CN103411166B - A kind of LED-backlit module - Google Patents
A kind of LED-backlit module Download PDFInfo
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- CN103411166B CN103411166B CN201310366496.XA CN201310366496A CN103411166B CN 103411166 B CN103411166 B CN 103411166B CN 201310366496 A CN201310366496 A CN 201310366496A CN 103411166 B CN103411166 B CN 103411166B
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- led
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- silicagel pad
- light source
- source component
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Abstract
The present invention relates to LED technology field, it is specifically related to a kind of LED-backlit module, including base plate and side plate, and it is set in turn in the reflective membrane on base plate, light guide plate and diffuser plate, the side of described light guide plate is provided with LED light source component, described side plate, base plate, diffuser plate form an accommodation space, and described reflective membrane, light guide plate and LED light source component are positioned at accommodation space；Also including radiating subassembly, described radiating subassembly includes heat-conducting plate and the first silicagel pad of being located between side plate and LED light source component, and described first silicagel pad is installed on heat-conducting plate, and LED light source component touches with heat-conducting plate and the first silicagel pad respectively.It is provided with heat-conducting plate and the first silicagel pad between side plate and the LED light source component of the LED-backlit module of the present invention, it is possible to dispel the heat preferably, extends the service life of LED light source component.
Description
Technical field
The present invention relates to LED technology field, be specifically related to a kind of LED-backlit module.
Background technology
Light emitting diode (LightEmittingDiode, LED) it is the semiconductor device of a kind of solid-state that can convert electrical energy into visible ray, it is widely used in the fields such as display screen, traffic signal, display light source, automobile lamp, LED backlight, lighting source, and LED semiconductor lighting has the distinguishing features such as life-span length, energy-conservation, environmental protection, rich color, microminiaturization.
Existing LED-backlit module includes base plate and side plate, and it is set in turn in the reflective membrane on base plate, light guide plate and diffuser plate, the side of described light guide plate is provided with LED light source component, described side plate, base plate, diffuser plate form an accommodation space, and described reflective membrane, light guide plate and LED light source component are positioned at accommodation space.The light-out effect ratio of the LED-backlit module of this design is more uniform, but the heat radiation of LED light source component is poor, and long use can affect the life-span of LED light source component.
Summary of the invention
Present invention aims to the deficiencies in the prior art, it is provided that a kind of simple in construction, uniform in light emission, radiating effect preferably LED-backlit module.
A kind of LED-backlit module, including base plate and side plate, and it is set in turn in the reflective membrane on base plate, light guide plate and diffuser plate, the side of described light guide plate is provided with LED light source component, described side plate, base plate, diffuser plate form an accommodation space, and described reflective membrane, light guide plate and LED light source component are positioned at accommodation space；Also including radiating subassembly, described radiating subassembly includes heat-conducting plate and the first silicagel pad of being located between side plate and LED light source component, and described first silicagel pad is installed on heat-conducting plate, and LED light source component touches with heat-conducting plate and the first silicagel pad respectively.
Wherein, being provided with the second silicagel pad between described base plate and reflective membrane, described second silicagel pad is fixed on base plate.
Wherein, the number of described second silicagel pad is 4, is uniformly distributed on base plate.
Wherein, the one side described light guide plate being connected with reflective membrane is evenly distributed with several sites.
Wherein, described site is cylindrical, spherical, hemispherical or prismatic.
Wherein, multiple LED encapsulation structure that described LED light source component includes mounting bar, is located on mounting bar, described LED encapsulation structure includes support unit, the LED chip that is arranged on single support and the optical lens covering on LED chip.
Wherein, described single support includes colloid support and metal rack, the electrode leg that described metal rack includes the heat sinking function body that is folded to form by a sheet metal and sheet metal extends, the side of heat sinking function body is provided with the LED chip mounting seat of minute surface, and the opposite side of heat sinking function body is the fin that sheet metal folds；Described colloid support wraps lives LED chip mounting seat and fin, and it is protruding that described electrode leg penetrates colloid support.
Wherein, described optical lens is silica-gel lens.
Wherein, described fin is provided with multiple louvre.
Wherein, the surface of described LED chip mounting seat is coated with the plating silver layer of minute surface.
Beneficial effects of the present invention: be provided with heat-conducting plate and the first silicagel pad between side plate and the LED light source component of the LED-backlit module of the present invention, it is possible to dispel the heat preferably, extends the service life of LED light source component；Additionally, LED light source component touches with heat-conducting plate and the first silicagel pad respectively, and the first silicagel pad plays thermolysis on the one hand, on the other hand due to the soft speciality of silica gel itself, first silicagel pad can also effectively prevent the damage that LED light source component causes because of collision, and stability is better.
Accompanying drawing explanation
Fig. 1 is the structural representation of the LED-backlit module of the present invention.
Fig. 2 is the Facad structure schematic diagram of the LED-backlit module of the present invention.
Fig. 3 is the inverse layer structure schematic diagram of Fig. 2.
Fig. 4 is the structure for amplifying schematic diagram at A place in Fig. 1.
Fig. 5 is the schematic diagram of the LED encapsulation structure of the present invention.
1 base plate；2 reflective membranes；
3 light guide plates；4 diffuser plates；
5 LED light source component；6 first silicagel pad；
7 heat-conducting plates；8 second silicagel pad；
51 mounting bars；52 LED encapsulation structure；
521 single supports；522 LED chips；
523 optical lenses；5211 electrode legs；
5212 LED chip mounting seats；5213 fin；
5214 colloid supports；9 side plates.
Detailed description of the invention
Below in conjunction with embodiment, the present invention is further illustrated.
Referring to Fig. 1 to Fig. 5, a kind of LED-backlit module, including base plate 1 and side plate 9, and it is set in turn in the reflective membrane 2 on base plate 1, light guide plate 3 and diffuser plate 4, the side of described light guide plate 3 is provided with LED light source component 5, described side plate 9, base plate 1, diffuser plate 4 form an accommodation space, and described reflective membrane 2, light guide plate 3 and LED light source component 5 are positioned at accommodation space；Also including radiating subassembly, described radiating subassembly includes heat-conducting plate 7 and the first silicagel pad 6 of being located between side plate 9 and LED light source component 5, and described first silicagel pad 6 is installed on heat-conducting plate 7, and LED light source component 5 touches with heat-conducting plate 7 and the first silicagel pad 6 respectively.
It is provided with heat-conducting plate 7 and the first silicagel pad 6 between side plate 9 and the LED light source component 5 of this LED-backlit module, it is possible to dispel the heat preferably, extends the service life of LED light source component 5；Additionally, LED light source component 5 touches with heat-conducting plate 7 and the first silicagel pad 6 respectively, and the first silicagel pad 6 one aspect plays thermolysis, on the other hand due to the soft speciality of silica gel itself, first silicagel pad 6 can also effectively prevent the damage that LED light source component 5 causes because of collision, and stability is better.
Wherein, being provided with the second silicagel pad 8 between described base plate 1 and reflective membrane 2, described second silicagel pad 8 is fixed on base plate 1.Second silicagel pad 8 one aspect plays thermolysis, and on the other hand due to the soft speciality of silica gel itself, the second silicagel pad 8 can also effectively prevent the bending etc. that reflective membrane 2, light guide plate 3, diffuser plate 4 cause because of collision, and stability is better.
Wherein, the number of described second silicagel pad 8 is 4, is uniformly distributed on base plate 1.The number of the second silicagel pad 8 can design according to the size of reflective membrane 2, and reflective membrane 2 can be better protected in being uniformly distributed of the second silicagel pad 8, it is prevented that it damages.
Wherein, the one side described light guide plate 3 being connected with reflective membrane 2 is evenly distributed with several sites.
Wherein, described site is cylindrical, spherical, hemispherical or prismatic.The design of site makes the reflection of light more uniform, and the light-out effect of light guide plate 3 is better.
Wherein, multiple LED encapsulation structure 52 that described LED light source component 5 includes mounting bar 51, is located on mounting bar 51, described LED encapsulation structure 52 includes support unit, the LED chip 522 that is arranged on single support 521 and the optical lens 523 covered on LED chip 522.The LED chip 522 of this LED encapsulation structure 52 being covered with optical lens 523, it is possible to the rising angle of this LED encapsulation structure 52 is adjusted, expand its light-emitting area, thus improve display quality, enhancing viewing effect.
Wherein, described single support 521 includes colloid support 5214 and metal rack, the electrode leg 5211 that described metal rack includes the heat sinking function body that is folded to form by a sheet metal and sheet metal extends, the side of heat sinking function body is provided with the LED chip mounting seat 5212 of minute surface, and the opposite side of heat sinking function body is the fin 5213 that sheet metal folds；Described colloid support 5214 surrounds LED chip mounting seat 5212 and fin 5213, and it is protruding that described electrode leg 5211 penetrates colloid support 5214.LED chip mounting seat 5212 is arranged to minute surface, has the effect of reflector, and minute surface mounting seat makes light efficiency distribution comparatively uniform, and LED chip 522 light-out effect is better；It addition, fin 5213 and single support 521 are structure as a whole, ensureing on the basis of radiating effect, decrease the operation installing radiating copper post, improve production efficiency, reduce production cost.
Wherein, described optical lens 523 is silica-gel lens.The lens of other transparent materials can certainly be adopted as optical lens 523.
Wherein, described fin 5213 is provided with multiple louvre.Louvre can speed up the heat radiation of LED chip 522, and radiating effect is better.
Wherein, the surface of described LED chip mounting seat 5212 is coated with the plating silver layer of minute surface.Plating silver layer can play the effect of reflection light on the one hand, is also prevented from oxidation on the other hand, it is ensured that the safety of circuit.
The LED-backlit module not only light-out effect of the present invention is better, and simple in construction, heat sinking function are preferably.
Above example is only in order to illustrate technical scheme; but not limiting the scope of the invention; although having made to explain to the present invention with reference to preferred embodiment; it will be understood by those within the art that; technical scheme can be modified or equivalent replacement, without deviating from the spirit and scope of technical solution of the present invention.
Claims (4)
1. a LED-backlit module, including base plate and side plate, and it is set in turn in the reflective membrane on base plate, light guide plate and diffuser plate, the side of described light guide plate is provided with LED light source component, described side plate, base plate, diffuser plate form an accommodation space, and described reflective membrane, light guide plate and LED light source component are positioned at accommodation space；It is characterized in that: also include radiating subassembly, described radiating subassembly includes heat-conducting plate and the first silicagel pad of being located between side plate and LED light source component, and described first silicagel pad is installed on heat-conducting plate, and LED light source component touches with heat-conducting plate and the first silicagel pad respectively；The one side being connected with reflective membrane on described light guide plate is evenly distributed with several sites, and described site is prismatic；
Being provided with the second silicagel pad between described base plate and reflective membrane, described second silicagel pad is fixed on base plate；The installing hole for installing the second silicagel pad it is provided with in the middle part of base plate；Second silicagel pad is fixed in the middle part of base plate；The number of described second silicagel pad is 4, is uniformly distributed on base plate；
Multiple LED encapsulation structure that described LED light source component includes mounting bar, is located on mounting bar, described LED encapsulation structure includes support unit, the LED chip that is arranged on single support and the optical lens covering on LED chip；
Described single support includes colloid support and metal rack, the electrode leg that described metal rack includes the heat sinking function body that is folded to form by a sheet metal and sheet metal extends, the side of heat sinking function body is provided with the LED chip mounting seat of minute surface, and the opposite side of heat sinking function body is the fin that sheet metal folds；Described colloid support wraps lives LED chip mounting seat and fin, and it is protruding that described electrode leg penetrates colloid support.
2. a kind of LED-backlit module according to claim 1, it is characterised in that: described optical lens is silica-gel lens.
3. a kind of LED-backlit module according to claim 2, it is characterised in that: described fin is provided with multiple louvre.
4. a kind of LED-backlit module according to claim 3, it is characterised in that: the surface of described LED chip mounting seat is coated with the plating silver layer of minute surface.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201310366496.XA CN103411166B (en) | 2013-08-21 | 2013-08-21 | A kind of LED-backlit module |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201310366496.XA CN103411166B (en) | 2013-08-21 | 2013-08-21 | A kind of LED-backlit module |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN103411166A CN103411166A (en) | 2013-11-27 |
| CN103411166B true CN103411166B (en) | 2016-07-27 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201310366496.XA Expired - Fee Related CN103411166B (en) | 2013-08-21 | 2013-08-21 | A kind of LED-backlit module |
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| CN (1) | CN103411166B (en) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104134407A (en) * | 2014-07-28 | 2014-11-05 | 联想(北京)有限公司 | Electronic equipment |
| CN107314285A (en) * | 2017-06-30 | 2017-11-03 | 武汉华星光电技术有限公司 | Backlight module and mobile terminal |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN2783371Y (en) * | 2005-01-31 | 2006-05-24 | 长沙湘计海盾科技有限公司 | High-performance backlight module for LCD |
| CN201615403U (en) * | 2009-12-31 | 2010-10-27 | 深圳市山本光电有限公司 | LED backlight source |
| CN202019000U (en) * | 2011-05-10 | 2011-10-26 | 吕能兵 | High-power LED bracket |
| CN202501340U (en) * | 2012-03-29 | 2012-10-24 | 青岛海信电器股份有限公司 | Backlight module and television |
Family Cites Families (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWI429992B (en) * | 2010-02-26 | 2014-03-11 | Young Lighting Technology Corp | Backlight module |
| CN202948156U (en) * | 2012-11-14 | 2013-05-22 | 信利半导体有限公司 | Backlight and light guide plate thereof |
-
2013
- 2013-08-21 CN CN201310366496.XA patent/CN103411166B/en not_active Expired - Fee Related
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN2783371Y (en) * | 2005-01-31 | 2006-05-24 | 长沙湘计海盾科技有限公司 | High-performance backlight module for LCD |
| CN201615403U (en) * | 2009-12-31 | 2010-10-27 | 深圳市山本光电有限公司 | LED backlight source |
| CN202019000U (en) * | 2011-05-10 | 2011-10-26 | 吕能兵 | High-power LED bracket |
| CN202501340U (en) * | 2012-03-29 | 2012-10-24 | 青岛海信电器股份有限公司 | Backlight module and television |
Also Published As
| Publication number | Publication date |
|---|---|
| CN103411166A (en) | 2013-11-27 |
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Effective date of registration: 20171101 Address after: 523565 Guangdong city of Dongguan province Changping Zhen Heng Jiang Jiang Xia Heng Industrial Road, set up a file Patentee after: KINGSUN OPTOELECTRONIC CO., LTD. Address before: 523565 Guangdong province Dongguan city Changping town Hengjiang Dongguan KingSun Au Optronics Co set up a file Patentee before: Dongguan Qinshang Photoelectric Co., Ltd. |
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Granted publication date: 20160727 Termination date: 20180821 |
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