CN103523977A - Printing plate etching waste liquid treatment system and method - Google Patents
Printing plate etching waste liquid treatment system and method Download PDFInfo
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- CN103523977A CN103523977A CN201210225689.9A CN201210225689A CN103523977A CN 103523977 A CN103523977 A CN 103523977A CN 201210225689 A CN201210225689 A CN 201210225689A CN 103523977 A CN103523977 A CN 103523977A
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Abstract
The invention relates to a printing plate etching waste liquid treatment system and method. The printing plate etching waste liquid treatment system comprises a liquid storage tank, an evaporation device, a cooling tank, a first electrolysis buffer tank, a first ionic membrane electrolysis tank, a second ionic membrane electrolysis tank, a filter tank and a second electrolysis buffer tank. After being connected with an etching line, the system realizes copper recovery through a mode of evaporation before electrolysis, and recovers alkali in an electrolysis process of the first ionic membrane electrolysis tank and the second ionic membrane electrolysis tank.
Description
Technical field
The present invention relates to printed circuit board (PCB) production field, particularly relate to a kind for the treatment of system and treatment process of the printed circuit board etching waste liquid that contains cupric chloride.
Background technology
In printed circuit board manufacture craft, printed-wiring board (PWB) enterprise is being perplexed in the reclaiming of acid copper chloride etching liquid all the time, in non-renewable acid copper chloride etching liquid every liter containing having an appointment the copper of 100 grams to 180 grams, the copper content of this class spent etching solution that only Guangdong Province produces every month just has more than thousands of tons of, if reclaim this metalloid copper and spent etching solution cyclic regeneration is used and must have very great economic benefit and the value of environmental protection.
Traditional printed board etching waste liquor treatment process is single extraction copper only, and after carrying copper, waste liquid directly discharges, and other compositions in etching solution is not reclaimed, and causes secondary pollution problems.
Summary of the invention
Based on this, be necessary to provide a kind of and can reclaim copper, but also the treatment system of recyclable other compositions of printed circuit board etching waste liquid and treatment process.
A treatment system, comprising: reservoir, evaporation unit, cooling tank, the first electrolysis dashpot, the first ion-exchange membrane electrolyzer, the second ion-exchange membrane electrolyzer, filtering basin and the second electrolysis dashpot, wherein,
Described reservoir is for memory print plate etching waste liquor, and the composition of described printed circuit board etching waste liquid comprises cupric chloride and hydrogenchloride and sodium-chlor;
Described evaporation unit is connected with described reservoir, for the hydrogenchloride evaporation of described printed circuit board etching waste liquid is separated;
Described cooling tank is connected with described evaporation unit, and the hydrogen chloride gas producing for receiving described evaporation unit forms hydrochloric acid after condensation absorbs;
Described the first electrolysis dashpot is connected with described evaporation unit, for receiving the printed circuit board etching waste liquid of removing after hydrogenchloride;
Described the first ion-exchange membrane electrolyzer comprises cathodic area and the positive column of being separated by anionic membrane, described cathodic area is for receiving from the printed circuit board etching waste liquid after the removal hydrogenchloride of described the first electrolysis dashpot, and electrolysis produces copper simple substance, and will remain electrolytic solution and inject described the first electrolysis dashpot, described positive column is for receiving the hydrochloric acid from described cooling tank, and electrolysis produces the chlorine that passes into described cooling tank;
Described the second ion-exchange membrane electrolyzer comprises positive column, buffer zone and cathodic area, described positive column and described buffer zone are separated by anionic membrane, described buffer zone and described cathodic area are separated by cationic membrane, described buffer zone is for injecting the electrolytic solution after described the first ion-exchange membrane electrolyzer electrolysis from described the first electrolysis dashpot, described positive column produces the chlorine that passes into described cooling tank for electrolysis, described cathodic area produces copper simple substance and sodium hydroxide solution for electrolysis;
Described filtering basin are connected with described the second ion-exchange membrane electrolyzer, for filtering, collect described copper simple substance;
Described the second electrolysis dashpot is connected with described filtering basin, for collecting described sodium hydroxide solution.
In an embodiment, the positive column of described the first ion-exchange membrane electrolyzer is connected with described cooling tank, and the electrolytic solution producing after the electrolysis of described positive column is injected to described cooling tank therein.
Therein in an embodiment, the positive column of described the second ion-exchange membrane electrolyzer is connected with described the first electrolysis dashpot, the electrolytic solution of part after described the first ion-exchange membrane electrolyzer electrolysis enters into the positive column of described the second ion-exchange membrane electrolyzer from described the first electrolysis dashpot, refill described the first electrolysis dashpot after electrolysis.
In an embodiment, described the first electrolysis dashpot is connected with described cooling tank therein, and the electrolytic solution after described the first ion-exchange membrane electrolyzer and described the second ion-exchange membrane electrolyzer electrolysis is injected to described cooling tank.
In an embodiment, described the second electrolysis dashpot is connected with described the second ion-exchange membrane electrolyzer therein, and the sodium hydroxide solution in described the second electrolysis dashpot is injected to the cathodic area of described the second ion-exchange membrane electrolyzer.
A treatment process, comprises the steps:
Use reservoir memory print plate etching waste liquor, described printed circuit board etching waste liquid comprises cupric chloride and hydrogenchloride and sodium-chlor;
Printed circuit board etching waste liquid in described reservoir is injected to evaporation unit, make the hydrogenchloride evaporation in printed circuit board etching waste liquid separated, the hydrogen chloride gas obtaining is passed in cooling tank, after condensation absorbs, forms hydrochloric acid;
Use the first electrolysis dashpot to receive the printed circuit board etching waste liquid of removing after hydrogenchloride;
Printed circuit board etching waste liquid after removal hydrogenchloride in described the first electrolysis dashpot is injected to the cathodic area of the first ion-exchange membrane electrolyzer, electrolysis produces copper simple substance, the hydrochloric acid of described cooling tank is injected to the positive column of described the first ion-exchange membrane electrolyzer, electrolysis produces chlorine, be passed in described cooling tank, condensation forms hydrochloric acid after absorbing again;
Electrolytic solution after described the first ion-exchange membrane electrolyzer electrolysis is injected to described the second ion-exchange membrane electrolyzer buffer zone, in the electrolysis of described positive column, produce chlorine, be passed in described cooling tank, after condensation absorbs, form hydrochloric acid; Make to be positioned at the cupric ion of electrolytic solution of described buffer zone and the cathodic area that sodium ion enters the second ion-exchange membrane electrolyzer, in the electrolysis of described cathodic area, produce copper simple substance and sodium hydroxide solution;
Use filtering basin to filter and collect described copper simple substance; And
Use the second electrolysis dashpot to collect described sodium hydroxide solution.
In an embodiment, the electrolytic solution after the positive column electrolysis of described the first ion-exchange membrane electrolyzer injects described cooling tank and circulates therein.
In an embodiment, the electrolytic solution after the positive column electrolysis of the second ion-exchange membrane electrolyzer injects described the first electrolysis dashpot therein, circulates in the positive column that then reenters the second ion-exchange membrane electrolyzer.
In an embodiment, described the first ion-exchange membrane electrolyzer of process in described the first electrolysis dashpot and the second ion-exchange membrane electrolyzer repeatedly electrolytic solution of circular treatment inject described cooling tank therein.
Therein in an embodiment, circulate in the cathodic area that the sodium hydroxide solution in described the second electrolysis dashpot injects described the second ion-exchange membrane electrolyzer.
A kind of printing plate etching solution treatment system, it comprises: reservoir, with the evaporation unit of reservoir fluid communication, with cooling tank and first membrane electrolyser and a first electrolysis dashpot of evaporation unit fluid communication, the first membrane electrolyser has cathodic area and the positive column that utilizes anionic membrane to separate, the cathodic area of the first electrolysis dashpot and the first membrane electrolyser and evaporation unit fluid communication, the positive column of the first membrane electrolyser and cooling tank fluid communication.
Therein in an embodiment, described the first dashpot and cooling tank fluid communication.
Therein in an embodiment, it further comprises second membrane electrolyser, the second membrane electrolyser comprises positive column, cathodic area and the buffer zone between positive column and cathodic area, between the positive column of the second membrane electrolyser and buffer zone, by anionic membrane, separate, between the cathodic area of the second membrane electrolyser and buffer zone, by cationic membrane, separate the positive column of the second membrane electrolyser and buffer zone and the first electrolysis dashpot fluid communication.
Therein in an embodiment, described the second membrane electrolyser further comprises the temporary tank with the positive column fluid communication of the second membrane electrolyser, and temporary tank simultaneously and the first electrolysis dashpot fluid communication.
In an embodiment, it further comprises a filtration unit being connected with the second membrane electrolyser and the second electrolysis dashpot being connected with filtration unit therein.
Therein in an embodiment, described the second electrolysis dashpot simultaneously with the cathodic area fluid communication of the second membrane electrolyser.
After said system and printing plate etching line interconnect, by the mode of electrolysis after first evaporation, realize the recovery of copper, can in electrolytic process, reclaim alkali simultaneously.
Accompanying drawing explanation
Fig. 1 is the Organization Chart for the treatment of system of the printed circuit board etching waste liquid of an embodiment;
Fig. 2 is the schema for the treatment of process of the printed circuit board etching waste liquid of an embodiment.
Embodiment
For above-mentioned purpose of the present invention, feature and advantage can be become apparent more, below in conjunction with accompanying drawing, the specific embodiment of the present invention is described in detail.A lot of details have been set forth in the following description so that fully understand the present invention.But the present invention can implement to be much different from alternate manner described here, and those skilled in the art can do similar improvement without prejudice to intension of the present invention in the situation that, so the present invention is not subject to the restriction of following public concrete enforcement.
In order to solve only single extraction copper of traditional printed board etching waste liquor treatment process, and waste liquid directly discharges after carrying copper, other compositions in etching solution are not reclaimed, cause secondary pollution problems, this programme adopts electrolysis, electrodialytic technique, the most copper in etching solution can not only be reclaimed, and the method that adopts film electrolysis also recyclable HCl, NaOH, whole system does not produce secondary pollution, and etching solution has obtained resource circulation utilization.
In the following description, " liquid adapter " refer to the pipeline that a kind of liquid can be therefrom mobile; " gas adapter " refers to the pipeline that a kind of gas can be therefrom mobile.In the present invention, no matter the pipeline between two equipment is that transport gas or liquid all can be understood as fluid communication.Liquid or gas flow can be by drive unit pressurization or the mode such as decompression realize, for better explanation principle of the present invention, the description of these drive units is omitted.
Fig. 1 has shown the configuration diagram for the treatment of system of the printed circuit board etching waste liquid of an embodiment.Refer to Fig. 1, the treatment system 100 of the printed circuit board etching waste liquid of an embodiment comprises: reservoir 10, evaporation unit 20, cooling tank 30, the first electrolysis dashpot 40, the first ion-exchange membrane electrolyzer 50, the second ion-exchange membrane electrolyzer 60, filtering basin 70 and the second electrolysis dashpot 80.
Printed circuit board etching waste liquid flows into and is stored in reservoir 10 from the production line of printed circuit board (PCB).Described printed circuit board etching waste liquid mainly comprises cupric chloride and hydrogenchloride and sodium-chlor.According to the difference of etching waste liquor, also may comprise other metal ions such as potassium, iron, nickel.The existence form of cupric ion in described cupric chloride in printed circuit board etching waste liquid is generally complex form, for example [CuCl]
+[CuCl
2]
-.
The top of cooling tank 30 is provided with two condensers (not indicating), and the temperature of taking over 21 hydrogen chloride gas that pass into from gas can be cooled to 5 ~ 10 ℃ condenser, and after being condensed into liquid, the water that hydrogen chloride gas is known from experience in the groove 30 that is cooled absorbs formation hydrochloric acid.
The first electrolysis dashpot 40 is taken over 22 by liquid and is connected with evaporation unit 20.Printed circuit board etching waste liquid after removal hydrogenchloride can be taken over 22 through liquid and enter in the first electrolysis dashpot 40.
The first ion-exchange membrane electrolyzer 50 comprises 52He positive column, cathodic area 54.Between 52He positive column, cathodic area 54, by an anionic membrane 56, separate.The characteristic of anionic membrane 56 is to allow negatively charged ion to pass, and stops positively charged ion to pass.The cathodic area 52 of the first ion-exchange membrane electrolyzer 50 is taken over 42 by liquid and is connected with the first electrolysis dashpot 40, therefore from the printed circuit board etching waste liquid after the removal hydrogenchloride of the first electrolysis dashpot 40, can inject cathodic area 52.The positive column 54 of the first ion-exchange membrane electrolyzer 50 is taken over 32 by liquid and is connected with cooling tank 30, so the hydrochloric acid of cooling tank 30 can enter in positive column 54.Under the effect of electric field and anionic membrane 56, positively charged ion (for example cupric ion) is 52 gatherings towards cathodic area, and negatively charged ion (for example chlorion) is 54 gatherings towards positive column.
While there is electrolysis, there is following chemical reaction in cathodic area 52:
[CuCl]
++2e
-→Cu+Cl
-
[CuCl
2]
-+e
-→Cu+2Cl
-
In cathodic area, 52 produce copper simple substance thus.In the present embodiment, the copper simple substance of generation is attached on cathode electrode with the form of copper coin, therefore can copper simple substance be taken out by changing the mode of electrode.The chlorion of ionization enters positive column 54 through anionic membrane 56.Residue electrolytic solution enters in the first electrolysis dashpot 40 by connecting the liquid adapter 51 of the first ion-exchange membrane electrolyzer 50 and the first electrolysis dashpot 40.
There is following chemical reaction in anode 54:
H
2O→
1/
2O
2+2H
++2e-
2Cl
-→Cl
2+2e-
2Cl
2+H
2O→2HClO+2HCl
In positive column, 54 produce chlorine and hydrogen chloride gas thus.The chlorine of producing and hydrogen chloride gas enter into cooling tank 30 by taking over the 21 gas adapters 53 that communicate with gas, finally form hydrochloric acid.
In the present embodiment, positive column 54 is also taken over 55 by liquid and is connected with cooling tank 30.Through the electrolytic solution after 54 electrolysis of positive column, by liquid, take over 55 and inject cooling tank 30, thereby realize constantly circulation.
The second ion-exchange membrane electrolyzer 60 comprises 64Ji cathodic area, 62, buffer zone, positive column 66.62Yu buffer zone 64, positive column is separated by anionic membrane 621, and 64Yu cathodic area 66, buffer zone is separated by cationic membrane 661.The feature of cationic membrane 661 is to make positively charged ion pass through to stop negatively charged ion to pass through.The second ion-exchange membrane electrolyzer 60 also comprises temporary tank 68.Temporary tank 68 is taken over (not indicating) by liquid and is communicated with positive column 62, for storing through the electrolytic solution after 62 electrolysis of positive column.
The second ion-exchange membrane electrolyzer 60 is taken over 41 by liquid and is connected with the first electrolysis dashpot 40.Concrete, the electrolytic solution in the first electrolysis dashpot 40 after the first ion-exchange membrane electrolyzer 50 electrolysis enters after liquid takes over 41 and is divided into two portions, and a part is taken over 41a by liquid and is entered in buffer zone 64, and another part is taken over 41b by liquid and is entered in positive column 62.In electrolytic solution after the first ion-exchange membrane electrolyzer 50 electrolysis, there is a small amount of cupric ion, sodium ion and a part of chlorion.Under the effect of electric field, anionic membrane 621 and cationic membrane 661, the cupric ion and the sodium ion that are positioned at buffer zone 64 are concentrated to cathodic area 66, and chlorion is concentrated to positive column 62.
While there is electrolysis, there is following chemical reaction in cathodic area 66:
Cu
2++2e
-→Cu
Cu
++e
-→Cu
2H
2O+2e-→H
2+2OH
-
OH
-+Na
+→NaOH
Produce thus copper simple substance and sodium hydroxide solution.In the present embodiment, owing to entering, the cupric ion in cathodic area 66 is less, and the copper simple substance therefore producing is present in electrolytic solution with the form of copper powder.
There is following chemical reaction in positive column 62:
H
2O→
1/
2O
2+2H
++2e
-
2Cl
-→Cl
2+2e
-
2Cl
2+H
2O→2HClO+2HCl
The gas that positive column 62 produces (is mainly Cl
2with HCl) by being connected the gas adapter 34 of the second ion-exchange membrane electrolyzer 60 and cooling tank 30, enter cooling tank 30, and absorb and become hydrochloric acid under the effect of condenser.
After 62 electrolysis of positive column, remaining electrolytic solution enters temporary tank 68.In the present embodiment, temporary tank 68 is taken over 44 by liquid and is connected with the first electrolysis dashpot 40, and the electrolytic solution after the second ion-exchange membrane electrolyzer 60 electrolysis is injected to the first electrolysis dashpot 40, forms thus circulation.Be appreciated that if do not need repeatedly to circulate, liquid takes over 41b and liquid adapter 44 also can be omitted.
The second electrolysis dashpot 80 is taken over 82 by liquid and is connected with filtering basin 70, and collects sodium hydroxide solution.
In the present embodiment, the second electrolysis dashpot 80 is also taken over 84 by liquid and is connected with the cathodic area 66 of the second ion-exchange membrane electrolyzer 60, and constantly sodium hydroxide solution is injected to the cathodic area 66 of the second ion-exchange membrane electrolyzer 60, the moisture consuming to supplement cathodic area 66.If supplement by other means the moisture that cathodic area 66 consumes, liquid is taken over 84 and also can be omitted.
In the present embodiment, the first electrolysis dashpot 40 is also taken over 43 by liquid and is connected with cooling tank 30.Because the printed circuit board etching waste liquid in the first electrolysis dashpot 40 is after the iterative cycles of the first ion-exchange membrane electrolyzer 50 and the second ion-exchange membrane electrolyzer 60 is processed, ionic concn reduces.Therefore the ionic concn in the first electrolysis dashpot 40 being detected reaches after a certain lower value, can open valve, make the electrolytic solution (being almost water) after the first ion-exchange membrane electrolyzer 50 and the second ion-exchange membrane electrolyzer 60 electrolysis in the first electrolysis dashpot 40 inject cooling tank 30, to supplement consumption.
Refer to Fig. 2, the treatment process of the printed circuit board etching waste liquid of an embodiment, comprises the steps:
Step S101, use reservoir memory print plate etching waste liquor, described printed circuit board etching waste liquid comprises cupric chloride and hydrogenchloride and sodium-chlor.
For example, printed circuit board etching waste liquid can be stored in reservoir 10.
Step S102, printed circuit board etching waste liquid in described reservoir is injected to evaporation unit, make the hydrogenchloride evaporation in printed circuit board etching waste liquid separated, the hydrogen chloride gas obtaining is passed in cooling tank, after condensation absorbs, forms hydrochloric acid.
For example, printed circuit board etching waste liquid in reservoir 10 can be taken over to 11 by liquid is injected into and in evaporation unit 20, carries out heat treated, thereby it is separated that partial oxidation hydrogen in printed circuit board etching waste liquid is flashed to after gas, and by gas, takes over 21 and enter into cooling tank 30, condensation formation hydrochloric acid.
Step S 103, use the first electrolysis dashpot receive to remove the printed circuit board etching waste liquid after hydrogenchloride.
For example, can first the printed circuit board etching waste liquid of removing after hydrogenchloride be taken in 22 injection the first electrolysis dashpots 40 by liquid.
Step S104, the printed circuit board etching waste liquid after the removal hydrogenchloride in described the first electrolysis dashpot is injected to the cathodic area of the first ion-exchange membrane electrolyzer, electrolysis produces copper simple substance, the hydrochloric acid of described cooling tank is injected to the positive column of described the first ion-exchange membrane electrolyzer, electrolysis produces chlorine, be passed in described cooling tank, condensation forms hydrochloric acid after absorbing again.
For example, can take over 42 by liquid the printed circuit board etching waste liquid after the removal hydrogenchloride in the first electrolysis dashpot 40 is injected to the cathodic area 52 of the first ion-exchange membrane electrolyzer 50, electrolysis produces copper simple substance.And the hydrochloric acid of cooling tank 30 is taken over to 32 by liquid enter in the positive column 54 of the first ion-exchange membrane electrolyzer 50, electrolysis produces chlorine, and the chlorine of production is taken over 53 by gas and is entered into cooling tank 30, formation hydrochloric acid after condensation absorbs.
Preferably, electrolytic solution after positive column 54 electrolysis of the first ion-exchange membrane electrolyzer 50 (being mainly the hydrochloric acid that does not have electrolysis complete) is taken over 55 by liquid and is entered in cooling tank 30, and then through liquid, takes over 32 and enter in the positive column 54 of the first ion-exchange membrane electrolyzer 50 and circulate.If be appreciated that, adopt other pipelines that the electrolytic solution after 54 electrolysis of positive column is drained, liquid adapter 55 also can be omitted.
Step S 105, the electrolytic solution after described the first ion-exchange membrane electrolyzer electrolysis is injected to described the second ion-exchange membrane electrolyzer buffer zone, in the electrolysis of described positive column, produce chlorine, be passed in described cooling tank, after condensation absorbs, form hydrochloric acid; Make to be positioned at the cupric ion of electrolytic solution of described buffer zone and the cathodic area that sodium ion enters the second ion-exchange membrane electrolyzer, in the electrolysis of described cathodic area, produce copper simple substance and sodium hydroxide solution.
For example, electrolytic solution after the first ion-exchange membrane electrolyzer 50 electrolysis can first be taken over 51 by liquid and turn back in the first electrolysis dashpot 40, then by liquid, take over 41, a part enters in the buffer zone 64 of the second ion-exchange membrane electrolyzer 60, and another part enters in the positive column 62 of the second ion-exchange membrane electrolyzer 60.In electrolytic solution after the first ion-exchange membrane electrolyzer 50 electrolysis, there is a small amount of cupric ion, sodium ion and a part of chlorion.Under the effect of anionic membrane 621 and cationic membrane 661, be positioned at buffer zone 64 cupric ions and sodium ion and be concentrated to cathodic area 66, and chlorion is concentrated to positive column 62.While there is electrolysis, in positive column, 62 electrolysis generate chlorine, and in cathodic area, 66 generate copper simple substance and sodium hydroxide.The chlorine producing is taken over 34 through gas and is entered cooling tank 30, and absorbs and become hydrochloric acid under the effect of condenser.
Preferably, through remaining electrolytic solution after 62 electrolysis of positive column, by liquid, is taken over and entered temporary tank 68, and by liquid, takes over 44 and enter the first electrolysis dashpot 40, and then by liquid, take over 41 and turn back to the second ion-exchange membrane electrolyzer 60, formation circulates thus.
Step S106, use filtering basin filter collects described copper simple substance.
For example, in cathodic area, the 66 copper simple substance that generate are taken over 72 by liquid and are entered filtering basin 70, and are filtered collection at filtering basin 70.
Step S107, use the second electrolysis dashpot to collect described sodium hydroxide solution to collect described sodium hydroxide.
For example, in cathodic area, 66 sodium hydroxide that generate are taken over 82 by liquid and are entered the second electrolysis dashpot 80, thereby collect and obtain sodium hydroxide solution at the second electrolysis dashpot 80.
Preferably, the sodium hydroxide solution in the second electrolysis dashpot 80 is taken over 84 cathodic areas 66 that enter into the second ion-exchange membrane electrolyzer 60 by liquid and is circulated, to supplement the moisture of consumption.
Printed circuit board etching waste liquid in the first electrolysis dashpot 40 is after the iterative cycles of the first ion-exchange membrane electrolyzer 50 and the second ion-exchange membrane electrolyzer 60 is processed, and ionic concn reduces.Therefore the ionic concn in the first electrolysis dashpot 40 being detected reaches after a certain lower value, can make the electrolytic solution (being almost water) after the first ion-exchange membrane electrolyzer 50 and the second ion-exchange membrane electrolyzer 60 electrolysis in the first electrolysis dashpot 40 take over 43 injection cooling tanks 30 by liquid, to supplement consumption.
After said system and etching line interconnect, circulation running can obtain HCl and NaOH when reclaiming metallic copper, and restored acid can be sent in real time etching line and again utilize, and the alkali of recovery is done corresponding storage.Whole process, without any waste water, waste gas and waste discharge, has been avoided secondary pollution, and whole etching work and recovery system realize automatization completely and control, and guarantees that whole system is stable, cycle operation safely.
When etching solution enters evaporation unit 20 and evaporates, can be by CuCl
2separated with acidic substance HCl wherein, reduce the acidity of etching solution, promote separating out of copper in the first ion-exchange membrane electrolyzer 50.On the other hand, chlorine in the first ion-exchange membrane electrolyzer 50 and the second ion-exchange membrane electrolyzer 60 is extracted and can strengthen Cu
2+and Cu
+redox reaction between chemical potential energy poor, promote the electrolysis of copper.Concentrating unit 30 is undertaken containing a large amount of acid and chlorine and gas in cooling and absorbing gas adapter 52 by two condensers and takes over a small amount of acid and the chlorine containing in 61, has reduced to a certain extent the pressure in the first ion-exchange membrane electrolyzer 50, makes electrolytic reaction more abundant.
The above embodiment has only expressed several embodiment of the present invention, and it describes comparatively concrete and detailed, but can not therefore be interpreted as the restriction to the scope of the claims of the present invention.It should be pointed out that for the person of ordinary skill of the art, without departing from the inventive concept of the premise, can also make some distortion and improvement, these all belong to protection scope of the present invention.Therefore, the protection domain of patent of the present invention should be as the criterion with claims.
Claims (16)
1. a printed circuit board etching waste liquid treatment system, is characterized in that, comprising: reservoir, evaporation unit, cooling tank, the first electrolysis dashpot, the first ion-exchange membrane electrolyzer, the second ion-exchange membrane electrolyzer, filtering basin and the second electrolysis dashpot, wherein,
Described reservoir is for memory print plate etching waste liquor, and the composition of described printed circuit board etching waste liquid comprises cupric chloride and hydrogenchloride and sodium-chlor;
Described evaporation unit is connected with described reservoir, for the hydrogenchloride evaporation of described printed circuit board etching waste liquid is separated;
Described cooling tank is connected with described evaporation unit, and the hydrogen chloride gas producing for receiving described evaporation unit forms hydrochloric acid after condensation absorbs;
Described the first electrolysis dashpot is connected with described evaporation unit, for receiving the printed circuit board etching waste liquid of removing after hydrogenchloride;
Described the first ion-exchange membrane electrolyzer comprises cathodic area and the positive column of being separated by anionic membrane, described cathodic area is for receiving from the printed circuit board etching waste liquid after the removal hydrogenchloride of described the first electrolysis dashpot, and electrolysis produces copper simple substance, and will remain electrolytic solution and inject described the first electrolysis dashpot, described positive column is for receiving the hydrochloric acid from described cooling tank, and electrolysis produces the chlorine that passes into described cooling tank;
Described the second ion-exchange membrane electrolyzer comprises positive column, buffer zone and cathodic area, described positive column and described buffer zone are separated by anionic membrane, described buffer zone and described cathodic area are separated by cationic membrane, described buffer zone is for injecting the electrolytic solution after described the first ion-exchange membrane electrolyzer electrolysis from described the first electrolysis dashpot, described positive column produces the chlorine that passes into described cooling tank for electrolysis, described cathodic area produces copper simple substance and sodium hydroxide solution for electrolysis;
Described filtering basin are connected with described the second ion-exchange membrane electrolyzer, for filtering, collect described copper simple substance;
Described the second electrolysis dashpot is connected with described filtering basin, for collecting described sodium hydroxide solution.
2. printed circuit board etching waste liquid treatment system according to claim 1, is characterized in that, the positive column of described the first ion-exchange membrane electrolyzer is connected with described cooling tank, and the electrolytic solution producing after the electrolysis of described positive column is injected to described cooling tank.
3. printed circuit board etching waste liquid treatment system according to claim 1, it is characterized in that, the positive column of described the second ion-exchange membrane electrolyzer is connected with described the first electrolysis dashpot, the electrolytic solution of part after described the first ion-exchange membrane electrolyzer electrolysis enters into the positive column of described the second ion-exchange membrane electrolyzer from described the first electrolysis dashpot, refill described the first electrolysis dashpot after electrolysis.
4. printed circuit board etching waste liquid treatment system according to claim 3, it is characterized in that, described the first electrolysis dashpot is connected with described cooling tank, and the electrolytic solution after described the first ion-exchange membrane electrolyzer and described the second ion-exchange membrane electrolyzer electrolysis is injected to described cooling tank.
5. printed circuit board etching waste liquid treatment system according to claim 1, it is characterized in that, described the second electrolysis dashpot is connected with described the second ion-exchange membrane electrolyzer, and the sodium hydroxide solution in described the second electrolysis dashpot is injected to the cathodic area of described the second ion-exchange membrane electrolyzer.
6. a printed circuit board etching waste liquid treatment process, is characterized in that, comprises the steps:
Use reservoir memory print plate etching waste liquor, described printed circuit board etching waste liquid comprises cupric chloride and hydrogenchloride and sodium-chlor;
Printed circuit board etching waste liquid in described reservoir is injected to evaporation unit, make the hydrogenchloride evaporation in printed circuit board etching waste liquid separated, the hydrogen chloride gas obtaining is passed in cooling tank, after condensation absorbs, forms hydrochloric acid;
Use the first electrolysis dashpot to receive the printed circuit board etching waste liquid of removing after hydrogenchloride;
Printed circuit board etching waste liquid after removal hydrogenchloride in described the first electrolysis dashpot is injected to the cathodic area of the first ion-exchange membrane electrolyzer, electrolysis produces copper simple substance, the hydrochloric acid of described cooling tank is injected to the positive column of described the first ion-exchange membrane electrolyzer, electrolysis produces chlorine, be passed in described cooling tank, condensation forms hydrochloric acid after absorbing again;
Electrolytic solution after described the first ion-exchange membrane electrolyzer electrolysis is injected to described the second ion-exchange membrane electrolyzer buffer zone, in the electrolysis of described positive column, produce chlorine, be passed in described cooling tank, after condensation absorbs, form hydrochloric acid; Make to be positioned at the cupric ion of electrolytic solution of described buffer zone and the cathodic area that sodium ion enters the second ion-exchange membrane electrolyzer, in the electrolysis of described cathodic area, produce copper simple substance and sodium hydroxide solution;
Use filtering basin to filter and collect described copper simple substance; And
Use the second electrolysis dashpot to collect described sodium hydroxide solution.
7. printed circuit board etching waste liquid treatment process according to claim 6, is characterized in that, the electrolytic solution after the positive column electrolysis of described the first ion-exchange membrane electrolyzer injects described cooling tank and circulates.
8. printed circuit board etching waste liquid treatment process according to claim 6, it is characterized in that, electrolytic solution after the positive column electrolysis of the second ion-exchange membrane electrolyzer injects described the first electrolysis dashpot, circulates in the positive column that then reenters the second ion-exchange membrane electrolyzer.
9. printed circuit board etching waste liquid treatment process according to claim 8, is characterized in that, described the first ion-exchange membrane electrolyzer of process in described the first electrolysis dashpot and the second ion-exchange membrane electrolyzer repeatedly electrolytic solution of circular treatment inject described cooling tank.
10. printed circuit board etching waste liquid treatment process according to claim 6, is characterized in that, circulates in the cathodic area that the sodium hydroxide solution in described the second electrolysis dashpot injects described the second ion-exchange membrane electrolyzer.
11. 1 kinds of printing plate etching solution treatment systems, it comprises: reservoir, with the evaporation unit of reservoir fluid communication, with cooling tank and first membrane electrolyser and a first electrolysis dashpot of evaporation unit fluid communication, the first membrane electrolyser has cathodic area and the positive column that utilizes anionic membrane to separate, the cathodic area of the first electrolysis dashpot and the first membrane electrolyser and evaporation unit fluid communication, the positive column of the first membrane electrolyser and cooling tank fluid communication.
12. printing plate etching solution treatment systems according to claim 11, is characterized in that: described the first dashpot and cooling tank fluid communication.
13. printing plate etching solution treatment systems according to claim 11, it is characterized in that: it further comprises second membrane electrolyser, the second membrane electrolyser comprises positive column, cathodic area and the buffer zone between positive column and cathodic area, between the positive column of the second membrane electrolyser and buffer zone, by anionic membrane, separate, between the cathodic area of the second membrane electrolyser and buffer zone, by cationic membrane, separate the positive column of the second membrane electrolyser and buffer zone and the first electrolysis dashpot fluid communication.
14. printing plate etching solution treatment systems according to claim 13, is characterized in that: described the second membrane electrolyser further comprises the temporary tank with the positive column fluid communication of the second membrane electrolyser, and temporary tank simultaneously and the first electrolysis dashpot fluid communication.
15. printing plate etching solution treatment systems according to claim 13, is characterized in that: it further comprises a filtration unit being connected with the second membrane electrolyser and the second electrolysis dashpot being connected with filtration unit.
16. printing plate etching solution treatment systems according to claim 15, is characterized in that: described the second electrolysis dashpot simultaneously with the cathodic area fluid communication of the second membrane electrolyser.
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| CN201210225689.9A CN103523977A (en) | 2012-07-03 | 2012-07-03 | Printing plate etching waste liquid treatment system and method |
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Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103979625A (en) * | 2014-04-25 | 2014-08-13 | 昆山市益民环保技术开发有限公司 | Mixing method for treating acid and alkaline etching waste liquid and nitric acid stripping waste liquid of printed-circuit boards |
| CN105523668A (en) * | 2015-12-04 | 2016-04-27 | 陈丽珊 | PCB ammonia-nitrogen wastewater zero discharge treatment method and device thereof |
| CN106007153A (en) * | 2016-08-09 | 2016-10-12 | 成都虹华环保科技股份有限公司 | System for treating precious metal recovery waste liquid |
| CN106676528A (en) * | 2015-11-06 | 2017-05-17 | 陶克（苏州）机械设备有限公司 | Regenerative device and method for nitric acid type solder stripping wastewater |
| WO2023217253A1 (en) * | 2022-05-12 | 2023-11-16 | 叶涛 | Method for progressive electrolytic recycling of acidic etching waste liquid and apparatus therefor |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101125719A (en) * | 2007-07-13 | 2008-02-20 | 深圳市中冠环保科技有限公司 | Method for reclaiming hydrochloric acid and metal copper from printed circuit acidic etching waste liquid |
| WO2008139021A1 (en) * | 2007-05-16 | 2008-11-20 | Pp Recycling Ltd. | Metthod of regeneration method of acid cupper(ii)chloride etching waste |
| CN101748430A (en) * | 2009-09-23 | 2010-06-23 | 王红华 | Copper recovery system of printed board acid etching waste solution and etching solution regeneration method |
| CN201834972U (en) * | 2010-10-19 | 2011-05-18 | 深圳市洁驰科技有限公司 | Regeneration system of acid etching liquid containing copper ions |
| CN102286746A (en) * | 2011-08-30 | 2011-12-21 | 广州市吉弛环保科技有限公司 | Recycling and regeneration of acid etching solution and copper recycling device |
-
2012
- 2012-07-03 CN CN201210225689.9A patent/CN103523977A/en active Pending
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2008139021A1 (en) * | 2007-05-16 | 2008-11-20 | Pp Recycling Ltd. | Metthod of regeneration method of acid cupper(ii)chloride etching waste |
| CN101125719A (en) * | 2007-07-13 | 2008-02-20 | 深圳市中冠环保科技有限公司 | Method for reclaiming hydrochloric acid and metal copper from printed circuit acidic etching waste liquid |
| CN101748430A (en) * | 2009-09-23 | 2010-06-23 | 王红华 | Copper recovery system of printed board acid etching waste solution and etching solution regeneration method |
| CN201834972U (en) * | 2010-10-19 | 2011-05-18 | 深圳市洁驰科技有限公司 | Regeneration system of acid etching liquid containing copper ions |
| CN102286746A (en) * | 2011-08-30 | 2011-12-21 | 广州市吉弛环保科技有限公司 | Recycling and regeneration of acid etching solution and copper recycling device |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103979625A (en) * | 2014-04-25 | 2014-08-13 | 昆山市益民环保技术开发有限公司 | Mixing method for treating acid and alkaline etching waste liquid and nitric acid stripping waste liquid of printed-circuit boards |
| CN106676528A (en) * | 2015-11-06 | 2017-05-17 | 陶克（苏州）机械设备有限公司 | Regenerative device and method for nitric acid type solder stripping wastewater |
| CN105523668A (en) * | 2015-12-04 | 2016-04-27 | 陈丽珊 | PCB ammonia-nitrogen wastewater zero discharge treatment method and device thereof |
| CN106007153A (en) * | 2016-08-09 | 2016-10-12 | 成都虹华环保科技股份有限公司 | System for treating precious metal recovery waste liquid |
| WO2023217253A1 (en) * | 2022-05-12 | 2023-11-16 | 叶涛 | Method for progressive electrolytic recycling of acidic etching waste liquid and apparatus therefor |
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