CN103509489B - A kind of low-temperature hot melt adhesive - Google Patents

A kind of low-temperature hot melt adhesive Download PDF

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Publication number
CN103509489B
CN103509489B CN201310401046.XA CN201310401046A CN103509489B CN 103509489 B CN103509489 B CN 103509489B CN 201310401046 A CN201310401046 A CN 201310401046A CN 103509489 B CN103509489 B CN 103509489B
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CN
China
Prior art keywords
add
low
hot melt
melt adhesive
raw material
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Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
CN201310401046.XA
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Chinese (zh)
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CN103509489A (en
Inventor
吴顺保
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Guangzhou Ke BondA Plastic Co., Ltd.
Original Assignee
Wuhu City Zheng Tong Electric Appliance Equipment Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
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Application filed by Wuhu City Zheng Tong Electric Appliance Equipment Co Ltd filed Critical Wuhu City Zheng Tong Electric Appliance Equipment Co Ltd
Priority to CN201310401046.XA priority Critical patent/CN103509489B/en
Publication of CN103509489A publication Critical patent/CN103509489A/en
Application granted granted Critical
Publication of CN103509489B publication Critical patent/CN103509489B/en
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

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Abstract

The invention discloses a kind of low-temperature hot melt adhesive, it is made up of the raw material of following weight parts: metallocene ethylene-octene copolymer 40-50, ethylene-ethyl acrylate copolymer 40-50, rosin 6-10, maleic anhydride inoculated polypropylene 6-10, BHT 1-2, Isooctyl acrylate monomer 2-3, atoleine 3-4, ammonium dihydrogen phosphate (ADP) 0.2-0.3, tackifier 7-8; PUR prepared by the present invention has good peel strength and workability in low temperature environment, has good caking property, sealing and stability, and technique is simple, and cost is low.

Description

A kind of low-temperature hot melt adhesive
Technical field
The present invention relates generally to a kind of PUR powder, relates in particular to a kind of low-temperature hot melt adhesive.
Background technology
PUR is a kind of plastic adhesive, and in certain temperature range, its physical state changes with temperature change, and chemical characteristic is constant, and it is nonpoisonous and tasteless, belongs to environmental-protecting chemical product.
Summary of the invention
The object of the invention is just to provide a kind of low-temperature hot melt adhesive.
The present invention is achieved by the following technical solutions:
A kind of low-temperature hot melt adhesive, it is made up of the raw material of following weight parts:
Metallocene ethylene-octene copolymer 40-50, ethylene-ethyl acrylate copolymer 40-50, rosin 6-10, maleic anhydride inoculated polypropylene 6-10, BHT 1-2, Isooctyl acrylate monomer 2-3, atoleine 3-4, ammonium dihydrogen phosphate (ADP) 0.2-0.3, tackifier 7-8;
Described tackifier are made up of the raw material of following weight parts:
Terpene resin 30-40, C5 Petropols 20-30, prodan 3-5, silane resin acceptor kh-550 1-2, ZPT 0.2-0.3, PLA 2-3, PTMG 1-2;
Above-mentioned terpene resin and C5 Petropols Hybrid Heating are arrived to 100-150 DEG C, add prodan, insulated and stirred 10-15 minute, reduction temperature is 70-75 DEG C, add ZPT, fully mix, reduction temperature is 60-65 DEG C, adds silane resin acceptor kh-550,600-800 rev/min of dispersed with stirring 4-6 minute, add the each raw material of residue, fully mix, obtain described tackifier.
A preparation method for low-temperature hot melt adhesive, comprises the following steps:
(1) above-mentioned metallocene ethylene-octene copolymer, ethylene-ethyl acrylate copolymer, rosin, BHT, Isooctyl acrylate monomer, atoleine Hybrid Heating are arrived to 130-200 DEG C, insulated and stirred 30-40 minute;
(2) add tackifier, at 150-200 DEG C, continue insulated and stirred 10-15 minute, add the each raw material of residue, after fully mixing, make film or particle, obtain described low-temperature hot melt adhesive.
Advantage of the present invention is:
PUR prepared by the present invention has good peel strength and workability in low temperature environment, has good caking property, sealing and stability, and technique is simple, and cost is low.
Detailed description of the invention
Embodiment 1
A kind of low-temperature hot melt adhesive, it by following weight parts (kilogram) raw material form:
Metallocene ethylene-octene copolymer 50, ethylene-ethyl acrylate copolymer 50, rosin 10, maleic anhydride inoculated polypropylene 7, BHT 2, Isooctyl acrylate monomer 3, atoleine 3, ammonium dihydrogen phosphate (ADP) 0.3, tackifier 7;
Described tackifier are made up of the raw material of following weight parts:
Terpene resin 40, C5 Petropols 30, prodan 5, silane resin acceptor kh-550 1, ZPT 0.3, PLA 2-3, PTMG 1;
By above-mentioned terpene resin and C5 Petropols Hybrid Heating to 100 DEG C, add prodan, insulated and stirred 15 minutes, reducing temperature is 75 DEG C, add ZPT, fully mix, reducing temperature is 65 DEG C, adds silane resin acceptor kh-550,800 revs/min of dispersed with stirring 6 minutes, add the each raw material of residue, fully mix, obtain described tackifier.
A preparation method for low-temperature hot melt adhesive, comprises the following steps:
(1) by above-mentioned metallocene ethylene-octene copolymer, ethylene-ethyl acrylate copolymer, rosin, BHT, Isooctyl acrylate monomer, atoleine Hybrid Heating to 160 DEG C, insulated and stirred 40 minutes;
(2) add tackifier, at 200 DEG C, continue insulated and stirred 15 minutes, add the each raw material of residue, after fully mixing, make film or particle, obtain described low-temperature hot melt adhesive.
Performance test:
23 DEG C to PE adhesive strength N/cm(>=70): 105;
23 DEG C to epoxy primer steel adhesive strength N/cm(>=70): 104.

Claims (1)

1. a low-temperature hot melt adhesive, is characterized in that what it was made up of the raw material of following weight parts:
Metallocene ethylene-octene copolymer 40-50, ethylene-ethyl acrylate copolymer 40-50, rosin 6-10, maleic anhydride inoculated polypropylene 6-10, BHT 1-2, Isooctyl acrylate monomer 2-3, atoleine 3-4, ammonium dihydrogen phosphate (ADP) 0.2-0.3, tackifier 7-8;
Described tackifier are made up of the raw material of following weight parts:
Terpene resin 30-40, C5 Petropols 20-30, prodan 3-5, silane resin acceptor kh-550 1-2, ZPT 0.2-0.3, PLA 2-3, PTMG 1-2;
Above-mentioned terpene resin and C5 Petropols Hybrid Heating are arrived to 100-150 DEG C, add prodan, insulated and stirred 10-15 minute, reduction temperature is 70-75 DEG C, add ZPT, fully mix, reduction temperature is 60-65 DEG C, adds silane resin acceptor kh-550,600-800 rev/min of dispersed with stirring 4-6 minute, add the each raw material of residue, fully mix, obtain described tackifier;
The preparation method of described low-temperature hot melt adhesive comprises the following steps:
(1) above-mentioned metallocene ethylene-octene copolymer, ethylene-ethyl acrylate copolymer, rosin, BHT, Isooctyl acrylate monomer, atoleine Hybrid Heating are arrived to 130-200 DEG C, insulated and stirred 30-40 minute;
(2) add tackifier, at 150-200 DEG C, continue insulated and stirred 10-15 minute, add the each raw material of residue, after fully mixing, make film or particle, obtain described low-temperature hot melt adhesive.
CN201310401046.XA 2013-09-06 2013-09-06 A kind of low-temperature hot melt adhesive Expired - Fee Related CN103509489B (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN201310401046.XA CN103509489B (en) 2013-09-06 2013-09-06 A kind of low-temperature hot melt adhesive

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN201310401046.XA CN103509489B (en) 2013-09-06 2013-09-06 A kind of low-temperature hot melt adhesive

Publications (2)

Publication Number Publication Date
CN103509489A CN103509489A (en) 2014-01-15
CN103509489B true CN103509489B (en) 2016-05-11

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Application Number Title Priority Date Filing Date
CN201310401046.XA Expired - Fee Related CN103509489B (en) 2013-09-06 2013-09-06 A kind of low-temperature hot melt adhesive

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Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN111909637A (en) * 2020-06-24 2020-11-10 杭州可靠护理用品股份有限公司 Low-temperature hot melt adhesive for processing paper diapers and processing method thereof

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102559078A (en) * 2011-12-28 2012-07-11 广州鹿山新材料股份有限公司 Hot melt adhesive membrane for bonding bi-metallic composite plate and preparing method thereof
CN103045111A (en) * 2012-12-25 2013-04-17 广州鹿山新材料股份有限公司 Polyester hot melt adhesive for bonding polar polymer with metal

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8197947B2 (en) * 2009-12-01 2012-06-12 Equistar Chemicals, Lp Adhesive compositions
JP5789382B2 (en) * 2011-02-25 2015-10-07 ヘンケルジャパン株式会社 Hot melt adhesive
CN103562332B (en) * 2011-04-08 2017-08-04 波士胶公司 The hotmelt based on polyolefin containing solid plasticizer
JP5850682B2 (en) * 2011-09-16 2016-02-03 ヘンケルジャパン株式会社 Hot melt adhesive

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102559078A (en) * 2011-12-28 2012-07-11 广州鹿山新材料股份有限公司 Hot melt adhesive membrane for bonding bi-metallic composite plate and preparing method thereof
CN103045111A (en) * 2012-12-25 2013-04-17 广州鹿山新材料股份有限公司 Polyester hot melt adhesive for bonding polar polymer with metal

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Publication number Publication date
CN103509489A (en) 2014-01-15

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Effective date of registration: 20160510

Address after: 241200 Anhui city of Wuhu province Fanchang County Economic and Technological Development Zone Beisi entrepreneurial Science Park

Patentee after: Fanchang Beisi Productivity Promotion Center Co., Ltd.

Address before: 241200 Anhui city of Wuhu province Fanchang County Economic Development Zone Science and technology park business times thinking

Patentee before: Wuhu City Zheng Tong Electric Appliance Equipment Co., Ltd

CB03 Change of inventor or designer information

Inventor after: Liu Haifeng

Inventor before: Wu Shunbao

CB03 Change of inventor or designer information
TR01 Transfer of patent right

Effective date of registration: 20180425

Address after: 510000 Guangzhou, Liwan District, Guangdong Province, South China Street, Hailong Road, 36, Mount Huang Gang hill, 8 two.

Patentee after: Guangzhou Ke BondA Plastic Co., Ltd.

Address before: 241200 Anhui County Wuhu City Fanchang County Economic and Technological Development Zone Bi Si pioneering science and Technology Park

Patentee before: Fanchang Beisi Productivity Promotion Center Co., Ltd.

TR01 Transfer of patent right
CF01 Termination of patent right due to non-payment of annual fee

Granted publication date: 20160511

Termination date: 20190906

CF01 Termination of patent right due to non-payment of annual fee