CN103409113A - A heat storage material - Google Patents
A heat storage material Download PDFInfo
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- CN103409113A CN103409113A CN2013103097377A CN201310309737A CN103409113A CN 103409113 A CN103409113 A CN 103409113A CN 2013103097377 A CN2013103097377 A CN 2013103097377A CN 201310309737 A CN201310309737 A CN 201310309737A CN 103409113 A CN103409113 A CN 103409113A
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- heat storage
- heat
- thermodiffusion
- storage material
- electronic products
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Abstract
The invention provides a heat storage material. The heat storage material comprises a thermal interface material in the middle layer, a thermal diffusion material and an isotropic thermal conductive material, wherein the thermal diffusion material and the isotropic thermal conductive material are disposed on the two sides. The heat storage material is formed by composition of the thermal diffusion material, the thermal interface material and the isotropic thermal conductive material. Edges of the heat storage material only comprise the thermal diffusion material and the isotropic thermal conductive material. The heat storage material is advantageous in that the heat storage material changes traditional cooling thinking ways for electronic products, and the heat storage material changes a common cooling manner for the electronic products into a manner of storing heat of the electronic products in a material, thereby decreasing the temperature of the electronic products. The heat storage amount of the heat storage material is considerable. The heat storage material has advantages of capability of reducing the chip temperature of the electronic products by 3-4 degrees and reducing the surface temperature of the electronic products by 5-6 degrees over traditional heat dissipation manners, thus promoting rapid development of the electronic products.
Description
Technical field
The present invention relates to a kind of heat accumulation diffusion material.
Background technology
Current electronic product is just towards high integration, the future development of high calorie, make a general survey of current chip for cell phone, from core before, four current cores have been developed into, and the trend that has continuation to increase, high integration, the focus that high volume power consumption has become people to pay close attention at present, as mobile phone, dull and stereotyped this class hand-held electronic product, it is particularly important that customer experience becomes, if can effectively reduce master chip temperature 2～3 degree, have an opportunity to reduce surface temperature 4～5 degree, and it is more comfortable that the experience that can make the client becomes, degree of recognition to brand more promotes a class, also can improve gradually to this brand dependency degree.At present electronic chip is mainly lowered the temperature by dispelling the heat, due to the high integration of electronic product, the development of high calorie method phase, common radiating and cooling can not meet the needs of electronic product development, therefore, how, further to the electronic product temperature with high efficiency, become the fast-developing significant problem solved that needs in electronic product field.
Summary of the invention
For solving common radiator, electronic product is carried out to the problem that radiating and cooling can not meet the needs of present high integration, high calorie production development, the invention provides following technical scheme:
A kind of heat accumulating, it comprises the heat interfacial material in middle layer and thermodiffusion material and the isotropy thermally conductive material on both sides, described heat accumulating is that described thermodiffusion material, described heat interfacial material and described isotropy thermally conductive material are composited, and only there are described thermodiffusion material and described isotropy thermally conductive material in the edge of described heat accumulating.
As a preferred embodiment of the present invention, described thermodiffusion material and the described isotropy thermally conductive material of described heat accumulating edge carry out the double edge processing.
As another kind of preferred version of the present invention, described thermodiffusion material is the thermodiffusion film.
As another preferred version of the present invention, described thermodiffusion film is each diversity heat-transfer matcrial that natural graphite, synthetic graphite or thermal conductivity coefficient are more than or equal to 200W/mk.
As another preferred version of the present invention, described heat interfacial material is phase change material or the material that contains phase change material.
As another preferred version of the present invention, described isotropy thermally conductive material is Copper Foil or aluminium foil.
Advantage of the present invention is: the present invention has changed traditional electronic product cooling thinking, and the mode of common electronic product radiating is changed into the heat of electronic product is stored in material, thus the temperature of reduction electronic product.Because the quantity of heat storage of heat accumulating of the present invention is quite large, with traditional radiating mode, to compare, the inventive method can effectively reduce electronic product chip temperature 3～4 degree, reduces electronic product surface temperature 5～6 degree, has effectively promoted the high speed development of electronic product.
The accompanying drawing explanation
Accompanying drawing 1 is invention heat accumulating structure sectional view.
Number in the figure is:
1-thermal diffusion sheet 2-heat interfacial material 3-isotropy thermally conductive material
Embodiment
Below in conjunction with accompanying drawing, preferred embodiment of the present invention is described in detail, thereby so that advantages and features of the invention can be easier to be it will be appreciated by those skilled in the art that, protection scope of the present invention is made to more explicit defining.
As shown in accompanying drawing 1 heat accumulating structure sectional view, a kind of heat accumulating, it comprises the heat interfacial material 2 in middle layer and thermodiffusion material 1 and the isotropy thermally conductive material 3 on both sides, heat accumulating is that thermodiffusion material 1, heat interfacial material 2 and isotropy thermally conductive material 3 are composited, and only there are thermodiffusion material 1 and isotropy thermally conductive material 3 in the edge of heat accumulating.
Thermodiffusion material 1 and the isotropy thermally conductive material 3 of heat accumulating edge carry out the double edge processing.Thermodiffusion material 1 is the thermodiffusion film.The thermodiffusion film is each diversity heat-transfer matcrial that natural graphite, synthetic graphite or thermal conductivity coefficient are more than or equal to 200W/mk.
Heat interfacial material 2 is phase change material or the material that contains phase change material.The isotropy thermally conductive material is Copper Foil or aluminium foil.
The above; it is only the specific embodiment of the present invention; but protection scope of the present invention is not limited to this; any those of ordinary skill in the art are in the disclosed technical scope of the present invention; variation or the replacement that can expect without creative work, within all should being encompassed in protection scope of the present invention.Therefore, protection scope of the present invention should be as the criterion with the protection domain that claims were limited.
Claims (6)
1. heat accumulating, it is characterized in that: it comprises the heat interfacial material (2) in middle layer and thermodiffusion material (1) and the isotropy thermally conductive material (3) on both sides, described heat accumulating is that described thermodiffusion material (1), described heat interfacial material (2) and described isotropy thermally conductive material (3) are composited, and only there are described thermodiffusion material (1) and described isotropy thermally conductive material (3) in the edge of described heat accumulating.
2. a kind of heat accumulating according to claim 1 is characterized in that: the described thermodiffusion material (1) of described heat accumulating edge carries out the double edge processing with described isotropy thermally conductive material (3).
3. a kind of heat accumulating according to claim 1 and 2, it is characterized in that: described thermodiffusion material (1) is the thermodiffusion film.
4. a kind of heat accumulating according to claim 3, it is characterized in that: described thermodiffusion film is each diversity heat-transfer matcrial that natural graphite, synthetic graphite or thermal conductivity coefficient are more than or equal to 200W/mk.
5. according to claim 1 or 2 described a kind of heat accumulatings, it is characterized in that: described heat interfacial material (2) is phase change material or the material that contains phase change material.
6. according to claim 1 or 2 described a kind of heat accumulatings, it is characterized in that: described isotropy thermally conductive material is Copper Foil or aluminium foil.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2013103097377A CN103409113A (en) | 2013-07-23 | 2013-07-23 | A heat storage material |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2013103097377A CN103409113A (en) | 2013-07-23 | 2013-07-23 | A heat storage material |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN103409113A true CN103409113A (en) | 2013-11-27 |
Family
ID=49602156
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2013103097377A Pending CN103409113A (en) | 2013-07-23 | 2013-07-23 | A heat storage material |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN103409113A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104506686A (en) * | 2015-01-09 | 2015-04-08 | 李宁 | Efficiently cooling mobile phone shell |
| CN115418199A (en) * | 2022-09-22 | 2022-12-02 | 东莞市鸿亿导热材料有限公司 | Expanded graphite composite heat dissipation material and preparation method thereof |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN2629478Y (en) * | 2003-06-18 | 2004-08-04 | 武汉市利源能源开发有限公司 | Phase-changeable energy-storage constant-temp. moudel |
| CN201045223Y (en) * | 2007-05-08 | 2008-04-09 | 武汉市丰达建筑节能材料有限公司 | Phase-change composite thermal insulation board |
| CN101424102A (en) * | 2008-11-13 | 2009-05-06 | 杨凌雨露节水绿化工程有限公司 | Heat-storing material |
| CN102940424A (en) * | 2012-11-20 | 2013-02-27 | 浙江三赢医疗器械有限公司 | Instant heating and heat accumulation dual purpose heating pad |
| CN102942904A (en) * | 2012-11-19 | 2013-02-27 | 冯志标 | Paraffin-felt phase-changing composite heat storage material and heat storage device thereof |
-
2013
- 2013-07-23 CN CN2013103097377A patent/CN103409113A/en active Pending
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN2629478Y (en) * | 2003-06-18 | 2004-08-04 | 武汉市利源能源开发有限公司 | Phase-changeable energy-storage constant-temp. moudel |
| CN201045223Y (en) * | 2007-05-08 | 2008-04-09 | 武汉市丰达建筑节能材料有限公司 | Phase-change composite thermal insulation board |
| CN101424102A (en) * | 2008-11-13 | 2009-05-06 | 杨凌雨露节水绿化工程有限公司 | Heat-storing material |
| CN102942904A (en) * | 2012-11-19 | 2013-02-27 | 冯志标 | Paraffin-felt phase-changing composite heat storage material and heat storage device thereof |
| CN102940424A (en) * | 2012-11-20 | 2013-02-27 | 浙江三赢医疗器械有限公司 | Instant heating and heat accumulation dual purpose heating pad |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104506686A (en) * | 2015-01-09 | 2015-04-08 | 李宁 | Efficiently cooling mobile phone shell |
| CN115418199A (en) * | 2022-09-22 | 2022-12-02 | 东莞市鸿亿导热材料有限公司 | Expanded graphite composite heat dissipation material and preparation method thereof |
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| C02 | Deemed withdrawal of patent application after publication (patent law 2001) | ||
| WD01 | Invention patent application deemed withdrawn after publication |
Application publication date: 20131127 |