CN103531717B - A kind of OLED display and preparation method thereof - Google Patents
A kind of OLED display and preparation method thereof Download PDFInfo
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- CN103531717B CN103531717B CN201310513040.1A CN201310513040A CN103531717B CN 103531717 B CN103531717 B CN 103531717B CN 201310513040 A CN201310513040 A CN 201310513040A CN 103531717 B CN103531717 B CN 103531717B
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- 238000002360 preparation method Methods 0.000 title abstract description 6
- 239000000758 substrate Substances 0.000 claims abstract description 90
- 229910021389 graphene Inorganic materials 0.000 claims abstract description 85
- OKTJSMMVPCPJKN-UHFFFAOYSA-N carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 claims abstract description 84
- 238000004806 packaging method and process Methods 0.000 claims abstract description 80
- 239000011231 conductive filler Substances 0.000 claims abstract description 17
- 238000005401 electroluminescence Methods 0.000 claims abstract description 10
- 238000000465 moulding Methods 0.000 claims abstract description 6
- 239000010410 layer Substances 0.000 claims description 236
- 239000011241 protective layer Substances 0.000 claims description 42
- TWXTWZIUMCFMSG-UHFFFAOYSA-N nitride(3-) Chemical compound [N-3] TWXTWZIUMCFMSG-UHFFFAOYSA-N 0.000 claims description 19
- PXHVJJICTQNCMI-UHFFFAOYSA-N nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 claims description 18
- 230000015572 biosynthetic process Effects 0.000 claims description 17
- 238000005755 formation reaction Methods 0.000 claims description 17
- XKRFYHLGVUSROY-UHFFFAOYSA-N argon Chemical compound [Ar] XKRFYHLGVUSROY-UHFFFAOYSA-N 0.000 claims description 12
- 239000000463 material Substances 0.000 claims description 11
- 239000012212 insulator Substances 0.000 claims description 10
- 238000004519 manufacturing process Methods 0.000 claims description 9
- 229910052759 nickel Inorganic materials 0.000 claims description 9
- 229910052786 argon Inorganic materials 0.000 claims description 6
- UFHFLCQGNIYNRP-UHFFFAOYSA-N hydrogen Chemical compound [H][H] UFHFLCQGNIYNRP-UHFFFAOYSA-N 0.000 claims description 6
- 239000001257 hydrogen Substances 0.000 claims description 6
- 229910052739 hydrogen Inorganic materials 0.000 claims description 6
- VNWKTOKETHGBQD-UHFFFAOYSA-N methane Chemical compound C VNWKTOKETHGBQD-UHFFFAOYSA-N 0.000 claims description 6
- 239000002904 solvent Substances 0.000 claims description 3
- 238000005538 encapsulation Methods 0.000 claims description 2
- 238000000034 method Methods 0.000 abstract description 7
- 239000010408 film Substances 0.000 description 26
- 238000010586 diagram Methods 0.000 description 10
- 230000000694 effects Effects 0.000 description 7
- 239000011159 matrix material Substances 0.000 description 7
- 238000002347 injection Methods 0.000 description 5
- 239000007924 injection Substances 0.000 description 5
- 230000005540 biological transmission Effects 0.000 description 4
- 239000007943 implant Substances 0.000 description 4
- 239000002184 metal Substances 0.000 description 4
- 229910052751 metal Inorganic materials 0.000 description 4
- 238000000059 patterning Methods 0.000 description 4
- 239000000243 solution Substances 0.000 description 4
- 239000010409 thin film Substances 0.000 description 4
- 150000001336 alkenes Chemical class 0.000 description 3
- 239000000969 carrier Substances 0.000 description 3
- 239000002356 single layer Substances 0.000 description 3
- 239000004575 stone Substances 0.000 description 3
- 210000002381 Plasma Anatomy 0.000 description 2
- 229910052799 carbon Inorganic materials 0.000 description 2
- 125000004432 carbon atoms Chemical group C* 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 239000004973 liquid crystal related substance Substances 0.000 description 2
- 101710031899 moon Proteins 0.000 description 2
- 239000000126 substance Substances 0.000 description 2
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- AMGQUBHHOARCQH-UHFFFAOYSA-N indium;oxotin Chemical compound [In].[Sn]=O AMGQUBHHOARCQH-UHFFFAOYSA-N 0.000 description 1
- MRNHPUHPBOKKQT-UHFFFAOYSA-N indium;tin;hydrate Chemical compound O.[In].[Sn] MRNHPUHPBOKKQT-UHFFFAOYSA-N 0.000 description 1
- 238000004020 luminiscence type Methods 0.000 description 1
- 239000007769 metal material Substances 0.000 description 1
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Abstract
The invention provides a kind of OLED display and preparation method thereof, relate to Display Technique field, solve the problem that in prior art, the resistance of array base palte Anodic or negative electrode is big.Embodiments provide a kind of OLED display, including: array base palte and the base plate for packaging to box molding, described array base palte includes the first substrate, anode layer, cathode layer and the electroluminescence layer being arranged between anode layer and cathode layer, wherein, described anode layer or described cathode layer are arranged on the top layer of described array base palte；Described base plate for packaging includes the second substrate and graphene layer, and wherein, described graphene layer is arranged on the top of described base plate for packaging；By filling conductive filler to box between described array base palte and base plate for packaging, so that described graphene layer is electrically connected with the described cathode layer being arranged at array base palte top layer or anode layer by conductive filler.
Description
Technical field
The present invention relates to Display Technique field, particularly relate to a kind of OLED display and preparation method thereof.
Background technology
Organic Light Emitting Diode (Organic Light-Emitting Diode, be called for short: OLED) device by
In advantages such as self-luminous, all solid state, wide viewing angle, response are fast, before having huge applications in flat panel display product
LCD), plasma (plasma scape, is considered as even to continue that (Liquid Crystal Display is called for short: liquid crystal
Display panel, is called for short: the flat panel display product of a new generation after PDP).
As a example by color OLED display device, including to the base plate for packaging of box molding and array base palte.Wherein,
As it is shown in figure 1, base plate for packaging 10 includes the second substrate 1 and is arranged on the black square on described second substrate 1
Battle array film layer 2 and colored film layer 3, wherein, colored film layer 3 includes R (red), G (green), B (blue) three
Plant the pattern unit of different colours.Array base palte 20 includes the first substrate 4 and is arranged on described first substrate
Anode layer 5, electroluminescence layer 6 and cathode layer 7 etc. on 4.Fill between base plate for packaging and array base palte
Implant 8 becomes display device to box-like.Existing anode and negative electrode are formed by ITO, and it transmits resistance
Greatly, display effect is affected.
Summary of the invention
Embodiments of the invention provide a kind of OLED display and preparation method thereof, the sun of described display device
The transmission resistance of pole or negative electrode is little, promotes display effect.
For reaching above-mentioned purpose, embodiments of the invention adopt the following technical scheme that
Embodiments provide a kind of OLED display, including: array base palte and the envelope to box molding
Dress substrate, described array base palte includes the first substrate, anode layer, cathode layer and is arranged at anode layer and the moon
Electroluminescence layer between the layer of pole, wherein, described anode layer or described cathode layer are arranged on described array base palte
Top layer；Described base plate for packaging includes the second substrate and graphene layer, and wherein, described graphene layer is arranged
Top at described base plate for packaging；By filling conductive filler between described array base palte and base plate for packaging
To box, so that described graphene layer is by conductive filler and the described negative electrode being arranged at array base palte top layer
Layer or anode layer electrical connection.
Optionally, described base plate for packaging also includes: between described second substrate and described graphene layer
Protective layer.
Optionally, described protective layer is formed with protection pattern.
Optionally, described base plate for packaging also includes: between described protective layer and described graphene layer every
Underbed layer, described dottle pin nitride layer includes chock insulator matter pattern.
Optionally, described dottle pin nitride layer is identical with described protective layer material.
Optionally, described dottle pin nitride layer and described protective layer one-shot forming.
Embodiments provide the manufacture method of a kind of OLED display, including: form array base palte；
Form base plate for packaging；By array base palte and base plate for packaging to box；Described formation array base palte specifically includes:
Anode layer or cathode layer is formed on first substrate；Described formation base plate for packaging specifically includes: on the second substrate
Form graphene layer；Described box is specifically included by array base palte and base plate for packaging: in array base palte and encapsulation
Conductive filler is filled between substrate, then by array base palte and base plate for packaging to box so that described graphene layer
Electrically connected with the described cathode layer being arranged at array base palte top layer or anode layer by conductive filler.
Optionally, the described graphene layer that formed on the second substrate includes:
Forming a layer thickness on the 3rd substrate is the nickel of 200-500nm；
The mixed airflow of the methane of 900-1200 DEG C, hydrogen and argon heats, then is rapidly cooled to room temperature；
With solvent, nickel is eroded, so that graphene film swims in solution surface, form graphene layer；
Described graphene layer is transferred to the upper surface of described second substrate.
Optionally, the described upper surface that described graphene layer is transferred to described second substrate particularly as follows:
Graphene layer swims in solution surface, is placed in by base plate for packaging in the solution being suspended with graphene layer, will
Graphene layer is transferred to the upper surface of the second substrate.
Optionally, the 3rd substrate forms the nickel of 200-300nm, and 1000 DEG C methane, hydrogen and
The mixed airflow of argon heats.
Optionally, formation base plate for packaging also includes before forming graphene layer on the second substrate: at the second lining
Protective layer is formed at the end.
Optionally, before described formation base plate for packaging forms graphene layer on the second substrate, and at the second lining
After forming protective layer, also include: on the second substrate, form dottle pin nitride layer at the end.
A kind of OLED display that the embodiment of the present invention provides and preparation method thereof, described OLED shows dress
The top of the base plate for packaging put is provided with graphene layer, and by conductive filler and array base palte top
Anode layer or cathode layer electrical connection, and then array base palte Anodic layer or the resistance of cathode layer can be reduced,
Promote display effect.
Accompanying drawing explanation
Fig. 1 is existing OLED display schematic diagram；
A kind of OLED display schematic diagram that Fig. 2 provides for the embodiment of the present invention；
Fig. 3 is the base plate for packaging schematic diagram in the OLED display of Fig. 2；
The base plate for packaging up-protective layer pattern of the another kind of OLED display that Fig. 4 provides for the embodiment of the present invention
Change schematic diagram；
The base plate for packaging schematic diagram of the another kind of OLED display that Fig. 5 provides for the embodiment of the present invention；
The base plate for packaging schematic diagram of the another kind of OLED display that Fig. 6 provides for the embodiment of the present invention；
Fig. 7 is the OLED display schematic diagram including base plate for packaging shown in Fig. 5；
Fig. 8 is the OLED display schematic diagram including base plate for packaging shown in Fig. 6；
The base plate for packaging schematic diagram of the another kind of OLED display that Fig. 9 provides for the embodiment of the present invention；
A kind of method signal forming graphene layer on the second substrate that Figure 10 provides for the embodiment of the present invention
Figure；
Figure 11 is the manufacture method schematic diagram of the base plate for packaging shown in Fig. 7；
Reference:
1-the second substrate；2-black matrix film layer；3-colored film layer；4-the first substrate；5-anode layer；6-electricity
Electroluminescent layer；7-cathode layer；8-implant；9-protective layer；10-base plate for packaging；11-graphene layer；12-
Chock insulator matter；20-array base palte.
Detailed description of the invention
Below in conjunction with the accompanying drawing in the embodiment of the present invention, the technical scheme in the embodiment of the present invention is carried out clearly
Chu, be fully described by, it is clear that described embodiment be only a part of embodiment of the present invention rather than
Whole embodiments.
It should be noted that the displaying principle of OLED display screen is: by arranging cathode layer and sun on substrate
Pole layer, and between cathode layer and anode layer, it is provided with organic light emitting material, when negative electrode and anode lead to simultaneously
Electricity, then due to the migration of electric charge, excite so that luminous organic material is luminous, and then realize display.And it is actual
Structure is more more complex than this board structure, such as, can also add one again between organic luminous layer and anode
Layer hole transmission layer, to regulate injection rate and the injection rate in hole.Can also be at organic luminous layer and negative electrode
Between add one layer of electron transfer layer again, be used for regulating injection rate and the injection rate of electronics.Owing to it is specifically tied
Structure is unrelated with the inventive point of the present invention, and its concrete structure is not described in detail by the present invention.And the present invention implements
Being positioned at below organic light emitting material with array base palte Anodic in example, negative electrode is positioned at organic light emitting material
Above as a example by illustrate.Wherein, described " on ", D score with make thin film order as foundation,
The film layer being initially formed under, at the film layer of rear formation upper.
The invention provides a kind of OLED display, including: array base palte and the base plate for packaging to box molding,
Include on described array base palte the first substrate, anode layer, cathode layer and be arranged at anode layer and cathode layer it
Between electroluminescence layer, wherein, described anode layer or described cathode layer are arranged on the top layer of described array base palte；
Described base plate for packaging includes: the second substrate and graphene layer, and wherein, described graphene layer is arranged on described
The top of base plate for packaging；By filling conductive filler to box between described array base palte and base plate for packaging,
So that described graphene layer is by conductive filler and described cathode layer or the sun being arranged at array base palte top layer
Pole layer electrical connection.
It should be noted that be provided with anode layer, cathode layer on described array base palte and be arranged on described sun
Electroluminescence layer between pole layer and cathode layer, the most described anode layer and described cathode layer are relative two-layers,
It can be the side that anode layer is formed adjacent to the first substrate, and the most described cathode layer is formed at away from the first lining
The side at the end；Or can also be the cathode layer side that is formed adjacent to the first substrate, the most described anode layer shape
Become in the side away from the first substrate.With described anode near the one of described first substrate in the embodiment of the present invention
Side, negative electrode is described in detail as a example by one layer of described first substrate.OLED display is according to luminescence
Color, it can be monochromatic, it is also possible to realizes colour display by arranging colored film layer.The present invention implements
It is described in detail as a example by example is provided with on the base plate for packaging of described OLED display colored film layer.Separately
Outward, the substrate that array base palte and base plate for packaging include can be all transparency carrier, it is also possible to is only that light emission side is
Transparency carrier, in the embodiment of the present invention as a example by described base plate for packaging is as transparency carrier.
Concrete, as in figure 2 it is shown, embodiments provide a kind of display device, described display device
Including to the array base palte 20 of box molding and base plate for packaging 10, wherein said array base palte 20 includes the first lining
The end 4 and be arranged on the anode layer 5 on the first substrate 4, cathode layer 7 and be positioned at anode layer 5 and cathode layer
Electroluminescence layer 6 between 7.Described base plate for packaging 10 is as it is shown on figure 3, include the second substrate 1 and set
Put the graphene layer 11 on described second substrate 1.And array base palte 20 and base plate for packaging 10 are by filling
Box, the then described cathode layer or the anode layer that are arranged at array base palte top layer are filled out by conductive filler 8 by conduction
Fill thing 8 to electrically connect with graphene layer 11.
By forming layer of metal layer on the protective layer of base plate for packaging in a kind of technology, such as, form silver metal
Layers etc., deposit ITO (Indium tin oxide, tin indium oxide), ITO and array base palte the most on the metal layer
Cathode contacts.Owing to this structure is general to the improvement effect of resistivity, therefore subtract by arranging metal level
The way of small resistor rate is greatly limited.
Graphene (Graphene) is the new material of a kind of single-layer sheet structure being made up of carbon atom, relative to
Other conductive metallic material, it has the advantage that transparency is high, resistivity is low, electron mobility is exceedingly fast.
But due to the characteristic that Graphene is exclusive, it is impossible to directly use and the way forming metal level on base plate for packaging
Graphene is directly prepared on base plate for packaging by similar technique.And in embodiments of the present invention, by elder generation
Described graphene layer is formed on the 3rd substrate, graphene layer is transferred to described base plate for packaging the most again
Surface, it is achieved thereby that the scheme that Graphene is arranged on base plate for packaging.Side at embodiments of the invention
In case, the negative electrode electrically connected with graphene layer or the transmission resistance of anode are little, and voltage homogeneity is good, can enter one
Step promotes display effect.It should be noted that described Graphene can also be able to be multilamellar stone with single-layer graphene
Ink alkene, is described in detail in the embodiment of the present invention as a example by described Graphene is as multi-layer graphene.
A kind of OLED display that the embodiment of the present invention provides, the array base palte top of described display device
Being provided with anode layer or cathode layer, the top of base plate for packaging is provided with graphene layer, and array base palte and envelope
Dress substrate is by the implant of conduction to box, and the graphene layer of the most described base plate for packaging is by the implant of conduction
Electrically connect with the cathode layer being arranged on described array base palte top or anode layer, and then described the moon can be reduced
Pole or the resistance of anode.
Optionally, described base plate for packaging also includes: between described second substrate and described graphene layer
Protective layer.
It should be noted that described protective layer is mainly used in making the thin film on the second substrate or pattern planarization.
As it is shown on figure 3, when being formed with black matrix film layer 2 and colored film layer 3 on the second substrate 1, its upper surface
Uneven, described protective layer 9 is set so that the surface planarisation of base plate for packaging, contributes to lifting aobvious
Show effect.Concrete, as it is shown on figure 3, base plate for packaging 10 is between the second substrate 1 and graphene layer 11
It is additionally provided with protective layer 9.Certainly, described second substrate is not provided with colored film layer and black matrix film layer can also
Described protective layer is set.
It is further preferred that described protective layer is formed with protection pattern.Concrete, as shown in Figure 4, described
The upper surface of protective layer 9 arranges multiple protuberance, forms protection pattern.Certainly, the protection of described protective layer
Pattern can also is that other Thinfilm patterns, and the embodiment of the present invention only illustrates as a example by shown in Fig. 4.And
Protective layer is arranged to patterning and can also regulate the transmitance of oled light, and refractive index etc., reduce scattering and
Improve contrast.
Optionally, described base plate for packaging also includes: between described protective layer and described graphene layer every
Underbed layer, described chock insulator matter includes chock insulator matter pattern.
Concrete, as it is shown in figure 5, described base plate for packaging 10 is gone back between protective layer 9 and graphene layer 11
Being provided with dottle pin nitride layer, described dottle pin nitride layer includes chock insulator matter 12.Certainly, as shown in Figure 6, it is also possible to be
Between protective layer 9 and the graphene layer 11 being provided with protection pattern, dottle pin nitride layer 12 is set.Need explanation
Being that described chock insulator matter can be the pattern of any other shape, such as, can also is that rectangle etc., the present invention is real
Execute in example, be only described in detail as a example by shown in Fig. 5, Fig. 6.
Optionally, described dottle pin nitride layer is identical with described protective layer material.And further, described chock insulator matter
Layer and described protective layer one-shot forming.Concrete, as it is shown in figure 9, described dottle pin nitride layer and described protective layer
Material is identical, then it can be by a patterning processes one-shot forming, the dottle pin nitride layer so formed and guarantor
Sheath is an entirety, the problem not havinging loose contact, and easy to make.Certainly, described chock insulator matter
Layer can also use different materials and be formed respectively through one-time process from described protective layer.
Embodiments provide the manufacture method of a kind of OLED display, including: form array base palte；
Form base plate for packaging；By array base palte and base plate for packaging to box；Wherein, described formation array base palte specifically wraps
Include: form anode layer or cathode layer on the first substrate；Described formation base plate for packaging specifically includes: second
Graphene layer is formed on substrate；Described box is specifically included by array base palte and base plate for packaging: at array base palte
With fill conductive filler between base plate for packaging, then by array base palte and base plate for packaging to box so that described stone
Ink alkene layer is electrically connected with the described cathode layer being arranged at array base palte top layer or anode layer by conductive filler.
It should be noted that array base palte includes cathode layer and anode layer, and between cathode layer and anode layer
Being provided with electroluminescence layer, the most described cathode layer can be relative with the position of described anode layer, but this
In bright embodiment, form anode layer or cathode layer, the most described anode layer or cathode layer position in the top of substrate
Top in described substrate.Described formation base plate for packaging specifically includes: form Graphene on the second substrate
Layer, and described graphene layer is positioned at the top of described base plate for packaging.
It should be noted that be also provided with electron injecting layer, electronics between electroluminescence layer and cathode layer
Transport layer, is also provided with hole injection layer and hole transmission layer between electroluminescence layer and anode layer.
It should be noted that Graphene is the new material of a kind of single-layer sheet structure being made up of carbon atom, its tool
There is the advantage that transparency is high, resistivity is low, electron mobility is exceedingly fast.
Optionally, as shown in Figure 10, the described graphene layer that formed on the second substrate specifically includes:
Step S101, on the 3rd substrate formed a layer thickness be the nickel of 200-500nm.
Described 3rd substrate could be for being formed the substrate etc. of other thin film or Rotating fields.Preferably, in institute
Stating and forming thickness on the 3rd substrate is the nickel of 200-300nm.
Step S102, heating in the mixed airflow at methane, hydrogen and the argon of 900-1200 DEG C, more fast
Speed is cooled to room temperature.
Preferably, heat in the mixed airflow of the methane of 1000 DEG C, hydrogen and argon, then be rapidly cooled to
Room temperature.
Step S103, with solvent, nickel is eroded, so that graphene film swims in solution surface, formed
Graphene layer.
It should be noted that the method forming graphene layer has multiple, such as, can form stone by Physical
Ink alkene, it is also possible to form Graphene by chemical method, only to be deposited by chemical gaseous phase in the embodiment of the present invention
Method is described in detail as a example by forming graphene film.
Step S104, described graphene layer is transferred to the upper surface of described second substrate.
It should be noted that the surface that the graphene layer of formation is formed at described second substrate can be to pass through
Described graphene film is sticked to the upper surface of described second substrate by transparent glues etc..
Optionally, formation base plate for packaging also includes before forming graphene layer on the second substrate: at the second lining
Protective layer is formed at the end.Described protective layer can be used for, so that substrate surface planarizes, improving display effect.When
If so described display device is for realizing colour display, base plate for packaging can also arrange colored film layer etc..Its
Corresponding making step can be carried out, owing to it is unrelated with the inventive point of the present invention according to concrete display device
Do not enumerate.
Optionally, before described formation base plate for packaging forms Graphene on the second substrate, and at the second substrate
After upper formation protective layer, also include: on the second substrate, form dottle pin nitride layer.The chock insulator matter position i.e. formed
Between described graphene layer and described protective layer.It addition, described dottle pin nitride layer can also be with described protective layer
Make simultaneously.
Below, the present invention will provide a specific embodiment, and the making step forming base plate for packaging is described in detail in detail, such as figure
Shown in 11, specifically include:
Step S201, on the second substrate formed black matrix film layer.
It should be noted that described second substrate can be transparent glass substrate.Concrete, can be logical
Cross a patterning processes on the second substrate, form described black matrix film layer.
Step S202, on the second substrate formed colored film layer.
Concrete, the second substrate being formed with black matrix film layer forms described colored film layer.Described colour
Film layer can be to be formed by a patterning processes.
Step S203, on the second substrate formed protective layer.
Concrete, the second substrate being formed with black matrix film layer and colored film layer forms described protective layer again,
Described protective layer is so that the surface protection of described substrate.Certainly, described protective layer can also be formed
Dottle pin nitride layer, it is preferred that described dottle pin nitride layer is identical with described protective layer material and one-shot forming.Described every
Underbed can be used for alleviating the pressure of screen.
Step S204, on the second substrate formed graphene layer.
Finally, forming graphene layer on described second substrate, the most described graphene layer is arranged on described second
The top of substrate.The base plate for packaging formed is as shown in Figure 7.Base plate for packaging shown in Fig. 8 is for having pattern
The protective layer changed.
The above, the only detailed description of the invention of the present invention, but protection scope of the present invention is not limited to
This, any those familiar with the art, in the technical scope that the invention discloses, can readily occur in
Change or replacement, all should contain within protection scope of the present invention.Therefore, protection scope of the present invention
Should be as the criterion with described scope of the claims.
Claims (12)
1. an OLED display, including: array base palte and the base plate for packaging to box molding, its feature
Being, described array base palte includes the first substrate, anode layer, cathode layer and is arranged at anode layer and negative electrode
Electroluminescence layer between Ceng, wherein, described anode layer or described cathode layer are arranged on described array base palte
Top layer；Described base plate for packaging includes the second substrate and graphene layer, and wherein, described graphene layer is arranged on
The top of described base plate for packaging；By being filled up completely with conductive fill between described array base palte and base plate for packaging
Thing is to box, and described conductive filler is completely covered described graphene layer and is arranged at array base palte top layer
Described cathode layer or anode layer, so that described graphene layer passes through conductive filler and is arranged at array base palte
The described cathode layer of top layer or anode layer electrical connection.
Display device the most according to claim 1, it is characterised in that described base plate for packaging also includes:
Protective layer between described second substrate and described graphene layer.
Display device the most according to claim 2, it is characterised in that described protective layer is formed with protection
Pattern.
Display device the most according to claim 1, it is characterised in that described base plate for packaging also includes:
Dottle pin nitride layer between protective layer and described graphene layer, described dottle pin nitride layer includes chock insulator matter pattern.
Display device the most according to claim 4, it is characterised in that described dottle pin nitride layer and described guarantor
Jacket material is identical.
Display device the most according to claim 5, it is characterised in that described dottle pin nitride layer and described guarantor
Sheath one-shot forming.
7. a manufacture method for OLED display, including: form array base palte；Form base plate for packaging；
By array base palte and base plate for packaging to box；It is characterized in that, described formation array base palte specifically includes:
Anode layer or cathode layer is formed on one substrate；Described formation base plate for packaging specifically includes: shape on the second substrate
Become graphene layer；Described box is specifically included by array base palte and base plate for packaging: at array base palte and encapsulation base
Conductive filler it is filled up completely with between plate, then by array base palte and base plate for packaging to box, described conductive filler
Described graphene layer it is completely covered and is arranged at described cathode layer or the anode layer of array base palte top layer, making
Obtain described graphene layer by conductive filler and described cathode layer or the anode layer being arranged at array base palte top layer
Electrical connection.
Manufacture method the most according to claim 7, it is characterised in that described formation on the second substrate
Graphene layer includes:
Forming a layer thickness on the 3rd substrate is the nickel of 200-500nm；
The mixed airflow of the methane of 900-1200 DEG C, hydrogen and argon heats, then is rapidly cooled to room temperature；
With solvent, nickel is eroded, so that graphene film swims in solution surface, form graphene layer；
Described graphene layer is transferred to the upper surface of described second substrate.
Manufacture method the most according to claim 8, it is characterised in that described described graphene layer is turned
Move to the upper surface of described second substrate particularly as follows:
Graphene layer swims in solution surface, is placed in by base plate for packaging in the solution being suspended with graphene layer, will
Graphene layer is transferred to the upper surface of the second substrate.
Manufacture method the most according to claim 8, it is characterised in that form thickness on the 3rd substrate
Degree is the nickel of 200-300nm, and heats in the mixed airflow of methane, hydrogen and the argon of 1000 DEG C.
11. manufacture methods according to claim 7, it is characterised in that form base plate for packaging second
Also include before forming graphene layer on substrate: on the second substrate, form protective layer.
12. manufacture methods according to claim 10, it is characterised in that described formation base plate for packaging exists
Before forming graphene layer on second substrate, and on the second substrate after formation protective layer, also include:
Dottle pin nitride layer is formed on substrate.
Priority Applications (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201310513040.1A CN103531717B (en) | 2013-10-25 | A kind of OLED display and preparation method thereof | |
| PCT/CN2014/083275 WO2015058571A1 (en) | 2013-10-25 | 2014-07-30 | Oled display device and manufacturing method thereof |
| US14/429,532 US9905797B2 (en) | 2013-10-25 | 2014-07-30 | OLED display device and fabrication method thereof |
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| CN201310513040.1A CN103531717B (en) | 2013-10-25 | A kind of OLED display and preparation method thereof |
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