CN103426808A - Slide structure for temporary bonding and method for bonding and bonding removal - Google Patents
Slide structure for temporary bonding and method for bonding and bonding removal Download PDFInfo
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- CN103426808A CN103426808A CN2013104015001A CN201310401500A CN103426808A CN 103426808 A CN103426808 A CN 103426808A CN 2013104015001 A CN2013104015001 A CN 2013104015001A CN 201310401500 A CN201310401500 A CN 201310401500A CN 103426808 A CN103426808 A CN 103426808A
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Abstract
The invention provides a slide structure for temporary bonding. The slide structure comprises a slide wafer, a groove is formed in the upper surface of the slide wafer, and viscosity removal treatment is performed on the inner wall of the groove and the upper surface of the outer circle of slide wafer surrounding the groove; filling glue is filled into the groove and solidified; a device wafer is in bonding with the upper surface of the solidified filling glue and the upper surface of the outer circle of the slide wafer to form a temporary bonding body. The invention further provides a method for bonding and bonding removal of the slide structure. The slide structure for temporary bonding and the method for bonding and bonding removal solve the related problems that an existing slide wafer is complicated in manufacturing process, high in cost and the like, achieve the low-cost temporary bonding process to a large extent, meanwhile, guarantee reliability of bonding removal, and reduce fraction risks.
Description
Technical field
The present invention relates to the microelectronic packaging technology field, particularly relate to a kind of interim bonding and tear bonding technology open.
Background technology
Thickness along with encapsulating structure further reduces at present, and especially, to 2.5DIC, the 3DIC technology of stacked structure, the advantage of thin wafer technology is more and more obvious.Thin wafer and thin chip is processed into the bottleneck for the volume production ultrathin products thus.And drawn on this basis interim bonding and torn bonding technology open.
Interim bonding with tear bonding open and there is following advantage: at first, the slide glass wafer provides supportive protection mechanically for thin device wafers, so just can carry out back process by the equipment of normal component wafer fabrication.For the ultra thin device wafer, can realize the PROCESS FOR TREATMENT of wafer scale.Therefore, by interim bonding and tear bonding techniques open, utilize every equipment of normal component wafer factory can both process thin device wafers, and without conversion unit again, and do not need special fixture or wafer cassette.
Meanwhile tear bonding open and also show certain destabilizing factor, because after back process, thin device wafers has lacked certain support bearing in tearing bonding process open, and do not have enough safeguard measures.When device wafers thickness arrival 50um is following, the yield of tearing bonding technology open can not be guaranteed now, and this also allows manufacturer can not realize as early as possible the volume production of ultra-thin wafers.
Mention in U.S. Pat 8267143B2, after by laser treatment, dielectric viscosity being reduced, then utilize mechanical force upwards by adminicle and wafer separate.Need extra laser processing apparatus, cost is high.
When tearing bonding open, after reducing dielectric viscosity, some methods are to utilize the rotation that adminicle is relative with device wafers and the pulling force made progress, by adminicle and wafer separate.But the method reliability is poor, sometimes can make device wafers break.
On the whole interim bonding of the prior art with tear open bonding technology exist have a big risk, the high in cost of production shortcoming.
Summary of the invention
The object of the present invention is to provide a kind of slide glass structure and bonding for interim bonding and tear bonding method open, easy to make, realized interim bonding technology cheaply, the reliability that has simultaneously guaranteed to tear open bonding.The technical solution used in the present invention is:
A kind of slide glass structure for interim bonding, comprise a slide glass wafer, at slide glass wafer upper surface, has groove, and the slide glass wafer outer ring upper surface of the inwall of described groove and described groove surrounding is processed through past viscosity; Filling glue is filled in described groove and is cured; Filling glue upper surface and slide glass wafer outer ring upper surface bonding after device wafers is passed through the ephemeral key rubber alloy and solidified, thus the ephemeral key zoarium formed.
Further, the described viscosity of going is treated to the silanization processing.
Further, described filling glue is PDMS glue.
Further, the degree of depth of described groove is less than 400um.
A kind of slide glass structure bonding for interim bonding with tear bonding method open, comprise the following steps:
Bonding method comprises the steps S1～S5:
S1. provide the slide glass wafer, in the upper surface recessing of slide glass wafer;
S2. to the inwall of slide glass wafer upper groove, and the slide glass wafer outer ring upper surface of described groove surrounding is gone viscosity to process;
S3. use the groove of filling on glue filling slide glass wafer, and be cured;
S4. the filling glue upper surface after solidifying and slide glass wafer outer ring upper surface apply the ephemeral key rubber alloy;
S5. device wafers and slide glass wafer are passed through to the interim bonding of ephemeral key rubber alloy, form the ephemeral key zoarium;
Tear bonding method open and comprise the steps S6～S7:
S6. the slide glass wafer outer ring upper surface of groove surrounding and the ephemeral key rubber alloy between device wafers are removed;
S7. assembly and the slide glass wafer separate of the filling glue by device wafers, ephemeral key rubber alloy, after solidifying;
S8. the ephemeral key rubber alloy on device wafers and filling glue are removed.
Further, in step S2, the described viscosity of going is treated to the silanization processing.
Further, described use is filled glue and is filled the groove on the slide glass wafer, and, after being cured, before step S4, also comprises: the residual filling glue of slide glass wafer outer ring upper surface of removing the groove surrounding.
Further, in described step S6, the method that the slide glass wafer outer ring upper surface of removal groove surrounding and the method for the ephemeral key rubber alloy between device wafers can adopt Metal Cutting method or wet method to dissolve.
Advantage of the present invention: the invention solves the relevant issues such as the loaded down with trivial details and cost costliness of existing slide glass wafer manufacturing technique, largely realized interim bonding technology cheaply, the reliability that has simultaneously guaranteed to tear open bonding, reduce the risk of fragment.
The accompanying drawing explanation
Fig. 1 is slide glass wafer schematic diagram.
Fig. 2 is recessing schematic diagram on the slide glass wafer.
Fig. 3 fills PDMS to fill the glue schematic diagram in groove.
Fig. 4 applies ephemeral key rubber alloy schematic diagram on the slide glass wafer.
Fig. 5 is the fit schematic diagram of the ephemeral key after bonding.
Fig. 6 removes the slide glass wafer outer ring upper surface of groove surrounding and the ephemeral key rubber alloy schematic diagram between device wafers.
Schematic diagram after Fig. 7 device wafers and slide glass wafer separate.
Fig. 8 has removed the ephemeral key rubber alloy and has filled the device wafers schematic diagram of glue.
Embodiment
Below in conjunction with concrete drawings and Examples, the invention will be further described.
The invention discloses a kind of slide glass structure and technique thereof for interim bonding, comprising: slide glass wafer manufacturing, glue-line apply, interim bonding and tear the technique such as bonding open.Solve the relevant issues such as the loaded down with trivial details and cost costliness of existing slide glass wafer manufacturing technique, largely realized interim bonding technology cheaply, the reliability that has simultaneously guaranteed to tear open bonding.
As shown in Fig. 1～Fig. 5: a kind of slide glass structure for interim bonding, comprise a slide glass wafer 1, have groove 2 at slide glass wafer 1 upper surface, the slide glass wafer 1 outer ring upper surface of the inwall of described groove 2 and described groove 2 surroundings is processed to remove certain viscosity through silanization, makes the inwall of groove 2 and the slide glass wafer 1 outer ring upper surface of groove 2 surroundings show as weak viscosity; Filling glue 3 is filled in described groove 2 and is cured; Filling glue 3 upper surfaces and slide glass wafer 1 outer ring upper surface bonding after device wafers 5 is passed through ephemeral key rubber alloy 4 and solidified.Described filling glue 3 can adopt the PDMS(dimethyl silicone polymer) glue.The degree of depth of described groove 2 is less than 400um usually.
A kind of slide glass structure bonding for interim bonding provided by the invention with tear bonding method open, comprise the following steps:
The method of device wafers 5 and slide glass wafer 1 interim bonding is referring to Fig. 1～Fig. 5, specific as follows described:
S1. provide slide glass wafer 1, in the upper surface recessing 2 of slide glass wafer 1; Specifically can on slide glass wafer 1, by dry etching or wet etching, form groove 2;
S2. to the inwall of slide glass wafer 1 upper groove 2, and the slide glass wafer 1 outer ring upper surface of described groove 2 surroundings carries out the silanization processing; To reduce the bonding force of groove 2 inwalls and slide glass wafer 1 outer ring upper surface and glue;
S3. use and fill the groove 2 that glue 3 is filled on slide glass wafer 1, and be cured, then remove the residual filling glue 3 of slide glass wafer 1 outer ring upper surface of groove 2 surroundings; Described filling glue 3 can adopt the PDMS(dimethyl silicone polymer) glue.The filling glue 3 used solidifies afterwards and slide glass wafer 1 can be realized demoulding functions.(being that mutual bonding force is little)
S4. filling glue 3 upper surfaces after solidifying and slide glass wafer 1 outer ring upper surface apply ephemeral key rubber alloy 4;
S5. device wafers 5 and slide glass wafer 1 are passed through to the interim bonding of ephemeral key rubber alloy 4, form the ephemeral key zoarium; Device wafers 5 with solidify after filling glue 3 also by ephemeral key rubber alloy 4, be bonded together; In this ephemeral key zoarium, because the filling glue 3 after solidifying is arranged in the groove 2 of slide glass wafer 1, and the filling glue after solidifying 3 is by ephemeral key rubber alloy 4 and the firm bonding of device wafers 5, so device wafers 5 can keep reasonable lateral stability in follow-up processing technology.Because groove 2 inwalls and slide glass wafer 1 outer ring upper surface have passed through the silanization processing, so groove 2 inwalls and the bonding force of filling glue 3, and the bonding force of slide glass wafer 1 outer ring upper surface and ephemeral key rubber alloy 4 is not very large, stability requirement in the time of can guaranteeing device wafers 5 following process, but after facilitating again device wafers 5 processing technologys to finish with the separating of slide glass wafer 1.
After above-mentioned steps S5 completes, just can carry out back process to device wafers 5; Comprise attenuate, connect up again, make salient point etc.Tear the ephemeral key zoarium open bonding subsequently, referring to Fig. 6～Fig. 8, concrete steps are as follows:
S6. the ephemeral key rubber alloy between the slide glass wafer of groove 2 surroundings 1 outer ring upper surface and device wafers 5 is removed; Such as the method that can take Metal Cutting method or wet method to dissolve is removed the ephemeral key rubber alloy of this circle.Metal Cutting utilizes Metal Cutting line or blade to be cut exactly; Wet method is dissolved and is utilized chemical agent to soak and dissolve the ephemeral key rubber alloy at above-mentioned position.
S7. the assembly of the filling glue 3 by device wafers 5, ephemeral key rubber alloy 4, after solidifying separates with slide glass wafer 1; Groove 2 inwalls are little with the bonding force of filling glue 3, so this step is easy to realize.
S8. the ephemeral key rubber alloy 4 on device wafers 5 and filling glue 3 are removed, wherein PDMS filling glue 3 can directly remove or chemolysis, and ephemeral key rubber alloy 4 can wash with chemical agent.
To those skilled in the art, obviously the invention is not restricted to the details of above-mentioned example embodiment, and in the situation that do not deviate from spirit of the present invention or essential characteristic, can realize the present invention with other concrete form.Therefore, no matter from which point, all should regard embodiment as exemplary, and be nonrestrictive, scope of the present invention is limited by claims rather than above-mentioned explanation, therefore is intended to include in the present invention dropping on the implication that is equal to important document of claim and all changes in scope.Any Reference numeral in claim should be considered as limit related claim.
In addition, be to be understood that, although this specification is described according to execution mode, but not each execution mode only comprises an independently technical scheme, this narrating mode of specification is only for clarity sake, those skilled in the art should make specification as a whole, and the technical scheme in each embodiment also can, through appropriate combination, form other execution modes that it will be appreciated by those skilled in the art that.
Claims (9)
1. the slide glass structure for interim bonding, comprise a slide glass wafer (1), it is characterized in that: have groove (2) at described slide glass wafer (1) upper surface, slide glass wafer (1) the outer ring upper surface of the inwall of described groove (2) and described groove (2) surrounding is processed through past viscosity; Filling glue (3) is filled in described groove (2) and is cured; Filling glue (3) upper surface and slide glass wafer (1) outer ring upper surface bonding after device wafers (5) is passed through ephemeral key rubber alloy (4) and solidified.
2. the slide glass structure for interim bonding as claimed in claim 1 is characterized in that: describedly go viscosity to be treated to silanization to process.
3. the slide glass structure for interim bonding as claimed in claim 1, it is characterized in that: described filling glue (3) is PDMS glue.
4. the slide glass structure for interim bonding as claimed in claim 1, it is characterized in that: the degree of depth of described groove (2) is less than 400um.
A slide glass structure bonding for interim bonding with tear bonding method open, it is characterized in that, comprise the following steps:
Bonding method comprises the steps S1～S5:
S1. provide slide glass wafer (1), in the upper surface recessing (2) of slide glass wafer (1);
S2. to the inwall of slide glass wafer (1) upper groove (2), and slide glass wafer (1) the outer ring upper surface of described groove (2) surrounding is gone viscosity to process;
S3. use the groove (2) of filling on glue (3) filling slide glass wafer (1), and be cured;
S4. filling glue (3) upper surface after solidifying and slide glass wafer (1) outer ring upper surface apply ephemeral key rubber alloy (4);
S5. device wafers (5) and slide glass wafer (1) are passed through to the interim bonding of ephemeral key rubber alloy (4), form the ephemeral key zoarium;
Tear bonding method open and comprise the steps S6～S7:
S6. slide glass wafer (1) the outer ring upper surface of groove (2) surrounding and the ephemeral key rubber alloy between device wafers (5) are removed;
S7. the assembly of the filling glue (3) by device wafers (5), ephemeral key rubber alloy (4), after solidifying separates with slide glass wafer (1);
S8. the ephemeral key rubber alloy (4) on device wafers (5) and filling glue (3) are removed.
Slide glass structure bonding for interim bonding as claimed in claim 4 with tear bonding method open, it is characterized in that: in step S2, describedly go viscosity to be treated to silanization to process.
Slide glass structure bonding for interim bonding as claimed in claim 4 with tear bonding method open, it is characterized in that: described filling glue (3) adopts PDMS glue.
Slide glass structure bonding for interim bonding as claimed in claim 4 with tear bonding method open, it is characterized in that: described use is filled glue (3) and is filled the groove (2) on slide glass wafer (1), and after being cured, before step S4, also comprise step: the residual filling glue (3) of slide glass wafer (1) outer ring upper surface of removing groove (2) surrounding.
Slide glass structure bonding for interim bonding as claimed in claim 4 with tear bonding method open, it is characterized in that: in described step S6, the method that slide glass wafer (1) the outer ring upper surface of removal groove (2) surrounding and the method for the ephemeral key rubber alloy between device wafers (5) can adopt Metal Cutting method or wet method to dissolve.
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Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104485294A (en) * | 2014-12-12 | 2015-04-01 | 浙江中纳晶微电子科技有限公司 | Temporary bonding and separation method for wafers |
| CN105244308A (en) * | 2015-11-16 | 2016-01-13 | 华天科技（昆山）电子有限公司 | Method for holding thin wafer through temporary bonding of porous slide glass |
| CN106165074A (en) * | 2014-03-19 | 2016-11-23 | 三星电子株式会社 | The method manufacturing semiconductor device |
| CN109449112A (en) * | 2018-09-27 | 2019-03-08 | 华进半导体封装先导技术研发中心有限公司 | Chip assemble method and chip assembled devices |
| CN114628241A (en) * | 2020-12-10 | 2022-06-14 | 武汉新芯集成电路制造有限公司 | Chip bonding method |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101479835A (en) * | 2006-06-27 | 2009-07-08 | 3M创新有限公司 | Process for manufacturing split chip |
| US20110308739A1 (en) * | 2010-06-21 | 2011-12-22 | Brewer Science Inc. | Method and apparatus for removing a reversibly mounted device wafer from a carrier substrate |
| CN103035482A (en) * | 2012-08-15 | 2013-04-10 | 上海华虹Nec电子有限公司 | Temporary bonding method of silicon wafer |
| CN103219272A (en) * | 2012-01-20 | 2013-07-24 | 英飞凌科技股份有限公司 | Methods of forming semiconductor devices |
| CN103280423A (en) * | 2013-05-29 | 2013-09-04 | 华进半导体封装先导技术研发中心有限公司 | Technology and system for mechanical bonding disassembling |
-
2013
- 2013-09-05 CN CN201310401500.1A patent/CN103426808B/en active Active
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101479835A (en) * | 2006-06-27 | 2009-07-08 | 3M创新有限公司 | Process for manufacturing split chip |
| US20110308739A1 (en) * | 2010-06-21 | 2011-12-22 | Brewer Science Inc. | Method and apparatus for removing a reversibly mounted device wafer from a carrier substrate |
| CN103219272A (en) * | 2012-01-20 | 2013-07-24 | 英飞凌科技股份有限公司 | Methods of forming semiconductor devices |
| CN103035482A (en) * | 2012-08-15 | 2013-04-10 | 上海华虹Nec电子有限公司 | Temporary bonding method of silicon wafer |
| CN103280423A (en) * | 2013-05-29 | 2013-09-04 | 华进半导体封装先导技术研发中心有限公司 | Technology and system for mechanical bonding disassembling |
Cited By (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106165074A (en) * | 2014-03-19 | 2016-11-23 | 三星电子株式会社 | The method manufacturing semiconductor device |
| US10157766B2 (en) | 2014-03-19 | 2018-12-18 | Samsung Electronics Co., Ltd. | Method of fabricating a semiconductor device |
| CN106165074B (en) * | 2014-03-19 | 2020-05-12 | 三星电子株式会社 | Method for manufacturing semiconductor device |
| CN104485294A (en) * | 2014-12-12 | 2015-04-01 | 浙江中纳晶微电子科技有限公司 | Temporary bonding and separation method for wafers |
| CN105244308A (en) * | 2015-11-16 | 2016-01-13 | 华天科技（昆山）电子有限公司 | Method for holding thin wafer through temporary bonding of porous slide glass |
| CN105244308B (en) * | 2015-11-16 | 2018-08-03 | 华天科技（昆山）电子有限公司 | The method that porous slide glass is bonded holding LED reverse mounting type temporarily |
| CN109449112A (en) * | 2018-09-27 | 2019-03-08 | 华进半导体封装先导技术研发中心有限公司 | Chip assemble method and chip assembled devices |
| CN114628241A (en) * | 2020-12-10 | 2022-06-14 | 武汉新芯集成电路制造有限公司 | Chip bonding method |
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