CN103525086A - High-heat-resistance low-rigidity flame-retardant resin and compositions thereof - Google Patents
High-heat-resistance low-rigidity flame-retardant resin and compositions thereof Download PDFInfo
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- CN103525086A CN103525086A CN201210230506.2A CN201210230506A CN103525086A CN 103525086 A CN103525086 A CN 103525086A CN 201210230506 A CN201210230506 A CN 201210230506A CN 103525086 A CN103525086 A CN 103525086A
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- C08L79/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing nitrogen with or without oxygen or carbon only, not provided for in groups C08L61/00 - C08L77/00
- C08L79/04—Polycondensates having nitrogen-containing heterocyclic rings in the main chain; Polyhydrazides; Polyamide acids or similar polyimide precursors
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Abstract
The invention relates to a high-heat-resistance low-rigidity flame-retardant resin and compositions thereof. The resin mainly comprises a thermosetting resin, a chain extension agent and a softening agent, wherein the thermosetting resin accounts for 70-92wt% of the overall composition formula; the chain extension agent accounts for 3-20wt% of the overall composition formula; and the softening agent accounts for 5-10wt% of the overall composition formula. A composition composed of 35-50wt% of the resin and 50-65wt% of heat-conducting powder has the characteristics of high heat conductivity, high heat resistance, low rigidity and flame retardancy. Another composition composed of 60-95wt% of the resin and 5-40wt% of multifunctional polyester has the characteristics of low dielectric constant, high heat resistance, low rigidity and flame retardancy.
Description
Technical field
The present invention relates to a kind of height heat-resisting (High heat resistance), low rigidity (Low elastic modulus) resin and composition thereof with flame retardancy, espespecially a kind of can be as dielectric insulation material, it has the advantages such as high glass-transition temperature, high heat resistance, low rigidity and difficult combustion characteristic, is applicable to being applied to soft and rigid circuit card, Rigid Flex, high heat conduction and heat radiation substrate, increases a layer adhesive for additional, the high speed transmission of signals material that applies to high in the clouds computing, IC encapsulation, LCD encapsulation and LED encapsulation etc.
Background technology
In recent years, along with the trend development of electronics and IT products toward light, thin, short, little, high function, high-density, 3D structure, high reliability and high-speedization, use and the demand of soft or hard plywood correlation technique material are also more and more obvious.
Now, rigid-flex (Rigid-Flex Printed Board or title F/R PWB, soft or hard plywood), soft board and hardboard to be combined into the electronic component of identical product, but the characteristic because of rigid-flex, it is fit structure demand and designing, therefore there is no fixing Design Mode or product design, the classification of rigid-flex making processes, if classify according to making processes, the mode that soft board engages with hardboard, can divide into soft-hard composite board and the large series products of Rigid Flex two, difference is the technology of soft-hard composite board, can be by soft board and hardboard combination in making processes, wherein, there are common blind hole and buried via hole design, therefore can there is more highdensity circuit layout, and the technology of Rigid Flex, to go and be pressed into single circuit card again after soft board and hardboard are separately made, there is signal to connect but without the design of communicating pores.But habitual at present " rigid-flex " be referred to as whole rigid-flex products, and do not segment both.Rigid-flex is on material, equipment and processing procedure, and each is variant with original soft board, hardboard.Aspect material, the material of hardboard is mainly to take FR4 as large, and the material of soft board is mainly to take PI as material, has the not equal technical difficulties of joint, hot pressing shrinking percentage between two materials, causes the stability of product and reliability not good.And rigid-flex is because the characteristic of solid space configuration, consideration except XY axial plane direction stress, it is also important consideration that Z-direction stress bears, there is at present material supplier to PCB hardboard or soft board manufacturer, provide rigid-flex applicable modified form material, as materials such as epoxy resin (Epoxy) or modified form resins (Resin), to meet the engagement problems between PCB hardboard or soft board, in addition in conjunction with the selection of film (No-flow or Very-low-flow Prepreg) and anti-solder ink (Flexible S/M), be also one of R/F plate key of successfully making.Aspect equipment, rigid-flex is because the difference of material behavior and product specification, equipment in pressing and copper facing part must is revised, and the how appropriate of equipment will affect product yield and stability, so strides into the how appropriate that must first consider equipment before the production of rigid-flex.
Yet the soft board of Taiwan or the copper clad laminate (Copper Clad Laminate) that hardboard factory is used in conjunction with printed circuit board (PCB) processing procedure in soft or hard, almost used former printed circuit board (PCB) processing procedure copper clad laminate used at present.Therefore the pressure that, domestic production soft or hard is low in conjunction with the yield of printed circuit board (PCB), reliability is not good, cost is high and the product friendship phase is long.In addition, use novel material in soft or hard during in conjunction with printed circuit board (PCB) processing procedure, produce that the synthetic exploitation difficulty of novel material, material evaluation are difficult for, UL-94 checking is long, novel material adapts to not good and delamination for soft or hard in conjunction with printed circuit board (PCB) processing procedure.Therefore, domestic PC B industry is badly in need of supply and the service of rigid-flex connecting material in reinforcement supply chain.
Use on the market at present rigid-flex material, the material of hardboard is mainly to take FR4 as large, and the material of soft board is mainly to take PI as material, has the not equal technical difficulties of joint, hot pressing shrinking percentage between two materials, easily causes the stability of product and reliability not good.In order to increase stability and the reliability of product, Hitachi Chemical develops take epoxy resin as basis collocation upgrading polyamidoimide (PAI), making has the thermosetting resin material of low rigidity and makes PP prepreg or RCC, utilize this prepreg and Copper Foil to make hardboard, and coordinate the RCC of made to increase layer, not only can possess the basic function of rigid-flex originally, more the thickness of script rigid-flex can be reduced, and because there is no rigid-flex storeroom engagement problems, can increase stability and the reliability of product.Only, because take epoxy resin as basis, therefore need reach difficult combustion requirement with brominated epoxy resin or with phosphide upgrading epoxy resin collocation inorganic powder, when using brominated epoxy resin, cannot meet the trend of current environment-friendly materials; And when using phosphide upgrading epoxy resin collocation inorganic powder, phosphorus compound is compared to bromine compounds, its less stable, and phosphorus flame retardant easily hydrolysis cause rivers and creeks or lake oxygen enrichment, the following final another kind of environmental hazard problem that still may derive while processing phosphorous waste.
Summary of the invention
The technical problem to be solved in the present invention is to provide a kind of have high glass-transition temperature, high heat-resisting, low rigidity and difficult combustion characteristic resin and composition thereof.Meanwhile, this resin combination has the characteristics such as high thermal conduction characteristic and low dielectric constant.
For reaching above-mentioned purpose, a kind of high heat-resisting, low rigidity of the present invention, nonflammable resin and composition thereof, this resin mainly comprises a thermosetting resin, a chain extension agent and a softening agent, wherein this thermosetting resin has accounted for 70 ~ 92wt% in total compositing formula, this chain extension agent has accounted for 3 ~ 20wt% in total compositing formula, and this softening agent has accounted for 5 ~ 10wt% in total compositing formula.Separately the composition with this resin 35 ~ 50wt% and 50 ~ 65wt% heat conduction phosphor composing has high heat conduction, high heat-resisting, low rigidity and difficult combustion characteristic.Again, the composition that this resin 60 ~ 95wt% and 5 ~ 40wt% multiple functional radical polyester form has low dielectric constant, high heat-resisting, low rigidity and difficult combustion characteristic.
During enforcement, this thermosetting resin is selected from the group of the sub-amide resins of polymeric amide, two Maleimide, free phenol resins, epoxy resin, urea resin, melmac, pi resin, thermosetting vibrin, Synolac, silica gel resin, amine ester resin, polyvinylesters resin, polydiallyl phthalate, furane resin, xylene resin, guanamine resin, maleic resin and Dicyclopentadiene (DCPD) resin.
During enforcement, this chain extension agent comprises two amido sulfobenzides (DD S), two amido diphenyl ethers (ODA), two amido ditans (MDA), polyetheramine or its mixture.
During enforcement, this softening agent can be selected carboxylation acrylonitrile resin (CTBN), contain compound or its mixture of poly-imine structure olefin resin (olefin).
During enforcement, this thermosetting resin comprises the sub-amide resins of a polymeric amide and a pair of Maleimide, and wherein the sub-amide resins of this polymeric amide has accounted for 23 ~ 62wt% in total compositing formula, and this pair of Maleimide accounted for 30 ~ 69wt% in total compositing formula.
During enforcement, the sub-amide resins structural formula of this polymeric amide is:
, wherein Q is
10＜n＜500。
During enforcement, the structural formula of this pair of Maleimide is:
, wherein R comprises
During enforcement, the sub-amide resins of this polymeric amide, two Maleimide, chain extension agent and the mixed mixture of softening agent are in 100 ~ 150 ℃ of reactions 2 ~ 8 hours, to form the two Malaya of response type modification amide resins.
During enforcement, this heat conduction powder comprises aluminum oxide, aluminium nitride, silicon carbide, boron nitride or its mixture.
During enforcement, the structure of this multiple functional radical polyester is as follows:
Wherein Q is following formula
, and X:-CH
2,-C (CH
3)
2,-SO
2, and the integer of n=1 ~ 10.
For further understanding the present invention, below lift preferred embodiment, coordinate accompanying drawing, concrete constitution content of the present invention and the effect that will reach thereof are described in detail as follows:
Accompanying drawing explanation
Fig. 1 is that the resin of the embodiment of the present invention forms schematic diagram;
Fig. 2 is the composition schematic diagram of the resin combination of the embodiment of the present invention;
Fig. 3 is the composition schematic diagram of another resin combination of the embodiment of the present invention.
Description of reference numerals: heat-resisting, the low rigidity of 1-height, nonflammable resin; 2-thermosetting resin; The agent of 3-chain extension; 4-softening agent; 5-heat conduction powder; 6-multiple functional radical polyester; 7-resin combination.
Embodiment
As shown in Figure 1, graphic content is an embodiment of heat-resisting, the low rigidity of height of the present invention, nonflammable resin 1, and it is comprised of a thermosetting resin 2, a chain extension agent 3 and a softening agent 4.
This thermosetting resin 2 has accounted for 70 ~ 92wt% in total compositing formula, and this chain extension agent 3 has accounted for 3 ~ 20wt% in total compositing formula, and this softening agent 4 has accounted for 5 ~ 10wt% in total compositing formula.
Wherein, this thermosetting resin 2 is selected from the group of the sub-amide resins of polymeric amide, two Maleimide, free phenol resins, epoxy resin, urea resin, melmac, pi resin, thermosetting vibrin, Synolac, silica gel resin, amine ester resin, polyvinylesters resin, polydiallyl phthalate, furane resin, xylene resin, guanamine resin, maleic resin and Dicyclopentadiene (DCPD) resin.This chain extension agent 3 comprises two amido sulfobenzides (DDS), two amido diphenyl ethers (ODA), two amido ditans (MDA), polyetheramine or its mixture.This softening agent 4 can be selected carboxylation acrylonitrile resin (CTBN), contain compound or its mixture of poly-imine structure olefin resin (olefin).
In the present embodiment, this thermosetting resin 2 comprises the sub-amide resins of a polymeric amide and a pair of Maleimide, wherein the sub-amide resins of this polymeric amide has accounted for 23 ~ 62wt% in total compositing formula, this pair of Maleimide accounted for 30 ~ 69wt% in total compositing formula, be in the present embodiment, the sub-amide resins content of polymeric amide between 23 ~ 62wt% ,Shuan Malaya amide content between 30 ~ 69wt%, chain extension agent 3 content between 3 ~ 20wt%, softening agent 4 content between 5 ~ 10wt%.
Wherein the sub-amide resins structural formula of this polymeric amide is:
, wherein Q is
10＜n＜500。
And the structural formula of this pair of Maleimide is:
, wherein R comprises
By this, during enforcement, by the sub-amide resins of this polymeric amide, two Maleimide, chain extension agent 3 and the mixed mixture of softening agent 4, in 100 ~ 150 ℃ of reactions 2 ~ 8 hours, can form the two Malaya of response type modification amide resins, actually operating is mainly first by two Maleimides, chain extension agent 3, at 100 ℃ ~ 150 ℃, stirring reaction is approximately 1 ~ 6 hour, again the sub-amide resins of polymeric amide and softening agent 4 are added wherein afterwards, at 100 ℃ ~ 150 ℃, stirring reaction is approximately 1 ~ 2 hour, uses and forms the two Malaya of homogeneous reaction type modification amide resins.
In addition, as shown in Figure 2, the formed resin of the invention described above, can 35 ~ 50wt% and the resin combination 7 that forms of the heat conduction powder 5 of one 50 ~ 65wt%, and it has high heat conduction, high heat-resisting, low rigidity and difficult combustion characteristic; Again, as shown in Figure 3, the formed resin of the present invention, can this resin 60 ~ 95wt% and the resin combination 7 that forms of 5 ~ 40wt% multiple functional radical polyester 6, and it can have low dielectric constant, high heat-resisting, low rigidity and a difficult combustion characteristic.Wherein, this heat conduction powder 5 comprises aluminum oxide, aluminium nitride, silicon carbide, boron nitride or its mixture.The structure of this multiple functional radical polyester 6 is as follows:
Wherein Q is following formula:
, and X:-CH
2,-C (CH
3)
2,-SO
2, and the integer of n=1 ~ 10.
Following table one is the list comparison of embodiment and comparative example:
Table one:
Wherein,
Embodiment 1: use 500 milliliters, the glass reactor of 3 mouthfuls, the stirring rod of 2 impellers, add the two Maleimides (BMI) of 84.2g, 14.8g chain extension agent " two amido sulfobenzides " (DDS) and (DMAc) 115g of solvent " N,N-DIMETHYLACETAMIDE ", dissolving stirs at 120 ℃ ~ 140 ℃, react approximately 1 ~ 6 hour, add again afterwards the sub-amide resins (PAI of 100g polymeric amide; 43.5%) and 47.5g softening agent (containing poly-imine structure olefin resin; DMF; 30%), at 100 ℃ ~ 140 ℃, stirring reaction is approximately 1 ~ 2 hour, and reaction treats that temperature is down to room temperature after finishing, and obtains the low rigidity non-halogen non-phosphate of resistance to combustion compound composition.
Embodiment 2: use 500 milliliters, the glass reactor of 3 mouthfuls, the stirring rod of 2 impellers, add the two Maleimides of 84.2g, 11.9g bis-amido diphenyl ethers (ODA) and solvent N,N-DIMETHYLACETAMIDE (DMAc) 115g, dissolving stirs at 120 ℃ ~ 140 ℃, react approximately 1 ~ 3 hour, add again afterwards the sub-amide resins of 100g polymeric amide and 46.5g containing poly-imine structure olefin resin, at 100 ℃ ~ 140 ℃, stirring reaction is approximately 1 ~ 2 hour, reaction treats that temperature is down to room temperature after finishing, and obtains the low rigidity non-halogen non-phosphate of resistance to combustion compound composition.
Embodiment 3: use 500 milliliters, the glass reactor of 3 mouthfuls, the stirring rod of 2 impellers, add the two Maleimides of 75.4g, 14g polyetheramine and solvent N,N-DIMETHYLACETAMIDE (DMAc) 105g, dissolving stirs at 120 ℃ ~ 140 ℃, react approximately 1 ~ 6 hour, add again afterwards the sub-amide resins of 100g polymeric amide and 44.3g containing poly-imine structure olefin resin, at 100 ℃ ~ 140 ℃, stirring reaction is approximately 1 ~ 2 hour, reaction treats that temperature is down to room temperature after finishing, and obtains the low rigidity non-halogen non-phosphate of resistance to combustion compound composition.
Embodiment 4: use 500 milliliters, the glass reactor of 3 mouthfuls, the stirring rod of 2 impellers, add the two Maleimides (BMI) of 62.8g, 21.26g chain extension agent " two amido sulfobenzides " (DDS) and (DMAc) 115g of solvent " N,N-DIMETHYLACETAMIDE ", dissolving stirs at 120 ℃ ~ 140 ℃, react approximately 1 ~ 6 hour, add again afterwards the sub-amide resins (PAI of 100g polymeric amide; 43.5%) and 47.2g softening agent (containing poly-imine structure olefin resin; DMF; 30%), at 100 ℃ ~ 140 ℃, stirring reaction is approximately 1 ~ 2 hour, and reaction treats that temperature is down to room temperature after finishing, by the aluminum oxide (Al of 141.7 grams
2o
3, Showa Denko Co.) and add above-mentioned solution to stir in reactor, obtain the low rigidity non-halogen non-phosphate of the resistance to combustion of high heat radiation composition.
Embodiment 5: use 500 milliliters, the glass reactor of 3 mouthfuls, the stirring rod of 2 impellers, add the two Maleimides (BMI) of 62.8g, 21.26g chain extension agent " two amido sulfobenzides " (DDS) and (DMAc) 115g of solvent " N,N-DIMETHYLACETAMIDE ", dissolving stirs at 120 ℃ ~ 140 ℃, react approximately 1 ~ 6 hour, add again afterwards the sub-amide resins (PAI of 100g polymeric amide; 43.5%) and 47.2g softening agent (containing poly-imine structure olefin resin; DMF; 30%), and the polyester (Polyester, DIC-Japan) of the multiple functional radical of 60.7 grams, at 100 ℃ ~ 140 ℃, stirring reaction is approximately 1 ~ 2 hour, treats that temperature is down to room temperature after reaction finishes, and obtains the low rigidity non-halogen non-phosphate of the resistance to combustion of low dielectric constant composition.
Comparative example 1: use 500 milliliters, the glass reactor of 3 mouthfuls, the stirring rod of 2 impellers, add 110g polyamide-imide resin (43.5%), 67.3g epoxy resin and 13.3g solvent N,N-DIMETHYLACETAMIDE (DMAc), the dissolving that stirs at 80 ~ 90 ℃, reacts approximately 2 ~ 4 hours, treats that temperature is down to room temperature after reaction finishes, add above-mentioned solution to stir in reactor 13.3g bis-amido sulfobenzides (DDS), obtain non-halogen non-phosphate compound composition.
Comparative example 2: use 500 milliliters, the glass reactor of 3 mouthfuls, the stirring rod of 2 impellers, add 110g polyamide-imide resin (43.5%), 67.3g epoxy resin and 13.3g solvent N,N-DIMETHYLACETAMIDE (DMAc), dissolving stirs at 80 ~ 90 ℃, react approximately 2 ~ 4 hours, reaction treats that temperature is down to room temperature after finishing, by 13.3g bis-amido sulfobenzides (DDS) and 114g aluminium hydroxide (Al (OH) 3, add above-mentioned solution to stir in reactor, obtain the non-halogen non-phosphate of resistance to combustion compound composition.
Comparative example 3: use 500 milliliters, the glass reactor of 3 mouthfuls, the stirring rod of 2 impellers, add 100gFR-5 glue resin (65%) and 32.5g CTBN resin (solvent MEK, solid content:20%), the mixing that stirs under room temperature, obtains the Halogen of resistance to combustion compound composition.Wherein the formula of FR-5 glue is as follows:
By this, embodiment 1 ~ 5 is listed in to upper table with the physical property of comparative example 1 ~ 3, the resistance to combustion of embodiment 1 ~ 5 as shown in Table 1, high Tg characteristic and low rigidity characteristics, be all obviously better than comparative example, and the comparative example 3 FR-5 resin system that is brominated system.
Therefore, the material that compound composition of the present invention is used is non-halogen non-phosphate structure, one thermosetting resin amide resins as sub-in polymeric amide is added after two Maleimides, collocation chain extension agent and softening agent reacting by heating under appropriate reaction temperature and time, use and form the two Malaya of homogeneous reaction type upgrading amide resins, and by controlling storeroom ratio, can produce the low rigidity flame retardant resin composition of halogen-free phosphate-free high-heat-resistance of different soft degree (flexibility), gel time (gel time) and gummosis amount.Meanwhile, the present composition has superior flexibility and heat-resistant quality, and is not containing under any halogen and phosphide incombustible agent, does not need to add the grade that any inorganic powder can reach the difficult combustion of UL-94V0.
The above is specific embodiments of the invention and the technique means used, according to exposure herein or instruction, can derive and derive many changes and correction, if the equivalence of doing according to conception of the present invention changes, when its effect producing does not exceed specification sheets and graphic contained connotation yet, all should be considered as within technology category of the present invention.
Claims (16)
1. high heat-resisting, low rigidity, a nonflammable resin, comprising:
One thermosetting resin, it has accounted for 70 ~ 92wt% in total compositing formula;
One chain extension agent, it has accounted for 3 ~ 20wt% in total compositing formula; And
One softening agent, it has accounted for 5 ~ 10wt% in total compositing formula.
2. heat-resisting, the low rigidity of height as claimed in claim 1, nonflammable resin, it is characterized in that, described thermosetting resin is selected from the group of the sub-amide resins of polymeric amide, two Maleimide, free phenol resins, epoxy resin, urea resin, melmac, pi resin, thermosetting vibrin, Synolac, silica gel resin, amine ester resin, polyvinylesters resin, polydiallyl phthalate, furane resin, xylene resin, guanamine resin, maleic resin and Dicyclopentadiene (DCPD) resin.
3. heat-resisting, the low rigidity of height as claimed in claim 1, nonflammable resin, it is characterized in that, described thermosetting resin comprises the sub-amide resins of a polymeric amide and a pair of Maleimide, wherein the sub-amide resins of this polymeric amide has accounted for 23 ~ 62wt% in total compositing formula, and this pair of Maleimide accounted for 30 ~ 69wt% in total compositing formula.
4. heat-resisting, the low rigidity of height as claimed in claim 3, nonflammable resin, it is characterized in that, the sub-amide resins of described polymeric amide, two Maleimide, chain extension agent and the mixed mixture of softening agent are in 100 ~ 150 ℃ of reactions 2 ~ 8 hours, to form the two Malaya of response type modification amide resins.
5. heat-resisting, the low rigidity of height as claimed in claim 3, nonflammable resin, is characterized in that, the sub-amide resins structural formula of described polymeric amide is:
, wherein Q is
10＜n＜500。
6. heat-resisting, the low rigidity of height as claimed in claim 3, nonflammable resin, is characterized in that, the structural formula of described pair of Maleimide is:
, wherein R comprises
7. heat-resisting, the low rigidity of height as claimed in claim 1, nonflammable resin, it is characterized in that, described chain extension agent comprises two amido sulfobenzides (DDS), two amido diphenyl ethers (ODA), two amido ditans (MDA), polyetheramine or its mixture.
8. heat-resisting, the low rigidity of height as claimed in claim 1, nonflammable resin, is characterized in that, described softening agent is carboxylation acrylonitrile resin (CTBN), compound or its mixture that contains poly-imine structure olefin resin (olefin).
9. high heat-resisting, low rigidity, a flame-retardant resin composition, comprising:
Heat-resisting, the low rigidity of one height as claimed in claim 1, nonflammable resin; And
One heat conduction powder.
10. heat-resisting, the low rigidity of height as claimed in claim 9, flame-retardant resin composition, is characterized in that, heat-resisting, the low rigidity of described height, the weight percent of nonflammable resin in heat-resisting, the low rigidity of this height, flame-retardant resin composition are 35 ~ 50%.
Heat-resisting, the low rigidity of 11. height as claimed in claim 9, flame-retardant resin composition, is characterized in that, the weight percent of described heat conduction powder in heat-resisting, the low rigidity of this height, flame-retardant resin composition is 50 ~ 65%.
Heat-resisting, the low rigidity of 12. height as claimed in claim 9, flame-retardant resin composition, is characterized in that, described heat conduction powder comprises aluminum oxide, aluminium nitride, silicon carbide, boron nitride or its mixture.
13. 1 kinds high heat-resisting, low rigidity, flame-retardant resin composition, comprising:
Heat-resisting, the low rigidity of one height as claimed in claim 1, nonflammable resin; And
One multiple functional radical polyester.
Heat-resisting, the low rigidity of 14. height as claimed in claim 13, flame-retardant resin composition, is characterized in that, heat-resisting, the low rigidity of described height, the weight percent of nonflammable resin in heat-resisting, the low rigidity of this height, flame-retardant resin composition are 60 ~ 95%.
Heat-resisting, the low rigidity of 15. height as claimed in claim 13, flame-retardant resin composition, is characterized in that, the weight percent of described multiple functional radical polyester in heat-resisting, the low rigidity of this height, flame-retardant resin composition is 5 ~ 40%.
Heat-resisting, the low rigidity of 16. height as claimed in claim 13, flame-retardant resin composition, is characterized in that, the structure of described multiple functional radical polyester is as follows:
Wherein Q is following formula:
, and X:-CH2 ,-C (CH3) 2 ,-SO2, and the integer of n=1 ~ 10.
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| JPH0940845A (en) * | 1995-07-31 | 1997-02-10 | Matsushita Electric Works Ltd | Phenolic resin composition, prepreg and laminated sheet for electricity |
| WO2004087811A1 (en) * | 2003-03-27 | 2004-10-14 | Matsushita Electric Works, Ltd. | Flame retardant epoxy resin compositions, prepregs and metal-clad laminates |
| CN1631972A (en) * | 2003-12-22 | 2005-06-29 | 合正科技股份有限公司 | High heat conduction, halogen free, phosphorus free and flame retardant resin composition for printed circuit board |
| US20100240811A1 (en) * | 2009-03-18 | 2010-09-23 | He Yufang | Thermosetting Resin Composition and Application Thereof |
| CN101851390A (en) * | 2010-05-19 | 2010-10-06 | 广东生益科技股份有限公司 | Black halogen-free epoxy resin composition and covering film prepared from same |
| CN102191004A (en) * | 2010-12-31 | 2011-09-21 | 莱芜金鼎电子材料有限公司 | Thermosetting adhesive for flexible basic material and preparation method thereof |
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| CN103525086B (en) | 2015-12-16 |
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