CN201690694U - Structure of shell of electronic product - Google Patents

Structure of shell of electronic product Download PDF

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Publication number
CN201690694U
CN201690694U CN2010202061609U CN201020206160U CN201690694U CN 201690694 U CN201690694 U CN 201690694U CN 2010202061609 U CN2010202061609 U CN 2010202061609U CN 201020206160 U CN201020206160 U CN 201020206160U CN 201690694 U CN201690694 U CN 201690694U
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China
Prior art keywords
composite panel
electronic product
composite material
plastic part
material panel
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Expired - Lifetime
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CN2010202061609U
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Chinese (zh)
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廖伟宇
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KUNSHAN TONGYIN INDUSTRIAL ELECTRICAL Co Ltd
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KUNSHAN TONGYIN INDUSTRIAL ELECTRICAL Co Ltd
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Abstract

The utility model discloses a structure of a shell of an electronic product. The structure comprises a composite panel, wherein the inner surface of the composite panel is provided with a membrane medium layer; and one surface of the membrane medium layer is glued on the inner surface of the composite panel, and the other surface thereof is glued with a plastic part. The structure of the shell of the electronic product is combined with the composite panel and the plastic part, and the injection molding for the surface of the composite panel can be realized by the intermedium that is the membrane medium layer, thereby achieving the aim of fixedly combining the composite panel and the plastic part; as the composite panel serves as the outer surface of the shell, and the plastic part serves as the structural component, so that the shell of the electronic product can not only preserve the advantages of the composite panel of good radiation protection, high strength, thin thickness, light weight, good corrosion resistance, good high temperature resistance, attractive appearance and the like, but also form the plastic part with complex structure by the membrane medium layer and the injection molding process, thereby overcoming the defect that the composite panel can not form the complex structural component.

Description

电子产品外壳的结构 The structure of the electronic product casing

技术领域technical field

本实用新型涉及一种电子产品的机壳结构,具体地说是涉及一种由复合材料和塑胶相结合的外壳。The utility model relates to a casing structure of an electronic product, in particular to a casing made of composite materials and plastics.

背景技术Background technique

传统的电子产品的外壳采用塑料材料制成,产品表面会有不平滑,所以在烤漆之前需进行多次磨平加工的程序达到外壳面板的要求,加工比较复杂,而且防辐射性能不佳。市面上还有一些由金属材料制作的外壳,这类金属材质的外壳不容易摔坏,但是金属材质的外壳需在金属上打孔固定,降低了外壳的强度,而且提高了外壳的厚度及重量。市面上还有一些以碳纤或玻纤等复合材料制成的外壳,此类复合材料制成的外壳具有强度高、厚度薄、质量轻、耐腐蚀等优点,还有很好的防辐射性能,但其只能制成外观面板不能成型出复杂的结构件。The shell of traditional electronic products is made of plastic material, and the surface of the product will be uneven. Therefore, it is necessary to perform multiple grinding procedures before painting to meet the requirements of the shell panel. The processing is more complicated, and the radiation protection performance is not good. There are still some shells made of metal materials on the market. This kind of metal shell is not easy to break, but the metal shell needs to be fixed on the metal, which reduces the strength of the shell and increases the thickness and weight of the shell. . There are also some shells made of composite materials such as carbon fiber or glass fiber on the market. The shells made of such composite materials have the advantages of high strength, thin thickness, light weight, corrosion resistance, etc., and have good radiation resistance. But it can only be made into appearance panels and cannot be formed into complex structural parts.

实用新型内容Utility model content

为了克服上述缺陷,本实用新型提供了一种电子产品外壳的结构,该电子产品外壳的结构具有强度高、厚度薄、质量轻、耐腐蚀、防辐射性能佳等优点,且具有结构复杂的结构件。In order to overcome the above-mentioned defects, the utility model provides a shell structure of an electronic product, which has the advantages of high strength, thin thickness, light weight, corrosion resistance, good radiation protection performance, etc., and has a complex structure pieces.

本实用新型为了解决其技术问题所采用的技术方案是:The technical scheme that the utility model adopts in order to solve its technical problem is:

一种电子产品外壳的结构,包括复合材料面板,所述复合材料面板的内表面设有膜介质层,所述膜介质层一面粘合于所述复合材料面板的内表面,所述膜介质层另一面粘合有塑胶件。A structure of an electronic product housing, comprising a composite material panel, the inner surface of the composite material panel is provided with a film medium layer, one side of the film medium layer is bonded to the inner surface of the composite material panel, and the film medium layer The other side is glued with plastic parts.

本实用新型的进一步技术方案是:The further technical scheme of the utility model is:

所述膜介质层为热熔胶膜。The film medium layer is a hot melt adhesive film.

所述膜介质层的厚度为0.01~0.2mm。The thickness of the film medium layer is 0.01-0.2 mm.

所述膜介质层另一面局部粘合有塑胶件。The other side of the film medium layer is partially bonded with a plastic part.

所述塑胶件为具有结构的塑胶件。The plastic part is a plastic part with structure.

所述复合材料面板为非金属类复合材料面板。The composite material panel is a non-metallic composite material panel.

所述复合材料面板为碳纤复合材料面板、玻纤复合材料面板和树脂类复合材料面板中的一种。The composite material panel is one of a carbon fiber composite material panel, a glass fiber composite material panel and a resin composite material panel.

本实用新型的有益效果是:本实用新型充分结合了具有强度高、厚度薄、质量轻、耐腐蚀、防辐射性能好等优点的复合材料面板和具有质地轻、便于结构加工等特性的塑胶件,并通过中间媒介膜介质层来实现在复合材料面板表面的注塑,到达了将复合材料面板与塑胶件相固定结合的目的,该电子产品外壳的结构由复合材料面板充当外壳外表面并由塑胶件充当结构件,使得该电子产品外壳不仅保留了复合材料面板的防辐射效果好、强度高、厚度薄、质量轻、耐腐蚀、耐高温和美观等优点,还通过膜介质层和注塑工艺成型出了结构复杂的塑胶件,克服了复合材料面板不能成型出复杂的结构件的缺陷。The beneficial effects of the utility model are: the utility model fully combines the advantages of high strength, thin thickness, light weight, corrosion resistance, good radiation protection performance and other advantages of composite material panels and plastic parts with light texture, easy structure processing and other characteristics , and the injection molding on the surface of the composite material panel is realized through the intermediate medium film medium layer, and the purpose of fixing the composite material panel and the plastic part is achieved. The parts act as structural parts, so that the electronic product shell not only retains the advantages of good radiation protection effect, high strength, thin thickness, light weight, corrosion resistance, high temperature resistance and beautiful appearance of the composite panel, but also through the film dielectric layer and injection molding process Plastic parts with complex structures have been produced, which overcomes the defect that composite material panels cannot be formed into complex structural parts.

附图说明Description of drawings

图1为本实用新型所述电子产品外壳的结构示意图。Fig. 1 is a structural schematic diagram of the housing of the electronic product described in the present invention.

具体实施方式Detailed ways

实施例:一种电子产品1外壳的结构,包括复合材料面板2,所述复合材料面板为碳纤复合材料面板、玻纤复合材料面板或树脂类复合材料面板,所述复合材料面板的内表面设有厚度为0.01~0.2mm的热熔胶膜3,所述热熔胶膜一面粘合于所述复合材料面板的内表面,所述热熔胶膜另一面局部粘合有具有结构的塑胶件4。Embodiment: a structure of an electronic product 1 shell, including a composite material panel 2, the composite material panel is a carbon fiber composite material panel, a glass fiber composite material panel or a resin composite material panel, and the inner surface of the composite material panel is set There is a hot-melt adhesive film 3 with a thickness of 0.01-0.2mm, one side of the hot-melt adhesive film is bonded to the inner surface of the composite material panel, and the other side of the hot-melt adhesive film is partially bonded with a plastic part with structure 4.

Claims (7)

1.一种电子产品外壳的结构,包括复合材料面板,其特征在于:所述复合材料面板的内表面设有膜介质层,所述膜介质层一面粘合于所述复合材料面板的内表面,所述膜介质层另一面粘合有塑胶件。1. A structure of an electronic product housing, comprising a composite material panel, characterized in that: the inner surface of the composite material panel is provided with a film medium layer, and one side of the film medium layer is bonded to the inner surface of the composite material panel , the other side of the film medium layer is bonded with a plastic part. 2.根据权利要求1所述的电子产品外壳的结构,其特征在于:所述膜介质层为热熔胶膜。2. The structure of the housing of an electronic product according to claim 1, wherein the film medium layer is a hot-melt adhesive film. 3.根据权利要求1所述的电子产品外壳的结构,其特征在于:所述膜介质层的厚度为0.01~0.2mm。3. The structure of the housing of an electronic product according to claim 1, wherein the thickness of the film dielectric layer is 0.01-0.2 mm. 4.根据权利要求1所述的电子产品外壳的结构,其特征在于:所述膜介质层另一面局部粘合有塑胶件。4. The structure of the housing of an electronic product according to claim 1, characterized in that: the other side of the film dielectric layer is partially bonded with a plastic part. 5.根据权利要求1所述的电子产品外壳的结构,其特征在于:所述塑胶件为具有结构的塑胶件。5. The structure of the housing of an electronic product according to claim 1, wherein the plastic part is a plastic part with a structure. 6.根据权利要求1至5之一所述的电子产品外壳的结构,其特征在于:所述复合材料面板为非金属类复合材料面板。6. The structure of an electronic product casing according to any one of claims 1 to 5, wherein the composite material panel is a non-metallic composite material panel. 7.根据权利要求6所述的电子产品外壳的结构,其特征在于:所述复合材料面板为碳纤复合材料面板、玻纤复合材料面板和树脂类复合材料面板中的一种。7. The structure of the housing of an electronic product according to claim 6, wherein the composite material panel is one of a carbon fiber composite material panel, a glass fiber composite material panel and a resin composite material panel.
CN2010202061609U 2010-05-27 2010-05-27 Structure of shell of electronic product Expired - Lifetime CN201690694U (en)

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Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102909914A (en) * 2012-10-26 2013-02-06 福建省石狮市通达电器有限公司 Notebook shell and molding process thereof
CN113022060A (en) * 2019-12-25 2021-06-25 五行科技股份有限公司 Composite component

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102909914A (en) * 2012-10-26 2013-02-06 福建省石狮市通达电器有限公司 Notebook shell and molding process thereof
CN113022060A (en) * 2019-12-25 2021-06-25 五行科技股份有限公司 Composite component

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Granted publication date: 20101229

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