Export-oriented heat radiating LED lamp
Technical field
The present invention relates to field of LED illumination, particularly a kind of export-oriented heat radiating LED lamp.
Background technology
At present, LED is widely used at lighting field, but the heating of LED directly has influence on the life-span of LED.Existing LED adopts light source connection metal or ceramic heat sink to dispel the heat usually, often needs to arrange the larger radiator of volume to improve radiating effect; Simultaneously for realizing the luminescence of wide-angle, usually LED light source need be arranged on a stereoscopic column.Such as authorized announcement date is on October 31st, 2012, and the patent No. is that namely the Chinese utility model patent of 201220060615.X discloses a kind of specular removal Large-angle LED lamp bulb.This specular removal Large-angle LED lamp bulb comprises base shell, lamp holder, constant-current supply, cover plate, heat radiation column, diffuser, this heat radiation column is fixed on above this cover plate in cube, the bottom surface of this heat radiation column is installed on this cover plate, its lap all posts pcb board, and on every sheet pcb board, distribution is welded with several LED chip.Because this specular removal Large-angle LED lamp bulb pcb board dispels the heat by arranging heat radiation column, the heat that these LED chip produce only is distributed by the one side transmission be affixed, easily cause heat radiation phenomenon not in time, reduce the service life of these LED chip, and need to set up larger heat radiation column and pcb board, add weight and the cost of this specular removal Large-angle LED lamp bulb.
Summary of the invention
In view of this, be necessary to provide a kind of timely, light export-oriented heat radiating LED lamp that dispels the heat.
The technical solution adopted for the present invention to solve the technical problems is: a kind of export-oriented heat radiating LED lamp, comprise body, bulb housing, illuminating part and luminous intensity distribution part, this bulb housing is located at the top of this body, this illuminating part comprises substrate and is arranged on the LED light source on substrate, this luminous intensity distribution part comprises luminous intensity distribution portion and heat transfer part hot linked with luminous intensity distribution portion, this heat transfer part is arranged at this body top, this luminous intensity distribution portion and this heat transfer part are made by the material with good heat conductive or heat-sinking capability, this luminous intensity distribution portion is made up of transparent or semitransparent material, this luminous intensity distribution portion comprises installed surface and exiting surface, this installed surface is provided with accepting groove, this substrate is fixed on this installed surface and LED light source on it is housed in described accepting groove, the installed surface of this illuminating part and this luminous intensity distribution part is thermally coupled, this exiting surface is arranged towards this bulb housing.
Further, be provided with Heat Conduction Material in described accepting groove, the heat that described LED light source sends is delivered on this accepting groove by this Heat Conduction Material, and this Heat Conduction Material is liquid or solid-state heat-conducting glue.
Compared with prior art, this export-oriented heat radiating LED lamp is provided with luminous intensity distribution part, the LED light source of this illuminating part is arranged in the substrate of this illuminating part and the accepting groove of the thermally coupled formation of this luminous intensity distribution part, be filled with Heat Conduction Material in this accepting groove and omnibearing heat radiation is carried out to the appearance of these LED light sources, and these LED light sources generation heat is delivered on this luminous intensity distribution part in time, in time heat is distributed, thus avoid the accumulation of heat; Another part heat is delivered on luminous intensity distribution part hot linked with it by this substrate, and the heat on this luminous intensity distribution part is delivered on this body by this heat transfer part and falls apart heat to space outerpace.Like this, because this export-oriented heat radiating LED lamp is without the need to arranging larger heat radiation column and pcb board, the heat that just can produce these LED light sources carries out omnibearing heat radiation, makes this export-oriented heat radiating LED lamp have timely, the light advantage of heat radiation.
Accompanying drawing explanation
Fig. 1 is the three-dimensional exploded view of the export-oriented heat radiating LED lamp of first embodiment of the invention;
Fig. 2 is the generalized section after export-oriented heat radiating LED lamp assembling shown in Fig. 1;
Fig. 3 is the partial enlarged drawing of part A shown in Fig. 2.
Fig. 4 be in export-oriented heat radiating LED lamp shown in Fig. 1 luminous intensity distribution part and illuminating part assemble after along the schematic perspective view of other direction.
Description of reference numerals:
100 export-oriented heat radiating LED lamp 10 body 20 bulb housings
30 luminous intensity distribution part 40 illuminating part 31 luminous intensity distribution portions
32 heat transfer part 311 installed surface 312 exiting surfaces
313 accepting groove 35 Heat Conduction Materials
41 substrate 42LED light sources
Detailed description of the invention
Below in conjunction with accompanying drawing and detailed description of the invention, the present invention is described in further detail.
Fig. 1 is the three-dimensional exploded view of the export-oriented heat radiating LED lamp 100 of first embodiment of the invention, this export-oriented heat radiating LED lamp 100 comprises body 10, bulb housing 20, illuminating part 40 and luminous intensity distribution part 30, this bulb housing 20 is located at the top of this body 10, in this luminous intensity distribution part 30 and this illuminating part 40 being contained in.
Please refer to Fig. 1 to Fig. 4, this illuminating part 40 comprises substrate 41 and is arranged on LED light source 42(on this substrate 41 as shown in Figure 3).This substrate 41 is loop configuration, comprises multiple LED light source 42, and these LED light sources 42 to be disposed on this substrate 41 and to arrange in the form of a ring around this substrate 41 center.This substrate 41 is made up of transparent material, and this substrate 41 is made up of Heat Conduction Material.
Please refer to Fig. 1 to Fig. 3, this luminous intensity distribution part 30 comprises luminous intensity distribution portion 31 and heat transfer part 32 hot linked with this luminous intensity distribution portion 31, this heat transfer part 32 is arranged at the top of this body 10, for supporting this luminous intensity distribution part 30 and the heat that this illuminating part 40 produces being delivered to this body 10.One end of this heat transfer part 32 is provided with the support be connected with this luminous intensity distribution portion 31, and this luminous intensity distribution portion 31 is lens arrangement, and this luminous intensity distribution portion 31 is made up of transparent or semitransparent material.This luminous intensity distribution portion 31 is loop configuration, and the cross section in this luminous intensity distribution portion 31 is the sector structure (as shown in Figure 3) that central angle is greater than 180 degree, to reflect the light be irradiated on it, makes the bottom of more this bulb housing 20 of light directive.This luminous intensity distribution portion 31 makes by the material with good heat conductive or heat-sinking capability with this heat transfer part 32.This luminous intensity distribution portion 31 comprises installed surface 311 and exiting surface 312(as shown in Figure 3).This installed surface 311 is positioned at the bottom surface in this luminous intensity distribution portion 31, and the base area in this luminous intensity distribution portion 31 is greater than the area of the substrate 41 of this illuminating part 40.This installed surface 311 is positioned at this luminous intensity distribution portion 31 towards on the side of this body 10, and this exiting surface 312 is arranged towards this bulb housing 20.The light that this illuminating part 40 sends by this luminous intensity distribution portion 31 reflects, to illuminate the bottom of this bulb housing 20 towards the bottom of this bulb housing 20 more.This illuminating part 40 is thermally coupled with the installed surface 311 in this luminous intensity distribution portion 31, this installed surface 311 is provided with accepting groove 313, this substrate 41 is fixed on this installed surface 311, thermally coupled by heat-conducting medium between this substrate 41 and this installed surface 311, and the LED light source 42 on it is housed in these accepting grooves 313.Be provided with Heat Conduction Material 35 in these accepting grooves 313, the heat that these LED light sources 42 send is delivered on this accepting groove 313 by this Heat Conduction Material 35, and this Heat Conduction Material 35 is liquid or solid-state transparent or semitransparent material.Be preferably liquid material, because the heat conductivility of liquid is fabulous, the heat on this LED light source 42 surface can be delivered in this luminous intensity distribution portion 31 fast.This luminous intensity distribution part 30 is provided with printing opacity scattering material, and the light that these LED light sources 42 send, through scattering, makes the luminosity curve of this LED 100 be more evenly distributed.
During work, the disperse function of the light that these LED light sources 42 send through this luminous intensity distribution portion 31 and illuminate this bulb housing 20, a part of heat that these LED light sources 42 produce is delivered in this luminous intensity distribution portion 31 by the Heat Conduction Material 35 in this accepting groove 313 in time, another part heat is via being delivered in this luminous intensity distribution portion 31 with the hot linked installed surface 311 of this substrate 41, the heat in this luminous intensity distribution portion 31 is delivered on this body 10 via heat transfer part 32 hot linked with it, thus heat is dispersed into space outerpace in time.
In sum, this export-oriented heat radiating LED lamp 100 is provided with luminous intensity distribution part 30, the LED light source 42 of this illuminating part 40 is arranged on the substrate 41 of this illuminating part 40 with in the accepting groove 313 of the thermally coupled formation of this luminous intensity distribution part 30, be filled with Heat Conduction Material 35 in this accepting groove 313 and omnibearing heat radiation is carried out to the appearance of these LED light sources 42, and these LED light sources 42 are produced heat and be delivered on this luminous intensity distribution part 30 in time, in time heat is distributed, thus avoid the accumulation of heat; Another part heat is delivered on luminous intensity distribution part 30 hot linked with it by this substrate 41, and the heat on this luminous intensity distribution part 30 is delivered on this body 10 by the heat transfer part 32 of this luminous intensity distribution part 30 and falls apart heat to space outerpace.Like this, because this export-oriented heat radiating LED lamp 100 is without the need to arranging larger heat radiation column and pcb board, just can carry out omnibearing heat radiation to the heat that these LED light sources 42 produce, making this export-oriented heat radiating LED lamp 100 have timely, the light advantage of heat radiation.
Because this installed surface 312 is positioned at the bottom surface in this luminous intensity distribution portion 31, and the area of this installed surface 312 is greater than the area of this substrate 41, and this installed surface 312 can not be blocked by this substrate 41, and light can penetrate from this installed surface 312, according to the bottom to this bulb housing 20.In addition, because this substrate 41 is made up of transparent material, the light that this LED light source 42 sends can directly through the bottom emission of this substrate 41 to this bulb housing 20.The light that these LED light sources 42 send is dispersed through this luminous intensity distribution part 30 luminous intensity distribution portion 31, illuminates the top of this bulb housing 20, sidewall and bottom thus realizes wide-angle luminescence.Why the cross section in this luminous intensity distribution portion 31 is set to the sector structure that central angle is greater than 180 degree, and this installed surface is arranged on this luminous intensity distribution portion 31 towards on the side of this body 10, that the light that LED light source 42 sends reflects by the more position thicker towards lens because we find.Compared with prior art, due to just wide-angle luminescence can be realized without the need to arranging multiple pcb board and weld LED chip on each pcb board on heat radiation column, this export-oriented heat radiating LED lamp 100 is made also to have advantage easy to assembly.
Further, the cross section in this different luminous intensity distribution part 30 luminous intensity distribution portions 31 can also be designed, as long as secondary light-distribution can be carried out to the light that these LED light sources 42 send, reach the object of wide-angle luminescence.
These are only preferred embodiment of the present invention above, and not in order to limit the present invention, any those skilled in the art, not departing from this programme technical scope, utilize the technology contents of above-mentioned exposure to make the Equivalent embodiments for equal change of few modifications.In every case depart from technical solution of the present invention content, according to the technology of the present invention essence to any amendment made for any of the above embodiments, equivalent replacement, improvement etc., all should be included within the scope of protection of the invention.