CN103476205A - Structure of changing composite-material electronic product shell deformation degree - Google Patents

Structure of changing composite-material electronic product shell deformation degree Download PDF

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Publication number
CN103476205A
CN103476205A CN2012101872677A CN201210187267A CN103476205A CN 103476205 A CN103476205 A CN 103476205A CN 2012101872677 A CN2012101872677 A CN 2012101872677A CN 201210187267 A CN201210187267 A CN 201210187267A CN 103476205 A CN103476205 A CN 103476205A
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CN
China
Prior art keywords
deformation
composite
electronic product
composite layer
composite material
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN2012101872677A
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Chinese (zh)
Inventor
魏宏帆
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
KUNSHAN TONGYIN INDUSTRIAL ELECTRICAL Co Ltd
Original Assignee
KUNSHAN TONGYIN INDUSTRIAL ELECTRICAL Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by KUNSHAN TONGYIN INDUSTRIAL ELECTRICAL Co Ltd filed Critical KUNSHAN TONGYIN INDUSTRIAL ELECTRICAL Co Ltd
Priority to CN2012101872677A priority Critical patent/CN103476205A/en
Priority to TW102206311U priority patent/TWM466457U/en
Publication of CN103476205A publication Critical patent/CN103476205A/en
Pending legal-status Critical Current

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Abstract

The invention discloses a structure of changing a composite-material electronic product shell deformation degree. The structure comprises a composite material layer. The composite material layer is provided with several deformation apparatuses which set a deformation direction. Positions of the deformation apparatuses are relatively fixed and are combined with one of an inner portion and a surface of the composite material layer. According to the invention, the several deformation apparatuses are arranged on the composite material layer so that a deformation degree of an original shell is effectively changed; according to an actual need, the deformation degree of the composite-material electronic product shell is decreased and increased and product quality is further increased so as to satisfy an actual need.

Description

Change the structure of composite material electronic product enclosure degree of deformation
Technical field
The present invention relates to a kind of electronic product enclosure structure, specifically relate to a kind of structure that changes composite material electronic product enclosure degree of deformation.
Background technology
At present, generally use on the market the electronic product enclosure made from composite materials such as carbon fiber or glass fibres, the advantage such as the shell that this type of composite material is made has that intensity is high, thin thickness, quality are light, corrosion-resistant, also has good shielding property, but use the electronic product enclosure of this class composite material, after moulding on the whole easily towards certain Direction distortion, the degree of deformation of composite material electronic product enclosure can not effectively meet actual needs, quality to electronic product impacts, and needs to change the degree of deformation of composite material electronic product enclosure.
Summary of the invention
In order to overcome above-mentioned defect, the invention provides a kind of structure that changes composite material electronic product enclosure degree of deformation, there is the degree of deformation advantage of effective adjusting composite material electronic product enclosure.
The present invention for the technical scheme that solves its technical problem and adopt is:
A kind of structure that changes composite material electronic product enclosure degree of deformation, comprise composite layer, and described composite layer is provided with several deformation devices of setting deformation direction.
As a further improvement on the present invention, at least one in described composite layer inside and surface of the relative secure bond in described deformation device position.
As a further improvement on the present invention, the composition of described deformation device is: be provided with the distortion sheet that a shrinkage direction is contrary with described composite layer shrinkage direction, described distortion sheet is embedded at least one in described composite layer inside and surface.
As a further improvement on the present invention, the composition of described deformation device is: be provided with the distortion sheet that a shrinkage direction is identical with described composite layer shrinkage direction, described distortion sheet is located at least one in described composite layer inside and surface.
As a further improvement on the present invention, described distortion sheet is strip, is embedded in the surface of described composite layer, and described distortion sheet is covered with the surface of described composite layer at length direction.
As a further improvement on the present invention, described composite layer is a kind of in carbon fibre composite, glass fiber compound material and kevlar composite.
As a further improvement on the present invention, described distortion sheet is a kind of in carbon fibre composite, glass fiber compound material and kevlar composite.
The invention has the beneficial effects as follows: the present invention is provided with several deformation devices by composite layer, effectively changed the degree of deformation of original casing, make that former composite material casing has not only retained that the radiation-proof effect of composite material is good, intensity is high, thin thickness, quality is light, corrosion-resistant, high temperature resistant and the advantage such as attractive in appearance, can also be according to actual needs, reduce or increase the degree of deformation of composite material electronic product enclosure, further improve the quality of products, meet actual needs.
The accompanying drawing explanation
Fig. 1 is the vertical composite material surface cross-sectional view of the present invention (composite material surface has additional deformation device);
Fig. 2 is the parallel composite material surface cross-sectional view of the present invention (composite material surface has additional deformation device);
Fig. 3 is the vertical composite material surface cross-sectional view of the present invention (the composite surface layer part replaces with deformation device).
By reference to the accompanying drawings, be supplemented as follows explanation:
1---composite layer 2---deformation device
3---the distortion sheet
Embodiment
As shown in Figure 1, Figure 2 and Figure 3, a kind of structure that changes composite material electronic product enclosure degree of deformation, comprise composite layer 1, described composite layer is provided with several deformation devices 2 of setting deformation direction, and described like this deformation device just can make the degree of deformation of described composite layer reduce or increase.
Preferably, at least one in described composite layer 1 inside and surface of the described deformation device 2 relative secure bond in position, now, but described deformation device 2 exposing surfaces or concordant with surface.
Preferably, the composition of described deformation device 2 is: be provided with the distortion sheet 3 that a shrinkage direction is contrary with described composite layer 1 shrinkage direction, described distortion sheet 3 is embedded at least one in described composite layer 1 inside and surface, being out of shape the shrinkage that sheet 3 shrinkages were less than, were equal to or greater than composite layer 1 herein all can, now, for reducing the distortion of composite layer 1.
Preferably, the composition of described deformation device 2 is: be provided with the distortion sheet 3 that a shrinkage direction is identical with described composite layer 1 shrinkage direction, described distortion sheet 3 is located at least one in described composite layer 1 inside and surface, herein, distortion sheet 3 shrinkages are less than, are equal to or greater than composite layer 1 shrinkage and all can, when the shrinkage of distortion sheet 3 is less than the shrinkage of composite layer, for reducing the distortion of composite layer 1, when the shrinkage of distortion sheet 3 is equal to or greater than the shrinkage of composite layer, for increasing the distortion of composite layer 1.
Preferably, described distortion sheet 3 is strip, is embedded in the surface of described composite layer 1, and described distortion sheet 3 is covered with the surface of described composite layer 1 at length direction.
Preferably, described composite layer is a kind of in carbon fibre composite, glass fiber compound material and kevlar composite.
Preferably, described distortion sheet 3 is a kind of in carbon fibre composite, glass fiber compound material and kevlar composite.
Above embodiment is with reference to accompanying drawing; to a preferred embodiment of the present invention will be described in detail; those skilled in the art is by above-described embodiment being carried out to modification or the change on various forms, but do not deviate from the situation of essence of the present invention, within all dropping on protection scope of the present invention.

Claims (7)

1. a structure that changes composite material electronic product enclosure degree of deformation, comprise composite layer (1), it is characterized in that: described composite layer (1) is provided with several deformation devices (2) of setting deformation direction.
2. the structure of change composite material electronic product enclosure degree of deformation according to claim 1, is characterized in that: at least one in described composite layer (1) inside and surface of the relative secure bond in described deformation device (2) position.
3. the structure of change composite material electronic product enclosure degree of deformation according to claim 2, it is characterized in that: the composition of described deformation device (2) is: be provided with the distortion sheet (3) that a shrinkage direction is contrary with described composite layer (1) shrinkage direction, described distortion sheet (3) is embedded at least one in described composite layer (1) inside and surface.
4. the structure of change composite material electronic product enclosure degree of deformation according to claim 2, it is characterized in that: the composition of described deformation device (2) is: be provided with the distortion sheet (3) that a shrinkage direction is identical with described composite layer (1) shrinkage direction, described distortion sheet (3) is located at least one in described composite layer (1) inside and surface.
5. according to the structure of the described change composite material of claim 3 or 4 electronic product enclosure degree of deformation, it is characterized in that: described distortion sheet (3) is strip, be embedded in the surface of described composite layer (1), and described distortion sheet (3) is covered with the surface of described composite layer (1) at length direction.
6. the structure of change composite material electronic product enclosure degree of deformation according to claim 5 is characterized in that: described composite layer is a kind of in carbon fibre composite, glass fiber compound material and kevlar composite.
7. the structure of change composite material electronic product enclosure degree of deformation according to claim 5 is characterized in that: a kind of in carbon fibre composite, glass fiber compound material and kevlar composite of described distortion sheet (3).
CN2012101872677A 2012-06-08 2012-06-08 Structure of changing composite-material electronic product shell deformation degree Pending CN103476205A (en)

Priority Applications (2)

Application Number Priority Date Filing Date Title
CN2012101872677A CN103476205A (en) 2012-06-08 2012-06-08 Structure of changing composite-material electronic product shell deformation degree
TW102206311U TWM466457U (en) 2012-06-08 2013-04-08 Structure for changing the housing deformability of electronic devices

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN2012101872677A CN103476205A (en) 2012-06-08 2012-06-08 Structure of changing composite-material electronic product shell deformation degree

Publications (1)

Publication Number Publication Date
CN103476205A true CN103476205A (en) 2013-12-25

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Family Applications (1)

Application Number Title Priority Date Filing Date
CN2012101872677A Pending CN103476205A (en) 2012-06-08 2012-06-08 Structure of changing composite-material electronic product shell deformation degree

Country Status (2)

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CN (1) CN103476205A (en)
TW (1) TWM466457U (en)

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN2796766Y (en) * 2005-04-01 2006-07-19 陈正盛 Improved frame structure of composite material racket
CN101326139A (en) * 2005-12-08 2008-12-17 斯奈克玛 Joint between a metal part and a ceramic part based sic and/or c
CN201446752U (en) * 2009-04-13 2010-05-05 昆山同寅兴业机电制造有限公司 Laminated structure of electronic product housing panel
CN101792644A (en) * 2008-12-25 2010-08-04 仁宝电脑工业股份有限公司 Heat bonding film

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN2796766Y (en) * 2005-04-01 2006-07-19 陈正盛 Improved frame structure of composite material racket
CN101326139A (en) * 2005-12-08 2008-12-17 斯奈克玛 Joint between a metal part and a ceramic part based sic and/or c
CN101792644A (en) * 2008-12-25 2010-08-04 仁宝电脑工业股份有限公司 Heat bonding film
CN201446752U (en) * 2009-04-13 2010-05-05 昆山同寅兴业机电制造有限公司 Laminated structure of electronic product housing panel

Also Published As

Publication number Publication date
TWM466457U (en) 2013-11-21

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