CN103472082A - Quantitative line scanning method for curved surface sample electronic probe - Google Patents

Quantitative line scanning method for curved surface sample electronic probe Download PDF

Info

Publication number
CN103472082A
CN103472082A CN2013104032929A CN201310403292A CN103472082A CN 103472082 A CN103472082 A CN 103472082A CN 2013104032929 A CN2013104032929 A CN 2013104032929A CN 201310403292 A CN201310403292 A CN 201310403292A CN 103472082 A CN103472082 A CN 103472082A
Authority
CN
China
Prior art keywords
sample
quantitative
curved surface
scanning
coordinate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN2013104032929A
Other languages
Chinese (zh)
Inventor
李文竹
马惠霞
严平沅
钟莉莉
黄磊
王晓峰
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Angang Steel Co Ltd
Original Assignee
Angang Steel Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Angang Steel Co Ltd filed Critical Angang Steel Co Ltd
Priority to CN2013104032929A priority Critical patent/CN103472082A/en
Publication of CN103472082A publication Critical patent/CN103472082A/en
Pending legal-status Critical Current

Links

Images

Landscapes

  • Analysing Materials By The Use Of Radiation (AREA)

Abstract

The invention provides a quantitative line scanning method for an electronic probe of a curved surface sample, which comprises the steps of finding a sample analysis area by using a back-scattered electron image, setting electron microscope acceleration voltage, electron beam current, beam spot size, minimum moving step length of a surface distribution diagram and a grid data dot matrix, reading the coordinate position of a current point, moving the next point and reading the coordinate of the point until all grid point coordinate positions are completely read; obtaining an element intensity surface scanning image of an analysis area by utilizing element characteristic X-ray spectrum analysis, testing the X-ray intensity of a standard sample of the analyzed element, and converting the X-ray intensity of an original counting surface scanning result into concentration content to obtain a quantitative surface distribution map; and obtaining a quantitative line scanning curve of the curved surface sample by using line scanning. The invention can correct the measurement error generated by the concave-convex surface of the sample, improve the inspection efficiency and the inspection precision, effectively solve the problem that the electronic probe can only analyze flat samples, and enlarge the sample range of the electronic probe analysis.

Description

A kind of quantitative line sweep method of curved surface sample electron probe
Technical field
The invention belongs to metallurgical analysis check field, be specifically related to a kind of quantitative line sweep method of electron probe for the curved surface sample.
Background technology
The linescan of electron probe can qualitative, quantitative ground be described the segregation rate of certain composition in sample, can understand the rate of propagation of certain element and measure thickness of diffusion layer, can judge in sample the element degree etc. that is evenly distributed, so the line scanning of electron probe is the extremely useful analysis means of steel products.
But not all samples can adopt electron probe to carry out line scanning, because electron probe requires sample to reach the smooth degree of minute surface, otherwise can produce great measuring error, the analysis result that must make mistake.For example, certain sample is distributed components originally, and line scanning but draws element segregation rate 80%, and this analysis result is exactly because this sample surfaces is smooth not, is revised again and the wrong conclusion that draws.
Sample, because the reasons such as use, processing often can produce torsional deformation, makes sample to be analyzed smooth not, but urgent hope is understood the distribution situation of element on this type of sample to solve a research and production difficult problem.Therefore, be necessary to invent a kind of quantitative line sweep method that is applicable to the curved surface sample.
Summary of the invention
The present invention is intended to solve the problem that electron probe can only be analyzed flat sample, thereby providing a kind of can revise due to concavo-convex the produced measuring error of sample, enlarge electron probe sample analysis scope, improve the quantitative line sweep method of curved surface sample electron probe of checkability and precision.
For this reason, the solution that the present invention takes is:
A kind of quantitative line sweep method of curved surface sample electron probe, its concrete steps are:
1, determine analyzed area
Clean analytic sample is put into to the EPMA-1610 of Shimadzu company electron probe sample chamber, by backscattered electron image, find sample analysis area.
2, parameter setting
The Electronic Speculum parameter: during measurement, accelerating potential is 15-25kV, and electronic beam current is 20-200nA, and beam spot size is 1;
The mapping parameter arranges: selecting scan mode in menu is sample stage scanning, minimum moving step length 1.0, coordinate manual positioning;
The sample stage sweep parameter arranges: the scanning residence time is greater than 30ms, and moving step length is greater than 1.0 * 1.0;
Trace Map parameter arranges: the grid data dot matrix is greater than 9 * 9, reads current point coordinate position, moves to next point, and Manual focusing reads this point coordinate again, repeats above-mentioned steps until the coordinate position of the interior all net points of analyzed area all reads complete; Above-mentioned coordinate is calculated to rear preservation result of calculation.
3, obtain original face scanning distribution plan, utilize the Spectrum Analysis of elemental characteristic X ray to obtain analyzed area element X ray intensity face scintigram.
4, be converted to quantitative mapping, the standard sample X ray intensity at same test condition test institute analytical element, become concentration content by the X ray intensity conversion in original counting face scanning result, obtains quantitative mapping.
5, Line Profile line sweep
Quantitatively in mapping, applying Line Profile line sweep, obtain the quantitative linescan of the curved surface sample through revising.
Beneficial effect of the present invention is:
The present invention can revise concavo-convex the produced measuring error of sample surfaces, greatly improves checkability and testing accuracy, effectively solves the problem that electron probe can only be analyzed flat sample, and the sample scope of electron probing analysis is further enlarged.Especially not minute surface flat sample and the curved surface sample that distortion is arranged for specimen surface, through revising, can obtain accurately quantitatively line sweep result yet.
The accompanying drawing explanation
Fig. 1 is Comparative Examples linescan figure;
Fig. 2 is linescan figure after correction of the present invention.
Embodiment
Embodiment adopts the quantitative line sweep method of curved surface sample of the present invention, and uneven sample is carried out to line scanning.Its step is as follows:
1. clean analytic sample is put into to the electron probe sample chamber, by backscattered electron image, find sample analysis area.
2., while measuring, select the Electronic Speculum running parameter, accelerating potential 15kV, electronic beam current is selected 100nA, beam spot size 1.The mapping parameter is selected: scan mode is sample stage scanning, minimum moving step length 1.0, and the coordinate manual positioning, Trace Map selects YES.Sample stage scanning residence time 30ms, moving step length 6.0 X 6.0.The corrected parameter of curved surface sample is set to 9 * 9 grids, after reading current point coordinate, moves to next point coordinate, and Manual focusing reads this point coordinate again, repeats above-mentioned steps until the coordinate position of interior all 81 points of analyzed area all reads complete.Above-mentioned coordinate is calculated to rear preservation result of calculation.
3. obtain the original face scanning result.Utilize the Spectrum Analysis of the characteristic X-ray of element to carry out the scanning of ferro element X ray intensity face to analyzed area.
4. the original face distribution plan is converted to quantitative mapping.Under same test condition, the standard sample X ray intensity of test institute analytical element, become concentration content by the X ray intensity conversion in original counting face scanning result.
5.Line Profile line sweep.Quantitatively in mapping, applying the quantitative linescan that line sweep Line Profile obtains the curved surface sample through revising.
Fig. 1 is Comparative Examples linescan figure, ferro element average content 62.26%; Fig. 2 is linescan figure after correction of the present invention, ferro element average content 97.74%.From Fig. 1, Fig. 2, can find out, for same sample, under identical test condition, the present invention has successfully repaired the huge measuring error that the concavo-convex difference due to sample produces.

Claims (1)

1. the quantitative line sweep method of curved surface sample electron probe, is characterized in that, concrete steps are:
(1), determine analyzed area
Clean analytic sample is put into to the electron probe sample chamber, by backscattered electron image, find sample analysis area;
(2), parameter setting
The Electronic Speculum parameter: during measurement, accelerating potential is 15-25kV, and electronic beam current is 20-200nA, and beam spot size is 1;
The mapping parameter arranges: selecting scan mode in menu is sample stage scanning, minimum moving step length 1.0, coordinate manual positioning;
The sample stage sweep parameter arranges: the scanning residence time is greater than 30ms, and moving step length is greater than 1.0 * 1.0;
Trace Map parameter arranges: the grid data dot matrix is greater than 9 * 9, reads current point coordinate position, moves to next point, and Manual focusing reads this point coordinate again, repeats above-mentioned steps until the coordinate position of the interior all net points of analyzed area all reads complete; Above-mentioned coordinate is calculated to rear preservation result of calculation;
(3), obtain original face scanning distribution plan, utilize the Spectrum Analysis of elemental characteristic X ray to obtain analyzed area element X ray intensity face scintigram;
(4), be converted to quantitative mapping, the standard sample X ray intensity at same test condition test institute analytical element, become concentration content by the X ray intensity conversion in original counting face scanning result, obtains quantitative mapping;
(5), Line Profile line sweep
Quantitatively in mapping, applying Line Profile line sweep, obtain the quantitative linescan of the curved surface sample through revising.
CN2013104032929A 2013-09-07 2013-09-07 Quantitative line scanning method for curved surface sample electronic probe Pending CN103472082A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN2013104032929A CN103472082A (en) 2013-09-07 2013-09-07 Quantitative line scanning method for curved surface sample electronic probe

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN2013104032929A CN103472082A (en) 2013-09-07 2013-09-07 Quantitative line scanning method for curved surface sample electronic probe

Publications (1)

Publication Number Publication Date
CN103472082A true CN103472082A (en) 2013-12-25

Family

ID=49797021

Family Applications (1)

Application Number Title Priority Date Filing Date
CN2013104032929A Pending CN103472082A (en) 2013-09-07 2013-09-07 Quantitative line scanning method for curved surface sample electronic probe

Country Status (1)

Country Link
CN (1) CN103472082A (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN113009324A (en) * 2021-05-24 2021-06-22 中国电子科技集团公司第二十九研究所 Curved surface multi-probe test fixture
CN114739342A (en) * 2022-04-08 2022-07-12 河北光兴半导体技术有限公司 Method for measuring thickness of ultrathin glass stress layer

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1661363B (en) * 1998-11-10 2011-03-23 株式会社岛津制作所 Electro-probe micro analyzer
JP2012078234A (en) * 2010-10-04 2012-04-19 Jeol Ltd X-ray analysis method and apparatus
CN102954976A (en) * 2011-08-19 2013-03-06 鞍钢股份有限公司 Quantitative detection method for center segregation of wire rod

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1661363B (en) * 1998-11-10 2011-03-23 株式会社岛津制作所 Electro-probe micro analyzer
JP2012078234A (en) * 2010-10-04 2012-04-19 Jeol Ltd X-ray analysis method and apparatus
CN102954976A (en) * 2011-08-19 2013-03-06 鞍钢股份有限公司 Quantitative detection method for center segregation of wire rod

Non-Patent Citations (3)

* Cited by examiner, † Cited by third party
Title
张文兰等: "电子探针面分析与相分析技术及其应用", 《电子显微学报》 *
杨勇,陈能松: "电子探针线扫描分析技术", 《电子显微学报》 *
潘清林: "《材料现代分析测试实验教程》", 31 August 2011, 冶金工业出版社,北京大学出版社,国防工业出版社,哈尔滨工业大学出版社 *

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN113009324A (en) * 2021-05-24 2021-06-22 中国电子科技集团公司第二十九研究所 Curved surface multi-probe test fixture
CN114739342A (en) * 2022-04-08 2022-07-12 河北光兴半导体技术有限公司 Method for measuring thickness of ultrathin glass stress layer
CN114739342B (en) * 2022-04-08 2023-08-11 河北光兴半导体技术有限公司 Method for measuring thickness of ultrathin glass stress layer

Similar Documents

Publication Publication Date Title
Sobel et al. Influence of etching conditions on apatite fission-track etch pit diameter
Hwang et al. Three-dimensional imaging of individual dopant atoms in SrTiO 3
CN103558237B (en) Three-dimensional precision measurement and calibration method for industrial CT (computed tomography)
US9129353B2 (en) Charged particle beam device, and image analysis device
CN103454300A (en) Electronic probe line analysis quantitative detection method for ultra-light element carbon
JPWO2019059011A1 (en) Teacher data creation method and equipment and defect inspection method and equipment
WO2010029700A1 (en) Charged particle beam device
CN105510362B (en) Rice tillering character damage-free measuring apparatus and its measurement method based on minitype CT
CN103604824A (en) Method for quantitative detection on steel wire rod carbon segregation
CN102636488A (en) Quantitative measurement method for sorbite content in high-carbon steel rod
CN102426119A (en) Preparation method of structure section sample of small-sized wafer sample for observation
Gong et al. Comparison of simultaneous signals obtained from a dual-field-of-view lidar and its application to noise reduction based on empirical mode decomposition
JP2007183231A (en) Method for processing eddy current flaw detection signal
CN108008000A (en) A kind of method for measuring the brannerite age
CN109030462A (en) Different type inclusion area and the quantitatively characterizing method of content in a kind of steel
CN104215489A (en) Preparation method of retained austenite standard sample of high-carbon chromium bearing steel
CN106098518A (en) Use the adaptive scanning of the particle size of directional beam signal analysis
CN105093166B (en) A kind of field test method of electronic electric energy meter
CN103472082A (en) Quantitative line scanning method for curved surface sample electronic probe
JP5187810B2 (en) Film thickness measuring method and sample preparation method, film thickness measuring apparatus and sample preparation apparatus
CN109884180A (en) A kind of sparse current vortex fast imaging detection method of conductive structure defect and system
US20150012229A1 (en) Sample analysis apparatus, non-transitory computer-readable recording medium and sample analysis method
Jenson et al. A Bayesian approach for the determination of POD curves from empirical data merged with simulation results
CN111579572A (en) Hierarchical quantitative analysis method for material surface topological structure and application
CN109668862B (en) Aluminum electrolyte molecular ratio detection method based on laser-induced breakdown spectroscopy

Legal Events

Date Code Title Description
C06 Publication
PB01 Publication
C10 Entry into substantive examination
SE01 Entry into force of request for substantive examination
C02 Deemed withdrawal of patent application after publication (patent law 2001)
WD01 Invention patent application deemed withdrawn after publication

Application publication date: 20131225