CN103531507A - 模块承载托盘及igbt模块的封装方法 - Google Patents

模块承载托盘及igbt模块的封装方法 Download PDF

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CN103531507A
CN103531507A CN201210231645.7A CN201210231645A CN103531507A CN 103531507 A CN103531507 A CN 103531507A CN 201210231645 A CN201210231645 A CN 201210231645A CN 103531507 A CN103531507 A CN 103531507A
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寇庆娟
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CRRC Xian Yongdian Electric Co Ltd
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2221/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof covered by H01L21/00
    • H01L2221/67—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere
    • H01L2221/683—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L2221/68304—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
    • H01L2221/68313—Auxiliary support including a cavity for storing a finished device, e.g. IC package, or a partly finished device, e.g. die, during manufacturing or mounting
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2221/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof covered by H01L21/00
    • H01L2221/67—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere
    • H01L2221/683—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L2221/68304—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
    • H01L2221/6835—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support used as a support during build up manufacturing of active devices

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Abstract

本发明提供一种模块承载托盘及IGBT模块的封装方法，模块承载托盘包括底座和四个支撑销，所述四个支撑销可拆卸固定在底座上，所述四个支撑销分别与模块底板上的安装孔相对应，所述支撑销远离底座的一端为锥台，所述锥台的顶端的外径小于安装孔的内径，所述锥台底端的外径大于安装孔的内径，即所述锥台可嵌入安装孔中，所述支撑销可架空模块底板，减少底板与模块承载托盘的接触面。本发明还公开了一种采用上述模块承载托盘的IGBT模块的封装方法。本发明结构简单、合理、紧凑，克服了现有技术的诸多问题，用于IGBT模块封装具有有效防止底板污染、节约模块封装成本和提高模块封装效率的优点。

Description

模块承载托盘及IGBT模块的封装方法
技术领域
本发明涉及电力电子设备技术，尤其涉及一种模块承载托盘及IGBT模块的封装方法。
背景技术
IGBT（Insulated Gate Bipolar Transistor，绝缘栅双极型晶体管）具有高频率、高电压、大电流、尤其是容易开通和关断的性能特点，是国际上公认的电力电子技术第三次革命的最具代表性的产品。目前，IGBT已广泛应用于国民经济的各行业中。
IGBT模块如图1所示，IGBT模块底板1上设置有四个安装孔2。现有IGBT模块在封装时，需要将底板、外壳和顶盖等部件装配在一起。IGBT模块的封装过程需要在多个工序间周转，以完成将底板、外壳和顶盖等部件装配在一起的操作。对于IGBT模块，需要保持底板干净、无明显划痕才能保证其良好的散热性的重要条件，显然，封装过程如果底板接触操作台面就增加了污染的机会，而周转过程处置不当，也容易导致底板出现划痕。
目前的封装工艺主要通过使用无尘纸来减少底板的污染，将无尘纸放在操作台面上，在无尘纸上进行IGBT模块的封装。当无尘纸达不到工作净度进行更换，消耗了大量成本较高的无尘纸，造成浪费，增加了IGBT模块的封装成本；此外，无尘纸虽然一定程度减少了IGBT模块底板的污染，但是当IGBT模块底板的侧边或下边少量胶体的溅漏粘时，无尘纸直接与底板接触，导致无尘纸上沾染了胶体，从而间接的污染了底板，即无尘纸防污染效果并不理想。
发明内容
本发明的目的在于，针对上述IGBT模块底板易污染的问题，提出一种模块承载托盘，用于IGBT模块封装具有有效防止底板污染、节约模块封装成本和提高模块封装效率的优点。
为实现上述目的，本发明采用的技术方案是：一种模块承载托盘，包括底座和四个支撑销，所述四个支撑销可拆卸固定在底座上，所述四个支撑销分别与模块底板上的安装孔相对应，所述支撑销远离底座的一端为锥台，所述锥台的顶端的外径小于安装孔的内径，所述锥台底端的外径大于安装孔的内径。
进一步地，所述支撑销采用具有一定弹性、耐高温和耐腐蚀的材料制备，具体为采用塑料或橡胶制备。
进一步地，所述底座采用耐高温材料制备，具体地，所述底座采用金属材料制备。所述底座的大小取决于所承载的模块底板的大小。
进一步地，所述底座为矩形底座。
进一步地，所述矩形底座的四边中至少有一边向支撑销所在一侧弯折。
进一步地，所述矩形底座的两个相对边向支撑销所在一侧弯折。
进一步地，所述支撑销通过螺纹连接固定在底座上。
本发明的另一个方面提供了一种IGBT模块的封装方法，实现IGBT模块流转方便，整个封装过程底板干净、无划痕。
为实现上述目的，本发明采用的技术方案是：一种IGBT模块的封装方法包括：将IGBT模块置于上述模块承载托盘上，所述IGBT模块底板上的安装孔分别与四个支撑销相对应。
本发明模块承载托盘结构简单、合理、紧凑，与现有技术相比较具有以下优点：
1、本发明采用托盘结构，方便GBT模块底板在各工序间的周转；
2、本发明模块承载托盘可重复利用，一方面可节约模块封装成本，另一方面降低了工作量，提高了模块封装的工作效率；
3、所述IGBT模块底板被支撑销架空，底板与本发明模块承载托盘的接触面积小，有效防止底板在装配过程中造成污染；此外所述支撑销可拆卸固定在模块本体上，便于清洁。
附图说明
图1为IGBT模块底板的结构示意图；
图2为本发明模块承载托盘的主视图；
图3为本发明模块承载托盘的俯视图。
具体实施方式
实施例1
图2为本发明模块承载托盘的主视图；图3为本发明模块承载托盘的俯视图。
如图2和图3所示，本实施例公开的一种模块承载托盘，包括底座4和四个支撑销3，支撑销3采用塑料制备，可理解所述支撑销3还可以采用橡胶或其他具有一定弹性、耐高温（150℃）和耐腐蚀的材料制备。四个支撑销3可拆卸固定在底座4上。
底座4为矩形底座，矩形底座的大小应略大于所承载的IGBT模块底板的大小。该矩形底座的两个相对边向支撑销所在一侧弯折，弯折部分可作为把手，方便模块承载托盘的拿取和移动。该底座4采用不锈钢制备，也可采用其他金属材料制备。
四个支撑销3分别与IGBT模块底板上的安装孔相对应，支撑销3远离底座的一端为锥台，锥台的顶端的外径小于安装孔的内径，锥台低端底端的外径大于安装孔的内径，即锥台可嵌入安装孔中，支撑销3可架空IGBT模块底板，减少IGBT模块底板与模块承载托盘的接触面。
四个支撑销3可拆卸固定在底座4上，具体地，支撑销3远离锥台的一端设置有外螺纹，底座4上设置有通孔，该通孔设置有与支撑销3外螺纹相配和的内螺纹，支撑销3通过螺纹连接可拆卸固定在底座4上。
上述模块承载托盘方便GBT模块底板在各工序间的周转；且可重复利用，一方面可节约模块封装成本，另一方面降低了工作量，提高了模块封装的工作效率；所述IGBT模块底板被支撑销架空，底板与上述模块承载托盘的接触面积小，有效防止底板在装配过程中造成污染，保证了模块的散热性能；支撑销可拆卸固定在模块本体上，便于清洁。此外，所述支撑销可采用具有一定弹性、耐高温和耐腐蚀的材料制备，在与IGBT模块底板安装孔接触时，不会摩擦或划伤IGBT模块底板的安装孔，进一步保证了模块的散热性能。
实施例2
本实施例提供了一种IGBT模块的封装方法，包括：将实施例1所述模块承载托盘置于操作台面上，将IGBT模块置于模块承载托盘上，所述IGBT模块底板上的安装孔分别与四个支撑销相对应。支撑销架空IGBT模块，底板使IGBT模块底板与操作台面完全分离。实现IGBT模块流转方便，整个封装过程底板干净、无划痕的优点。
本发明的实施例仅以IGBT模块封装为例，可以理解，本发明模块承载托盘可用于多种电力电子设备原件的工序间周转，已达到洁净、无划痕的目的。本发明不局限于上述实施例所描述的模块承载托盘，托盘本体形状和材质的变换、支撑销与托盘本体连接位置或方法的改变均落在本发明的保护范围之内。
最后应说明的是：以上各实施例仅用以说明本发明的技术方案，而非对其限制；尽管参照前述各实施例对本发明进行了详细的说明，本领域的普通技术人员应当理解：其依然可以对前述各实施例所记载的技术方案进行修改，或者对其中部分或者全部技术特征进行等同替换；而这些修改或者替换，并不使相应技术方案的本质脱离本发明各实施例技术方案的范围。

Claims (8)

1.一种模块承载托盘，其特征在于，包括底座和四个支撑销，所述四个支撑销可拆卸固定在底座上，所述四个支撑销分别与模块底板上的安装孔相对应，所述支撑销远离底座的一端为锥台，所述锥台的顶端的外径小于安装孔的内径，所述锥台底端的外径大于安装孔的内径。
2.根据权利要求1所述模块承载托盘，其特征在于，所述支撑销采用塑料或橡胶制备。
3.根据权利要求1所述模块承载托盘，其特征在于，所述底座采用金属材料制备。
4.根据权利要求1所述模块承载托盘，其特征在于，所述底座为矩形底座。
5.根据权利要求4所述模块承载托盘，其特征在于，所述矩形底座的四边中至少有一边向支撑销所在一侧弯折。
6.根据权利要求5所述模块承载托盘，其特征在于，所述矩形底座的两个相对边向支撑销所在一侧弯折。
7.根据权利要求1所述模块承载托盘，其特征在于，所述支撑销通过螺纹连接固定在底座上。
8.IGBT模块的封装方法，其特征在于，包括：将IGBT模块置于权利要求1-7任意一项所述模块承载托盘上，所述IGBT模块底板上的安装孔分别与四个支撑销相对应。
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Cited By (1)

* Cited by examiner, † Cited by third party
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CN105280537A (zh) * 2014-07-14 2016-01-27 西安永电电气有限责任公司 一种定位装置

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CN201414257Y (zh) * 2009-05-26 2010-02-24 昆山市华涛电子有限公司 电路板双面印刷治具
CN102246048A (zh) * 2008-12-11 2011-11-16 贝克曼考尔特公司 支架托盘、支架和支架传送系统

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CN2092849U (zh) * 1991-03-25 1992-01-08 胡祝欣 电路板双面印刷架板
CN2134031Y (zh) * 1992-09-14 1993-05-19 胡祝欣 电路板双面印刷治具
CN1234005A (zh) * 1996-10-21 1999-11-03 小詹姆斯·F·布伦南 可堆叠托盘
CN1527109A (zh) * 2003-03-06 2004-09-08 友达光电股份有限公司 液晶面板托盘
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CN101646912A (zh) * 2007-01-05 2010-02-10 Lg电子株式会社 冰箱
CN102246048A (zh) * 2008-12-11 2011-11-16 贝克曼考尔特公司 支架托盘、支架和支架传送系统
TWM368897U (en) * 2009-05-14 2009-11-11 Phoenix Prec Technology Corp Conducting jig for clipping circuit board
CN201414257Y (zh) * 2009-05-26 2010-02-24 昆山市华涛电子有限公司 电路板双面印刷治具

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN105280537A (zh) * 2014-07-14 2016-01-27 西安永电电气有限责任公司 一种定位装置

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Application publication date: 20140122