CN103457067B - Pin structure and there is the electronics assembly of this pin structure - Google Patents
Pin structure and there is the electronics assembly of this pin structure Download PDFInfo
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- CN103457067B CN103457067B CN201210179847.1A CN201210179847A CN103457067B CN 103457067 B CN103457067 B CN 103457067B CN 201210179847 A CN201210179847 A CN 201210179847A CN 103457067 B CN103457067 B CN 103457067B
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Abstract
The present invention discloses a kind of pin structure and has its electronics assembly. Electronics assembly is suitable for being mounted to a socket connector, and socket connector has multiple jacks. Electronics assembly comprises a circuit base plate, multiple pin structure and a scolder. Circuit base plate has a surface, and pin structure is arranged on surface. Each pin structure comprises an inserting section and a welding section, and inserting section is suitable for inserting jack corresponding on socket connector, to be electrically connected with socket connector. Welding section is arranged on circuit base plate and with inserting section and is connected, and wherein the diameter of welding section is less than the diameter of inserting section. Scolder is coated each welding section, and the thickness of scolder to be not more than the diameter of inserting section and welding section poor.
Description
Technical field
The present invention relates to a kind of pin structure and electronics assembly, and particularly relate to a kind of pin structure and there is the electronics assembly of this pin structure.
Background technology
In recent years, along with making rapid progress of electronic technology, coming out one after another of high-tech electronic industry, electronic product more humane, with better function is constantly weeded out the old and bring forth the new, modularized design and modularization are produced has become the considerable means of electronic industry now, makes that bulk article tool is customized, the characteristic of variation and low cost etc.
In order to make the electronic component on circuit base plate reach modular demand, the existing circuit base plates that adopt pin lattice arrays (pingridarray, PGA) are the electronic component on it in order to modularization more. Pin lattice array is that multiple stitch (pin) are assembled on circuit base plate with array way, and existing is to utilize surface adhering technical (SurfaceMountTechnology, SMT), and one end of these stitch is respectively welded to the stitch joint sheet on circuit base plate.
But, in the time stitch being soldered to the stitch joint sheet on circuit base plate surface with scolder, one end that stitch and socket connector plug together is easily because scolder is stained with the difficulty that plugs together of paying while too much causing stitch wish to insert socket connector, and then affect being electrically connected between stitch and socket connector, even may, in the time forcing to plug together, cause the problems such as stitch distortion or fracture because of undue force.
Summary of the invention
An object of the present invention is to provide a kind of pin structure, and it has good production yield.
A further object of the present invention is to provide a kind of electronics assembly, and its pin structure has good production yield.
For reaching above-mentioned order, the present invention proposes a kind of pin structure, is suitable for being soldered to a circuit base plate, and to insert a jack of a socket connector, pin structure comprises an inserting section and a welding section. Inserting section is suitable for inserting the jack of socket connector, to be electrically connected with socket connector. Welding section is connected with inserting section and is suitable for being soldered to circuit base plate, and the diameter of welding section is less than the diameter of inserting section.
The present invention also proposes a kind of electronics assembly, is suitable for being mounted to a socket connector, and socket connector has multiple jacks. Electronics assembly comprises a circuit base plate, multiple pin structure and a scolder. Circuit base plate has a surface, and pin structure is arranged on surface. Each pin structure comprises an inserting section and a welding section, and inserting section is suitable for inserting jack corresponding on socket connector, to be electrically connected with socket connector. Welding section is arranged on circuit base plate and with inserting section and is connected, and wherein the diameter of welding section is less than the diameter of inserting section. Scolder is coated each welding section, and to be not more than the diameter of inserting section and welding section poor with the thickness of the scolder of inserting section junction.
Based on above-mentioned, the present invention is disposed at scolder on the welding section of pin structure, and utilize the section between inserting section and welding section poor, make the unlikely diameter that exceedes inserting section of external diameter of the welding section after coated solder, and can stop that scolder up attaches to inserting section, inserts the situation of socket connector to avoid pin structure to be difficult to. And the present invention can arrange various burrs or dimpled grain on welding section, to increase the contact area between welding section and scolder, and then increase bond strength each other. In addition, also can away from one end of inserting section, welding base be set in welding section, be welded on circuit base plate, with the structural stability of booster injection leg structure, therefore, the present invention not only can improve the welding yield of pin structure, also can improve the structural strength of its electronics assembly.
For above-mentioned feature and advantage of the present invention can be become apparent, special embodiment below, and coordinate appended accompanying drawing to be described in detail below.
Brief description of the drawings
Figure 1A is the schematic perspective view of the pin structure of one embodiment of the invention;
Figure 1B is the schematic side view of the pin structure of Figure 1A;
Fig. 1 C is the schematic perspective view that the pin structure of Figure 1A is applied to the electronics assembly of one embodiment of the invention;
Fig. 2 is the generalized section that the electronics assembly in Figure 1A-1C engages with socket connector;
Fig. 3 A is the schematic perspective view of the pin structure of another embodiment of the present invention;
Fig. 3 B is the schematic side view of the pin structure of Fig. 3 A;
Fig. 4 A is the schematic perspective view of the pin structure of another embodiment of the present invention;
Fig. 4 B is the schematic side view of the pin structure of Fig. 4 A;
Fig. 5 A is the schematic perspective view of the pin structure of another embodiment of the present invention;
Fig. 5 B is the schematic side view of the pin structure of Fig. 5 A;
Fig. 5 C be Fig. 5 A pin structure look up enlarged diagram;
Fig. 6 A is the schematic perspective view of the pin structure of another embodiment of the present invention;
Fig. 6 B is the schematic side view of the pin structure of Fig. 6 A;
Fig. 6 C be Fig. 6 A pin structure look up enlarged diagram;
Fig. 7 A is the schematic perspective view of the pin structure of another embodiment of the present invention;
Fig. 7 B is the schematic side view of the pin structure of Fig. 7 A;
Fig. 8 A is the schematic perspective view of the pin structure of another embodiment of the present invention;
Fig. 8 B is the schematic side view of the pin structure of Fig. 8 A;
Fig. 9 A is the schematic perspective view of the pin structure of another embodiment of the present invention;
Fig. 9 B is the schematic side view of the pin structure of Fig. 9 A;
Figure 10 A is the schematic perspective view of the pin structure of one embodiment of the invention;
Figure 10 B is the schematic side view of the pin structure of Figure 10 A;
Figure 10 C is the schematic perspective view that the pin structure of Figure 10 A is applied to the electronics assembly of one embodiment of the invention;
Figure 11 is the generalized section that the electronics assembly of Figure 10 A engages with socket connector.
Main element symbol description
10: electronics assembly
12: circuit base plate
20: socket connector
22: jack
100,100a, 100b, 100c, 100d, 100e, 100f, 100g: pin structure
110: inserting section
120: welding section
130: welding base
121: ring-type dimpled grain
110: ring-type burr
123: vertical bar shape dimpled grain
120: vertical bar shape burr
125: helical form dimpled grain
126: helical form burr
D1: welding section diameter
D2: inserting section diameter
T1: solder thickness
H1: welding section length
H2: inserting section length
H3: welding base thickness
H1, h2, h3: burr thickness
Detailed description of the invention
Figure 1A is the schematic perspective view of the pin structure of one embodiment of the invention. Figure 1B is the schematic side view of the pin structure of Figure 1A. Fig. 1 C is the schematic perspective view that the pin structure of Figure 1A is applied to the electronics assembly of one embodiment of the invention. Fig. 2 is the generalized section that the electronics assembly in Figure 1A-1C engages with socket connector. Please also refer to Figure 1A to Fig. 2, being suitable for of the present embodiment is mounted to a socket connector 20, and socket connector 20 has multiple jacks 22. Electronics assembly 10 comprises a circuit base plate 12, multiple pin structure 100. In the present embodiment, electronics assembly 10 is pin lattice arrays (pingridarray, a PGA) structure. Circuit base plate 12 has multiple weld pads 14, and pin structure 100 is arranged at respectively on the weld pad 14 of circuit base plate 12. Each pin structure 100 comprises an inserting section 110 and a welding section 120. Inserting section 110 is suitable for inserting jack 22 corresponding on socket connector 20, to be electrically connected with socket connector 20. Welding section 120 is arranged on circuit base plate 12 and with inserting section 110 and is connected, and wherein the diameter D1 of welding section 120 is less than the diameter D2 of inserting section 110. In the present embodiment, welding section 120 is welded on circuit base plate 12. Each welding section 120 is soldered to corresponding weld pad 14 via scolder, and to be not more than inserting section 110 poor with the diameter of welding section 120 with the solder thickness t1 of inserting section 110 junctions, this means, t1≤(D2-D1).
In the present embodiment, the length of welding section 120 is H1, the length of inserting section is H2, inserting section 110 has certain ratio with the length of welding section 120, specifically, the length of welding section 120 be greater than pin structure 100 total length 1/3rd, meaning, and H1 > 1/3 (H1+H2), or the length H1 of welding section 120 is greater than 0.35mm. Configuration described above, scolder is disposed on welding section 120, and utilize the section between inserting section 110 and welding section 120 poor, make the unlikely diameter that exceedes inserting section 110 of external diameter of the welding section 120 after coated solder, and can stop that scolder up attaches to inserting section 110, to avoid pin structure 100 cannot insert the situation of socket connector 20.
In addition, the present invention also can arrange various dimpled grains or burr on welding section 120, to increase the contact area between scolder and welding section 120, and then the bond strength of increase scolder and welding section 120. Only illustrate as follows with several embodiment at this, but the present invention is not as limit.
Fig. 3 A is the schematic perspective view of the pin structure of another embodiment of the present invention. Fig. 3 B is the schematic side view of the pin structure of Fig. 3 A. Please also refer to Fig. 3 A and Fig. 3 B, the pin structure 100a of the present embodiment is similar to the pin structure of Figure 1B 100, the two Main Differences part is: the welding section 120 of the pin structure 100a of the present embodiment has multiple ring-type dimpled grains 121, and ring-type dimpled grain 121 is spaced on welding section 120. Fig. 4 A is the schematic perspective view of the pin structure of another embodiment of the present invention. Fig. 4 B is the schematic side view of the pin structure of Fig. 4 A. Please also refer to Fig. 4 A and Fig. 4 B, the pin structure 100b of the present embodiment is similar to the pin structure of Figure 1B 100, the two Main Differences part is: the welding section 120 of the pin structure 100b of the present embodiment has multiple ring-type burrs 122, and ring-type burr 122 is spaced on welding section 120, wherein, as shown in Figure 4 B, the diameter of welding section 120 is D1, the diameter of inserting section 110 is D2, and the thickness of each ring-type burr 122 is h1, and D1+2h1≤D2.
Fig. 5 A is the schematic perspective view of the pin structure of another embodiment of the present invention. Fig. 5 B is the schematic side view of the pin structure of Fig. 5 A. Fig. 5 C be Fig. 5 A pin structure look up enlarged diagram. Please also refer to Fig. 5 A, Fig. 5 B and Fig. 5 C, the pin structure 100c of the present embodiment is similar to the pin structure of Figure 1B 100, the two Main Differences part is: the welding section 120 of the pin structure 100c of the present embodiment has multiple vertical bar shape dimpled grains 123, and vertical bar shape dimpled grain 123 is around being arranged at welding section 120 around.
Fig. 6 A is the schematic perspective view of the pin structure of another embodiment of the present invention. Fig. 6 B is the schematic side view of the pin structure of Fig. 6 A. Fig. 6 C be Fig. 6 A pin structure look up enlarged diagram. Please also refer to Fig. 6 A, Fig. 6 B and Fig. 6 C, the pin structure 100d of the present embodiment is similar to the pin structure of Figure 1B 100, the two Main Differences part is: the welding section 120 of the pin structure 100d of the present embodiment has multiple vertical bar shape burrs 124, and vertical bar shape burr 124 is around being arranged at welding section 120 around, wherein, as shown in Fig. 6 B and Fig. 6 C, the diameter of welding section 120 is D1, the diameter of inserting section 110 is D2, and the thickness of each vertical bar shape burr 124 is h2, and D1+2h2≤D2.
Fig. 7 A is the schematic perspective view of the pin structure of another embodiment of the present invention. Fig. 7 B is the schematic side view of the pin structure of Fig. 7 A. Please also refer to Fig. 7 A and Fig. 7 B, the pin structure 100e of the present embodiment is similar to the pin structure of Figure 1B 100, the two Main Differences part is: the welding section 120 of the pin structure 100e of the present embodiment has a helical form dimpled grain 125, is surrounded on welding section 120. Fig. 8 A is the schematic perspective view of the pin structure of another embodiment of the present invention. Fig. 8 B is the schematic side view of the pin structure of Fig. 8 A. Please also refer to Fig. 8 A and Fig. 8 B, the pin structure 100f of the present embodiment is similar to the pin structure of Figure 1B 100, the two Main Differences part is: the welding section 120 of the pin structure 100f of the present embodiment has a helical form burr 126, be surrounded on welding section 120, wherein, the diameter of welding section 120 is D1, and the diameter of inserting section 110 is D2, the thickness of each helical form burr 126 is h3, and D1+2h3≤D2.
Fig. 9 A is the schematic perspective view of the pin structure of another embodiment of the present invention. Fig. 9 B is the schematic side view of the pin structure of Fig. 9 A. Please refer to Fig. 9 A and Fig. 9 B, the pin structure 100g of the present embodiment is similar to the pin structure of Figure 1B 100, and the two Main Differences part is: the diameter D1 of the welding section 120 of the pin structure 100g of the present embodiment is along diminishing gradually away from the direction of inserting section 110.
Figure 10 A is the schematic perspective view of the pin structure of one embodiment of the invention. Figure 10 B is the schematic side view of the pin structure of Figure 10 A. Figure 10 C is the schematic perspective view that the pin structure of Figure 10 A is applied to the electronics assembly of one embodiment of the invention. Figure 11 is the generalized section that the electronics assembly of Figure 10 A engages with socket connector. Please also refer to Figure 10 A to and Figure 11, in the electronics assembly 10h of another embodiment of the present invention, pin structure 100h also comprises a welding base 130, be connected to welding section 120 one end away from inserting section 110, welding base 130 is suitable for being soldered to circuit base plate 12, and the diameter D3 of welding base 130 is greater than the diameter D1 of welding section 120, to increase the stabilized structure of pin structure 100h. In addition, in the present embodiment, the length of welding base 130 is H3, and the length H1 of the length H2 of inserting section 110 and welding section 120 and the thickness H3 of welding base 130 have certain ratio. Specifically, the length H1 of welding section 120 add the thickness H3 of welding base 130 be greater than pin structure 100 total length 1/3rd, meaning, and (H1+H3) > 1/3 (H1+H2), or the length H1 of welding section 120 adds that the thickness of welding base 130 is greater than 0.35mm. This means, (H1+H3) > 0.35mm. In the present embodiment, pin structure 100h also can be as in the foregoing embodiment, the various dimpled grains or the burr that on welding section 120, arrange, and to increase the contact area between welding section 120 and scolder, and then the bond strength of increase welding section 120 and scolder.
In sum, the present invention is disposed at scolder on the welding section of pin structure, and utilize the section between inserting section and welding section poor, make the unlikely diameter that exceedes inserting section of external diameter of the welding section after coated solder, and can stop that scolder up attaches to inserting section, inserts the situation of socket connector to avoid pin structure to be difficult to. And the present invention can arrange various burrs or dimpled grain on welding section, to increase the contact area between welding section and scolder, and then increase bond strength each other. In addition, also can away from one end of inserting section, welding base be set in welding section, be welded on circuit base plate, with the structural stability of booster injection leg structure, therefore, the present invention not only can improve pin structure and be soldered to the welding yield of circuit base plate, also can improve the structural strength of its electronics assembly.
Although disclosed the present invention in conjunction with above embodiment; but it is not in order to limit the present invention; under any, in technical field, be familiar with this operator; without departing from the spirit and scope of the present invention; can do a little change and retouching, thus protection scope of the present invention should with enclose claim was defined is as the criterion.
Claims (27)
1. a pin structure, is suitable for being soldered to a circuit base plate, to insert the jack of a socket connector,This pin structure comprises:
Inserting section, is suitable for inserting this jack of this socket connector, to be electrically connected with this socket connector;And
Welding section, is connected with this inserting section and is suitable for being soldered to this circuit base plate, and this socket connector is completeExpose this welding section, the diameter of this welding section is less than the diameter of this inserting section and this welding section junction, andThis welding section has multiple ring-type dimpled grains, multiple ring-type burrs, multiple vertical bar shape dimpled grains, multiple vertical bar shapesBurr, helical form dimpled grain or helical form burr.
2. pin structure as claimed in claim 1, also comprises:
Welding base, is connected to this welding section one end away from this inserting section, and this welding base is suitable for being soldered to thisCircuit base plate, and the diameter of this welding base is greater than the diameter of this welding section.
3. pin structure as claimed in claim 1, wherein the length of this welding section is H1, this graftingThe length of section is H2, and H1 > 1/3 (H1+H2).
4. pin structure as claimed in claim 1, wherein the length of this welding section is H1, and H1 >0.35mm。
5. pin structure as claimed in claim 2, wherein the length of this welding section is H1, this graftingThe length of section is H2, and the thickness of this welding base is H3, and (H1+H3) > 1/3 (H1+H2).
6. pin structure as claimed in claim 2, wherein the length of this welding section is H1, this weldingThe thickness of seat is H3, and (H1+H3) > 0.35mm.
7. pin structure as claimed in claim 1 or 2, wherein those ring-type dimpled grains are spaced in thisOn welding section.
8. pin structure as claimed in claim 1, wherein those ring-type burrs are spaced in this weldingDuan Shang, wherein the diameter of this welding section is D1, the diameter of this inserting section is D2, respectively this ring-type burrThickness is h1, and D1+2h1≤D2.
9. pin structure as claimed in claim 1 or 2, wherein those vertical bar shape dimpled grains are surrounded on this welderingThe section of connecing around.
10. pin structure as claimed in claim 1 or 2, wherein those vertical bar shape burrs are surrounded on thisAround, wherein the diameter of this welding section is D1 to welding section, and the diameter of this inserting section is D2, and respectively this is straightThe thickness of strip burr is h2, and D1+2h2≤D2.
11. pin structure as claimed in claim 1 or 2, wherein this helical form dimpled grain is surrounded on this welderingIn the section of connecing.
12. pin structure as claimed in claim 1, wherein this helical form burr is surrounded on this welding sectionUpper, wherein the diameter of this welding section is D1, the diameter of this inserting section is D2, respectively this helical form burrThickness is h3, and D1+2h3≤D2.
13. pin structure as claimed in claim 1 or 2, wherein the diameter of this welding section along away fromThe direction of this inserting section diminishes gradually.
14. 1 kinds of electronics assemblies, are suitable for being mounted to a socket connector, and this socket connector has multipleJack, this electronics assembly comprises:
Circuit base plate, has multiple weld pads; And
Multiple pin structure, are arranged at respectively on those weld pads, and respectively this pin structure comprises:
Inserting section, is suitable for inserting this jack corresponding on this socket connector, to be connected with this socketDevice electrical connection; And
Welding section, is arranged on this corresponding weld pad and is connected this socket connector with this inserting sectionExpose this welding section completely, wherein the diameter of this welding section is less than this inserting section and this welding section junctionDiameter, and this welding section has multiple ring-type dimpled grains, multiple ring-type burrs, multiple vertical bar shape dimpled grains are manyIndividual vertical bar shape burr, helical form dimpled grain or helical form burr.
15. electronics assemblies as claimed in claim 14, wherein respectively this pin structure also comprises welding base,Be arranged at this welding section one end away from this inserting section, this welding base is arranged on this circuit base plate and this welderingThe diameter of joint chair is greater than the diameter of this welding section.
16. electronics assemblies as claimed in claim 14, wherein the length of this welding section is H1, this is insertedThe length of the section of connecing is H2, and H1 > 1/3 (H1+H2).
17. electronics assemblies as claimed in claim 14, wherein the length of this welding section is H1, and H1＞0.35mm。
18. electronics assemblies as claimed in claim 15, wherein the length of this welding section is H1, this is insertedThe length of the section of connecing is H2, and the thickness of this welding base is H3, and (H1+H3) > 1/3 (H1+H2).
19. electronics assemblies as claimed in claim 15, wherein the length of this welding section is H1, this welderingThe thickness of joint chair is H3, and (H1+H3) > 0.35mm.
20. electronics assemblies as described in claims 14 or 15, wherein those ring-type dimpled grains are spacedOn this welding section.
21. electronics assemblies as claimed in claim 14, wherein those ring-type burrs are spaced in this welderingThe section of connecing is upper, and wherein the diameter of this welding section is D1, and the diameter of this inserting section is D2, respectively this ring-type burrLength be h1, and D1+2h1≤D2.
22. electronics assemblies as described in claims 14 or 15, wherein those vertical bar shape dimpled grains are surrounded onThis welding section around.
23. electronics assemblies as described in claims 14 or 15, wherein those vertical bar shape burrs are surrounded onAround, wherein the diameter of this welding section is D1 to this welding section, and the diameter of this inserting section is D2, respectively shouldThe thickness of vertical bar shape burr is h2, and D1+2h2≤D2.
24. electronics assemblies as described in claims 14 or 15, wherein this helical form dimpled grain is surrounded on thisOn welding section.
25. electronics assemblies as claimed in claim 14, wherein this helical form burr is surrounded on this welding sectionUpper, wherein the diameter of this welding section is D1, the diameter of this inserting section is D2, respectively this helical form burrThickness is h3, and D1+2h3≤D2.
26. electronics assemblies as described in claims 14 or 15, wherein the diameter of this welding section is along farDirection from this inserting section diminishes gradually.
27. electronics assemblies as described in claims 14 or 15, wherein respectively this welding section welds via scolderBe connected to this corresponding weld pad, and be not more than this inserting section and this weldering with the solder thickness of this inserting section junctionThe diameter of the section of connecing is poor.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201210179847.1A CN103457067B (en) | 2012-06-01 | 2012-06-01 | Pin structure and there is the electronics assembly of this pin structure |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201210179847.1A CN103457067B (en) | 2012-06-01 | 2012-06-01 | Pin structure and there is the electronics assembly of this pin structure |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN103457067A CN103457067A (en) | 2013-12-18 |
| CN103457067B true CN103457067B (en) | 2016-05-11 |
Family
ID=49739184
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201210179847.1A Expired - Fee Related CN103457067B (en) | 2012-06-01 | 2012-06-01 | Pin structure and there is the electronics assembly of this pin structure |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN103457067B (en) |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1496212A (en) * | 2002-09-20 | 2004-05-12 | 日本特殊陶业株式会社 | Circuit board with pin made of resin |
| CN201966475U (en) * | 2010-12-27 | 2011-09-07 | 江西昌河航空工业有限公司 | Plug tool for mounting pin of cable plug connector |
| CN202134353U (en) * | 2011-06-22 | 2012-02-01 | 杭州福华光电科技有限公司 | Embedded type pin |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102307430A (en) * | 2011-08-25 | 2012-01-04 | 安徽华东光电技术研究所 | Circuit board with realization of electric connection between right side and reverse side through binding post and welding method thereof |
-
2012
- 2012-06-01 CN CN201210179847.1A patent/CN103457067B/en not_active Expired - Fee Related
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1496212A (en) * | 2002-09-20 | 2004-05-12 | 日本特殊陶业株式会社 | Circuit board with pin made of resin |
| CN201966475U (en) * | 2010-12-27 | 2011-09-07 | 江西昌河航空工业有限公司 | Plug tool for mounting pin of cable plug connector |
| CN202134353U (en) * | 2011-06-22 | 2012-02-01 | 杭州福华光电科技有限公司 | Embedded type pin |
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| Publication number | Publication date |
|---|---|
| CN103457067A (en) | 2013-12-18 |
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Granted publication date: 20160511 Termination date: 20190601 |