CN103527952A - LED lighting device - Google Patents

LED lighting device Download PDF

Info

Publication number
CN103527952A
CN103527952A CN201310487808.2A CN201310487808A CN103527952A CN 103527952 A CN103527952 A CN 103527952A CN 201310487808 A CN201310487808 A CN 201310487808A CN 103527952 A CN103527952 A CN 103527952A
Authority
CN
China
Prior art keywords
led
liquid cooling
substrate
heat
wiring board
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
CN201310487808.2A
Other languages
Chinese (zh)
Other versions
CN103527952B (en
Inventor
梁光勇
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Individual
Original Assignee
Individual
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Individual filed Critical Individual
Priority to CN201310487808.2A priority Critical patent/CN103527952B/en
Publication of CN103527952A publication Critical patent/CN103527952A/en
Application granted granted Critical
Publication of CN103527952B publication Critical patent/CN103527952B/en
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Images

Landscapes

  • Led Device Packages (AREA)
  • Illuminated Signs And Luminous Advertising (AREA)

Abstract

The invention provides an LED lighting device. An S-shaped liquid cooling pipe is arranged on the back of a substrate. A hexagon-shaped LED lamp is correspondingly arranged on the front of the substrate. By means of heat conduction of a middle substrate and the S-shaped liquid cooling pipe, heat generated when the LED lamp emits light is transmitted to a thermoelectric converter in time to be converted into electric energy. Meanwhile, when the LED lamp emits light, partial light rays which are emitted to the two sides and the rear correspondingly illuminate on a photoelectric converter on the inner side of a photoelectric protection sleeve so that the lost part of light energy is converted into electric energy which is converged to a circuit board together with the electric energy generated through thermal conversion. Afterwards, electric energy can drive the LED lamp to emit light is generated after circuit processing by the circuit board. According to the LED lighting device, lost light energy and heat energy when the LED emits light are converted into electric energy which can be used again. Thus, the luminous efficacy of the LED and the radiating effect of light emitting of the LED are radically improved, consumption of light in the lighting process of the LED is reduced and waste of emitted light is reduced.

Description

A kind of LED lighting device
Technical field
The present invention relates to LED lighting technical field, what be specifically related to is the LED lighting device of a kind of high light efficiency, high-cooling property.
Background technology
Due to LED have long service life, energy consumption low, save the features such as the energy, therefore, LED is widely used in daily life as light source.
For existing LED light efficiency level, owing to inputting 80% left and right of electric energy, be transformed into heat, and in order to guarantee the normal operation of LED, must, by this part dissipation of heat in air, have therefore caused the significant wastage of energy.
In addition, current LED in use, the loss that the photon that radiation recombination produces can produce light when outwards launching, its a part of light cannot shine outside from chip, although some emergent ray can penetrate, but it is radiated at light fixture two side areas substantially, can not shine the required field of illumination that obtains according to lighting demand.
Summary of the invention
For this reason, the object of the present invention is to provide a kind of LED lighting device of high light efficiency, to solve existing LED, throw light on that existing light efficiency is not high, radiating effect is poor and emergent light is wasted serious problem.
The object of the invention is to be achieved through the following technical solutions.
A lighting device, comprising:
One base (100), in described base (100), be installed with a wiring board (101) and two liquid cooling circulating pumps (102) that are connected with wiring board (101), described base (100) upper surface is provided with a holddown groove (103), this holddown groove (103) both sides are respectively arranged with negative input (104) and electrode input end (105), and described negative input (104) is connected with wiring board (101) respectively with electrode input end (105);
One holder (500), correspondence is fixed in described holddown groove (103), is provided with six pairs of electrode holes (501) and six pairs of liquid cooling pores (502) on described holder (500); And in described holder (500), be provided with liquid cooling heat-exchange tube (503), described liquid cooling heat-exchange tube (503) is connected with described liquid cooling circulating pump (102);
One thermoelectricity change-over panel (600), be arranged on described holder (500), the alkali metal thermo-electric converter being connected with described wiring board (101) is installed in described thermoelectricity change-over panel (600), and the liquid cooling heat-exchange tube (503) in described alkali metal thermo-electric converter and described holder (500) is adjoining, for obtaining the heat from liquid cooling heat-exchange tube (503);
One photoelectric protection cover (200), be fixedly mounted on described holder (500), described photoelectric protection cover (200) madial wall is provided with photoelectric conversion plate, and in the both sides of described photoelectric protection cover (200), be respectively arranged with a cathode output end (201) and a cathode output end (202), described photoelectric conversion plate is connected with electrode input end (105) with negative input (104) by cathode output end (201) and cathode output end (202) are corresponding;
One luminous lens (300), described luminous lens (300) upper end is hemisphere, lower end is the back taper platform connecting as one with hemisphere, and the bottom of described back taper platform is provided with a cylindrical groove (301);
One printing opacity sleeve (400), identical with photoelectric protection cover (200) size shape, and bottom is connected with the upper end of photoelectric protection cover (200), and form a sleeve, and its correspondence is fixed in described cylindrical groove (301);
One column cylinder (700), be positioned at the sleeve that photoelectric protection cover (200) and printing opacity sleeve (400) form, described column cylinder (700) is cylindrical ceramic sleeve pipe, its inner hollow, exterior lateral sides correspondence is installed with six by the substrate (800) of column cylinder (700) lateral surface decile, described substrate (800) is aluminium base, and it is positioned at photoelectric protection cover (200) between column cylinder (700);
The adjacent side in described substrate (800) and column cylinder (700) outside is provided with continuous S shape liquid cooling pipe (801), the cooling fluid entrance (802) of described S shape liquid cooling pipe (801) with cooling liquid outlet (803) respectively by the electrode hole (501) on holder (500) and corresponding connection of described liquid cooling heat-exchange tube (503), the opposite side correspondence of substrate (800) is provided with a plurality of hexagon LED lamps (900), described hexagon LED lamp (900) consists of six single LEDs that are positioned at hexagon summit, described single LEDs comprises garment bag (901), be arranged on heat sink (902) in garment bag (901) and be fixed on the package lens (907) on garment bag (901), described heat sink (902) bottom is bonded on substrate (800) by adhesive glue (903), upper surface has LED chip (905) by elargol (904) fixed bonding, on described LED chip (905), be coated with fluorescent material (909), described LED chip (905), between fluorescent material (909) and heat sink (902) and package lens (907), by casting glue (906), seal, described LED chip (905) comprises to be supported substrate (9051) and is positioned at the passivation layer (9055) of supporting on substrate (9051), and described support substrate (9051) bottom is provided with N electrode (9056), in described passivation layer (9055), be provided with P metal level (9052) and N metal level (9053), on described P metal level (9052), be provided with LED film (9054), on described LED film (9054), be provided with electrode (9057),
Wherein when hexagon LED lamp (900) is luminous, the corresponding liquid cooling circulating pump (102) of controlling of wiring board (101) starts, the corresponding S shape liquid cooling pipe (801) by substrate (800) back side of heat of the luminous generation of hexagon LED lamp (900) carries out circulating cooling, and from cooling liquid outlet (803), the cooling fluid that carries heat is sent to liquid cooling heat-exchange tube (503), and convert heat to electric energy with the adjoining thermoelectricity change-over panel (600) of liquid cooling heat-exchange tube (503), and correspondence is input in wiring board (101); The light of the luminous generation of hexagon LED lamp (900) part is penetrated by luminous lens (300) by after printing opacity sleeve (400) simultaneously; another part is the photoelectric conversion plate of directive photoelectric protection cover (200) madial wall; through described photoelectric conversion plate, convert electric energy to; and correspondence is input in wiring board (101); wiring board (101) is after processing from the electric energy of described photoelectric conversion plate and thermoelectricity change-over panel (600), then exports to hexagon LED lamp (900) power supply.
Preferably, described casting glue (906) is silica gel.
Preferably, described LED chip (905) connects outer electrode by gold thread (908), and described outer electrode is connected with wiring board (101) through described electrode hole (501).
Preferably, on described substrate (800) madial wall, be provided with pipe-line tank, the corresponding fixedly holding of described S shape liquid cooling pipe (801) is in described pipe-line tank.
Preferably, described column cylinder (700) is hexagon cylinder.
Preferably, the length of described substrate (800) equates with the length sum of photoelectric protection cover (200) and printing opacity sleeve (400).
The present invention compared with prior art, beneficial effect is: LED lighting device provided by the invention, at substrate back, be provided with S shape liquid cooling pipe, substrate front side correspondence is provided with hexagon LED lamp, heat by Intermediate substrate and S shape liquid cooling pipe is conducted, heat when LED lamp is luminous is transmitted to thermoelectric converter in time, converts electric energy to; And when simultaneously LED lamp is luminous part to both sides or the light correspondence of rear outgoing be irradiated to the optical-electrical converter of photoelectric protection cover inner side; the part transform light energy of loss is become to electric energy; be pooled to wiring board with the electric energy of heat conversion; through the processing of circuit of wiring board, formation can the luminous electric energy of driving LED lamp.The present invention becomes the luminous energy of loss in LED luminescence process the electric energy that can be reused by it with thermal power transfer, fundamentally improved light efficiency and the luminous radiating effect of LED of LED, has reduced the loss of light in LED lighting process, has avoided the waste of emergent light.
Accompanying drawing explanation
Fig. 1 is the perspective view of LED lighting device of the present invention;
Fig. 2 is the package assembly schematic diagram of LED lighting device of the present invention;
Fig. 3 is the inside structure schematic diagram of substrate in LED lighting device of the present invention;
Fig. 4 is the outboard structure schematic diagram of substrate in LED lighting device of the present invention;
Fig. 5 is the internal structure schematic diagram of holder in LED lighting device of the present invention;
Fig. 6 is the structural representation of hexagon edge LED of the present invention;
Fig. 7 is the structural representation of LED chip of the present invention.
Identifier declaration in figure: base 100, wiring board 101, liquid cooling circulating pump 102, holddown groove 103, negative input 104, electrode input end 105, photoelectric protection cover 200, cathode output end 201, cathode output end 202, luminous lens 300, cylindrical groove 301, printing opacity sleeve 400, holder 500, electrode hole 501, liquid cooling pore 502, liquid cooling heat-exchange tube 503, thermoelectricity change-over panel 600, column cylinder 700, substrate 800, S shape liquid cooling pipe 801, cooling fluid entrance 802, cooling liquid outlet 803, hexagon LED lamp 900, garment bag 901, heat sink 902, adhesive glue 903, elargol 904, LED chip 905, support substrate 9051, P metal level 9052, N metal level 9053, LED film 9054, passivation layer 9055, N electrode 9056, electrode 9057, casting glue 906, package lens 907, gold thread 908, fluorescent material 909.
The specific embodiment
In order to make object of the present invention, technical scheme and advantage clearer, below in conjunction with drawings and Examples, the present invention is further elaborated.Should be appreciated that specific embodiment described herein, only in order to explain the present invention, is not intended to limit the present invention.
Refer to shown in Fig. 1 to 7, the present invention is to provide a kind of LED lighting device, it is mainly used in solving, and in current LED illumination, existing light efficiency is not high, radiating effect is poor and emergent light is wasted serious problem.
Wherein the present invention includes: base 100, photoelectric protection cover 200, luminous lens 300 and printing opacity sleeve 400, holder 500, thermoelectricity change-over panel 600, column cylinder 700 and substrate 800.
Base 100 is for connecting the part of external power source, in it, be installed with a wiring board 101 and two liquid cooling circulating pumps 102 that are connected with wiring board 101, by wiring board 101, the alternating current of outside input can be converted to the direct current of the luminous use of capable for LED, the corresponding circuit that can carry out opto-electronic conversion and thermoelectricity conversion that is provided with on wiring board 101 simultaneously, realizing heat energy, transform light energy becomes electric energy.
In the upper surface center of base 100, be provided with a holddown groove 103, one of this holddown groove 103 picks up the ears to be provided with a negative input 104, opposite side is provided with an electrode input end 105, and described negative input 104 is connected with wiring board 101 respectively with electrode input end 105.
In holddown groove 103, be installed with a holder 500, described holder 500 inside are provided with liquid cooling heat-exchange tube 503, and described liquid cooling heat-exchange tube 503 is connected (seeing Fig. 5) with described liquid cooling circulating pump 102; At holder 500 upper surfaces, near excircle place, be respectively arranged with six pairs of electrode holes 501 and six pairs of liquid cooling pores 502; And six pairs of described electrode holes 501 and six pairs of liquid cooling pores 502, by the upper surface circumference equal dividing of holder 500, have a pair of liquid cooling pore 502 at every pair of electrode hole 501 places.
Holder 500 tops are provided with a thermoelectricity change-over panel 600, the alkali metal thermo-electric converter being connected with described wiring board 101 is installed in described thermoelectricity change-over panel 600, and the liquid cooling heat-exchange tube in described alkali metal thermo-electric converter and described holder 500 503 is close or adjoining, for obtaining the heat from liquid cooling heat-exchange tube 503.Alkali metal thermo-electric converter is a kind of area-type power generating device, and its movement-less part, noiseless, Maintenance free, can meet the requirement of different capabilities load, and conversion efficiency of thermoelectric can surpass 30%.Same, the alkali metal thermo-electric converter here also can replace with thermocouple, and thermocouple is a kind of temperature-sensing element, can directly measure temperature, and temperature signal is converted to thermo-electromotive force signal, converts the temperature of measured medium by electric meter to.
Thermoelectricity change-over panel 600 tops are provided with a column cylinder 700; in the outside of this column cylinder 700, corresponding cover has photoelectric protection cover 200 and printing opacity sleeve 400; described photoelectric protection cover 200 is identical with printing opacity sleeve 400 shape sizes; and the two correspondence connects into a sleeve, correspondingly between column cylinder 700 and photoelectric protection cover 200 and printing opacity sleeve 400 be provided with six substrates 800.
Above printing opacity sleeve 400, also has a luminous lens 300, the upper end of described luminous lens 300 is hemisphere, lower end is back taper platform, and the face that described back taper platform is larger is connected with hemisphere, make the two form an integral body, and in the bottom of described back taper platform, be also provided with a cylindrical groove 301 (seeing Fig. 2); Printing opacity sleeve 400 correspondences are arranged in described cylindrical groove 301, and correspondingly the part substrate 800 between printing opacity sleeve 400 and column cylinder 700 is also arranged in cylindrical groove 301, as illuminating source.
Wherein the madial wall of photoelectric protection cover 200 is provided with photoelectric conversion plate, and the side at described photoelectric protection cover 200 is provided with a cathode output end 201, opposite side is provided with a cathode output end 202, described photoelectric conversion plate is connected with negative input 104 by cathode output end 201, by cathode output end 202 is corresponding, is connected with electrode input end 105; Thereby realizing photoelectric conversion plate is connected with wiring board 101.
Substrate 800 is aluminium base, and it comprises the front in outside and the back side of inner side, and wherein the back side is the one side towards column cylinder 700, and front is the one side towards photoelectric protection cover 200 or printing opacity sleeve 400 madial walls.The back side of substrate 800 is provided with continuous S shape liquid cooling pipe 801, the cooling fluid entrance 802 of described S shape liquid cooling pipe 801 with cooling liquid outlet 803 respectively by the electrode hole 501 on holder 500 and described corresponding connection of liquid cooling heat-exchange tube 503 (seeing Fig. 3); The front correspondence of substrate 800 is provided with a plurality of hexagon LED lamps 900 (seeing Fig. 4), and described hexagon LED lamp 900 is to consist of six single LEDs that are positioned at hexagon summit.
The present invention adopts hexagon LED lamp 900 can make the quantity of single LEDs on each light source maximum, in the hexagon LED lamp that this arrangement mode is produced, the quantity of single LEDs is more 15% than the quadrangle of same size or leg-of-mutton quantity, and the bundle section that produces of this mode LED lamp approaches the circular tangent plane of the circular eyeglass using in optical design very much.
As shown in Figure 6, above-mentioned single LEDs includes garment bag 901, is arranged on heat sink 902 in garment bag 901 and is fixed on the package lens 907 on garment bag 901, described heat sink 902 bottoms are bonded on substrate 800 by adhesive glue 903, upper surface has LED chip 905 by elargol 904 fixed bondings, described LED chip 905 is connected to outer electrode by gold thread 908, and described outer electrode is connected with wiring board 101 through described electrode hole 501.
On LED chip 905, be coated with fluorescent material 909, described LED chip 905, fluorescent material 909 and heat sink 902 and package lens 907 between by casting glue 906, seal.In LED use procedure, the photon that radiation recombination produces produces loss when outwards launching, and therefore, a lot of light cannot shine outside from chip.The present invention, by applying the relatively high substratum transparent (casting glue 906) of one deck refractive index on LED chip 905 surfaces, because this glue-line is between chip and air, thereby has effectively reduced the loss of photon at interface, has improved and has got optical efficiency.In addition, the effect of casting glue 906 also comprises carries out mechanical protection to chip, Stress Release, and as a kind of guide structure.Therefore, require its light transmittance high, refractive index is high, Heat stability is good, and good fluidity, is easy to spraying.For improving the reliability of LED encapsulation, also require casting glue to there is agent of low hygroscopicity, low stress, the characteristic such as ageing-resistant.Conventional casting glue comprises epoxy resin and silica gel at present.And silica gel is high owing to having light transmittance, refractive index is large, Heat stability is good, and the feature such as stress is little, and hygroscopicity is low, is obviously better than epoxy resin, so the casting glue 906 adopting in the present invention is silica gel.
LED chip 905 of the present invention comprises to be supported substrate 9051 and is positioned at the passivation layer 9055 of supporting on substrate 9051, and described support substrate 9051 bottoms are provided with N electrode 9056; In described passivation layer 9055, be provided with P metal level 9052 and N metal level 9053, on described P metal level 9052, be provided with LED film 9054, on described LED film 9054, be provided with electrode 9057 (seeing Fig. 7).The p-type limiting layer that this LED chip structure of the present invention has been peeled off the LED film of growth substrates is bonded on metal level and (is called p metal level), N-shaped limiting layer is electrically connected to another metal level (being called n metal level) by electrode, p metal level and n metal level are by supporting through hole in substrate to be electrically connected to supporting metal level (being called p electrode and the n electrode) formation on the another side of substrate, become SMD device, when adopting heat radiation to support substrate preferably, can effectively solve the heat radiation of chip and encapsulation.
Operation principle of the present invention is: when hexagon LED lamp 900 is luminous, the corresponding liquid cooling circulating pump 102 of controlling of wiring board 101 starts, the heat correspondence of hexagon LED lamp 900 luminous generations is carried out circulating cooling by the S shape liquid cooling pipe 801 at substrate 800 back sides, and from cooling liquid outlet 803, the cooling fluid that carries heat is sent to liquid cooling heat-exchange tube 503, and convert heat to electric energy with the adjoining thermoelectricity change-over panel 600 of liquid cooling heat-exchange tube 503, and correspondence is input in wiring board 101; A light part for simultaneously hexagon LED lamp 900 luminous generations is penetrated by luminous lens 300 after by printing opacity sleeve 400; another part directive photoelectric protection overlaps the photoelectric conversion plate of 200 madial walls; through described photoelectric conversion plate, convert electric energy to; and correspondence is input in wiring board 101; wiring board 101 is after processing from the electric energy of described photoelectric conversion plate and thermoelectricity change-over panel 600, then exports to 900 power supplies of hexagon LED lamp.
In sum, the present invention is conducted by the heat of Intermediate substrate and S shape liquid cooling pipe, and heat when LED lamp is luminous is transmitted to thermoelectric converter in time, converts electric energy to; And when simultaneously LED lamp is luminous part to both sides or the light correspondence of rear outgoing be irradiated to the optical-electrical converter of photoelectric protection cover inner side; the part transform light energy of loss is become to electric energy; be pooled to wiring board with the electric energy of heat conversion; through the processing of circuit of wiring board, formation can the luminous electric energy of driving LED lamp.The present invention has reduced the loss of the energy as much as possible, makes the conversion that circulates between heat energy, luminous energy and electric energy of the energy of the luminous generation of LED, effectively reduces the loss of the energy in whole process, has greatly improved light efficiency.
The foregoing is only preferred embodiment of the present invention, not in order to limit the present invention, all any modifications of doing within the spirit and principles in the present invention, be equal to and replace and improvement etc., within all should being included in protection scope of the present invention.

Claims (6)

1. a LED lighting device, is characterized in that, comprising:
One base (100), in described base (100), be installed with a wiring board (101) and two liquid cooling circulating pumps (102) that are connected with wiring board (101), described base (100) upper surface is provided with a holddown groove (103), this holddown groove (103) both sides are respectively arranged with negative input (104) and electrode input end (105), and described negative input (104) is connected with wiring board (101) respectively with electrode input end (105);
One holder (500), correspondence is fixed in described holddown groove (103), is provided with six pairs of electrode holes (501) and six pairs of liquid cooling pores (502) on described holder (500); And in described holder (500), be provided with liquid cooling heat-exchange tube (503), described liquid cooling heat-exchange tube (503) is connected with described liquid cooling circulating pump (102);
One thermoelectricity change-over panel (600), be arranged on described holder (500), the alkali metal thermo-electric converter being connected with described wiring board (101) is installed in described thermoelectricity change-over panel (600), and the liquid cooling heat-exchange tube (503) in described alkali metal thermo-electric converter and described holder (500) is adjoining, for obtaining the heat from liquid cooling heat-exchange tube (503);
One photoelectric protection cover (200), be fixedly mounted on described holder (500), described photoelectric protection cover (200) madial wall is provided with photoelectric conversion plate, and in the both sides of described photoelectric protection cover (200), be respectively arranged with a cathode output end (201) and a cathode output end (202), described photoelectric conversion plate is connected with electrode input end (105) with negative input (104) by cathode output end (201) and cathode output end (202) are corresponding;
One luminous lens (300), described luminous lens (300) upper end is hemisphere, lower end is the back taper platform connecting as one with hemisphere, and the bottom of described back taper platform is provided with a cylindrical groove (301);
One printing opacity sleeve (400), identical with photoelectric protection cover (200) size shape, and bottom is connected with the upper end of photoelectric protection cover (200), and form a sleeve, and its correspondence is fixed in described cylindrical groove (301);
One column cylinder (700), be positioned at the sleeve that photoelectric protection cover (200) and printing opacity sleeve (400) form, described column cylinder (700) is cylindrical ceramic sleeve pipe, its inner hollow, exterior lateral sides correspondence is installed with six by the substrate (800) of column cylinder (700) lateral surface decile, described substrate (800) is aluminium base, and it is positioned at photoelectric protection cover (200) between column cylinder (700);
The adjacent side in described substrate (800) and column cylinder (700) outside is provided with continuous S shape liquid cooling pipe (801), the cooling fluid entrance (802) of described S shape liquid cooling pipe (801) with cooling liquid outlet (803) respectively by the electrode hole (501) on holder (500) and corresponding connection of described liquid cooling heat-exchange tube (503), the opposite side correspondence of substrate (800) is provided with a plurality of hexagon LED lamps (900), described hexagon LED lamp (900) consists of six single LEDs that are positioned at hexagon summit, described single LEDs comprises garment bag (901), be arranged on heat sink (902) in garment bag (901) and be fixed on the package lens (907) on garment bag (901), described heat sink (902) bottom is bonded on substrate (800) by adhesive glue (903), upper surface has LED chip (905) by elargol (904) fixed bonding, on described LED chip (905), be coated with fluorescent material (909), described LED chip (905), between fluorescent material (909) and heat sink (902) and package lens (907), by casting glue (906), seal, described LED chip (905) comprises to be supported substrate (9051) and is positioned at the passivation layer (9055) of supporting on substrate (9051), and described support substrate (9051) bottom is provided with N electrode (9056), in described passivation layer (9055), be provided with P metal level (9052) and N metal level (9053), on described P metal level (9052), be provided with LED film (9054), on described LED film (9054), be provided with electrode (9057),
Wherein when hexagon LED lamp (900) is luminous, the corresponding liquid cooling circulating pump (102) of controlling of wiring board (101) starts, the corresponding S shape liquid cooling pipe (801) by substrate (800) back side of heat of the luminous generation of hexagon LED lamp (900) carries out circulating cooling, and from cooling liquid outlet (803), the cooling fluid that carries heat is sent to liquid cooling heat-exchange tube (503), and convert heat to electric energy with the adjoining thermoelectricity change-over panel (600) of liquid cooling heat-exchange tube (503), and correspondence is input in wiring board (101); The light of the luminous generation of hexagon LED lamp (900) part is penetrated by luminous lens (300) by after printing opacity sleeve (400) simultaneously; another part is the photoelectric conversion plate of directive photoelectric protection cover (200) madial wall; through described photoelectric conversion plate, convert electric energy to; and correspondence is input in wiring board (101); wiring board (101) is after processing from the electric energy of described photoelectric conversion plate and thermoelectricity change-over panel (600), then exports to hexagon LED lamp (900) power supply.
2. LED lighting device according to claim 1, is characterized in that, described casting glue (906) is silica gel.
3. LED lighting device according to claim 1, is characterized in that, described LED chip (905) connects outer electrode by gold thread (908), and described outer electrode is connected with wiring board (101) through described electrode hole (501).
4. LED lighting device according to claim 1, is characterized in that, on described substrate (800) madial wall, is provided with pipe-line tank, and the corresponding fixedly holding of described S shape liquid cooling pipe (801) is in described pipe-line tank.
5. LED lighting device according to claim 1, is characterized in that, described column cylinder (700) is hexagon cylinder.
6. LED lighting device according to claim 1, is characterized in that, the length of described substrate (800) equates with the length sum of photoelectric protection cover (200) and printing opacity sleeve (400).
CN201310487808.2A 2013-10-15 2013-10-15 A kind of LED light device Expired - Fee Related CN103527952B (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN201310487808.2A CN103527952B (en) 2013-10-15 2013-10-15 A kind of LED light device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN201310487808.2A CN103527952B (en) 2013-10-15 2013-10-15 A kind of LED light device

Publications (2)

Publication Number Publication Date
CN103527952A true CN103527952A (en) 2014-01-22
CN103527952B CN103527952B (en) 2015-09-16

Family

ID=49930182

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201310487808.2A Expired - Fee Related CN103527952B (en) 2013-10-15 2013-10-15 A kind of LED light device

Country Status (1)

Country Link
CN (1) CN103527952B (en)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN106152025A (en) * 2015-04-09 2016-11-23 王喻楠 Lamp bar and the illuminator of application thereof
CN107644868A (en) * 2016-07-20 2018-01-30 美科米尚技术有限公司 Light emitting diode illuminating apparatus
CN110486632A (en) * 2019-09-12 2019-11-22 重庆市润金新材料科技有限公司 A kind of high-powered LED lamp

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101089458A (en) * 2006-06-15 2007-12-19 雅马哈株式会社 Illumination system
CN101936495A (en) * 2009-07-01 2011-01-05 厦门兴恒隆照明科技有限公司 Device for actively cooling LED (light emitting diode) and recycling waste heat
CN202580659U (en) * 2012-03-31 2012-12-05 宁波万仕星户外用品有限公司 Warning light

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101089458A (en) * 2006-06-15 2007-12-19 雅马哈株式会社 Illumination system
JP2007335258A (en) * 2006-06-15 2007-12-27 Yamaha Corp Lighting system
CN101936495A (en) * 2009-07-01 2011-01-05 厦门兴恒隆照明科技有限公司 Device for actively cooling LED (light emitting diode) and recycling waste heat
CN202580659U (en) * 2012-03-31 2012-12-05 宁波万仕星户外用品有限公司 Warning light

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN106152025A (en) * 2015-04-09 2016-11-23 王喻楠 Lamp bar and the illuminator of application thereof
CN107644868A (en) * 2016-07-20 2018-01-30 美科米尚技术有限公司 Light emitting diode illuminating apparatus
CN110486632A (en) * 2019-09-12 2019-11-22 重庆市润金新材料科技有限公司 A kind of high-powered LED lamp
CN110486632B (en) * 2019-09-12 2020-09-15 重庆市润金新材料科技有限公司 High-power LED lamp

Also Published As

Publication number Publication date
CN103527952B (en) 2015-09-16

Similar Documents

Publication Publication Date Title
CN201078687Y (en) LED illumination device
US9028082B2 (en) Light source module and illumination apparatus having the same
US20130107523A1 (en) Light Source Device
KR20110002791A (en) Illumination device
CN104534421A (en) LED light source module with highlight power density
CN103527952B (en) A kind of LED light device
US20140210333A1 (en) Lighting device
CN201348212Y (en) LED lighting tube
TWI575784B (en) Opto-mechanical module
CN206943847U (en) A kind of LED that can quickly assemble
CN204240087U (en) Lamp and lighting device
CN101988625A (en) Novel LED (Light-Emitting Diode) miner lamp
CN204102898U (en) All-round smooth LED light source
CN207868228U (en) A kind of LED excitations fluorescent liquid light-emitting device
CN105444036B (en) Light-emitting diode (LED) light source light-emitting and heat-dissipating structure
CN209869680U (en) Optical mechanism
Chan Electronic packaging for solid-state lighting
TWM448063U (en) Light emitting apparatus
CN212510800U (en) High-efficiency energy-saving LED down lamp
CN215184032U (en) Multilayer gradient LED packaging structure of nano epoxy composite material
CN213878089U (en) LED encapsulation module of convenient equipment
TWI413742B (en) With the promotion of luminous and thermal efficiency of the light-emitting diode structure and its LED lamps
CN204693325U (en) A kind of reflector for light emitting diode module
CN207800641U (en) A kind of fluorescent powder paint-on technique white-light LED encapsulation light source
CN219180534U (en) Semiconductor assembly with transparent base

Legal Events

Date Code Title Description
C06 Publication
PB01 Publication
C10 Entry into substantive examination
SE01 Entry into force of request for substantive examination
C14 Grant of patent or utility model
GR01 Patent grant
CF01 Termination of patent right due to non-payment of annual fee

Granted publication date: 20150916

Termination date: 20161015

CF01 Termination of patent right due to non-payment of annual fee