CN103531868A - Substrate integration waveguide duplexer - Google Patents

Abstract

The invention relates to a substrate integration waveguide duplexer which comprises a main body part, and a common end connector, a receiving filter channel output end and a transmitting filter channel receiving end which are arranged on the main body part, wherein a first receiving resonant cavity, a second receiving resonant cavity, a first transmitting resonant cavity, a second transmitting resonant cavity and a dual-mode common resonant cavity are arranged on the main body part; the first receiving resonant cavity, the second receiving resonant cavity and the dual-mode common resonant cavity form a receiving filter channel used for filtering a signal received by the common end connector; the first transmitting resonant cavity, the second transmitting resonant cavity and the dual-mode common resonant cavity form a transmitting filter channel used for filtering a signal to be transmitted by the common end connector; and the transmitting filter channel and the receiving filter channel are isolated mutually. The substrate integration waveguide duplexer has the benefits of simple structure and small size.

Description

Substrate Integrated Waveguide Duplexer

technical field

The invention relates to the communication field, in particular to a substrate integrated waveguide duplexer.

Background technique

For communication systems, duplexers are of great significance to transceivers based on the principle of frequency division. Its performance has an important impact on the overall receive/transmit isolation, selectivity, noise figure, gain, and sensitivity of the system. Traditional duplexer circuits usually need to use T-shaped connectors to connect the receiving channel filter and the transmitting channel filter. On the one hand, it occupies a large area. On the other hand, the length of the stub in the T-connector directly affects the two channels. The performance of the medium filter, so it takes a long time to optimize.

Compared with metal waveguides, substrate integrated waveguide technology has the advantages of small size, easy integration with active circuits, and low cost. Compared with microstrip line technology, it has the advantages of small radiation, low loss, and is suitable for higher frequency applications.

At present, there is still a lack of a new type of structure that enables duplexer design to abandon the traditional T-joint, and is used to design a new type of miniaturized substrate-integrated waveguide duplexer.

Contents of the invention

The technical problem to be solved by the present invention is to provide an improved substrate-integrated waveguide duplexer for the defects existing in the prior art, which no longer relies on traditional T-shaped joints, so that the occupied area of the duplexer is smaller .

The technical solution adopted by the present invention to solve the technical problem is to provide a substrate-integrated waveguide duplexer, including a main body, a common terminal joint arranged on the main body, an output end of a receiving filter channel, a receiving end of a transmitting filter channel At the end, the main body is provided with a first receiving resonant cavity, a second receiving resonant cavity, a first transmitting resonant cavity, a second transmitting resonant cavity and a dual-mode public resonant cavity;

The output end of the receiving filter channel is arranged adjacent to and forms a coupling with the first receiving resonant cavity, and the receiving end of the transmitting filter channel is arranged adjacent to and forms a coupling with the first transmitting resonant cavity; the first receiving resonant cavity and The second receiving resonator is arranged adjacent to and formed in cascade through coupling, the first transmitting resonator is arranged adjacent to the second transmitting resonator and formed in cascade through coupling, the second receiving resonator and the The second transmitting resonant cavities are arranged adjacent to the dual-mode common resonant cavities respectively and form cascaded connections with the dual-mode common resonant cavities respectively, and the common end joints are arranged adjacent to the dual-mode common resonant cavities and within a predetermined The position forms a coupling;

The first receiving resonant cavity, the second receiving resonant cavity and the dual-mode common resonant cavity form a receiving filter channel for filtering the signal received by the common end joint, and the first transmitting resonant cavity, the second The transmitting resonant cavity and the dual-mode common resonant cavity form a transmitting filter channel for filtering the signal sent by the common end connector, and the transmitting filter channel and the receiving filter channel pass through the dual-mode common resonant cavity in different channels The different working modes in the filter form mutual isolation.

Preferably, the second transmitting resonant cavity and the dual-mode common resonant cavity are coupled to each other through a first coupling slot provided on the main body to form a cascade connection, and the second receiving resonant cavity and the dual-mode The public resonant cavities are coupled with each other through the second coupling slot provided on the main body to form a cascade connection, and the dual-mode public resonant cavity and the common end connector are formed through the third coupling slot provided on the main body Coupling, the first receiving resonant cavity is coupled with the output end of the receiving filter channel through the sixth coupling slot provided on the main body, and the first transmitting resonant cavity is coupled with the receiving end of the transmitting filter channel by setting The seventh coupling groove on the body portion forms coupling.

Preferably, the common end connector, the output end of the receiving filter channel and the receiving end of the transmitting filter channel are all rectangular feeding microstrip lines.

Preferably, the dual-mode common resonant cavity is in the shape of a cuboid and is partially aligned with the second receiving resonant cavity and the second transmitting resonant cavity, and the first coupling groove is arranged between the second receiving resonant cavity and the second transmitting resonant cavity. Between the mutually aligned parts of the dual-mode common resonant cavity, the second coupling groove is disposed between the mutually aligned parts of the second transmitting resonant cavity and the dual-mode common resonant cavity.

Preferably, both the first receiving resonant cavity and the second receiving resonant cavity are rectangular parallelepiped, and the first receiving resonant cavity and the second receiving resonant cavity are partially aligned with each other, and the main part is also provided with a stage for A fourth coupling groove connecting the first receiving resonator and the second receiving resonator, the fourth coupling groove is opened between the aligned parts of the first receiving resonator and the second receiving resonator.

Preferably, both the first emitting resonator and the second emitting resonator are rectangular parallelepiped, the first emitting resonator and the second emitting resonator are partially aligned with each other, and the main part is also provided with a cascade The fifth coupling groove of the first transmitting resonator and the second receiving resonator is opened between the aligned parts of the first transmitting resonator and the second transmitting resonator.

Preferably, the substrate-integrated waveguide duplexer includes a first dielectric substrate, the second dielectric substrate, and the third dielectric substrate sequentially laminated, and the output end of the receiving filter channel and the receiving end of the transmitting filter channel and the common end connectors are all printed on the upper surface of the first dielectric substrate with silver paste; the third coupling groove, the sixth coupling groove and the seventh coupling groove are all printed on the The upper surface of the second dielectric substrate; the first coupling groove, the second coupling groove, the fourth coupling groove and the fifth coupling groove are all printed on the upper surface of the third dielectric substrate with silver paste ; The lower surface of the third dielectric substrate is completely covered with silver paste; the first receiving resonant cavity, the first transmitting resonant cavity, and the dual-mode common resonant cavity are all set inside the second dielectric substrate , both the second receiving resonant cavity and the second transmitting resonant cavity are set inside the third dielectric substrate.

The substrate-integrated waveguide duplexer of the present invention has the following beneficial effects: the transmitting filter channel and the receiving filter channel of the substrate-integrated waveguide duplexer provided by the present invention share a dual-mode common resonant cavity, and utilize different Due to the distribution characteristics of the resonant modes, the cascaded positions of the dual-mode common resonant cavity and other resonant cavities are properly selected to form isolation between the two channel filters. In the present invention, the common end connector only needs to be coupled with the dual-mode common resonant cavity at a predetermined position, and compared with the duplexer using a T-shaped connector, it has the beneficial effects of smaller volume and simpler structure.

Description of drawings

The present invention will be further described below in conjunction with accompanying drawing and embodiment, in the accompanying drawing:

FIG. 1 is a schematic diagram of a three-dimensional structure of a substrate-integrated waveguide duplexer in an embodiment of the present invention;

Fig. 2 is the front view of the substrate integrated waveguide duplexer in the embodiment shown in Fig. 1 of the present invention;

Fig. 3 shows the simple schematic diagram of the electric field at the receiving filter channel frequency in the simulated dual-mode public resonant cavity;

Fig. 4 shows a simple schematic diagram of the electric field in the simulated dual-mode common resonant cavity at the frequency of the transmit filter channel.

Detailed ways

In order to have a clearer understanding of the technical features, purposes and effects of the present invention, the specific implementation manners of the present invention will now be described in detail with reference to the accompanying drawings.

Figure 1 shows a substrate-integrated waveguide duplexer in an embodiment of the present invention, including a roughly rectangular parallelepiped main body and a common terminal connector 80 disposed on the main body, a receiving filter channel output 10, and a transmitting filter channel The receiving end 40 is provided with a first receiving resonant cavity 20 , a second receiving resonant cavity 30 , a first transmitting resonant cavity 50 , a second transmitting resonant cavity 60 and a dual-mode common resonant cavity 70 on the main body.

The receiving filter channel output end 10 is adjacent to the first receiving resonant cavity 20 and forms a coupling, and the transmitting filter channel receiving end 40 is adjacent to the first transmitting resonant cavity 50 and forms a coupling; the first receiving resonant cavity 20 and the second receiving resonant cavity The cavities 30 are arranged adjacently and form a cascade through coupling, the first transmitting resonator 50 and the second transmitting resonator 60 are adjacently arranged and form a cascade through coupling, the second receiving resonator 30 and the second transmitting resonator 60 are respectively connected to the dual-mode The common resonant cavities 70 are adjacently arranged and respectively coupled with the dual-mode common resonant cavities 70 at predetermined positions to form a cascade connection, and the common terminal connector 80 is arranged adjacent to the dual-mode common resonant cavities 70 and formed to be coupled at predetermined positions.

One resonant mode in the first receiving resonant cavity 20, the second receiving resonant cavity 30, and the dual-mode common resonant cavity 70 together forms a receiving filter channel for filtering the signal received by the common end connector 80, and the first transmitting resonant cavity 50 , the second transmitting resonant cavity 60 and another resonant mode in the dual-mode common resonant cavity 70 jointly form a transmitting filter channel for filtering the signal to be sent out through the common terminal joint 80, and the transmitting filter channel and the receiving filter channel pass through In the dual-mode public resonant cavity, different working modes in different channel filters form mutual isolation.

The common terminal connector 80 is used for connecting with the antenna, and receiving or transmitting signals through the antenna. The common terminal connector 80 passes the received signal to the receiving filter channel output terminal 10 after being filtered by the receiving filter channel, and the receiving filter channel output terminal 10 outputs the processed signal to other required devices. The receiving end 40 of the transmission filter channel inputs the signal that needs to be transmitted by the antenna in other devices into the transmission filter channel for filtering processing, and then passes it to the common terminal connector 80, and the common terminal connector 80 transmits the signal to the antenna, and the antenna transmits the signal go out.

In the prior art, the common end connector 80 needs to use a T-shaped connector to couple with the resonant cavities of the transmitting filter and the receiving filter respectively, and connect to the antenna. Because the present invention has a dual-mode common resonant cavity 70 as the common resonant cavity for forming the receiving filter channel and the transmitting filter channel. Adopting the present invention can make the common end connector 80 not use a T-shaped connector, and the common end connector 80 only needs to be coupled with the dual-mode common resonant cavity 70 at a predetermined position. It has the beneficial effects of simpler structure and smaller volume.

It can be understood that, as required, one or more resonant cavities can be cascaded between the first receiving resonant cavity 20 and the second receiving resonant cavity 30, and the first receiving resonant cavity 20 and the second receiving resonant cavity 30 pass through the One or more resonant cavities are cascaded to achieve better filtering effect. One or more resonators can also be cascaded between the first emission resonator 50 and the second emission resonator 60, and the first emission resonator 50 and the second emission resonator 60 pass through one or more than one resonator between the first emission resonator 50 and the second emission resonator 60 Resonant cavities are cascaded to achieve better filtering effect.

In this embodiment, the main body of the substrate-integrated waveguide duplexer includes a first dielectric substrate 1 , a second dielectric substrate 2 and a third dielectric substrate 3 bonded in sequence. The first dielectric substrate 1 is made of an LTCC cast film with a thickness of 0.1 mm and a dielectric constant of 5.9. The second dielectric substrate 22 is formed by stacking four LTCC cast films with a thickness of 0.1 mm and a dielectric constant of 5.9. The third dielectric substrate 33 is formed by stacking four LTCC cast films with a thickness of 0.1 mm and a dielectric constant of 5.9.

In the present invention, the substrate integrates each resonant cavity in the waveguide duplexer, such as the first receiving resonant cavity 20, the second receiving resonant cavity 30, the first transmitting resonant cavity 50, the second transmitting resonant cavity 60, and the dual-mode The common resonant cavity 70 is based on the substrate integrated waveguide technology, and the metallized through holes arranged in a rectangle and the metal layers on the upper and lower surfaces of the medium enclose a cuboid cavity. The size of the cavity other than the common resonant cavity is selected so that the resonant frequency of the TE101 mode of the cavity is equal to the center frequency of the corresponding transmitting filter or receiving filter. The size of the dual-mode public resonant cavity is selected so that the resonant frequency of the TE102 mode of the cavity corresponds to the center frequency of the receive filter channel, and the resonant frequency of the TE103 mode of the cavity corresponds to the center frequency of the transmit filter channel.

The first receiving resonant cavity 20 , the first transmitting resonant cavity 50 and the dual-mode common resonant cavity 70 are arranged inside the second dielectric substrate 2 . The first receiving resonant cavity 20 and the first transmitting resonant cavity 50 are set inside the second dielectric substrate 2 and respectively arranged on two sides of the dual-mode common resonant cavity 70 . Both the second receiving substrate-integrated waveguide resonator 30 and the second transmitting substrate-integrated waveguide resonator 60 are in the shape of a cuboid and set inside the third dielectric substrate 3 . The second receiving cavity 30 and the second transmitting cavity 60 are partially aligned with each other.

Both the first receiving resonant cavity 20 and the second receiving resonant cavity 30 are rectangular parallelepiped, and the first receiving resonant cavity 20 and the second receiving resonant cavity 30 are partially aligned with each other. The cavity 20 and the fourth coupling groove 23 of the second receiving resonant cavity 30 are opened between the parts of the first receiving resonant cavity 20 and the second receiving resonant cavity 30 that are aligned with each other.

Both the first emission resonator 50 and the second emission resonator 60 are cuboid, the first emission resonator 50 and the second emission resonator 60 are partly aligned with each other, and the main body part is also provided with the first emission resonator for cascading 50 and the fifth coupling groove 56 of the second transmitting resonator 60 , the fifth coupling groove 56 is opened between the parts of the first transmitting resonator 50 and the second transmitting resonator 60 that are aligned with each other.

The dual-mode common resonant cavity 70 is a cuboid and is partially aligned with the second receiving resonant cavity 30 and the second transmitting resonant cavity 60 respectively, and the first coupling groove 37 is arranged between the second receiving resonant cavity 30 and the dual-mode common resonant cavity 70 Between the facing parts that are aligned with each other, the second coupling groove 67 is disposed between the parts of the second transmitting resonator 60 and the dual-mode common resonant cavity 70 that are aligned with each other.

The common terminal connector 80 is a rectangular feeding microstrip line, which is arranged at a corresponding position on the upper surface of the first dielectric substrate 1 . And it is coupled and cascaded with the dual-mode common resonant cavity 70 through the third coupling groove 78 arranged at a corresponding position on the lower surface of the first dielectric substrate 1 .

The output end 10 of the receiving filter channel and the input end 40 of the transmitting filter channel are also rectangular feeding microstrip lines printed on corresponding positions on the upper surface of the first dielectric substrate 1 . The output end 10 of the receiving filter channel and the receiving end 40 of the transmitting filter channel are respectively coupled 50 with the first receiving resonant cavity 20 and the first transmitting and receiving end through the sixth coupling slot 12 and the seventh coupling slot 45 provided on the main body.

The first coupling groove 37, the second coupling groove 67, and the third coupling groove 78 must be selected in suitable positions, so that the two resonance modes in the common resonant cavity can be respectively excited to connect the two filter channels on the one hand, and on the other hand Simultaneously realize the isolation of two filtering channels. We have given the electric field line diagrams of the dual-mode public resonant cavity 70 respectively simulated in the computer software at predetermined frequencies, as shown in FIG. 2 and FIG. 3 . When the dual-mode public resonant cavity 70 works at the receiving filter channel frequency, the electric field at the A region is very weak or almost none; The electric field is weak or almost non-existent; field strength in region C is strong at both channel frequencies. Therefore, the second transmitting resonant cavity 60 and the dual-mode common resonant cavity 70 are cascaded in the A region, that is, the second coupling slot 67 is arranged in the A region, and the second receiving resonant cavity 30 and the dual-mode common resonant cavity 70 are connected in the B region. Area cascading, that is, the first coupling slot 37 is arranged in the B area, can realize the excitation of two channel frequencies in the common resonant cavity on the one hand, and realize the isolation between the two channel frequencies on the other hand. The common terminal connector 80 and the dual-mode common resonant cavity 70 are coupled in the C region, that is, the third coupling slot 78 is arranged in the C region, so that the energy of the two channel frequencies can be coupled. Of course, the diagrams in FIG. 2 and FIG. 3 simply show the electric field diagram at a certain frequency, and the electric field diagram will change accordingly when the frequency changes.

Embodiments of the present invention have been described above in conjunction with the accompanying drawings, but the present invention is not limited to the above-mentioned specific implementations, and the above-mentioned specific implementations are only illustrative, rather than restrictive, and those of ordinary skill in the art will Under the enlightenment of the present invention, many forms can also be made without departing from the gist of the present invention and the protection scope of the claims, and these all belong to the protection of the present invention.

Claims (7)

1. A substrate-integrated waveguide duplexer, characterized in that it includes a main body and a common terminal connector (80) arranged on the main body, a receiving filter channel output terminal (10), a transmitting filter channel receiving end ( 40), the main body is provided with a first receiving resonant cavity (20), a second receiving resonant cavity (30), a first transmitting resonant cavity (50), a second transmitting resonant cavity (60) and a dual-mode public resonant cavity cavity(70); The output end (10) of the receiving filter channel is arranged adjacent to the first receiving resonant cavity (20) and forms a coupling, and the receiving end (40) of the transmitting filter channel is arranged adjacent to the first transmitting resonant cavity (50) and form a coupling; the first receiving resonator (20) is adjacent to the second receiving resonator (30) and forms a cascade through coupling, and the first transmitting resonator (50) and the second transmitting The resonant cavities (60) are arranged adjacent to and form a cascade through coupling, and the second receiving resonant cavity (30) and the second transmitting resonant cavity (60) are respectively arranged adjacent to the dual-mode common resonant cavity (70) and Forming a cascade connection with the dual-mode common resonant cavity (70) respectively through coupling, and the common terminal connector (80) is arranged adjacent to the dual-mode common resonant cavity (70) and forms a coupling at a predetermined position; The first receiving resonant cavity (20), the second receiving resonant cavity (30) and the dual-mode common resonant cavity (70) form a receiving filter for filtering signals received by the common end connector (80) channel, the first transmit resonator (50), the second transmit resonator (60) and the dual-mode common resonator (70) form a filter for the signal to be sent through the common terminal connection (80) A transmitting filter channel, and the transmitting filter channel and the receiving filter channel are isolated from each other through the difference in working modes of different channel filters in the dual-mode common resonant cavity. 2. The substrate integrated waveguide duplexer according to claim 1, characterized in that, the second transmitting resonant cavity (60) and the dual-mode common resonant cavity (70) are arranged on the main body through The first coupling grooves (37) of the two are coupled to each other and form a cascade connection, and the second receiving resonator (30) and the dual-mode common resonator (70) pass through the second coupling groove ( 67) are coupled with each other and form a cascade, the dual-mode common resonant cavity (70) and the common end joint (80) form a coupling through the third coupling slot (78) provided on the main body, the first A receiving resonant cavity (20) is coupled to the output end (10) of the receiving filter channel through a sixth coupling slot (12) provided on the main body, and the first transmitting resonant cavity (50) is coupled to the The receiving end (40) of the transmitting filter channel is coupled through a seventh coupling slot (45) provided on the main body. 3. The substrate integrated waveguide duplexer according to claim 1, characterized in that, the common end connector (80), the output end (10) of the receiving filter channel and the receiving end (40) of the transmitting filter channel ) are rectangular feeding microstrip lines. 4. The substrate-integrated waveguide duplexer according to claim 1, characterized in that, the dual-mode common resonant cavity (70) is a cuboid and is connected to the second receiving resonant cavity (30) and the second transmitting cavity respectively. The resonant cavities (60) are partially aligned with each other, and the first coupling groove (37) is arranged between the parts where the second receiving resonant cavity (30) and the dual-mode common resonant cavity (70) are aligned with each other , the second coupling groove (67) is arranged between the parts where the second transmitting resonator (60) and the dual-mode common resonator (70) are aligned with each other. 5. The substrate integrated waveguide duplexer according to claim 4, characterized in that, the first receiving cavity (20) and the second receiving cavity (30) are rectangular parallelepiped, and the first receiving cavity The resonant cavity (20) and the second receiving resonant cavity (30) are partially aligned with each other, and the main body part is also provided with the first receiving resonant cavity (20) and the second receiving resonant cavity (30). The fourth coupling groove (23) is opened between the parts where the first receiving resonant cavity (20) and the second receiving resonant cavity (30) are aligned with each other. 6. The substrate-integrated waveguide duplexer according to claim 5, characterized in that, both the first transmitting resonant cavity (50) and the second transmitting resonant cavity (60) are rectangular parallelepiped, and the first transmitting resonant cavity The cavity (50) and the second transmitting resonant cavity (60) are partially aligned with each other, and the main body part is also provided with the first transmitting resonant cavity (50) and the second transmitting resonant cavity (60) for cascading The fifth coupling groove (56) is opened between the parts where the first emitting resonant cavity (50) and the second emitting resonant cavity (60) are aligned with each other. 7. The substrate-integrated waveguide duplexer according to claim 6, characterized in that, the waveguide duplexer comprises a first dielectric substrate (1), the second dielectric substrate (2) and The third dielectric substrate (3), the output end of the receiving filter channel (10), the receiving end of the transmitting filter channel (40) and the common end connector (80) are all printed on the first On the upper surface of the dielectric substrate (1); the third coupling groove (78), the sixth coupling groove (12) and the seventh coupling groove (45) are all printed on the second medium with silver paste On the upper surface of the substrate (2); the first coupling groove (37), the second coupling groove (67), the fourth coupling groove (23) and the fifth coupling groove (56) all adopt Silver paste is printed on the upper surface of the third dielectric substrate (3); the lower surface of the third dielectric substrate (3) is completely covered with silver paste; the first receiving resonant cavity (20), the The first transmitting resonant cavity (50) and the dual-mode common resonant cavity (70) are all set inside the second dielectric substrate (2), the second receiving resonant cavity (30), the second transmitting resonant cavity The cavities (60) are all opened inside the third dielectric substrate (3).

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