CN103448205A - Manufacturing method of power adapter shell - Google Patents

Manufacturing method of power adapter shell Download PDF

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Publication number
CN103448205A
CN103448205A CN2012101728553A CN201210172855A CN103448205A CN 103448205 A CN103448205 A CN 103448205A CN 2012101728553 A CN2012101728553 A CN 2012101728553A CN 201210172855 A CN201210172855 A CN 201210172855A CN 103448205 A CN103448205 A CN 103448205A
Authority
CN
China
Prior art keywords
barricade
formed body
power adaptor
adaptor housing
male model
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN2012101728553A
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Chinese (zh)
Inventor
刘育诚
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Huanyong Technology Co Ltd
Ampower Beihai Ltd
Original Assignee
Huanyong Technology Co Ltd
Ampower Beihai Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Huanyong Technology Co Ltd, Ampower Beihai Ltd filed Critical Huanyong Technology Co Ltd
Priority to CN2012101728553A priority Critical patent/CN103448205A/en
Publication of CN103448205A publication Critical patent/CN103448205A/en
Pending legal-status Critical Current

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Abstract

A manufacturing method of a power adapter shell comprises following steps: providing a forming mould, resins and a shielding plate, carrying out injection forming through the forming mould so as to obtain a forming body with one side pasted with a shielding plate, processing the forming body so as to obtain a power adapter shell embedded with the shielding plate. The power adapter shell prepared through the method mentioned above has the advantage of high production efficiency.

Description

The preparation method of power adaptor housing
Technical field
The present invention relates to a kind of preparation method of power adaptor housing.
Background technology
Existing power supply adaptor comprises internal electronic element, barricade and power adaptor housing.Barricade is installed in power adaptor housing.Internal electronic element is installed in power adaptor housing.Due to, general barricade is fixed at power adaptor housing by combinations such as engaging, viscose glues, causes the production efficiency step-down of power adaptor housing.
Summary of the invention
In view of foregoing, be necessary to provide the preparation method of the power adaptor housing that a kind of production efficiency is higher.
A kind of preparation method of power adaptor housing, it comprises the steps: to be provided as mould, resin and barricade, and carries out injection mo(u)lding by mould, to make the formed body of a side with barricade; This formed body is processed and made the chimeric power adaptor housing that this barricade is arranged.
Power adaptor housing of the present invention makes the chimeric power adaptor housing that barricade is arranged by above-mentioned forming method, thereby be assembled in the assembling process in power adaptor housing without traditional barricade, and then improved the production efficiency of power adaptor housing.
The accompanying drawing explanation
Fig. 1 is the decomposing schematic representation of the power supply adaptor of embodiment of the present invention.
Fig. 2 is the schematic cross-section of the power adaptor housing shown in Fig. 1.
Fig. 3 is the schematic diagram of the making power adaptor housing of first embodiment of the invention.
Fig. 4 is the preparation method flow chart of the housing of first embodiment of the invention.
Fig. 5 is the schematic diagram of the making power adaptor housing of second embodiment of the invention.
Fig. 6 is the preparation method flow chart of the power adaptor housing of second embodiment of the invention.
The main element symbol description
Power adaptor housing 100
Barricade 11
Resin 30
The first formed body 50
The second formed body 70
Board 90
Power supply adaptor 200
Internal electronic element 201
Mould 300、500
Master mold 301、501
The first male model 303
Die cavity 3031、5031
The second male model 305
The first forming cavity 307
The second forming cavity 309
Heater 400
Male model 503
The moulding die cavity 507
Supersonic wave welder 600
Plumb joint 601
The following specific embodiment further illustrates the present invention in connection with above-mentioned accompanying drawing.
The specific embodiment
Refer to Fig. 1 and Fig. 2, the power adaptor housing 100 of embodiment of the present invention covers at internal electronic element 201 outsides of power supply adaptor 200, in order to the normal operation of the internal electronic element 201 that prevents outside electromagnetic interference influence power supply adaptor 200.
In present embodiment, the quantity of power adaptor housing 100 is two, and two power adaptor housings 100 are rectangular frame shaped all, and it cooperatively interacts and covers in the outside of establishing internal electronic element 201.All embed barricade 11 is arranged on the base plate of power adaptor housing 100, in order to shield outside electromagnetic interference, and strengthened the anti-power of falling of power adaptor housing 100.In present embodiment, power adaptor housing 100 is made by plastic material, and barricade 11 is made by electromagnetic shielding material, for example Copper Foil or aluminium foil.
See also Fig. 3 and Fig. 4, the preparation method of power adaptor housing 100 also is provided in the present invention.
Power adaptor housing 100 forming methods comprise the following steps:
Step S1: be provided as mould 300, resin 30 and barricade 11, and carry out injection mo(u)lding by mould 300, be fitted with the first formed body 50 of barricade 11 to make a side.
In present embodiment, mould 300 comprises master mold 301, the first male model 303 and second male model 305, and heater 400 also is provided.In present embodiment, be concaved with the die cavity 3031 be complementary with barricade 11 on the first male model 303, prevent barricade 11 distortion during in order to moulding.At first, resin 30 is positioned on heater 400, and heater 400 is heated to resin 30 molten condition of resin 30, then keeps constant temperature.In present embodiment, the melt temperature of resin 30 is 250 degree.Then, barricade 11 is fixed in the die cavity 3031 of the first male model 303, die cavity 3031 inwalls of barricade 11 and the first male model 303 fit tightly.Then, the first male model 303 is arranged to the top of master mold 301, the die cavity of the die cavity of the first male model 303 and master mold 301 surrounds first forming cavity 307 jointly.Follow again, to injecting the resin 30 of melting in the first forming cavity 307, and carry out coolingly, be fitted with the first formed body 50 of barricade 11 to make a side.
Step S3: the first formed body 50 that is fitted with barricade 11 by 300 pairs of moulds carries out injection mo(u)lding again, to make, embeds the power adaptor housing 100 that barricade 11 is arranged.
At first, remove the first male model 303, the second male model 305 is arranged to the top of master mold 301, the die cavity of the die cavity of the second male model 305 and master mold 301 surrounds second forming cavity 309 jointly.Then, to injecting the resin 30 of melting in the second forming cavity 309, and carry out cooling, to form the second formed body 70.The second formed body 70 is incorporated into the side that the first formed body 50 has barricade 11, and then makes the first formed body 50 and the common barricade 11 that coats of the second formed body 70, to make, embeds the power adaptor housing 100 that barricade 11 is arranged.
See also Fig. 5 and Fig. 6, the second embodiment of the preparation method of power adaptor housing 100 also is provided in the present invention.
The preparation method of power adaptor housing 100 comprises the following steps:
Step S101: be provided as mould 500, resin 30 and barricade 11, and carry out injection mo(u)lding by mould 300, be fitted with the formed body of barricade 11 to make a side.
In present embodiment, mould 500 comprises master mold 501 and male model 503, and heater 400 also is provided.At first, resin 30 is positioned on heater 400, and heater 400 is heated to resin 30 molten condition of resin 30, then keeps constant temperature.In present embodiment, the melt temperature of resin 30 is 250 degree.In present embodiment, be concaved with the die cavity 507 be complementary with barricade 11 on male model 503, prevent barricade 11 distortion during in order to moulding.。Then, barricade 11 is fixed in the die cavity 5031 of male model 503, barricade 11 fits tightly with die cavity 5031 inwalls of male model 503.Then, male model 503 is arranged to the top of master mold 501, the die cavity of the die cavity of male model 503 and master mold 501 surrounds moulding die cavity 507 jointly.Follow again, to injecting the resin 30 of melting in moulding die cavity 507, and carry out coolingly, be fitted with the formed body of barricade 11 to make a side.
Step S103: board 90 and supersonic wave welder 600 are provided, and adopt supersonic wave welder 600 to be fused on the side that formed body is fitted with barricade 11 in connection with plate 90, to make, embed the power adaptor housing 100 that barricade 11 is arranged.
In present embodiment, board 90 is made by plastic material.At first, in connection with plate 90, be positioned in formed body, and board 90 offsets with the formed body inwall.Then, the plumb joint 601 of supersonic wave welder 600 is sent to ultrasonic energy the weld zone of board 90, so that the fusing of the weld zone of board 90.Then, 601 pairs of boards 90 of the plumb joint of supersonic wave welder 600 are exerted pressure, so that on board 90 barricades 11, a side relative with formed body offsets.Finally, cooling board 90 afterwards and the inwall that is incorporated into formed body, and then formed body and the common barricade 11 that coats of board 90, embed to make the power adaptor housing 100 that barricade 11 is arranged.
Power adaptor housing 100 of the present invention makes the chimeric power adaptor housing 100 that barricade 11 is arranged by above-mentioned forming method, thereby be assembled in the assembling process in power adaptor housing 100 without traditional barricade 11, and then improved the production efficiency of power adaptor housing 100.
In addition, those skilled in the art also can do other variation in spirit of the present invention, and certainly, the variation that these are done according to spirit of the present invention, all should be included in the present invention's scope required for protection.

Claims (8)

1. the preparation method of a power adaptor housing, it comprises the steps:
Be provided as mould, resin and barricade, and carry out injection mo(u)lding by mould, to make the formed body of a side with barricade;
This formed body is processed and made the chimeric power adaptor housing that this barricade is arranged.
2. the preparation method of power adaptor housing as claimed in claim 1, it is characterized in that: described barricade is made by Copper Foil or aluminium foil.
3. the preparation method of power adaptor housing as claimed in claim 1, it is characterized in that: the described processing mode to formed body is: by this mould, this formed body is carried out to injection mo(u)lding again, at formed body, with a side of barricade, to form another formed body, so that these two formed bodys wrap up this barricade jointly.
4. the preparation method of power adaptor housing as claimed in claim 1, it is characterized in that: the described processing mode to formed body is: board and supersonic wave welder are provided, and adopt supersonic wave welder that this board is fused on this formed body one side, so that this formed body and this board wrap up barricade jointly.
5. the preparation method of power adaptor housing as claimed in claim 4, it is characterized in that: this board is made by plastic material.
6. the preparation method of power adaptor housing as claimed in claim 3, it is characterized in that: this mould comprises master mold and first male model, the die cavity of the die cavity of this male model and this first male model surrounds first forming cavity jointly, to make this formed body.
7. the preparation method of power adaptor housing as claimed in claim 6, it is characterized in that: on this first male model, shape has the die cavity be complementary with this barricade, this barricade is fixed in the die cavity of this first male model, and fits tightly with the die cavity inwall of this first male model.
8. the preparation method of power adaptor housing as claimed in claim 6, it is characterized in that: this mould also comprises the second male model, the die cavity of this second male model and the die cavity of this master mold surround second forming cavity jointly, by this second male model, this formed body is carried out to injection mo(u)lding again to make another formed body, so that these two formed bodys wrap up this barricade jointly.
CN2012101728553A 2012-05-30 2012-05-30 Manufacturing method of power adapter shell Pending CN103448205A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN2012101728553A CN103448205A (en) 2012-05-30 2012-05-30 Manufacturing method of power adapter shell

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN2012101728553A CN103448205A (en) 2012-05-30 2012-05-30 Manufacturing method of power adapter shell

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Publication Number Publication Date
CN103448205A true CN103448205A (en) 2013-12-18

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Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN104835631A (en) * 2015-04-17 2015-08-12 东莞市盈聚电子有限公司 Water-proof and damp-proof power adapter
CN108132089A (en) * 2017-11-16 2018-06-08 江阴市索菲电子科技有限公司 A kind of lightweight electronic scale
CN110491280A (en) * 2019-08-30 2019-11-22 佛山市南海慷德家居制品有限公司 A kind of ultra-thin nameplate and preparation method thereof
WO2021111743A1 (en) * 2019-12-03 2021-06-10 Nissha株式会社 Circuit-mounted two-color molding die device and circuit-mounted two-color molded product

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS63257298A (en) * 1987-04-15 1988-10-25 サカエ理研工業株式会社 Electromagnetic or radio frequency shielded product and manufacture of the same
CN201243029Y (en) * 2008-06-20 2009-05-20 Tcl集团股份有限公司 Lithium ion power cell case
CN101627669A (en) * 2007-03-30 2010-01-13 富士通株式会社 Adopt the compound framework and the manufacture method thereof of biodegradable plastic

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS63257298A (en) * 1987-04-15 1988-10-25 サカエ理研工業株式会社 Electromagnetic or radio frequency shielded product and manufacture of the same
CN101627669A (en) * 2007-03-30 2010-01-13 富士通株式会社 Adopt the compound framework and the manufacture method thereof of biodegradable plastic
CN201243029Y (en) * 2008-06-20 2009-05-20 Tcl集团股份有限公司 Lithium ion power cell case

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN104835631A (en) * 2015-04-17 2015-08-12 东莞市盈聚电子有限公司 Water-proof and damp-proof power adapter
CN108132089A (en) * 2017-11-16 2018-06-08 江阴市索菲电子科技有限公司 A kind of lightweight electronic scale
CN110491280A (en) * 2019-08-30 2019-11-22 佛山市南海慷德家居制品有限公司 A kind of ultra-thin nameplate and preparation method thereof
WO2021111743A1 (en) * 2019-12-03 2021-06-10 Nissha株式会社 Circuit-mounted two-color molding die device and circuit-mounted two-color molded product
JP2021088086A (en) * 2019-12-03 2021-06-10 Nissha株式会社 Mold device for two-color molding with circuit and two-color molded product with circuit

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Application publication date: 20131218