave beam, and by further directional focusing in the corresponding photosensitive unit of the sub-face battle array non-refrigerated infrared detector corresponding to each unit infrarefraction lenticule.Face battle array infrarefraction lenticule makes the incident ray in same wave vector direction orientation converge in the photosensitive unit of multiple sub-faces battle array non-refrigerated infrared detector same position, thus by incident ray by its wave vector direction by microlens array, realize the discrete and refocusing of array based on wave vector direction.Typically by
the focal spot situation that the infrared wave beam that wave vector characterizes is formed as shown in Figure 2 (A) shows, for making avatars clear, the corresponding infrared wave beam focal spot in wave vector direction of each 4 × 4 yuan of sub-face battle array non-refrigerated infrared detectors in figure, the focal spot of two other wave vector direction infrared waves beam optical path and formation thereof omits not shown.
Incident light wave is converted to electric signal by face battle array non-refrigerated infrared detector, obtains the infrared electro response signal array corresponding to the infrared wave beam of array in different wave vector direction.Drive control pretreatment module (not shown) the infrared electro response signal of array is quantized, carry out Nonuniformity Correction, obtain the sequential infrared image data distributing corresponding with its wave vector of target outgoing beam, namely obtain in certain angular field of view with several plane pose presentation data of different visual angles object observing.
As shown in Fig. 2 (B), for weak radiation target, the capacity gauge of imaging optical system raising to Infrared Targets outgoing beam be made up of primary mirror need be utilized.By the infrared imaging detection measured based on wave vector chip being placed in the focal plane place of primary mirror or carrying out weak out of focus configuration, carry out Infrared Image Information and catch operation.Because first imaging optical system applies to converge operation to infrared target light wave, namely primary mirror performs bunching type compression to it, and the wave vector distribution of infrared target wave beam will produce respective change.Consider this factor, by after driving control pretreatment module carrying out quantification treatment to infrared electro signal, also need to carry out corresponding resolving, then perform Nonuniformity Correction, obtain the sequential infrared image data of target.
Fig. 2 (C) gives a kind of focal spot distribution situation typically formed on the battle array non-refrigerated infrared detector of sub-face by the infrared wave beam in different wave vector directions, as shown in the figure, unit infrarefraction lenticule by the light beam discretize refocusing in different wave vector direction in the specific photosensitive unit of sub-face battle array non-refrigerated infrared detector.
Infrared imaging detection chip of the present invention, by battle array infrarefraction lenticule in face is coupled with face battle array non-refrigerated infrared detector, unit infrarefraction lenticule and sub-face battle array non-refrigerated infrared detector is adopted to detect framework one to one, measurable infrared wave vector direction mobility scale is large, measuring accuracy is high, can realize the imaging detection of dynamic/static object space characteristics, good environmental adaptability, easy to use, easily mate with conventional infrared optical system, auxiliary electron and mechanical hook-up and be coupled.
Those skilled in the art will readily understand; the foregoing is only preferred embodiment of the present invention; not in order to limit the present invention, all any amendments done within the spirit and principles in the present invention, equivalent replacement and improvement etc., all should be included within protection scope of the present invention.
Claims (8)
1. an infrared imaging detection chip, is characterized in that, comprises face battle array infrarefraction lenticule, face battle array non-refrigerated infrared detector and drives control pretreatment module; Wherein,
Described battle array non-refrigerated infrared detector is positioned at described the lenticular focal plane place of battle array infrarefraction, be divided into the sub-face battle array non-refrigerated infrared detector of multiple array distribution, every height face battle array non-refrigerated infrared detector comprises the photosensitive unit of the quantity multiple array distribution identical with arrangement mode;
Described battle array infrarefraction lenticule comprises the unit infrarefraction lenticule of multiple array distribution, and every unit infrarefraction lenticule is corresponding with a sub-face battle array non-refrigerated infrared detector;
Described battle array infrarefraction lenticule is used for focus objects infrared waves, every unit infrarefraction lenticule makes the incident light wave discretize in different wave vector direction arrange, and orientation converges in the corresponding photosensitive unit of the sub-face battle array non-refrigerated infrared detector corresponding to this unit infrarefraction lenticule, described battle array infrarefraction lenticule makes the incident ray in same wave vector direction orientation converge in the photosensitive unit of multiple sub-faces battle array non-refrigerated infrared detector same position;
Described battle array non-refrigerated infrared detector for converting the light wave focused on the battle array non-refrigerated infrared detector of multiple sub-faces to electric signal, the infrared electro response signal of the array that the infrared wave beam obtaining different wave vector direction is corresponding separately;
The described structure of driving control pretreatment module and adopting SoC and FPGA to combine, for the infrared electro response signal of array being quantized and carrying out Nonuniformity Correction, obtain and the sequential infrared image data that the wave vector of target outgoing beam distributes and space propagation situation is corresponding.
2. infrared imaging detection chip as claimed in claim 1, is characterized in that, described sub-face battle array non-refrigerated infrared detector is m × n unit, and wherein, m, n are the integer being greater than 1.
3. infrared imaging detection chip as claimed in claim 1, is characterized in that, described in drive control pretreatment module the infrared electro response signal of array quantized, it is resolved, and carries out Nonuniformity Correction.
4. infrared imaging detection chip as claimed any one in claims 1 to 3, it is characterized in that, described control pretreatment module of driving also drives and adjustment signal for providing for described battle array non-refrigerated infrared detector, drive described battle array non-refrigerated infrared detector work, and the photosignal of described battle array non-refrigerated infrared detector conversion is regulated and controled.
5. infrared imaging detection chip as claimed any one in claims 1 to 3, is characterized in that, also comprise ceramic package and metallic support heat sink; Wherein,
Described ceramic package is positioned at the top of described metallic support heat sink, described metallic support heat sink and described ceramic package connect firmly, for supporting and heat radiation, describedly drive control pretreatment module, described battle array non-refrigerated infrared detector and described battle array infrarefraction lenticule are coaxially sequentially placed in described ceramic package, wherein, the top of control pretreatment module is driven described in described battle array non-refrigerated infrared detector is positioned at, described battle array infrarefraction lenticule is positioned at the top of described battle array non-refrigerated infrared detector, and described the lenticular light entrance face of battle array infrarefraction is outside exposed by the facial perforate of described ceramic package.
6. infrared imaging detection chip as claimed in claim 5, is characterized in that, described in drive control pretreatment module and be provided with the second port and the second pilot lamp, described battle array non-refrigerated infrared detector is provided with the 3rd port and the 3rd pilot lamp;
Described second port drives driving and the adjustment signal that control pretreatment module is supplied to described battle array non-refrigerated infrared detector described in exporting, described second port also for input described battle array non-refrigerated infrared detector be supplied to described in drive control pretreatment module infrared electro response signal, described second port, also for receiving the work order that external unit inputs to described infrared imaging detection chip, driving control pretreatment module and whether being in normal operating conditions described in described second pilot lamp is used to indicate;
Described 3rd port drives driving and the adjustment signal that control pretreatment module is supplied to described battle array non-refrigerated infrared detector described in inputting, described 3rd port also for export described battle array non-refrigerated infrared detector be supplied to described in drive control pretreatment module infrared electro response signal, described 3rd pilot lamp is used to indicate described non-refrigerated infrared detector and whether is in normal operating conditions.
7. infrared imaging detection chip as claimed in claim 6, it is characterized in that, described control pretreatment module of driving is provided with the 4th port and the 4th pilot lamp, described 4th port is used for described sequential infrared image data to export from described control pretreatment module of driving, and drives control pretreatment module and whether be in normal data output state described in described 4th pilot lamp is used to indicate.
8. infrared imaging detection chip as claimed in claim 7, it is characterized in that, described control pretreatment module of driving is provided with the first port and the first pilot lamp, and described first port is for accessing power lead to connect external power source, and whether described first pilot lamp is used to indicate power supply and connects.
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| CN102853919A (en) * | 2012-08-29 | 2013-01-02 | 华中科技大学 | Wavefront measuring chip of hybrid integrated planar array liquid crystal micro-lens and infrared detector |
| CN102829879A (en) * | 2012-08-30 | 2012-12-19 | 华中科技大学 | Infrared imaging detection chip integrated with liquid crystal optically-controlled array and area array photosensitive structure |
| CN102853917A (en) * | 2012-08-30 | 2013-01-02 | 华中科技大学 | Plane array infrared detector chip of liquid crystal-base electronic speed controller imaging spectroscopy |
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| Wavevector-resolved monochromatic spectral imaging of extraordinary optical transmission through subwavelength aperture arrays;Sean P. Branagan et al.;《OPTICS EXPRESS》;20091006;第17卷(第21期);18995-19005 * |
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