CN103513343A - Photoelectric conversion connector and manufacturing method of photoelectric conversion connector - Google Patents
Photoelectric conversion connector and manufacturing method of photoelectric conversion connector Download PDFInfo
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- CN103513343A CN103513343A CN201210209300.1A CN201210209300A CN103513343A CN 103513343 A CN103513343 A CN 103513343A CN 201210209300 A CN201210209300 A CN 201210209300A CN 103513343 A CN103513343 A CN 103513343A
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Abstract
The invention provides a photoelectric conversion connector and its manufacturing method. Without increasing the number of parts or processes, optical alignment between a photosemiconductor element and an optical waveguide member can be carried out automatically, and the photosemiconductor element is sealed when positions of the photosemiconductor element and the optical waveguide member are maintained reliably. In a connector (1), a first resin member (60) is prepared from light transparent resin and has a bare wire support part (62) and a reflecting surface (63A), wherein the bare wire support part is used for supporting a fiber-optic bare wire (C1) of a fiber-optic cable (C) used for transmitting optical signals; and the reflecting surface (63A) reflects an optical signal to change the direction of a light path such that the optical signal is transmitted between the fiber-optic cable (C) and a light-receptor element (10).
Description
Technical field
The present invention relates to the manufacture method of a kind of photoelectric conversion connector and photoelectric conversion connector.
Background technology
As the photoelectric conversion connector of transmitting photo-signal and electric signal, for example known have patent documentation 1 to the connector of patent documentation 3 disclosures.
The connector of patent documentation 1 is the connector chimeric with being configured in matching connector on circuit substrate, and it is connecting the leading section of the fiber optic cables that extend in parallel with this circuit substrate.
This connector has shell, and this shell is formed with the recess to matching connector towards upper opening.In this recess, photosemiconductor utilization is configured in position, the posture that regulation was installed and be held in to installation component (platform) on the diapire of this recess regularly, this photosemiconductor be subject to light, light-emitting area towards the rear that forms the direction vertical with described diapire.In addition, on the diapire of described recess, the position configuration at described installation component rear has ground plate, with the leading section that is formed on gathering sill on the plate face of this ground plate and supports described optical fiber.
In the connector of described patent documentation 1, adjusting the height of described gathering sill, make after photosemiconductor aligns with bare optical line optics, under this state, to make in the recess of aqueous resin inflow shell, thereby photosemiconductor and optical fiber leading section are fixed.
In the optical module of described patent documentation 2, between each projection of described socket and mounting hole, be provided with some spaces, during assembling optical module, when confirming light quantity with ready infrared rays receiver separately and light quantity monitor, socket is moved in the scope in space, with optical mode, carry out aliging of socket and optical semiconductor.
Patent documentation 1: Japanese Patent Laid-Open 2010-135109
Patent documentation 2: Japanese Patent Laid-Open 2007-264411
Patent documentation 3: Japanese Patent Laid-Open 2008-256870
In patent documentation 1, because needs arrange installation component on substrate, so number of spare parts increases because of this installation component.Therefore in addition, owing to automatically not carrying out the mechanism of optical alignment, while need to adjust the height of gathering sill, carry out optical alignment, process number increases because of this adjustment.The increase of this number of spare parts and process number can cause the increase of manufacturing cost.Also have, owing to making aqueous resin flow in the recess of shell after photosemiconductor and optical fiber leading section optical alignment, therefore may by this liquid resin, be pressed and cause the position of photosemiconductor and optical fiber leading section to produce departing from because of the photosemiconductor after adjusting and optical fiber leading section.
In patent documentation 2, need to utilize ready infrared rays receiver and light quantity monitor separately to confirm that light quantity carries out aliging between optical semiconductor and socket on one side, correspondingly, process number increase, causes manufacturing cost increase.In addition, in the such optical module of patent documentation 2, also can consider to carry out sealing photosemiconductor at the potting resin in recess of accommodating of socket, but this resin may leak and be attached to the reflecting surface of socket from accommodating recess in this case, avoid this situation to carry out sealing operation and be difficult to.Therefore, for avoiding the leakage of resin and adhering to, need to process or carry out potting resin with accurate filling device the shape of socket, this also can cause the increase of manufacturing cost.
In addition, in patent documentation 3, need to use ready pattern recognition device separately to align with optical mode, correspondingly, process number increases, and causes manufacturing cost to increase.In addition, because the space of altimetric compensation member when sealing is subject to light/light-emitting component keeps the state towards upper opening, the material for sealing therefore leaking may be attached on the reflecting surface of thin film optical wave-guide, avoid this situation to carry out the sealing operation difficulty that becomes.Therefore, for avoiding the leakage of material for sealing and adhering to, need to process or carry out resin by injection with accurate injection device the shape of altimetric compensation member, this also can cause the increase of manufacturing cost.
Summary of the invention
In view of the foregoing, the object of the present invention is to provide a kind of photoelectric conversion connector, it can automatically carry out the optical alignment between optical semiconductor and light guide member in the situation that not increasing number of spare parts and process number, and the state reliably being maintained in both positions is by optical semiconductor sealing.
The<the first invention>
Photoelectric conversion connector of the present invention has: optical semiconductor, and this optical semiconductor is for transmitting photo-signal and electric signal; Supporting member, this supporting member supports described optical semiconductor; Contact member, this contact member is connected with described optical semiconductor, and contacts with the cooperation contact of matching connector; And first resin component element, this first resin component element is by integrally formed described optical semiconductor, supporting member and the contact member of keeping, and to this optical semiconductor sealing of major general.
Above-mentioned photoelectric conversion connector is characterised in that, this photoelectric conversion connector has integrally formed the second resin component element on the outside surface of described the first resin component element, described the first resin component element is made with light-transmissive resin, and have: waveguide support, this waveguide support is to supporting for transmitting the light guide member of light signal; And reflecting surface, this reflecting surface reflects to make light path break-in by light signal, thereby this light signal is transmitted between light guide member and optical semiconductor.
In the present invention, in the manufacture process of connector, by the first resin component element and optical semiconductor, supporting member and contact member is integrally formed, the first resin component element forms waveguide support and the reflecting surface of this first resin component element in sealing optical semiconductor at least.Therefore,, in the moment that has been shaped the first resin component element, optical semiconductor and waveguide support are aligned.
Consequently, only light guide member need be disposed to waveguide support, just can automatically carry out the optical alignment between light guide member and optical semiconductor.
In addition, when the first resin component element is shaped, because be carries out aliging between optical semiconductor and waveguide support in optical semiconductor sealing, the optical semiconductor after the preliminary stage that therefore can not occur in shaping as in the past aligns and the relative position of optical waveguide depart from such situation because of the filling of resin.Also have, in the present invention, do not need part and device for described alignment, also do not need to be only used for the operation of aliging, therefore, can correspondingly suppress the increase of cost.
Also can be, supporting member and contact member utilize metal lead frame to be made into a member, and separated from one another and form after integrally formed with the first resin component element, and described contact member is the terminal forming as a plurality of slice sheets.
By utilizing lead frame supporting member to be become to a member with contact structure manufacture, after being shaped, the first resin component element only need just terminal can be set by supporting member is separated with contact member, therefore, after being shaped, the first resin component element do not need to install the operation as the terminal of split member.Therefore, operation becomes simply, and the positional precision of terminal improves.
Also can be, supporting member be to make with the substrate of resin or pottery system, and contact member is printed on described supporting member.
Also can be, photoelectric conversion connector is except optical semiconductor, also have the driving arrangement that drives this optical semiconductor, this driving arrangement is connected with optical semiconductor and contact member, thereby by this driving arrangement, optical semiconductor is connected indirectly with contact member.
The<the second invention>
The manufacture method of photoelectric conversion connector of the present invention is characterised in that, have: arrangements of components operation, in this arrangements of components operation, using the position of the datum hole that forms as benchmark on supporting member or the member that is connected with this supporting member, with respect to described supporting member, optical semiconductor is positioned, thereby this optical semiconductor is disposed to supporting member, and wherein, described supporting member supports the described optical semiconductor for transmitting photo-signal and electric signal, electric-conductor connects operation, at this electric-conductor, connects in operation, and the contact member that utilizes electric-conductor that the cooperation contact with matching connector is contacted is connected in optical semiconductor, the first ester moulding operation, in this first ester moulding operation, as benchmark, with respect to described supporting member, waveguide support and reflecting surface have been carried out under the state of location usining the position of described datum hole, utilize light-transmissive resin by described optical semiconductor, supporting member and contact member are integrally formed, and to described light-transmissive resin sealing for major general's optical semiconductor, wherein, described waveguide support is to supporting for transmitting the light guide member of light signal, described reflecting surface reflects to make light path break-in by light signal, thereby this light signal is transmitted between light guide member and optical semiconductor, and the second ester moulding operation, in this second ester moulding operation, in the outside surface of the light-transmissive resin being shaped in described the first ester moulding operation, the integrally formed resin different from this light-transmissive resin.
In the present invention, in the first ester moulding operation, light-transmissive resin is integrally formed in optical semiconductor, supporting member and contact member, and this light-transmissive resin is to the sealing of major general's optical semiconductor, and forms waveguide support and reflecting surface.That is,, in the first ester moulding operation, when light-transmissive resin is integrally formed in optical semiconductor, form waveguide support and the reflecting surface of this light-transmissive resin.In addition, the location of the molding die of the light-transmissive resin in the location of the optical semiconductor in arrangements of components operation and the first ester moulding operation is to using the position of identical datum hole to carry out as benchmark.Therefore,, by the light-transmissive resin that is shaped, can carry out exactly aliging between the waveguide support of optical semiconductor and light-transmissive resin in the first ester moulding operation.Consequently, only light guide member need be disposed to waveguide support, just can automatically carry out the optical alignment between light guide member and optical semiconductor.
In addition, in the first ester moulding operation, owing to carrying out aliging between the waveguide support of optical semiconductor and light-transmissive resin when carrying out sealing optical semiconductor by shaping light-transmissive resin, the optical semiconductor after the preliminary stage that therefore can not occur in shaping light-transmissive resin as in the past aligns and the relative position of optical waveguide depart from such situation because of the filling of resin.Also have, in the present invention, do not need part and device for described alignment, also do not need to be only used for the operation of aliging, therefore, can correspondingly suppress the increase of cost.
Also can be, supporting member and contact member utilize metal belt bracket lead frame to be made into a member, on the bracket of this belt bracket lead frame, form datum hole, contact member is the terminal forming as a plurality of slice sheets, after the first ester moulding operation, there is the cut-out separation circuit that described contact member is cut open at the part of stretching out from light-transmissive resin and bracket, after described cut-out separation circuit, there is the bending operation that makes the bending of contact member form the terminal shape of regulation.
By supporting member is become with belt bracket lead frame to a member with contact structure manufacture, after the first ester moulding operation, only need just terminal can be set by supporting member is separated with contact member, therefore, do not need to install the operation as the terminal of split member, and the positional precision of terminal improves.
Also can be, supporting member be to make with the substrate of resin or pottery system, on this substrate, is formed with datum hole, and contact member is printed on described supporting member.
Also can be, before electric-conductor connects operation, there is the equipment arrangement step on the member that the driving arrangement that drives optical semiconductor is configured in to supporting member or is connected with this supporting member, at described electric-conductor, connect in operation, driving arrangement is connected with optical semiconductor and contact member, thereby by this driving arrangement, optical semiconductor is connected indirectly with contact member.
(invention effect)
As mentioned above, in the present invention, when the first resin component element (light-transmissive resin) is integrally formed in optical semiconductor, form waveguide support and the reflecting surface of this first resin component element, therefore, in the moment that has been shaped the first resin component element, can realize the optical alignment between optical semiconductor and waveguide support.Therefore,, in passing through the integrally formed connector obtaining, only light guide member need be disposed to waveguide support just can carry out the optical alignment between light guide member and optical semiconductor automatically.In addition, as the second invention, by usining that the location of optical semiconductor is carried out as benchmark in the position of identical datum hole and for the location that light-transmissive resin is shaped, can in integrally formed, carry out accurately aliging between optical semiconductor and optical waveguide support.
In addition, in the present invention, owing to carrying out aliging between the waveguide support of optical semiconductor and light-transmissive resin in optical semiconductor sealing, the optical semiconductor after the preliminary stage that therefore can prevent from being created in the shaping of light-transmissive resin as in the past aligns and the relative position of optical waveguide depart from such situation because of the filling of resin.
Also have, in the present invention, do not need part and device for described alignment, also do not need to be only used for the operation of aliging, therefore, can correspondingly suppress the increase of cost.
Accompanying drawing explanation
Fig. 1 is the stereographic map that the photoelectric conversion connector of the first embodiment is represented together with matching connector.
Fig. 2 is the stereographic map that the connector of Fig. 1 is represented with the posture spinning upside down.
Fig. 3 (A) is that the face parallel with the bearing of trend of light guide member of using of the connector of Fig. 2 dissects the longitudinal section obtaining, and Fig. 3 (B) means the partial enlarged drawing of the Fig. 3 (A) optical semiconductor near.
Fig. 4 is that the face vertical with the bearing of trend of light guide member of using of the connector of Fig. 2 dissects the longitudinal section obtaining, and Fig. 4 (A) represents the cross section of signal terminal position, and Fig. 4 (B) represents the cross section of ground terminal position.
Fig. 5 means the stereographic map of belt bracket lead frame.
Fig. 6 means the stereographic map that the state of optical semiconductor and driving arrangement is installed on the belt bracket lead frame of Fig. 5.
Fig. 7 means the stereographic map of the state of integrally formed the first resin component element on the belt bracket lead frame of Fig. 6.
Fig. 8 means that the terminal of belt bracket lead frame of Fig. 7 and sticking department are by the stereographic map of the state that cuts off and be bent from bracket.
Fig. 9 means the stereographic map of the state of integrally formed the second resin component element on the outside surface of the first resin component element of Fig. 8.
Figure 10 is the stereographic map that the photoelectric conversion connector of the second embodiment is represented together with matching connector.
Figure 11 is the stereographic map that the connector of Figure 10 is represented with the posture spinning upside down.
Figure 12 is that the face parallel with the bearing of trend of light guide member of using of the connector of Figure 11 dissects the longitudinal section obtaining.
Figure 13 means the stereographic map of substrate.
Figure 14 means the stereographic map that the state of optical semiconductor and driving arrangement has been installed on the substrate of Figure 13.
Figure 15 means the stereographic map of the state of integrally formed the first resin component element on the substrate of Figure 14.
Figure 16 means the stereographic map of the cut state of substrate of Figure 15.
Figure 17 means the stereographic map of the state of integrally formed the second resin component element on the outside surface of the first resin component element of Figure 16.
(symbol description)
1 connector 120 driving arrangements
2 matching connector 130 substrates (supporting member)
3 connector 140 distributions (contact member)
4 matching connector 160 first resin component elements
10 photo detectors (optical semiconductor), 162 bare wire supports (waveguide support)
20 driving arrangement 163A reflectings surface
30 supporting member 170 second resin component elements
40 terminals (contact member), 172 coating supports (waveguide support)
60 first resin component element 190 mating terminals (cooperation contact)
62 bare wire supports (waveguide support) C fiber optic cables (light guide member)
63A reflecting surface F lead frame
70 second resin component element F1 brackets
72 coating supports (waveguide support) F2A datum hole
90 mating terminals (cooperation contact) P substrate raw materials
110 photo detectors (optical semiconductor) P1 datum hole
Embodiment
Below, the embodiment of photoelectric conversion connector of the present invention is described with reference to the accompanying drawings.
[structure of connector]
Fig. 1 is the stereographic map that the photoelectric conversion connector of present embodiment 1 is represented together with matching connector 2, represents the chimeric front state of connector.Fig. 2 is the stereographic map that the connector of Fig. 11 is represented with the posture spinning upside down.Fig. 3 (A) is that the face parallel with the bearing of trend of light guide member (fiber optic cables C) of using of the connector 1 of Fig. 2 dissects the longitudinal section obtaining, and Fig. 3 (B) means the partial enlarged drawing of the Fig. 3 (A) optical semiconductor (photo detector 10) near.Fig. 4 is that the face vertical with the bearing of trend of light guide member of using of the connector 1 of Fig. 2 dissects the longitudinal section obtaining, and Fig. 4 (A) represents the cross section of signal terminal 41 positions, and Fig. 4 (B) represents the cross section of ground terminal 42 positions.
As shown in Figure 1, the photoelectric conversion connector 1 of present embodiment (below referred to as connector 1) is the connector that is connecting the leading section (Tu1Zhong left part) of the fiber optic cables C as light guide member extending along fore-and-aft direction (left and right directions in Fig. 1), itself and chimeric connection of matching connector 2 being arranged on circuit substrate (not shown).This connector 1 is for light signal being converted to the connector of electric signal, under the state being connected with matching connector 2 at connector 1, available connector 1 converts the light signal sending from fiber optic cables C to electric signal, and this electric signal is sent to the circuit part of the described circuit substrate that matching connector 2 is installed.
The fiber optic cables C being connected with connector 1 itself is known, as shown in Fig. 3 (A), it has the optical fiber bare wire C1 (being called bare wire C1 below) that with the covering of glass system, the fibre core of glass system covered and make, cover the coating C2 being formed by resin etc. of this bare wire C1.In the present embodiment, as shown in Fig. 3 (A), the coating C2 of described fiber optic cables C leading section is removed, and described bare wire C1 exposes.
As shown in Fig. 3 (A), Fig. 3 (B), described connector 1 has: for light signal being converted to the photo detector 10 as optical semiconductor of electric signal; Drive the driving arrangement 20 of photo detector 10; Support the supporting member 30 of this photo detector 10 and driving arrangement 20; A plurality of terminals 40 as contact member that contact with the mating terminals 90 of matching connector 2 described later (with reference to Fig. 1, Fig. 2); Described photo detector 10 is connected with described driving arrangement 20, and the metal wire 50 as electric-conductor that this driving arrangement 20 is connected with described terminal 40 (with reference to Fig. 4 (A), Fig. 4 (B)); By integrally formed the first resin component element 60 that keeps described photo detector 10, driving arrangement 20, supporting member 30, terminal 40 and metal wire 50; And on the outside surface of this first resin component element 60 integrally formed the second resin component element 70.In the present embodiment, this first resin component element 60 and the second resin component element 70 form the shell of connector 1.
In the present embodiment, as mentioned above, connector 1 is that it has the photo detector 10 as optical semiconductor for light signal being converted to the connector of electric signal, but this connector 1 can be also for converting the electrical signal to the connector of light signal.In this case, on connector 1, the light-emitting component (for example light-emitting component of vertical cavity surface emitting (VCSEL) laser class) that is for example provided as the surface-emitting type of optical semiconductor replaces this photo detector 10.In this case, as driving arrangement, can be provided for driving the equipment (for example VCSEL driver) of described light-emitting component.
Supporting member 30 is made by sheet metal is carried out to stamping-out processing, and it extends and arrange along fore-and-aft direction (left and right directions in Fig. 3 (A)).The first half of this supporting member 30 (the shown part of Fig. 3 (A)) forms the band plate-like supporting board 31 with the plate face vertical with above-below direction.
As mentioned above, this supporting board 31 is provided with described photo detector 10 and driving arrangement 20 on its plate face (upper surface in Fig. 3 (A)), so that this photo detector 10 and driving arrangement 20 are supported.
As shown in Figure 8, latter half of (not shown in Fig. 3 (A)) of this supporting member 30 is provided with locked portion 32, this locked portion 32 forms greatly than described supporting board 31 on the Width of connector 1, and the end positions on this Width has and this Width crooked plate face vertically.This locked portion 32 has the hole portion of running through along connector Width, and the lower edge of ，Gai hole portion (upper limb in Fig. 2) works as the locked edge 32A of the locking plate 101A engaging with matching connector 2 described later as shown in Figure 1.
A plurality of terminals 40 have signal terminal 41 and ground terminal 42.As shown in Fig. 4 (A), Fig. 4 (B), the second resin component element 70 that this signal terminal 41 and ground terminal 42 utilize the first resin component element 60 and cover this first resin component element 60 is by integrally formed by dual maintenance, and each terminal 40 passes through metal wire 50 and is connected with driving arrangement 20.As shown in Fig. 4 (A), signal terminal 41 forms with described supporting member 30 splits, and as shown in Fig. 4 (B), ground terminal 42 is connected (simultaneously also with reference to Fig. 5, Fig. 6) with described supporting member 30.
As shown in Fig. 4 (A) is clear, signal terminal 41 has: the upper arm parts 41A that extend along connector Width (left and right directions in Fig. 4 (A)) position identical with supporting member 30 on above-below direction; Crooked and extend towards below from this upper arm parts 41A, and with the contact arm 41B of the corresponding contact site 91A-1 contact of the cooperation signal terminal 91 of matching connector 2; And crooked from this contact arm 41B, and the lower arm part 41C inwards extending on described Width along the lower surface of connector 1, signal terminal 41 is roughly horizontal U font.
Described upper arm parts 41A is held in the first resin component element 60 and the second resin component element 70, the end of the inner side on the described Width of described upper arm parts 41A, is that near ends supporting member 30 form the connecting portion 41A-1 being connected with driving arrangement 20 with metal wire 50.In addition, described contact arm 41B is held in the second resin component element 70, the plate toward the outer side on described Width of described contact arm 41B show out and with the described corresponding contact site 91A-1 contact of matching connector 2.
Except being connected with supporting member 30, the shape of ground terminal 42 is identical with the shape of signal terminal 41, therefore, and for the structure of this ground terminal 42, as shown in Fig. 4 (B), be labeled in and on the basis of symbol of signal terminal 41 each several parts, add the symbol that " 1 " obtain and the description thereof will be omitted.
The first resin component element 60 use light-transmissive resins are made, and from the light signal of fiber optic cables C, can advance in the inside of this first resin component element 60.As shown in Fig. 3 (A), Fig. 3 (B) and Fig. 4 (A), Fig. 4 (B), this first resin component element 60 is integrally formed in photo detector 10, driving arrangement 20, metal wire 50 and supporting member 30, and this photo detector 10 and driving arrangement 20 are carried out to sealing.
Described the first resin component element 60 is the roughly rectangular parallelepiped profile using fore-and-aft direction as length direction, as shown in Fig. 2 and Fig. 3 (A), its roughly latter half of upper surface on fore-and-aft direction is formed with slot part 61, and this slot part 61 is sagged and extends along fore-and-aft direction at the middle position of connector Width.As shown in Fig. 3 (A), position is in the scope of rear end near ，Cong the place ahead, and the V-shaped valley that the cross section of using the face vertical with fore-and-aft direction to dissect to obtain of described slot part 61 is in the shape of the letter V forms bare wire support 62.This bare wire support 62 disposes the bare wire C1 that the leading section at fiber optic cables C exposes, and to this bare wire, C1 supports.
As shown in Fig. 3 (A), Fig. 3 (B), in slot part 61, described bare wire support 62 the place ahead be formed with than the foot of described bare wire support 62 towards above protuberance protrusion 63.
The rear end face of this protrusion 63 becomes the face vertical with fore-and-aft direction, and it is face with the front end face that is configured in the bare wire C1 on described bare wire support 62 and contacts.
In addition, the leading section of this protrusion 63 forms to convex curvature in the scope of front upper place, the inside surface of this convex curvature, is that the inside surface of concavity bending works the reflecting surface 63A of light path break-in as the light signal for reflecting from fiber optic cables C.As shown in Fig. 3 (A), Fig. 3 (B), this reflecting surface 63A is positioned at the top of photo detector 10, as the light path dotting in Fig. 3 (B), the light signal forwards advancing in described protrusion 63 from the front end face of the bare wire C1 of fiber optic cables C by described reflecting surface 63A reflection, made light path towards below break-in, thereby focus on the sensitive surface (upper surface) of photo detector 10.
As depicted in figs. 1 and 2, the second resin component element 70 is to make with the resin of non-light transmittance, is roughly rectangular parallelepiped profile, and as shown in Fig. 3 (A), the second resin component element 70 extends to the first resin component element 60 rear.At the roughly first half of this second resin component element 70, side vertical with connector Width and that extend along fore-and-aft direction, sagging with position corresponding to terminal 40, has formed the terminal groove 71 extending along the vertical direction.What in this terminal groove 71, contain signal terminal 41 and ground terminal 42 respectively contacts arm 41B, 42B, and the plate of this contact arm 41B, 42B is showed out.As shown in Fig. 4 (A), Fig. 4 (B), this terminal groove 71 allows corresponding contact site 91A-1, the 92A-1 of mating terminals 90 to enter under the chimerism of connector.
As shown in Figure 1 and Figure 2, the roughly latter half of of described the second resin component element 70 forms narrowlyer than described roughly first half on connector Width.This roughly latter half of side is positioned at the position identical with the outside surface (locked portion 32 is with reference to Fig. 8) of the locked portion 32 of supporting member 30 on this connector Width, forms same together with this outside surface.Described side is formed with the corresponding recess of measuring of thickness of slab of sagging in the position corresponding with locked Bu32 hole portion with this locked portion 32.Under the chimerism of connector, the locking plate 101A of matching connector 2 enters in described recess, thereby can be upper in the chimeric direction (above-below direction) of connector and the locked edge 32A engaging of connector 1.
As shown in Fig. 2 and Fig. 3 (A), described the second resin component element 70 is sagged in the middle position of connector Width, corresponding with the bare wire support 62 of the first resin component element 60 position at described roughly latter half of upper surface, forms the slot part that extends along fore-and-aft direction as coating support 72.This coating support 72 forms the V-shaped valley that the cross section using the face vertical with fore-and-aft direction to dissect to obtain is in the shape of the letter V, as shown in Fig. 2 and Fig. 3 (A) are clear, this coating support 72 is on the extended line of described bare wire support 62, forms a slot part together with this bare wire support 62.The part that the coating C2 of 72 pairs of fiber optic cables C leading sections of this coating support covers supports.In the present embodiment, the slot part being formed by described bare wire support 62 and described coating support 72 works as the waveguide support that the leading section of fiber optic cables C is supported.
[manufacturing process of connector]
Below, the manufacturing process of connector 1 is described according to Fig. 5 to Fig. 9.First, as shown in Figure 5, by the stamping-out of sheet metal, process, prepare the lead frame F with bracket F1 making in the mode of supporting member 30 and a tabular component of a plurality of terminal 40 formations.In the present embodiment, this lead frame F is corresponding with the connector group being formed by a plurality of connectors 1, under the state that the supporting member 30 corresponding with each connector 1 difference arranged at the bearing of trend along this terminal 40 with terminal 40, is connected with a bracket F1.
Described bracket F1 has: with the front end of supporting member 30 and rear end is connected and two vertical bracket part F2 extending along the bearing of trend of terminal 40; And on this bearing of trend in adjacent supporting member 30 position each other along fore-and-aft direction (direction vertical with described bearing of trend) extend and by described vertical bracket part F2 a plurality of transverse bracket F3 of portion connected to one another.As shown in Figure 5, terminal 40 and locked portion 32 are directly connected with the described transverse bracket F3 of portion.In addition, among a plurality of terminals 40, ground terminal 42 is also directly connected with the supporting board 31 of supporting member 30, but signal terminal 41 is not directly connected with described supporting board 31, but is indirectly connected with described supporting board 31 by bracket F1.In addition, described vertical bracket part F2 at this vertical bracket part F2, extend longitudinally on the position corresponding with supporting member 30 be formed with datum hole F2A.
Then, as shown in Figure 6, on the supporting board 31 of supporting member 30, the datum hole F2A of usining locates photo detector 10 and driving arrangement 20 for and is installed on described supporting board 31 as benchmark.For example, based on taking with the camera (not shown) that is arranged on described lead frame F top the image obtaining, with image processing apparatus (not shown) identification datum hole F2A position, carry out the location of this photo detector 10 and driving arrangement 20.
Also have, utilize metal wire 50 that this photo detector 10 is connected with driving arrangement 20, and this driving arrangement 20 is connected with each terminal 40.By known Bonding, carry out the connection of this metal wire 50.
Then, as shown in Figure 7, utilize light-transmissive resin that photo detector 10, driving arrangement 20, supporting member 30, terminal 40 and metal wire 50 is integrally formed, thereby be shaped the first resin component element 60.As benchmark, with respect to supporting member 30, carried out carrying out under the state of location the shaping of this first resin component element 60 usining the datum hole F2A of bracket F1.Particularly, for example, will be located at register pin on the molding die (not shown) of this first resin component element 60 through described datum hole F2A, and this mould is positioned to supporting member 30, under this state, in the inside of this mould, fill light-transmissive resin.The result of described the first resin component element 60 of being shaped is, available the first resin component element 60 is photo detector 10, driving arrangement 20 and metal wire 50 sealing, and forms bare wire support 62 and the reflecting surface 63A of this first resin component element 60.
The light-transmissive resin that forms described the first resin component element 60 comparatively it is desirable to use the higher light-transmissive resin of transmissivity concerning the wavelength of the light signal of transmission.In addition, the first resin component element 60 comparatively it is desirable to be shaped by transfer moudling.By being shaped by transfer moudling, the negative effects such as fracture of metal wire 50 in the time of avoiding being shaped.
Then, as shown in Figure 8, after the F3 of transverse bracket portion of the part of stretching out from the first resin component element 60 and described bracket F1 cuts open, make this terminal 40 and locked portion 32 crooked and form shape separately terminal 40 and locked portion 32.Particularly, near described terminal 40 and locked portion 32 position the first resin component element 60 of the extension stretching out from described the first resin component element 60 is crooked upward, and near the free end of this extension, position forms towards connector Width inside bend then.
Then, as shown in Figure 9, integrally formed the second resin component element 70 on the outside surface of the first resin component element 60.The same with the situation of the first resin component element 60, by the molding die of this second resin component element 70 (not shown) being positioned as benchmark under the state of supporting member 30, at the inside of this mould potting resin, to carry out the shaping of this second resin component element 70 usining the datum hole F2A of bracket F1.The result of described the second resin component element 70 of being shaped is that available the second resin component element 70 covers the first resin component element 60, and forms terminal groove 71 and the coating support 72 of this second resin component element 70.The second resin component element 70 can easily be shaped by for example injection molded.After the second resin component element 70 is shaped, supporting member 30 is cut open with the vertical bracket part F2 of bracket F1, thereby complete connector 1.Afterwards, utilize bonding agent etc. to be fixed the leading section of fiber optic cables C being disposed under the bare wire support 62 of this connector 1 and the state of coating support 72, thereby connector 1 is connected with the leading section of fiber optic cables C.
In the present embodiment, when the first resin component element 60 is shaped, when this first resin component element 60 is integrally formed in photo detector 10, form bare wire support 62 and the reflecting surface 63A of this first resin component element 60.In addition, the location of the molding die of the location of photo detector 10 and the first resin component element 60 is to using identical datum hole F2A position to carry out as benchmark.Therefore,, by first resin component element 60 that is shaped, can carry out exactly aliging between photo detector 10 and described bare wire support 62 and reflecting surface 63A.
In addition, when the second resin component element 70 is shaped, when this second resin component element 70 is integrally formed in the outside surface of the first resin component element 60, form the coating support 72 of this second resin component element 70.In addition, the location of the molding die of the second resin component element 70 is also the same with the location of the location of described photo detector 10 and the molding die of the first resin component element 60, usings datum hole F2A position to carry out as benchmark.Therefore,, by this second resin component element 70 that is shaped, can carry out exactly aliging between described photo detector 10, described bare wire support 62 and reflecting surface 63A and described coating support 72.Consequently, as long as at the waveguide support configuration fiber optic cables C being formed by bare wire support 62 and coating support 72, just can automatically carry out the optical alignment between these fiber optic cables C and photo detector 10.
In addition, when the first resin component element 60 is shaped, because be carries out aliging between this photo detector 10 and bare wire support 62 in photo detector 10 sealing, the situation that the photo detector after the preliminary stage that therefore can not occur in shaping as in the past aligns and the relative position of fiber optic cables depart from because of the filling of resin.Also have, in the present embodiment, do not need part and device for described alignment, also do not need to be only used for the operation of aliging, therefore, can correspondingly suppress the increase of cost.
In addition, in the present embodiment, by supporting member 30 and terminal 40 being made to a member with lead frame F, only need supporting member 30 is separated with terminal 40 after the first resin component element 60 is shaped, therefore, after the first resin component element 60 is shaped, do not need to install the operation as the terminal of split member.Therefore, operation becomes simply, and the positional precision of terminal 40 improves.
[structure of matching connector]
The structure of matching connector 2 then, is described.As shown in Figure 1, matching connector 2 has: the plastic shell 80 of rectangular parallelepiped profile roughly; Arrangement is held in a plurality of metal terminal 90 (being called mating terminals 90 below) of this shell 80; And be held in this shell 80 and with the locking component 100 of locked portion 32 engagings of connector 1.
As shown in Figure 1, roughly first half at described sidewall 82, the inside surface of this sidewall 82, upper surface and outside surface are sagged in the position corresponding with mating terminals 90, are formed for keeping the terminal of mating terminals 90 to keep groove 82A (simultaneously also with reference to Fig. 4 (A), Fig. 4 (B)).In other words, as shown in Fig. 4 (A), Fig. 4 (B), at the upper relative terminal of fore-and-aft direction (direction vertical with the paper of Fig. 4 (A), Fig. 4 (B)), keep the opposed inner walls face of groove 82A by the 82B of connecting wall portion extending along the vertical direction within terminal keeps groove 82A, to be connected each other.In addition, as shown in Figure 1, on described sidewall 82, sag near the inside surface of this sidewall 82, upper surface and outside surface position rear end, is formed for keeping the locking component of described locking component 100 to keep groove 82C.
As shown in Fig. 4 (A), Fig. 4 (B), mating terminals 90 is by the slice sheet of sheet metal is bent upwards and is made in thickness of slab side, is roughly horizontal S font.A plurality of mating terminals 90 have: the cooperation signal terminal 91 contacting with the signal terminal 41 of connector 1 (with reference to Fig. 4 (A)), the cooperation ground terminal 92 (with reference to Fig. 4 (B)) contacting with the ground terminal 42 of connector 1.
Coordinate signal terminal 91 to have: upper than the close roughly U font 91A of portion that receives recess 84 sides of the 82B of connecting wall portion at connector Width (left and right directions of Fig. 4 (A), Fig. 4 (B)); At this, roughly turn back the upper end that is positioned at a near the shank described connecting wall 82B of portion in two shanks of the 91A of U font portion, and the maintained portion 91B extending downwards along the outside surface of the 82B of this connecting wall portion; And from this maintained portion 91B lower end vertical curve, and the connecting portion 91C that keeps groove 82A to stretch out outward towards terminal.
Being positioned in two shanks of the described roughly U font 91A of portion receives near another shanks recess 84 to using as free-ended upper end to receiving the mode of recess 84 convex curvature crooked, forms the corresponding contact site 91A-1 with the contact arm 41B contact of the signal terminal 41 of connector 1.As shown in Fig. 4 (A), Fig. 4 (B), this correspondence contact site 91A-1 is to receiving recess 84 outstanding.With the chimeric state of connector 1 under, the contact arm 41B of signal terminal 41 presses described corresponding contact site 91A-1 on connector Width to the 82B of connecting wall portion, thus the roughly 91A of U font portion elasticity displacement on this connector Width described in making.
Maintained portion 91B the both side edges place of extending along the vertical direction by from above be pressed into terminal and keep groove 82A, consequently, can coordinate signal terminal 91 to remain on this terminal and keep in groove 82A.The lower surface of connecting portion 91C than the lower surface of the diapire of shell 80 81 slightly on the lower, is weldingly connected with the corresponding circuits portion of circuit substrate.
Coordinate the shape of ground terminal 92 identical with the shape of described cooperation signal terminal 91, therefore, for this, coordinate the structure of ground terminal 92, as shown in Fig. 4 (B), be labeled in and on the basis of the symbol that coordinates signal terminal 91 each several parts, add the symbol that " 1 " obtain and the description thereof will be omitted.
Locking component 100 is by be roughly the mode of reverse U shape to observe on fore-and-aft direction, sheet metal to be bent upwards and to be made in thickness of slab side, and it has on connector Width two plate-like portions in opposite directions.As shown in Figure 1, in these two plate-like portions, the board 101 that is positioned at sidewall 82 inner surface side on connector Width is formed with the locking plate 101A that Yi Qi lower end cuts towards the mode of receiving recess 84 sides to extend, thereby can be in the chimeric direction of connector and 32 engagings of described locked portion.
In addition, in described two plate-like portions, the outer board 102 that is positioned at the sidewall 82 outside surface sides on connector Width have as both side edges place by from above be pressed into the function that locking component keeps the maintained portion of groove 82C.In this outer board 102 lower end, be formed with the fixed part 102A that keeps the outside of groove 82C to extend to locking component, the lower surface of this fixed part 102A is weldingly connected with the corresponding portion of circuit substrate, thereby this connector 1 is fixed on circuit substrate.As the corresponding portion of the described circuit substrate being weldingly connected with described fixed part 102A, by forming grounding circuit (not shown), can also form ground structure herein.
[the chimeric connecting moves of connector]
Below, the chimeric connecting moves between connector 1 and matching connector 2 is described.First, as shown in Figure 1, to receive recess 84 at circuit substrate (not shown), matching connector 2 to be above installed towards the posture of upper opening, and the connector 1 that the leading section with fiber optic cables C is connected moves on to the top position of described matching connector 2 with bare wire support 62 and coating support 72 posture downward.
Then, described connector 1 is moved towards below, make in its receiving recess 84 that is embedded into matching connector 2.Consequently, the corresponding contact site 91A-1 of the signal terminal 41 of connector 1 and ground terminal 42 and the cooperation signal terminal 91 of matching connector 2 and coordinate the corresponding contact site 92A-1 Elastic Contact of ground terminal 92.In addition, the bottom of the locking plate 101A of matching connector 2 enter in the locked Bu32 hole portion of connector 1 and with this locked edge 32A engaging, thereby prevent that connector from throwing off to each other accidentally, the chimeric connection of connector completes.
Under the chimerism of connector, the light signal transmitting in fiber optic cables C by the reflecting surface 63A of the first resin component element 60 reflection, made light path towards below break-in, and focus on the sensitive surface of photo detector 10.Then, by this photo detector 10, convert light signal to electric signal, and via terminal 40 and mating terminals 90, send described electric signal the corresponding circuits portion of the circuit substrate that matching connector 2 is installed to.
In the present embodiment, be on the first resin component element, to form bare wire support, and on the second supporting member, form coating support, but as an alternative, for example also can on the first resin component element, form bare wire support and coating support the two.
The<the second embodiment>
In the present embodiment, supporting member is resinous substrate, contact member is the printed wiring being integrally formed with this substrate on the plate face of this substrate, and this point is that sheet-metal component, contact member are that conduct is different with the first embodiment of the terminal of the member formation of this supporting member split from supporting member.
[structure of connector]
Figure 10 is the stereographic map that the photoelectric conversion connector of present embodiment 3 is represented together with matching connector 4, represents the state before the chimeric connection of connector.Figure 11 is the stereographic map that the connector of Figure 10 3 is represented with the posture spinning upside down.Figure 12 is that the face parallel with the bearing of trend of light guide member (fiber optic cables C) of using of the connector of Figure 11 dissects the longitudinal section obtaining.
As shown in Figure 10 and Figure 11, the photoelectric conversion connector 3 of present embodiment (below referred to as connector 3) is the same with the connector 1 of the first embodiment, the connector that is connecting the leading section (Figure 10 Chu left part) of the fiber optic cables C as light guide member extending along fore-and-aft direction (left and right directions in Figure 10 and Figure 11), itself and chimeric connection of matching connector 4 being arranged on circuit substrate (not shown).The structure of fiber optic cables C of present embodiment itself is identical with the structure of the fiber optic cables C of the first embodiment.
As shown in figure 12, described connector 3 has: as the photo detector 110 of optical semiconductor; Drive the driving arrangement 120 of photo detector 110; Support the substrate 130 as supporting member of this photo detector 110 and driving arrangement 120; Be formed on the plate face of this substrate 130, and the distribution 140 as contact member contacting with the mating terminals 190 of matching connector 4 described later; Described photo detector 110 is connected with described driving arrangement 120, and the metal wire 150 (with reference to Figure 14) as electric-conductor that this driving arrangement 120 is connected with described distribution 140; By integrally formed the first resin component element 160 that keeps described photo detector 110, driving arrangement 120, substrate 130, distribution 140 and metal wire 150; And on the outside surface of this first resin component element 160 integrally formed the second resin component element 170.As mentioned above, in the present embodiment, be characterised in that supporting member has adopted substrate 130 this point.
In the present embodiment, the same with the first embodiment, this first resin component element 160 and the second resin component element 170 form the shell of connector 3.In addition, in the present embodiment, as optical semiconductor, photo detector 110 has been installed, but as an alternative, also can installing light emitting element, this is the same with the first embodiment.
Because structure and the position relationship each other of photo detector 110 and driving arrangement 120 are identical with driving arrangement 20 with the photo detector 10 of the first embodiment, therefore the description thereof will be omitted.As shown in figure 12, substrate 130 is resinous tabular component (simultaneously also with reference to Figure 13), and surperficial thereon, described distribution 140 forms printed wiring.That is, in the present embodiment, substrate 130 and distribution 140 are shaped and are integrated as a member, can be not separated in connector manufacturing process as the first embodiment.Described distribution 140 extends along fore-and-aft direction, and the upper surface of its leading section forms the contact 141 contacting for the mating terminals 190 with matching connector 4.In a plurality of these contacts 141, include contact and earthy contact for signal, as shown in figure 11, a plurality of contacts 141 separate certain intervals and arrange on connector Width.
In the present embodiment, substrate 130 is resinous, but the material of substrate 130 is not limited to this, for example, can be also pottery system.
Because metal wire 150 is members identical with the metal wire 50 of the first embodiment, therefore the description thereof will be omitted (with reference to Figure 14).The first resin component element 160 is light-transmissive resin systems, and it is formed in slim roughly rectangular parallelepiped profile on the plate face of substrate 130 (with reference to Figure 15).In addition, as shown in figure 12, the leading section of this first resin component element 160 is positioned at the contact 141 rear of described distribution 140, thereby this contact 141 is exposed.
The same with the first embodiment, described the first resin component element 160 has slot part 161, bare wire support 162, protrusion 163 and reflecting surface 163A.Because these structures are identical with reflecting surface 63A with slot part 61, bare wire support 62, the protrusion 63 of the first embodiment respectively, therefore the description thereof will be omitted.
As shown in Figure 11 and Figure 12, the second resin component element 170 is integrally formed in the outside surface of the first resin component element 160, and so that the state that the contact 141 of distribution 140 exposes is roughly rectangular parallelepiped profile.In addition, as shown in Figure 11 and Figure 12, cut in the whole region of the connector Width (direction vertical with the paper of Figure 12) of the first half of these the second resin component element 170 leading sections in these figure, Lower Half forms and makes described contact 141 at upper surface, expose the contact aligning section 173 of arranging.
As shown in Figure 11 and Figure 12, the roughly latter half of upper surface in these figure of the second resin component element 170 is sagged at connector Width middle position, is formed on the slot part 171 extending towards the rear from pars intermedia on fore-and-aft direction.The latter half of first half that is positioned at this slot part 171 of the first resin component element 160.The latter half of formation V-shaped valley of this slot part 171, forms coating support 172.
As shown in figure 10, sag in the substantial middle region on the connector Width of the upper surface of the second resin component element 170 (lower surface in Figure 12) in the scope near position front end to rear end, forms by splenium 174.As hereinafter described, this is pressed from top by flexure strip 204A by splenium 174, and wherein, flexure strip 204A is located at the upper plate portion 204 of the cap 203 that can rotate of matching connector shown in Figure 10 4.
In addition, as shown in figure 10, the roughly Lower Half of the second resin component element 170 side (the roughly first half in Figure 12) is cut in fore-and-aft direction Shang centre position, forms the square directed recess 175 open towards below.As hereinafter described, this directed recess 175 is engaged the guiding teat 182A guiding of connector 4 in the chimeric process of connector.
[manufacturing process of connector]
Below, the manufacturing process of connector 3 is described according to Figure 13 to Figure 17.First, as shown in figure 13, prepared substrate starting material P, this substrate raw materials P by with a plurality of connectors 3 respectively corresponding a plurality of substrates 130 be made into a member.This substrate raw materials P makes with such shape that on the Width of connector, a plurality of substrates 130 linked together, and at the substrate 130 with adjacent each other, is formed with the datum hole P1 as pilot hole each other on corresponding position.In addition, the upper surface of substrate raw materials P is formed with the distribution corresponding with each connector 3 140 (with reference to Figure 12).In Figure 13, distribution 140 only illustrates contact 141, and the diagram of other parts is omitted.
Then, as shown in figure 14, the upper surface of the substrate 130 comprising at substrate raw materials P, the datum hole P1 of usining locates photo detector 110 and driving arrangement 120 be arranged on substrate 130 as benchmark.The same with the first embodiment, use camera (not shown) and image processing apparatus (not shown) to carry out this location.Also have, by known Bonding, with metal wire 150, connect this photo detector 110 and driving arrangement 120, and connect this driving arrangement 120 and distribution 140 with this metal wire 150.
Then, as shown in figure 15, utilize light-transmissive resin that photo detector 110, driving arrangement 120, substrate 130, distribution 140 and metal wire 150 is integrally formed, thereby be shaped the first resin component element 160.As benchmark, with respect to substrate 130, carried out carrying out under the state of location the shaping of this first resin component element 160 usining the datum hole P1 of substrate raw materials P.The same with the first embodiment, for example, by the register pin of the molding die of this first resin component element 160 (not shown) is carried out to this location through described datum hole P1.The result of this first resin component element 160 of being shaped is, the same with the first embodiment, available the first resin component element 160 is photo detector 110, driving arrangement 120 and metal wire 150 sealing, and under the state being positioned, forms bare wire support 162 and the reflecting surface 163A of this first resin component element 160.
Then, as shown in figure 16, the datum hole P1 position by substrate raw materials P on connector Width cuts off.Consequently, the centre part before can obtaining corresponding with connector 3, the second resin component element 170 and being shaped.Then, for example, as benchmark, with respect to this substrate 130, carried out under the state of location usining the front end of substrate 130, as shown in figure 17, integrally formed the second resin component element 170 on the outside surface of the first resin component element 160.By the shaping of the second resin component element 170, the first resin component element 160 and substrate 130 are covered by this second resin component element 170, and form the slot part 171, coating support 172, contact aligning section 173 of this second resin component element 170, by splenium 174 and directed recess 175, connector 3 completes.Afterwards, utilize bonding agent etc. to be fixed being disposed under the bare wire support 162 of this connector 1 and the state of coating support 172 leading section of fiber optic cables C, thereby connector 3 is connected with the leading section of fiber optic cables C.
In the present embodiment, be also when the first resin component element 160 is shaped, when this first resin component element 160 is integrally formed in photo detector 110, form bare wire support 162 and the reflecting surface 163A of this first resin component element 160.In addition, the location of the molding die of the location of photo detector 110 and the first resin component element 160 is to using identical datum hole P1 position to carry out as benchmark.Therefore, in the present embodiment, also the same with the first embodiment, by first resin component element 160 that is shaped, can carry out exactly aliging between photo detector 110 and described bare wire support 162 and reflecting surface 163A.Therefore, only the bare wire C1 of fiber optic cables C need be disposed to bare wire support 62, just can automatically carry out the bare wire C1 of these fiber optic cables C and the optical alignment between photo detector 10.
In addition, the relative position that can not occur in photo detector after the preliminary stage alignment of shaping and fiber optic cables as in the past departs from such situation because of the filling of resin, do not need part and device for described alignment, and, do not need to be only used for the operation of aliging yet, can correspondingly suppress the increase of cost, this is also identical with the first embodiment.
[structure of matching connector]
Matching connector 4 shown in Figure 10 is the connectors that are configured on circuit substrate (not shown), and it has: the shell 180 of receiving connector 3; Arrangement is held in a plurality of terminals 190 (being called mating terminals 190 below) of this shell 180; And the metal mould component 200 that covers this shell 180.
Shell 180 has: be the roughly rectangular parallelepiped profile using fore-and-aft direction as length direction, and the diapire 181 parallel with circuit substrate; From this diapire 181, hold up, and two sidewalls 182 that extend along fore-and-aft direction relative to one another; And extend along connector Width (two sidewall 182 directions respect to one another), and by the leading section of this sidewall 182 antetheca 183 connected to one another.By these two sidewalls 182 and antetheca 183, surrounded and backwards the recess of upper opening form for receive the receiving recess 184 of connector 3 from top.
The roughly Lower Half of described antetheca 183 rearward, to receiving recess 184 side-prominent, this outshot forms the outstanding wall 183A of portion.In addition, this antetheca 183 keeps groove 183B at its terminal that roughly Lower Half is formed with a plurality of slit-shaped that run through along fore-and-aft direction, with this terminal maintenance groove 183B, accommodates and keeps mating terminals 190.This terminal keep groove 183B the position of the described outstanding wall 183A of portion in above and rear open.The contact aligning section 173 of receiving connector 3 under the chimerism the space forming above this outstanding wall 183A of portion (receiving a part for recess 184) at connector.
Two sidewalls 182 have towards receiving the side-prominent guiding teat 182A of recess 184 in the Lower Half at the place, fore-and-aft direction centre position of medial surface respect to one another.This guiding teat 182A forms square that directed recess 175 with connector 3 matches, in the chimeric process of connector, this guiding teat 182A enters in this directed recess 175 on one side, on one side by this connector 3 towards the regular location guide of receiving recess 184.
Mating terminals 190 is by the slice sheet of sheet metal system is bent upwards and is made in thickness of slab side, and its terminal that is pressed into and remains on shell 180 keeps in groove 183B.One one end side portion of this mating terminals 190 is housed in terminal in the position of the outstanding wall 183A of portion and keeps in groove 183B, and another one end side portion is extended towards the place ahead at the lower position of antetheca 183.The corresponding contact portion 191 for contact 141 contact with connector 3 of a described one end side portion forms to convex curvature upward, and as shown in figure 10, this correspondence contact Bu191 top is outstanding towards the top of the described outstanding wall 183A of portion.
Mould component 200 has: be arranged on shell 180, cover the case portion 201 of the lateral surface of two sidewalls 182 and the front surface of antetheca 183 of this shell 180; And in the mode that can rotate, be installed on this case portion 201, and under the chimerism of connector the cap 203 of the upper surface of covering connector 3.Described case portion 201 has: the sidewall cap 202 of the lateral surface of the sidewall 182 of covering shell 180; And the antetheca cap (not shown) that connects the front surface of the leading section of two sidewall caps 202 antetheca 183 of covering shell 180.
In the front portion of described sidewall cap 202, the axial region of cap 203 described later is supported to the axle support 202A that can rotate and forms the hole portion of running through along thickness of slab direction.In addition, sidewall cap 202Qi rear portion has engaging portion 202B, and this engaging portion 202B is by a part for sidewall cap 202 is cut and formed towards connector Width outside.The plate face of this engaging portion 202B is vertical with fore-and-aft direction, as hereinafter described, and can be with the engaged 206A of the portion engaging of lower ora terminalis and the cap 203 of this engaging portion 202B.
Described cap 203 can rotate between open position and off-position, on open position, as shown in figure 10, the posture of described cap 203 in extending along the vertical direction, and receive recess 184 can receive connector 3, in off-position, the posture of described cap 203 in extending along fore-and-aft direction, and the upper surface of covering connector 3.Cap 203 has: the upper plate portion 204 of the upper surface of covering connector 3 in off-position; The front side board 205 being bent to form in the side edge part front portion (Figure 10 Zhong bottom) of this upper plate portion 204; And the rear side board 206 being bent to form at the side edge part rear portion (Figure 10 Zhong top) of this upper plate portion 204.
Described front side board 205 has such as by embossing processing etc. and to the axial region (not shown) of side-prominent formation in connector Width.In the present embodiment, this axial region is supported by the axle support 202A of described case portion 201, thereby described cap 203 can be rotated between open position and off-position.In addition, described rear side board 206 in off-position, towards the place ahead, (below in Figure 10) extends to form with the engaged 206A of portion of the arm shape of the engaging portion 202B engaging of case portion 201.
Described upper plate portion 204 in off-position, press being extended to form along fore-and-aft direction (above-below direction in Figure 10) by two flexure strip 204A of splenium 174 of connector 3.This flexure strip 204A is by this upper plate portion 204 is cut and formed, and it becomes front end (Figure 10 Zhong lower end) and forms free-ended semi-girder shape.In addition, as shown in figure 10, this flexure strip 204A in rear end (Figure 10 Zhong upper end) locate bending and tilt a little to Figure 10 Zhong rear.
[connector chimeric connecting moves to each other]
Below, the chimeric connecting moves between connector 3 and matching connector 4 is described.First, as shown in figure 10, to receive recess 184 at circuit substrate (not shown), matching connector 4 to be above installed towards the posture of upper opening, and make the cap 203 of mould component 200 in an open position.Then, as shown in figure 10, make the connector 3 being connected with the leading section of fiber optic cables C with slot part 171 posture downward, be positioned at the top of described matching connector 4.
Then, described connector 3 is moved towards below, make in its receiving recess 184 that is housed in matching connector 4.Accommodating in process of this connector 3, the guiding teat 182A of matching connector 4 enters in the directed recess 175 of connector 1 from below, thus by this connector 1 towards the regular location guide of receiving in recess 184.In addition, the contact aligning section 173 of connector 3 is positioned at the top of the outstanding wall 183A of portion of matching connector 4, be arranged in contact 141 on the lower surface of this contact aligning section 173 respectively with corresponding contact portion 191 contacts of corresponding matching connector 4.
After in the receiving recess 184 of connector 3 being accommodated to matching connector 4, make the cap 203 of mould component 200 rotate and make it in the closed position.In off-position, the flexure strip 204A of cap 203 is pressed towards below by splenium 174 connector 3 upper surfaces, thereby the contact of connector 3 141 is pressed in to the corresponding contact portion 191 of matching connector 4 from top, makes both Elastic Contact.In addition, in off-position, the engaged 206A of portion of described cap 203 is positioned at the below of the engaging portion 202B of case portion 201, the lower edge engaging of the upper limb of this engaged 206A of portion and this engaging portion 202B, thus described cap 203 is maintained to off-position.Consequently, described contact 141 is maintained with the state of corresponding contact portion 191 Elastic Contact, and connector 3 has been connected with the chimeric of matching connector 4.
At connector each other under the state of chimeric connection, the light signal transmitting in fiber optic cables C by the reflecting surface 163A of the first resin component element 160 reflection, made light path towards below break-in, and focus on the sensitive surface of photo detector 110.Then, by this photo detector 110, convert light signal to electric signal, and via distribution 140 and mating terminals 190, send described electric signal the corresponding circuits portion of the circuit substrate that matching connector 2 is installed to.
Claims (8)
1. a photoelectric conversion connector, has: optical semiconductor, and this optical semiconductor is for transmitting photo-signal and electric signal; Supporting member, this supporting member is for supporting described optical semiconductor; Contact member, this contact member is connected with described optical semiconductor and contacts with the cooperation contact of matching connector; And first resin component element, this first resin component element is by integrally formed described optical semiconductor, supporting member and the contact member of keeping, and to this optical semiconductor sealing of major general, it is characterized in that,
This photoelectric conversion connector has integrally formed the second resin component element on the outside surface of described the first resin component element, described the first resin component element is made with light-transmissive resin, and have: waveguide support, this waveguide support is to supporting for transmitting the light guide member of light signal; And reflecting surface, this reflecting surface reflects to make light path break-in by light signal, thereby this light signal is transmitted between light guide member and optical semiconductor.
2. photoelectric conversion connector as claimed in claim 1, it is characterized in that, supporting member and contact member utilize metal lead frame to be made into a member, and separated from one another and form after integrally formed with the first resin component element, described contact member is the terminal forming as a plurality of slice sheets.
3. photoelectric conversion connector as claimed in claim 1, is characterized in that, supporting member is to make with the substrate of resin or pottery system, and contact member is printed on described supporting member.
4. photoelectric conversion connector as claimed any one in claims 1 to 3, it is characterized in that, photoelectric conversion connector is except optical semiconductor, also there is the driving arrangement that drives this optical semiconductor, this driving arrangement is connected with optical semiconductor and contact member, thereby by this driving arrangement, optical semiconductor is connected indirectly with contact member.
5. a manufacture method for photoelectric conversion connector, is characterized in that, has:
Arrangements of components operation, in this arrangements of components operation, using the position of the datum hole that forms as benchmark on supporting member or the member that is connected with this supporting member, with respect to described supporting member, optical semiconductor is positioned, thereby this optical semiconductor is disposed to supporting member, wherein, described supporting member supports the described optical semiconductor for transmitting photo-signal and electric signal;
Electric-conductor connects operation, at this electric-conductor, connects in operation, and the contact member that utilizes electric-conductor that the cooperation contact with matching connector is contacted is connected in optical semiconductor;
The first ester moulding operation, in this first ester moulding operation, as benchmark, with respect to described supporting member, waveguide support and reflecting surface have been carried out under the state of location usining the position of described datum hole, utilize light-transmissive resin by described optical semiconductor, supporting member and contact member are integrally formed, and to described light-transmissive resin sealing for major general's optical semiconductor, wherein, described waveguide support is to supporting for transmitting the light guide member of light signal, described reflecting surface reflects to make light path break-in by light signal, thereby this light signal is transmitted between light guide member and optical semiconductor, and
The second ester moulding operation, in this second ester moulding operation, in the outside surface of the light-transmissive resin being shaped in described the first ester moulding operation, the integrally formed resin different from this light-transmissive resin.
6. the manufacture method of photoelectric conversion connector as claimed in claim 5, it is characterized in that, supporting member and contact member utilize metal belt bracket lead frame to be made into a member, on the bracket of this belt bracket lead frame, be formed with datum hole, contact member is the terminal forming as a plurality of slice sheets, after the first ester moulding operation, there is the cut-out separation circuit that described contact member is cut open at the part of stretching out from light-transmissive resin and bracket, after described cut-out separation circuit, there is the bending operation that makes the bending of contact member form the terminal shape of regulation.
7. the manufacture method of photoelectric conversion connector as claimed in claim 5, is characterized in that, supporting member is to make with the substrate of resin or pottery system, on this substrate, is formed with datum hole, and contact member is printed on described supporting member.
8. the manufacture method of the photoelectric conversion connector as described in any one in claim 5 to 7, it is characterized in that, before electric-conductor connects operation, there is the equipment arrangement step on the member that the driving arrangement that drives optical semiconductor is configured in to supporting member or is connected with this supporting member, at described electric-conductor, connect in operation, driving arrangement is connected with optical semiconductor and contact member, thereby by this driving arrangement, optical semiconductor is connected indirectly with contact member.
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| Application Number | Priority Date | Filing Date | Title |
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| CN201210209300.1A CN103513343B (en) | 2012-06-25 | 2012-06-25 | The manufacture method of photoelectric conversion connector and photoelectric conversion connector |
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| CN201210209300.1A CN103513343B (en) | 2012-06-25 | 2012-06-25 | The manufacture method of photoelectric conversion connector and photoelectric conversion connector |
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| CN103513343A true CN103513343A (en) | 2014-01-15 |
| CN103513343B CN103513343B (en) | 2015-08-19 |
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Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
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| CN112305686A (en) * | 2019-08-02 | 2021-02-02 | 广濑电机株式会社 | Connector assembly |
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| CN112305686A (en) * | 2019-08-02 | 2021-02-02 | 广濑电机株式会社 | Connector assembly |
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| CN103513343B (en) | 2015-08-19 |
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