CN103474383A - Silicon wafer box - Google Patents
Silicon wafer box Download PDFInfo
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- CN103474383A CN103474383A CN201310401776XA CN201310401776A CN103474383A CN 103474383 A CN103474383 A CN 103474383A CN 201310401776X A CN201310401776X A CN 201310401776XA CN 201310401776 A CN201310401776 A CN 201310401776A CN 103474383 A CN103474383 A CN 103474383A
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- silicon wafer
- wafer box
- silicon
- box
- bent plate
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Abstract
The invention belongs to the technical field of semiconductor manufacturing devices, and discloses a silicon wafer box. The silicon wafer box comprises a silicon wafer carrying bent plate and supporting baffles connected with the two ends of the silicon wafer carrying bent plate. The silicon wafer box is characterized in that a shock absorption layer and an anti-sliding layer are arranged in the silicon wafer box. The silicon wafer box has the advantages that the number of silicon wafers is not limited by the number of carving grooves, the storage amount of the silicon wafers is increased, the silicon wafer box is easy to clean, has the shock absorption function, and is simple in structure, convenient to use and safe in operation, and the transfer efficiency is improved.
Description
Technical field
The invention belongs to the semiconductor manufacturing equipment technical field, relate in particular in semiconductor production and improve for the silicon box of depositing silicon chip.
Background technology
Semi-conductor silicon chip is deposited and is transported because its characteristic needs special bearing fixture in process of production, and the silicon box of using at present deposit and transport efficacy becomes the restraining factors of enhancing productivity.At present, the cutting silicon box shortcoming of generally using is as follows: one, and the quantity that the cutting silicon box is deposited silicon chip is few, is limited by the quantity of cutting, so affect production efficiency; Its two, silicon chip in transhipment, put into and the taking-up process especially easily causes fragment; Its three, easy cleaning, easily do not pollute silicon chip.This is the deficiencies in the prior art parts.
Summary of the invention
The object of the invention is to, overcome the deficiencies in the prior art, a kind of simple in structure, amount of storage of increasing silicon chip is provided, there is shock-absorbing function, easy cleaning and has improved a kind of silicon box of transport efficacy.
For solving the problems of the technologies described above, technical scheme of the present invention is: a kind of silicon box, include the slide glass bent plate, two ends link together with it supporting baffle forms, and it is characterized in that: buffer layer, skid resistant course are set in described silicon box.The carrying curved surface of slide glass bent plate is smooth, buffer layer, skid resistant course and be arranged to being connected of slide glass bent plate dismountablely, silicon chip quantity is not subject to the restriction of cutting quantity, and be easy to clean, carrying.
Further improvement of the present invention has, described skid resistant course is provided with dentate stripe, be laid on described buffer layer above.Purpose is the effect of damping that silicon chip is played, and prevents that the silicon chip landing from breaking into pieces.
Further improvement of the present invention also has, and in the outer end of described supporting baffle, handle is set.Utilize the handle transhipment convenient.
In specification, do not have the structure of describing to belong to prior art.
The beneficial effect of this programme can be learnt according to the narration to such scheme, and a kind of silicon box includes the slide glass bent plate, two ends link together with it supporting baffle forms, and it is characterized in that: buffer layer, skid resistant course are set in described silicon box.The invention has the beneficial effects as follows: silicon chip quantity is not subject to the restriction of cutting quantity, increases the amount of storage of silicon chip, and is easy to clean, have shock-absorbing function, and simple in structure, easy to use, handling safety, improves transport efficacy.
The accompanying drawing explanation
Fig. 1 is structural representation front view of the present invention, Fig. 2 structural representation vertical view of the present invention, Fig. 3 structural representation left view of the present invention.In figure: the 1st, supporting baffle, the 2nd, slide glass bent plate, the 3rd, silicon chip, the 4th, handle, the 5th, buffer layer, the 6th, skid resistant course.
Embodiment
Below in conjunction with the drawings and specific embodiments, the present invention is described in further detail.
Below in conjunction with the drawings and specific embodiments, the present invention is described in further detail, by accompanying drawing, can find out, a kind of silicon box of this programme, include slide glass bent plate 2, two ends link together with it supporting baffle 1 forms, it is characterized in that: buffer layer 5, skid resistant course 6 are set in silicon box.Skid resistant course 6 is provided with dentate stripe, be laid on buffer layer 5 above.The outer end of supporting baffle 1 arranges handle 4.
Certainly, above-mentioned explanation is not limitation of the present invention, and the present invention also is not limited only to above-mentioned giving an example, and the variation that those skilled in the art make in essential scope of the present invention, remodeling, interpolation or replacement, also belong to protection scope of the present invention.
Claims (3)
1. a silicon box, include the slide glass bent plate, two ends link together with it supporting baffle forms, and it is characterized in that: buffer layer, skid resistant course are set in described silicon box.
2. a kind of silicon box according to claim 1 is characterized in that: described skid resistant course is provided with dentate stripe, be laid on described buffer layer above.
3. a kind of silicon box according to claim 1 and 2, it is characterized in that: the outer end in described supporting baffle arranges handle.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201310401776XA CN103474383A (en) | 2013-09-06 | 2013-09-06 | Silicon wafer box |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201310401776XA CN103474383A (en) | 2013-09-06 | 2013-09-06 | Silicon wafer box |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN103474383A true CN103474383A (en) | 2013-12-25 |
Family
ID=49799182
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201310401776XA Pending CN103474383A (en) | 2013-09-06 | 2013-09-06 | Silicon wafer box |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN103474383A (en) |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5228568A (en) * | 1991-08-30 | 1993-07-20 | Shin-Etsu Handotai Co., Ltd. | Semiconductor wafer basket |
| CN102553874A (en) * | 2012-02-23 | 2012-07-11 | 高佳太阳能股份有限公司 | Transfer box for cleaning of silicon wafers |
| CN102883973A (en) * | 2010-03-11 | 2013-01-16 | 恩特格林斯公司 | Thin wafer shipper |
| CN203521384U (en) * | 2013-09-06 | 2014-04-02 | 济南科盛电子有限公司 | Silicon slice box |
-
2013
- 2013-09-06 CN CN201310401776XA patent/CN103474383A/en active Pending
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5228568A (en) * | 1991-08-30 | 1993-07-20 | Shin-Etsu Handotai Co., Ltd. | Semiconductor wafer basket |
| CN102883973A (en) * | 2010-03-11 | 2013-01-16 | 恩特格林斯公司 | Thin wafer shipper |
| CN102553874A (en) * | 2012-02-23 | 2012-07-11 | 高佳太阳能股份有限公司 | Transfer box for cleaning of silicon wafers |
| CN203521384U (en) * | 2013-09-06 | 2014-04-02 | 济南科盛电子有限公司 | Silicon slice box |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| C02 | Deemed withdrawal of patent application after publication (patent law 2001) | ||
| WD01 | Invention patent application deemed withdrawn after publication |
Application publication date: 20131225 |