CN103404241B - Ceramic multi-layer baseplate and manufacture method thereof - Google Patents
Ceramic multi-layer baseplate and manufacture method thereof Download PDFInfo
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- CN103404241B CN103404241B CN201280012049.8A CN201280012049A CN103404241B CN 103404241 B CN103404241 B CN 103404241B CN 201280012049 A CN201280012049 A CN 201280012049A CN 103404241 B CN103404241 B CN 103404241B
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- 239000000919 ceramic Substances 0.000 title claims abstract description 298
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 53
- 239000000758 substrate Substances 0.000 claims abstract description 36
- 239000002003 electrode paste Substances 0.000 claims description 99
- 239000002562 thickening agent Substances 0.000 claims description 52
- 239000011347 resin Substances 0.000 claims description 23
- 229920005989 resin Polymers 0.000 claims description 23
- 239000000463 material Substances 0.000 claims description 16
- 230000015572 biosynthetic process Effects 0.000 claims description 12
- 238000005755 formation reaction Methods 0.000 claims description 12
- 238000007639 printing Methods 0.000 claims description 10
- 239000010410 layer Substances 0.000 description 136
- 238000010304 firing Methods 0.000 description 13
- 238000002788 crimping Methods 0.000 description 11
- 238000000034 method Methods 0.000 description 10
- 238000005245 sintering Methods 0.000 description 10
- 230000005611 electricity Effects 0.000 description 9
- 241000196435 Prunus domestica subsp. insititia Species 0.000 description 5
- 239000011521 glass Substances 0.000 description 5
- 239000000203 mixture Substances 0.000 description 5
- 230000000694 effects Effects 0.000 description 4
- PNEYBMLMFCGWSK-UHFFFAOYSA-N al2o3 Chemical compound [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 3
- 239000004615 ingredient Substances 0.000 description 3
- 230000001629 suppression Effects 0.000 description 3
- QVQLCTNNEUAWMS-UHFFFAOYSA-N Barium oxide Chemical compound [Ba]=O QVQLCTNNEUAWMS-UHFFFAOYSA-N 0.000 description 2
- 229910010293 ceramic material Inorganic materials 0.000 description 2
- 239000004020 conductor Substances 0.000 description 2
- 239000000470 constituent Substances 0.000 description 2
- 239000002320 enamel (paints) Substances 0.000 description 2
- 239000011229 interlayer Substances 0.000 description 2
- 229910000529 magnetic ferrite Inorganic materials 0.000 description 2
- 229910000859 α-Fe Inorganic materials 0.000 description 2
- JKWMSGQKBLHBQQ-UHFFFAOYSA-N Boron trioxide Chemical compound O=BOB=O JKWMSGQKBLHBQQ-UHFFFAOYSA-N 0.000 description 1
- 229910001884 aluminium oxide Inorganic materials 0.000 description 1
- 229910052810 boron oxide Inorganic materials 0.000 description 1
- OYPRJOBELJOOCE-UHFFFAOYSA-N calcium Chemical compound [Ca] OYPRJOBELJOOCE-UHFFFAOYSA-N 0.000 description 1
- 229910052791 calcium Inorganic materials 0.000 description 1
- 239000011575 calcium Substances 0.000 description 1
- 238000000280 densification Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- 230000003647 oxidation Effects 0.000 description 1
- 238000007254 oxidation reaction Methods 0.000 description 1
- 230000001314 paroxysmal Effects 0.000 description 1
- 229910052573 porcelain Inorganic materials 0.000 description 1
- 239000000843 powder Substances 0.000 description 1
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 1
- 229910052814 silicon oxide Inorganic materials 0.000 description 1
Abstract
Even if the manufacture method that the present invention provides a kind of ceramic multi-layer baseplate that can produce in the case of arranging surface electrode, internal electrode to high-density between also adjacent electrode also high without the reliability of short circuit ceramic multi-layer baseplate efficiently and the high ceramic multi-layer baseplate of the reliability utilizing this manufacture method to produce.Ceramic multi-layer baseplate (20) includes the ceramic substrate (10) that multiple ceramic layers (1) are carried out be laminated and the electrode (surface electrode (2), internal electrode (3)) being disposed on ceramic layer (1), in this ceramic multi-layer baseplate (20), on the interarea of arbitrary described ceramic layer, utilize electrode and ceramic layer (1) about that recess (5) is set.Electrode (surface electrode (2), internal electrode (3)) is buried in ceramic layer (1).And, the periphery of surface electrode (2) is capped ceramic layer and is covered.
Description
Technical field
The present invention relates to ceramic multi-layer baseplate and manufacture method thereof, specifically, relate to including internal electrode
And the ceramic multi-layer baseplate of at least one electrode and manufacture method thereof in surface electrode.
Background technology
Ceramic multi-layer baseplate is generally of ceramic substrate (the substrate master carrying out being laminated by multiple ceramic layers
Body) surface and inside the structure of electrode (surface electrode, internal electrode) is set.
In such ceramic multi-layer baseplate, along with further miniaturization, need with narrow interval high
Density ground arranges surface electrode, internal electrode, thus exists between adjacent surface electrode or inside
The problem producing short circuit between electrode.
As the method solving such problem, it is proposed that following ceramic circuit board (ceramic multi-layer baseplate)
Manufacture method (with reference to patent documentation 1): i.e., regulation is used for forming surface electrode, internal electrode is used
The component of conductive paste do not suppress, prevent from producing ooze out at surface electrode, internal electrode, thus not
The short circuit between electrode can be produced.
But, in the method for patent documentation 1, even if formed by printing conductive paste, become
Oozing out of the whole pattern of surface electrode and internal electrode can be inhibited, but is difficult to stop paroxysmal
Local is oozed out or spills.The electrode of this local oozes out or spills is because of roundabout, from version to printer of pattern
Deng and produce, even if being sometimes changed conductive paste itself also cannot avoiding.Even if additionally,
Improve printed patterns or printer, in volume production operation, the most also cannot avoid local, prominent
The situation that the property sent out is oozed out or spilt.
Prior art literature
Patent documentation
Patent documentation 1: 2003-No. 151351 publications of Japanese Patent Laid-Open
Summary of the invention
Invent technical problem to be solved
The present invention completes to solve above-mentioned technical problem, its object is to provide a kind of pottery
The manufacture method of multilager base plate and the high ceramic multilayer base of the reliability utilizing this manufacture method to produce
Plate, in the manufacture method of this ceramic multi-layer baseplate, even if arranging surface to high-density with narrow interval
In the case of electrode, internal electrode, also can suppress, prevent between adjacent surface electrode, internal electrode
Between be short-circuited because oozing out or spill, the ceramic multilayer base that reliability is higher can be produced efficiently
Plate.
Solve the technical scheme that technical problem is used
In order to solve above-mentioned technical problem, the ceramic multi-layer baseplate of the present invention includes carrying out multiple ceramic layers
The ceramic substrate that is laminated and be disposed in the electrode on described ceramic layer, it is characterised in that
On the interarea of arbitrary described ceramic layer, formed by described electrode and described ceramic layer about
There is recess.
It addition, as the method to set up of the recess formed by electrode and ceramic layer about, such as, example
Show: (a) forms the electrode paste using sintering shrinkage amount bigger to electrode, makes electrode paste when firing
Material is retracted to desired degree, thus the method forming recess around electrode；B () will fire work
Burn under the state of the surrounding that the disappearing material such as the resin thickener that can disappear in sequence are disposed in electrode pattern
System, makes disappearing material disappear in ablating work procedure, thus the method forming recess around electrode；(c)
Advance with method shapes around the region of the thickener to be printed electrode of ceramic green sheet such as such as Laser Processing
Becoming to become the groove of recess, the thickener that prints electrode in the region surrounded by groove is to form electrode paste pattern
Method；And (d) prints electrode thickener and around the electrode paste pattern that formed on ceramic green sheet,
The methods such as such as Laser Processing are utilized to be formed the method etc. of the groove becoming recess but it also may to make further
By other method.Additionally, join to high-density on the surface of ceramic substrate constituting ceramic multi-layer baseplate
If the situation of various surface electrodes (electrode, wiring etc.) is more, but applies this in this case
Bright, by being arranged around recess at surface electrode, a kind of suppression between adjacent surface electrode can be obtained
Short circuit, even if also can have the pottery of higher reliability in the case of arranging surface electrode to high-density
Multilager base plate.
Additionally, in the ceramic multi-layer baseplate of the present invention, be preferably and defining the described pottery of described recess
On enamel coating, by other ceramic layer of further stacking, described electrode and described ceramic layer about it
Between be formed with space.
Furthermore it is preferred that be buried in described ceramic layer for described electrode.
By possessing this structure, ceramic multi-layer baseplate low level can be made.
Furthermore it is preferred that be formed at the table of the outermost ceramic layer constituting described ceramic substrate for described recess
On face, the described electrode forming described recess is surface electrode, and the periphery of described surface electrode is capped
Ceramic layer is covered.By possessing this structure, in addition to the effect above, moreover it is possible to be improved surface electricity
The effect of the peel strength of pole.
Additionally, the manufacture method of the ceramic multi-layer baseplate of the present invention is used for manufacturing ceramic multi-layer baseplate, this pottery
Porcelain multilager base plate includes the ceramic substrate that multiple ceramic layers are carried out be laminated and is disposed in described pottery
Electrode on enamel coating, it is characterised in that including:
A () prepares the operation of ceramic green sheet；
B () be printing tree around the region of the electrode paste formed that to print electrode of described ceramic green sheet
The operation of fat thickener；
C the () thickener that prints electrode in the region surrounded by described resin thickener of described ceramic green sheet is formed
The operation of electrode paste pattern；
D the described ceramic green sheet defining described electrode paste pattern is carried out stacking and carrys out cambium layer stack by ()
Operation；And
E operation that described duplexer is fired by ().
By possessing this structure, at the thickener that prints electrode in the operation forming electrode paste pattern, pottery
The surrounding in the region of the electrode paste pattern to be formed of raw cook is covered by resin thickener, can directly suppress electrode
The oozing out or spill of thickener, and, even if oozing out or spilling, be also on resin thickener ooze out or
Spill.Additionally, in ablating work procedure, resin thickener carries out burning and decomposing disappearance, thus all with electrode
Recess is formed between the ceramic layer enclosed.As a result of which it is, can effectively suppress, prevent because of electrode (such as surface
Electrode, internal electrode etc.) ooze out or spill and between adjacent surface electrode, between internal electrode produce
Raw short circuit.Even if as a result of which it is, can reliably produce a kind of with narrow interval arranging table to high-density
In the case of face electrode, internal electrode etc., between surface electrode, internal electrode, produce the possibility of short circuit
The ceramic multi-layer baseplate that reliability that property is the least is high.It addition, the system of the ceramic multi-layer baseplate in the present invention
Make in method, carry out layer at the ceramic green sheet that will be provided with being formed around recess such electrode paste pattern
When folding cambium layer stack, the ceramic green sheet that (a) can possess above-mentioned electrode paste pattern possesses not with (b)
There are the ceramic green sheet different from above-mentioned (a) of the electrode paste pattern the most specially forming recess or non-shape
The ceramic green sheet etc. becoming to have electrode paste pattern is suitably combined to use, and the present invention also comprises so
Form.
Additionally, the manufacture method of other ceramic multi-layer baseplate of the present invention is used for manufacturing ceramic multi-layer baseplate,
This ceramic multi-layer baseplate includes the ceramic substrate that multiple ceramic layers are carried out be laminated and is disposed in institute
State the electrode on ceramic layer, it is characterised in that including:
A () prepares the operation of ceramic green sheet；
B () be formation groove around the region of the electrode paste formed that to print electrode of described ceramic green sheet
Operation；
C () prints electrode thickener to form electrode paste in the region surrounded by described groove of described ceramic green sheet
The operation of material pattern；
D the described ceramic green sheet defining described electrode paste pattern is carried out stacking and carrys out cambium layer stack by ()
Operation；And
E operation that described duplexer is fired by ().
By possessing this structure, formed electrode paste pattern time exfiltrating part or spill part drop to
In groove (recess), can suppress, prevent the outside of arrival slot, generation poor short circuit can be greatly reduced can
Can property.Even if as a result of which it is, can reliably produce by surface electrode, internal electrode etc. with narrow
In the case of interval arranges to high-density, between surface electrode, between internal electrode, produce short circuit
The ceramic multi-layer baseplate that reliability that probability is the least is high.
Additionally, the manufacture method of the another ceramic multi-layer baseplate of the present invention is used for manufacturing ceramic multi-layer baseplate,
This ceramic multi-layer baseplate includes the ceramic substrate that multiple ceramic layers are carried out be laminated and is disposed in institute
State the electrode on ceramic layer, it is characterised in that including:
A () prepares the operation of ceramic green sheet；
B () prints electrode thickener to form the operation of electrode paste pattern on described ceramic green sheet；
C () forms the operation of groove on described ceramic green sheet around described electrode paste pattern；
D the described ceramic green sheet formed around described groove at described electrode paste pattern is carried out stacking by ()
Carry out the operation of cambium layer stack；And
E operation that described duplexer is fired by ().
By possessing this structure, though print electrode thickener in the operation formed electrode paste pattern slightly
Permitted ooze out or spill, also can be removed in the operation forming groove.As a result of which it is, can be reliably
A kind of surface electrode, internal electrode etc. are being arranged to high-density with narrow interval even if producing
In the case of, produce the reliability that the probability of short circuit is the least between surface electrode, between internal electrode
High ceramic multi-layer baseplate.
Additionally, in the manufacture method of the ceramic multi-layer baseplate of the present invention, be preferably and will become for defining
The ceramic green sheet of the electrode paste pattern of the surface electrode of described ceramic substrate, arranges described electrode paste
The covering ceramic blank layer that at least periphery of pattern carries out covering and do not covers central part, uses
Thus obtained ceramic green sheet forms described duplexer.
By possessing this structure, the periphery that can obtain having surface electrode is capped what ceramic layer was covered
The ceramic multi-layer baseplate of structure, in addition to the basic effect of the present invention, can reliably produce surface electricity
The peel strength of pole is compared with big, the higher ceramic multi-layer baseplate of reliability.It addition, to becoming surface electrode
The covering ceramic blank that at least periphery of electrode paste pattern carries out covering and do not covers central part
Layer such as can be formed by the following method: by ceramic paste with at least periphery to electrode paste pattern
The mode carrying out covering and make central part expose is printed；Or opening will be offered to become table
The ceramic green sheet that the central part of the electrode paste pattern of face electrode exposes carries out stacking.
The effect of invention
Ceramic substrate that the ceramic multi-layer baseplate of the present invention includes carrying out multiple ceramic layers being laminated, with
And the electrode being disposed on ceramic layer, in this ceramic multi-layer baseplate, on the interarea of arbitrary ceramic layer,
It is formed with recess, accordingly, it is capable to suppress, prevent oozing because of electrode etc. by electrode and ceramic layer about
Go out or spill between the surface electrode caused, be short-circuited between internal electrode.
As a result of which it is, be provided that a kind of ceramic multi-layer baseplate, even if this ceramic multi-layer baseplate is with narrow
Interval arranged surface electrode, internal electrode to high-density in the case of, also can suppress, prevent adjacent
Between surface electrode, being short-circuited between internal electrode, reliability is high.
Accompanying drawing explanation
Fig. 1 is that the front of the structure representing the ceramic multi-layer baseplate involved by one embodiment of the present of invention is cutd open
View.
Fig. 2 is the major part of the ceramic multi-layer baseplate involved by enlarged representation embodiments of the invention
Figure.
Fig. 3 (a)～Fig. 3 (c) is the manufacturer that the ceramic multi-layer baseplate involved by embodiments of the invention is described
The figure of method (manufacture method A).
Fig. 4 (a)～Fig. 4 (c) is the manufacturer that the ceramic multi-layer baseplate involved by embodiments of the invention is described
The figure of method (manufacture method B).
Fig. 5 (a)～Fig. 5 (c) is the manufacturer that the ceramic multi-layer baseplate involved by embodiments of the invention is described
The figure of method (manufacture method C).
Fig. 6 (a)～Fig. 6 (c) is the manufacturer that the ceramic multi-layer baseplate involved by embodiments of the invention is described
The figure of method (manufacture method D).
Fig. 7 (a)～Fig. 7 (c) is the manufacturer that the ceramic multi-layer baseplate involved by embodiments of the invention is described
The figure of method (manufacture method E).
Detailed description of the invention
Embodiments of the invention described below, are carried out specifically further to inventive feature part
Bright.
Embodiment 1
[structure of ceramic multi-layer baseplate]
Fig. 1 is schematically illustrate ceramic multi-layer baseplate 20 involved by embodiments of the invention integrally-built
Sectional view, Fig. 2 is the sectional view representing its major part.
The ceramic multilayer base that ceramic multi-layer baseplate 20 involved by the present embodiment 1 is mounted on installation base plate
Plate, including: ceramic substrate 10, this ceramic substrate 10 has to enter multiple ceramic layers (substrate ceramic layer) 1
The structure that row is laminated；Surface electrode 2, this surface electrode 2 is disposed in the outermost layer constituting ceramic substrate
Ceramic layer 1 on；And internal electrode 3, this internal electrode 3 is disposed on the ceramic layer 1 of regulation.Separately
Outward, in surface electrode 2, internal electrode 3, the part of regulation carries out interlayer connection via via conductors 4.
And, in this ceramic multi-layer baseplate 20, as shown in Figures 1 and 2, surface electrode 2 and its
It is provided with recess 5 between ceramic layer 1 around and between internal electrode 3 and ceramic layer about 1.
Recess 5 is formed by surface electrode 2 and ceramic layer about 1, or by internal electrode 3 He
Ceramic layer 1 about and formed.Additionally, by internal electrode 3 and ceramic layer about 1 institute
It is laminated with other ceramic layer 1 on the recess 5 formed, therefore, is formed in part with space at this recess 5.
The monolithic ceramic electronic component of the present embodiment 1 includes structure as described above, at surface electrode 2
And between internal electrode 3 and ceramic layer about 1, be provided with recess 5, accordingly, it is capable to it is reliably suppressed because of electricity
The oozing out or spill and produce short between adjacent electrode of pole (such as surface electrode 2, internal electrode 3 etc.)
Road.Even if as a result of which it is, the interval between the electrodes such as surface electrode 2, internal electrode 3 is narrow (i.e.,
Make the electrode densification such as surface electrode 2, internal electrode 3) in the case of, also can obtain not having between electrode
There is the ceramic multi-layer baseplate 20 that short circuit, reliability are high.
It addition, in the present embodiment, it is surface electrode and the internal electrode structure the most around with recess,
But for the usual surface electrode the most only formed on the surface of the ceramic substrate with high density arranging electrode
It is formed around the situation of the structure of recess, also can obtain the ceramic multi-layer baseplate that reliability is high.
[manufacture of ceramic multi-layer baseplate]
It follows that the manufacture method of the ceramic multi-layer baseplate of the present invention is illustrated.
[1] manufacture method A
With reference to Fig. 3 (a)～Fig. 3 (c), manufacture method A of ceramic multi-layer baseplate is illustrated.
(1) first, ceramic green sheet is prepared.
(2) then, as shown in Fig. 3 (a), the thickener that prints electrode on ceramic green sheet 1a is to form electrode paste
Material pattern 2a.
Now, as the electrode paste for forming electrode paste pattern 2a, use in ablating work procedure
The electrode paste that the shrinkage factor (sintering shrinkage) sintering shrinkage than ceramic green sheet 1a is big.
(3) the ceramic green sheet 1a having printed electrode paste pattern 2a is carried out stacking and crimping forms stacking
Body.
This stacking, crimping operation in, the electrode paste pattern 2a quilt being disposed on ceramic green sheet 1a
Press and deform, as indicative icon in Fig. 3 (b), become the shape being buried in ceramic green sheet 1a
State.
It addition, Fig. 3 (a), Fig. 3 (b) show constitute duplexer outermost ceramic green sheet 1a, with
And the electrode becoming surface electrode 2 (with reference to Fig. 1, Fig. 2) after firing being formed on this ceramic green sheet 1a
Thickener pattern 2a, but the electrode paste pattern forming internal electrode deforms too, becomes and figure
The shape that in 3 (b), shape as indicative icon is identical.
(4) duplexer produced in the operation of above-mentioned (3) is fired.
Now, electrode paste pattern 2a is shrinking on the direction of interarea, with pottery about
Recess 5 is formed between Ceng.
Thus, can obtain surface electrode 2 (and internal electrode 3) be formed around recess 5, figure
1, the ceramic multi-layer baseplate 20 shown in Fig. 2.
It addition, to be only formed at around the surface electrode of ceramic base plate surface the situation forming recess
Under, as the electrode paste for forming the electrode paste pattern becoming surface electrode after firing, as long as
Use the electrode paste that the sintering shrinkage sintering shrinkage than ceramic green sheet 1a is big.
Additionally, in the situation only forming recess around the internal electrode being formed within ceramic substrate
Under, as the electrode paste for forming the electrode paste pattern becoming internal electrode after firing, as long as
Use the electrode paste that the sintering shrinkage sintering shrinkage than ceramic green sheet 1a is big.
Additionally, in order to be reliably formed recess, need to properly select the ceramic material constituting ceramic substrate
Material and the constituent material of electrode paste and component etc., but specifically, be preferably in view of reality
The material that uses, in the case of the characteristic required by ceramic multi-layer baseplate etc., suitably select to constitute pottery
The ceramic material of substrate adds into glass etc. with the conductive compositions of adding ingredient and composition electrode paste
Grade.
Such as, if the ratio constituting the glass contained in the material of ceramic substrate and electrode paste is more, then
Exist glass ingredient ooze out and by recess fill possibility, therefore, generally, the ratio of glass ingredient is less
It is preferred.
Additionally, when manufacturing ceramic multi-layer baseplate, by using the contraction that can suppress to shrink when firing to press down
Preparative layer is fired, even if in the case of the shrinkage factor of conductive paste is less, and also can be at electrode pattern
And it is reliably formed above-mentioned recess between ceramic layer about.Therefore, shrinkage suppression layer is used to burn
System, can improve the degree of freedom of the selection of conductive paste.
In the case of manufacture method A making the sintering shrinkage of electrode increase, even if in electrode paste pattern
There occurs and ooze out or spill, also can be by being formed during electrode paste pattern sintering shrinkage in ablating work procedure
The recess of surrounding them, make exfiltrating part or spill part and (make electrode isolate into island with electrode insulation
Shape), accordingly, it is capable to prevent the generation of poor short circuit efficiently.
[2] manufacture method B
With reference to Fig. 4 (a)～Fig. 4 (c), another manufacture method B of ceramic multi-layer baseplate is illustrated.
(1) first, ceramic green sheet is prepared.
(2) then, as shown in Fig. 4 (a), at the electrode paste formed that to print electrode of ceramic green sheet 1a
Surrounding's printing resin thickener 6 in the region of material.
(3) it follows that as shown in Fig. 4 (a), in the region surrounded by resin thickener 6 of ceramic green sheet 1a
Inside print electrode thickener to form electrode paste pattern 2a.
(4) the ceramic green sheet 1a defining electrode paste pattern 2a is carried out stacking and crimping forms stacking
Body.
This stacking, crimping operation in, the electrode paste pattern 2a that is disposed on ceramic green sheet 1a,
Resin thickener 6 is pressed and deforms, and as indicative icon in Fig. 4 (b), becomes and is buried in pottery
State in raw cook 1a.
It addition, Fig. 4 (a), Fig. 4 (b) show constitute duplexer outermost ceramic green sheet 1a, with
And the electrode becoming surface electrode 2 (with reference to Fig. 1, Fig. 2) after firing being formed on this ceramic green sheet 1a
Thickener pattern 2a and resin thickener 6, but it is positioned at the electrode paste by forming internal electrode within duplexer
Pattern and be disposed in resin thickener about and deform too in stacking and crimping process, becomes
The shape identical with shape as indicative icon in Fig. 4 (b).
(5) duplexer produced in the operation of above-mentioned (4) is fired.
In this ablating work procedure, resin thickener 6 carries out burning and decomposing and disappear, as shown in Fig. 4 (c),
Surrounding's formation recess 5 of the surface electrode 2 (and internal electrode 3) formed after firing.
Thus, can obtain that there is the pottery with ceramic multi-layer baseplate 20 equivalent structure shown in Fig. 1, Fig. 2
Multilager base plate.
It addition, will only be formed at formation recess around the surface electrode of ceramic base plate surface and
In the case of the surrounding of internal electrode the most specially arranges recess, as long as only for including becoming after firing table
The ceramic green sheet of the electrode paste pattern of face electrode, print around the region of electrode paste pattern to be formed
Brush resin thickener.
Additionally, will only around the internal electrode being formed within ceramic substrate formation recess and
In the case of the surrounding of surface electrode the most specially arranges recess, as long as in only for including becoming after firing
The ceramic green sheet of the electrode paste pattern of portion's electrode, print around the region of electrode paste pattern to be formed
Brush resin thickener.The recess being formed at around internal electrode be formed above other ceramic layer, because of
This, be formed in part with space at this recess.
The situation of manufacture method B of printing resin thickener in advance around the region of thickener to be printed electrode
Under, can directly suppress oozing out or spilling of electrode (electrode paste pattern), and, even if exist ooze out or
Spill, be also oozing out or spilling on resin thickener, and resin thickener can disappear in ablating work procedure, because of
This, can prevent efficiently the surface electrode after sintering, be short-circuited between internal electrode bad.
[3] manufacture method C
With reference to Fig. 5 (a)～Fig. 5 (c), another manufacture method C of ceramic multi-layer baseplate is illustrated.
(1) first, ceramic green sheet is prepared.
(2) then, as shown in Fig. 5 (a), utilize Laser Processing in the shape to be printed electrode of ceramic green sheet 1a
Surrounding's formation groove 7 in the region of the electrode paste become.
(3) it follows that the thickener that prints electrode in the region surrounded by above-mentioned groove 7 of ceramic green sheet 1a
Form electrode paste pattern 2a.
(4) inside region at groove 7 prints electrode thickener pattern 2a, and ceramic green sheet 1a is carried out stacking
Cambium layer stack is carried out with crimping.
This stacking, crimping operation in, the electrode paste pattern 2a quilt being disposed on ceramic green sheet 1a
Press and deform, as indicative icon in Fig. 5 (b), become the shape being buried in ceramic green sheet 1a
State.
It addition, Fig. 5 (a), Fig. 5 (b) show constitute duplexer outermost ceramic green sheet 1a, with
And the electrode becoming surface electrode 2 (with reference to Fig. 1, Fig. 2) after firing being formed on this ceramic green sheet 1a
Thickener pattern 2a, but the electrode paste pattern forming internal electrode deforms too, becomes and figure
The shape that in 5 (b), shape as indicative icon is identical.
(5) duplexer produced in the operation of above-mentioned (4) is fired.
Thus, as shown in Fig. 5 (c), formation around surface electrode 2 (and internal electrode 3) can be obtained
There is the ceramic multi-layer baseplate of recess 5.
In the case of this manufacture method C, printing electricity in the region surrounded by above-mentioned groove of ceramic green sheet
When pole thickener forms electrode paste pattern, even if oozing out or spilling, the part oozed out, spill
Part also can drop in groove (recess), can suppress, prevent the outside of its arrival slot.
Even if as a result of which it is, surface electrode, internal electrode etc. being carried out to high-density with narrow interval
In the case of arranging, also can produce efficiently and between surface electrode, between internal electrode, produce short circuit
The ceramic multi-layer baseplate that less likely reliability is high.
In manufacture method C, in the region of the electrode paste formed that to print electrode of ceramic green sheet 1a
Surrounding's formation groove 7, then, the thickener that prints electrode in the region surrounded by groove 7 is to form electrode paste
Pattern 2a, but in the present invention, it is also possible to it was configured to before forming groove 7 print electricity on ceramic green sheet 1a
Pole thickener forms electrode paste pattern 2a, then, defines electrode paste pattern at ceramic green sheet 1a
Surrounding's formation groove 7 in the region of 2a.
In the case of forming groove 7 after defining electrode paste pattern 2a, even if forming electrode paste
The operation of pattern 2a has oozing out or spilling slightly, also can be removed in the operation forming groove 7.
Even if arranging surface electricity as a result of which it is, can reliably produce to high-density with narrow interval
In the case of pole, internal electrode etc., the probability being short-circuited between surface electrode, between internal electrode
The ceramic multi-layer baseplate that the least reliability is high.
It addition, will only be formed at formation recess around the surface electrode of ceramic base plate surface and
In the case of the surrounding of internal electrode the most specially arranges recess, as long as only for including becoming after firing table
The ceramic green sheet of the electrode paste pattern of face electrode, is formed on above-mentioned groove.
Additionally, will only around the internal electrode being formed within ceramic substrate formation recess and
In the case of the surrounding of surface electrode the most specially arranges recess, as long as in only for including becoming after firing
The ceramic green sheet of the electrode paste pattern of portion's electrode, is formed on above-mentioned groove.In internal electrode week
Enclose the recess of formation and be formed above other ceramic layer, therefore, be formed in part with space at this recess.
[4] manufacture method D
With reference to Fig. 6 (a)～Fig. 6 (c), another manufacture method D of ceramic multi-layer baseplate is illustrated.
(1) first, ceramic green sheet is prepared.
(2) then, as shown in Fig. 6 (a), at the electrode paste formed that to print electrode of ceramic green sheet 1a
Surrounding's printing resin thickener 6 in the region of material.
(3) it follows that as shown in Fig. 6 (a), in the region surrounded by resin thickener 6 of ceramic green sheet 1a
Inside print electrode thickener to form electrode paste pattern 2a.
(4) for defining electrode paste pattern 2a's by becoming surface electrode 2 (with reference to Fig. 1, Fig. 2)
Ceramic green sheet, as shown in Fig. 6 (a), arranges at least periphery to electrode paste pattern 2a further and carries out
The covering ceramic blank layer 8a covered and central part is not covered.Herein, use ceramic paste, from
The periphery of electrode paste pattern 2a starts covering resin thickener 6, until the region that ceramic green sheet 1a exposes
Till, print ceramic paste within the range, thus form covering ceramic blank layer 8a.
As in ceramic paste use pottery, be preferably used with constituted the substrate i.e. pottery of ceramic substrate
Centered by the pottery of same composition, add glass further, oxide is close to intensity with raising and is obtained
Pottery.
Additionally, the pottery used in ceramic paste can also be Barium monoxide, silicon oxide, aluminium oxide, oxidation
Calcium, boron oxide mixture as material.
It addition, such as, in the case of the composition substrate i.e. pottery of ceramic substrate is ferrite class, preferably
For using ferrite powder.
As forming the method covering ceramic layer, it is possible to use opening will be offered to become surface electricity
The ceramic green sheet that the central part of the electrode paste pattern of pole exposes carries out the method for stacking and replaces printing pottery
The method of thickener.
Additionally, utilize the method identical with the method for explanation in manufacture method B of above-mentioned [2], prepare bag
Include the ceramic green sheet (not shown) of the electrode paste pattern becoming internal electrode.
(5) then, the ceramic green sheet 1a covering ceramic blank layer 8a will be defined and include becoming internal
The ceramic green sheet of the electrode paste pattern of electrode carries out stacking and crimping carrys out cambium layer stack.
In this stacking and crimping process, the electrode paste pattern 2a that is disposed on ceramic green sheet 1a, tree
Fat thickener 6 and covering ceramic blank layer 8a are pressed and deform, as indicative icon in Fig. 6 (b),
Become the state being buried in ceramic green sheet 1a.
On the other hand, the electrode paste pattern becoming internal electrode becomes and the manufacture method that above-mentioned [2] are described
Shape as indicative icon in Fig. 4 (b) that B is used.
(6) duplexer produced in the operation of above-mentioned (5) is fired.
In this ablating work procedure, resin thickener 6 carries out burning and decomposing and disappear, as shown in Fig. 6 (c),
The surface electrode 2 formed after firing be formed around recess 5, and the periphery of surface electrode 2 by by
The covering ceramic layer 8 that covering ceramic blank layer 8a fires covers, and the pottery obtaining having this spline structure is many
Laminar substrate.The recess 5 formed by surface electrode 2 and ceramic layer about 1 is capped ceramic layer 8
Cover, therefore, be formed in part with space at this recess 5.
It addition, in this manufacture method D, becoming not enter around the electrode paste pattern of internal electrode
The printing of row ceramic paste, but internal electrode is owing to being securely held on pottery interlayer, therefore, even if
The most specially formed and cover ceramic layer, also ensure that required reliability.
According to this manufacture method D, as shown in Fig. 6 (c), the periphery quilt of a kind of surface electrode 2 can be obtained
Ceramic layer 8 covers, the only central part of surface electrode 2 exposes such structure, surface electrode 2 in covering
The excellent ceramic multi-layer baseplate of peel strength.
[5] manufacture method E
With reference to Fig. 7 (a)～Fig. 7 (c), another manufacture method E of ceramic multi-layer baseplate is illustrated.
(1) first, ceramic green sheet is prepared.
(2) then, as shown in Fig. 7 (a), the thickener that prints electrode on ceramic green sheet 1a is to form electrode paste
Material pattern 2a.
(3) it follows that for the electrode paste defined becoming surface electrode 2 (with reference to Fig. 1, Fig. 2)
The ceramic green sheet 1a of pattern 2a, as shown in Fig. 7 (a), arranges at least periphery to electrode paste pattern 2a
Portion carries out covering and not covering the covering ceramic blank layer 8a of central part.
Cover ceramic blank layer 8a by printing and the material phase used in manufacture method D of above-mentioned [4]
Same ceramic paste is formed.
(4) it follows that multi-disc has been arranged electrode paste pattern 2a and has covered the ceramic green of ceramic blank layer 8a
Sheet 1a carries out stacking and crimping carrys out cambium layer stack.
In this stacking and crimping process, the electrode paste pattern 2a that is disposed on ceramic green sheet 1a and covering
Lid ceramic blank layer 8a is pressed and deforms, and as indicative icon in Fig. 7 (b), is buried in ceramic green sheet
In 1a, its upper surface and surrounding ceramic green sheet 1a and electrode paste pattern 2a upper surface substantially
For conplane state.
(5) duplexer formed during above-mentioned (4) is fired.
Now, as shown in Fig. 7 (c), the ceramic multi-layer baseplate with following structure can be obtained: electrode paste
Pattern 2a is shrinking on the direction of interarea, (is burnt by ceramic green sheet 1a with ceramic layer about
The ceramic layer of system) form recess 5, and the surface electricity fired by electrode paste pattern 2a between 1
The periphery of pole 2 is covered by the covering ceramic layer 8 fired by covering ceramic blank layer 8a.Pass through surface
The recess 5 that electrode 2 and ceramic layer about 1 are formed is capped ceramic layer 8 and covers, therefore, at this
Recess 5 be formed in part with space.
According to this manufacture method E, as shown in Fig. 7 (c), a kind of surface electrode periphery can be obtained and be capped
Ceramic layer 8 covers, the only central part of surface electrode 2 exposes such structure, the stripping of surface electrode 2
Ceramic multi-layer baseplate from excellent strength.
It addition, the present invention is not limited to above-described embodiment, about concrete structure, the internal electricity of ceramic substrate
The arranging form of pole and constituent material, the concrete pattern etc. of surface electrode, can be carried out in the range of invention
Various application and deformation.
Label declaration
1 ceramic layer (substrate ceramic layer)
2 surface electrodes
3 internal electrodes
4 via conductors
5 recesses
1a ceramic green sheet
2a electrode paste pattern
6 resin thickeners
7 grooves
8a covers ceramic blank layer
8 cover ceramic layer
10 ceramic substrates
20 ceramic multi-layer baseplates
Claims (8)
1. a ceramic multi-layer baseplate, this ceramic multi-layer baseplate includes being laminated multiple ceramic layers
Ceramic substrate and be disposed in the electrode on described ceramic layer, it is characterised in that
On the interarea of arbitrary described ceramic layer, formed by described electrode and described ceramic layer about
There is recess.
2. ceramic multi-layer baseplate as claimed in claim 1, it is characterised in that
On the described ceramic layer defining described recess, by other ceramic layer of further stacking, in institute
State and be formed with space between electrode and described ceramic layer about.
3. ceramic multi-layer baseplate as claimed in claim 1 or 2, it is characterised in that
Described electrode is buried in described ceramic layer.
4. ceramic multi-layer baseplate as claimed in claim 1 or 2, it is characterised in that
Described recess is formed on the surface of the outermost ceramic layer constituting described ceramic substrate, forms institute
The described electrode stating recess is surface electrode, and the periphery of described surface electrode is capped ceramic layer and is covered.
5. a manufacture method for ceramic multi-layer baseplate, includes multiple ceramic layers are carried out stacking for manufacture
Ceramic substrate and the ceramic multi-layer baseplate of electrode that is disposed on described ceramic layer, its feature
It is, including:
A () prepares the operation of ceramic green sheet；
B () be printing tree around the region of the electrode paste formed that to print electrode of described ceramic green sheet
The operation of fat thickener；
C the () thickener that prints electrode in the region surrounded by described resin thickener of described ceramic green sheet is formed
The operation of electrode paste pattern；
D the described ceramic green sheet defining described electrode paste pattern is carried out stacking and carrys out cambium layer stack by ()
Operation；And
E operation that described duplexer is fired by (),
In the operation being fired described duplexer, described resin thickener is decomposed and disappears.
6. a manufacture method for ceramic multi-layer baseplate, includes multiple ceramic layers are carried out stacking for manufacture
Ceramic substrate and the ceramic multi-layer baseplate of electrode that is disposed on described ceramic layer, its feature
It is, including:
A () prepares the operation of ceramic green sheet；
B () be formation groove around the region of the electrode paste formed that to print electrode of described ceramic green sheet
Operation；
C () prints electrode thickener to form electrode paste in the region surrounded by described groove of described ceramic green sheet
The operation of material pattern；
D the described ceramic green sheet defining described electrode paste pattern is carried out stacking and carrys out cambium layer stack by ()
Operation；And
E operation that described duplexer is fired by ().
7. a manufacture method for ceramic multi-layer baseplate, includes multiple ceramic layers are carried out stacking for manufacture
Ceramic substrate and the ceramic multi-layer baseplate of electrode that is disposed on described ceramic layer, its feature
It is, including:
A () prepares the operation of ceramic green sheet；
B () prints electrode thickener to form the operation of electrode paste pattern on described ceramic green sheet；
C () forms the operation of groove on described ceramic green sheet around described electrode paste pattern；
D the described ceramic green sheet formed around described groove at described electrode paste pattern is carried out stacking by ()
Carry out the operation of cambium layer stack；And
E operation that described duplexer is fired by ().
8. the manufacture method of the ceramic multi-layer baseplate as described in any one of claim 5 to 7, its feature
It is,
For defining the ceramic green sheet of the electrode paste pattern of the surface electrode by becoming described ceramic substrate,
At least periphery of described electrode paste pattern is covered and does not covers central part by arranging
Cover ceramic blank layer, use thus obtained ceramic green sheet to form described duplexer.
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2011-049044 | 2011-03-07 | ||
| JP2011049044 | 2011-03-07 | ||
| PCT/JP2012/055364 WO2012121141A1 (en) | 2011-03-07 | 2012-03-02 | Ceramic multilayered substrate and manufacturing method for same |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN103404241A CN103404241A (en) | 2013-11-20 |
| CN103404241B true CN103404241B (en) | 2016-11-30 |
Family
ID=
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4581098A (en) * | 1984-10-19 | 1986-04-08 | International Business Machines Corporation | MLC green sheet process |
| CN1906759A (en) * | 2004-02-09 | 2007-01-31 | 株式会社村田制作所 | Module with built-in component and method for manufacturing module |
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4581098A (en) * | 1984-10-19 | 1986-04-08 | International Business Machines Corporation | MLC green sheet process |
| CN1906759A (en) * | 2004-02-09 | 2007-01-31 | 株式会社村田制作所 | Module with built-in component and method for manufacturing module |
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