CN103397199A - Pretreatment method for smelting waste circuit board polymetallic powder - Google Patents
Pretreatment method for smelting waste circuit board polymetallic powder Download PDFInfo
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- CN103397199A CN103397199A CN2013103473036A CN201310347303A CN103397199A CN 103397199 A CN103397199 A CN 103397199A CN 2013103473036 A CN2013103473036 A CN 2013103473036A CN 201310347303 A CN201310347303 A CN 201310347303A CN 103397199 A CN103397199 A CN 103397199A
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Abstract
The invention relates to a pretreatment method for smelting waste circuit board polymetallic powder, which comprises the following steps: mixing waste circuit board polymetallic powder, adhesive, coal powder and water according to design requirements to obtain a mixed wet material, wherein the mass ratio of the waste circuit board polymetallic powder to the adhesive is 10:0.5-10:1, the mass ratio of the polymetallic powder to the coal powder is 10:0.15-10:0.25, the mass ratio of the polymetallic powder to the water is 10:2-10:5, the adhesive is composed of bentonite and lime, and the mass ratio of silicon to calcium in the adhesive is 1.5:1-2.5:1; adding the mixed wet material into a briquette press to obtain a mixed briquette material; adding the mixed briquette material into a drying kiln, and drying to obtain a dried briquette material; and adding the dried briquette material into a smelting furnace, and smelting to obtain copper dross and a copper solution, wherein the copper dross is subjected to copper recovery processing, and the copper solution is cast into an anode plate. Compared with the prior art, by taking comprehensive consideration on the aspects of production cost, smelting slag type and environmental protection, the invention is simple and easy to implement, and has the characteristics of common and cheap raw materials, simple equipment and the like.
Description
Technical field
The present invention relates to the pretreated method of many metal-powders of waste printed circuit board melting, particularly relate to the method for the many metal-powders of inorganic adhesive method pre-treatment waste printed circuit board.
Background technology
To be waste printed circuit boards be rich in many metal-powders such as copper, Au Ag Pt Pd, lead, tin, nickel, iron and aluminium by what cracking and sorting obtained to the many metal-powders of waste printed circuit board, and its metal content reaches more than 95%, has recovery value.The separation purifying techniques such as industrial common employing melting, electrolysis, recovery precious metal reclaim (Chinese invention patent ZL201010194555.6, International PCT patent PCT/CN2010/077935), and therefore, many metal-powders need to carry out the melting processing usually.The granularity that the many metal-powders of waste printed circuit board adopt different cracking and sorting technique to obtain differs widely, usually the powder that the many metal-powders that adopt wet crushing sorting (hydrofracture sorting) to obtain adopt the dry milling sorting to obtain is thick, and many metal-powders granularity that the wet crushing sorting obtains is approximately 20 ~ 40 orders (accounting for 70% left and right).Therefore, no matter be to adopt wet method or dry milling sorting, the many metal-powders that obtain granularity is all thinner, adopt existing industrial smelting furnace to carry out in the melting charging process, many metal-powders easily enter in flue gas, cause the loss of many metal-powders, and the metal straight yield is low.
In actual melting production process, for fear of the loss of many metal-powders, usually adopt in two ways many metal-powders are added.First kind of way is that many metal-powders are packed in the sack woven bag, then is transported in smelting furnace and carries out melting; The second way is that many metal-powders are packed in copper sheet, utilizes packing machine to pack, and forms many metal-powders copper-clad of copper sheet parcel, then is transported in smelting furnace and carries out melting.First kind of way is fairly simple, but in smelting process, the organic burning of woven bag produces the dioxin toxic gas, as the environmental practice of flue gas without response, will cause serious secondary pollution.Therefore, this mode environmental protection pressure is larger, and the subsequent environments processing cost is higher.Relatively environmental protection of the second way, but need a large amount of copper sheets, and production cost is high.
Summary of the invention
Purpose of the present invention mainly solves many metal-powders of waste printed circuit board melting problem of pretreatment, not only can avoid the loss of many metal-powders in smelting process, and can guarantee in fusion process to obtain expecting the slag type, guarantee the direct yield of copper, this technique has the characteristics such as processing technological flow is short, equipment simple, environmental protection.
The pretreated method of a kind of many metal-powders of waste printed circuit board of the present invention melting is as follows:
By design requirements, the many metal-powders of waste printed circuit board, caking agent, coal dust and water are mixed to get to the mixing wet feed, the many metal-powders of waste printed circuit board: caking agent=10:0.5 ~ 10:1(quality wherein), many metal-powders: coal dust=10:0.15 ~ 10:0.25(quality), many metal-powders: water=10:2 ~ 10:5(quality), caking agent is comprised of wilkinite and lime, silicon in caking agent: calcium=1.5:1 ~ 2.5:1(quality); To mix the wet feed briquetting in briquetting press of packing into and obtain the mixing pieces material, wherein pressure is 0.3 ~ 0.8MPa; The mixing pieces material is packed in drying kiln and carried out drying and processing and obtain drying the piece material, and the drying and processing temperature is 100 ~ 150 ℃, and drying time is 12 ~ 24 hours; To dry the piece material and join in smelting furnace and carry out melting, and obtain copper ashes and copper liquid, copper ashes is done the copper recycling, and copper liquid is cast as copper anode plate.
Compared with prior art, because the present invention has adopted wilkinite, lime as inorganic adhesive, both can be used as many metal-powders caking agent, can be used as again many metal-powders melting slag former, avoid many metal-powders in smelting process to run off, in fusion process, form simultaneously expectation slag type, copper factor in copper ashes rate and copper ashes in the reduction smelting process; Simultaneously in the briquetting process, add coal dust as reductive agent, avoid the direct yield of many metal-powders oxidation reduction copper in smelting process.The present invention considers from production cost, smelting slag type and environmental angle, have simple for process, raw materials used more common and cheap, the characteristics such as equipment is simple.
The accompanying drawing explanation
Fig. 1 represents many metal-powders of waste printed circuit board melting pretreatment process process flow sheet.
Embodiment
Embodiment 1
By design requirements, the many metal-powders of waste printed circuit board, caking agent, coal dust and water are mixed to get to the mixing wet feed, many metal-powders of waste printed circuit board wherein: caking agent=10:0.5(quality), many metal-powders: coal dust=10:0.15(quality), many metal-powders: water=10:2(quality), caking agent is comprised of wilkinite and lime, silicon in caking agent: calcium=1.5:1(quality); To mix the wet feed briquetting in briquetting press of packing into and obtain the mixing pieces material, wherein pressure is 0.3MPa; The mixing pieces material is packed in drying kiln and carried out drying and processing and obtain drying the piece material, and the drying and processing temperature is 100 ℃, and drying time is 12 hours; To dry the piece material and join in smelting furnace and carry out melting, and obtain copper ashes and copper liquid, copper ashes is done the copper recycling, and copper liquid is cast as copper anode plate.The copper ashes rate is 9.5%, and in copper ashes, copper factor is 3.5%.
Embodiment 2
By design requirements, the many metal-powders of waste printed circuit board, caking agent, coal dust and water are mixed to get to the mixing wet feed, many metal-powders of waste printed circuit board wherein: caking agent=10:1(quality), many metal-powders: coal dust=10:0.25(quality), many metal-powders: water=10:5(quality), caking agent is comprised of wilkinite and lime, silicon in caking agent: calcium=2.5:1(quality); To mix the wet feed briquetting in briquetting press of packing into and obtain the mixing pieces material, wherein pressure is 0.8MPa; The mixing pieces material is packed in drying kiln and carried out drying and processing and obtain drying the piece material, and the drying and processing temperature is 150 ℃, and drying time is 24 hours; To dry the piece material and join in smelting furnace and carry out melting, and obtain copper ashes and copper liquid, copper ashes is done the copper recycling, and copper liquid is cast as copper anode plate.The copper ashes rate is 9.7%, and in copper ashes, copper factor is 3.2%.
Embodiment 3
By design requirements, the many metal-powders of waste printed circuit board, caking agent, coal dust and water are mixed to get to the mixing wet feed, many metal-powders of waste printed circuit board wherein: caking agent=10:0.8(quality), many metal-powders: coal dust=10:0.2(quality), many metal-powders: water=10:3(quality), caking agent is comprised of wilkinite and lime, silicon in caking agent: calcium=2:1(quality); To mix the wet feed briquetting in briquetting press of packing into and obtain the mixing pieces material, wherein pressure is 0.6MPa; The mixing pieces material is packed in drying kiln and carried out drying and processing and obtain drying the piece material, and the drying and processing temperature is 120 ℃, and drying time is 16 hours; To dry the piece material and join in smelting furnace and carry out melting, and obtain copper ashes and copper liquid, copper ashes is done the copper recycling, and copper liquid is cast as copper anode plate.The copper ashes rate is 9.1%, and in copper ashes, copper factor is 4.2%.
Embodiment 4
By design requirements, the many metal-powders of waste printed circuit board, caking agent, coal dust and water are mixed to get to the mixing wet feed, many metal-powders of waste printed circuit board wherein: caking agent=10:0.6(quality), many metal-powders: coal dust=10:0.18(quality), many metal-powders: water=10:3(quality), caking agent is comprised of wilkinite and lime, silicon in caking agent: calcium=1.9:1(quality); To mix the wet feed briquetting in briquetting press of packing into and obtain the mixing pieces material, wherein pressure is 0.7MPa; The mixing pieces material is packed in drying kiln and carried out drying and processing and obtain drying the piece material, and the drying and processing temperature is 130 ℃, and drying time is 18 hours; To dry the piece material and join in smelting furnace and carry out melting, and obtain copper ashes and copper liquid, copper ashes is done the copper recycling, and copper liquid is cast as copper anode plate.The copper ashes rate is 9.0%, and in copper ashes, copper factor is 4.1%.
Embodiment 5
By design requirements, the many metal-powders of waste printed circuit board, caking agent, coal dust and water are mixed to get to the mixing wet feed, many metal-powders of waste printed circuit board wherein: caking agent=10:0.7(quality), many metal-powders: coal dust=10:0.22(quality), many metal-powders: water=10:4(quality), caking agent is comprised of wilkinite and lime, silicon in caking agent: calcium=2.3:1(quality); To mix the wet feed briquetting in briquetting press of packing into and obtain the mixing pieces material, wherein pressure is 0.5MPa; The mixing pieces material is packed in drying kiln and carried out drying and processing and obtain drying the piece material, and the drying and processing temperature is 140 ℃, and drying time is 20 hours; To dry the piece material and join in smelting furnace and carry out melting, and obtain copper ashes and copper liquid, copper ashes is done the copper recycling, and copper liquid is cast as copper anode plate.The copper ashes rate is 8.8%, and in copper ashes, copper factor is 4.3%.
Claims (4)
1. the pretreated method of many metal-powders of waste printed circuit board melting, it is characterized in that: the many metal-powders of waste printed circuit board, caking agent, coal dust and water are mixed to get to the mixing wet feed, to mix the wet feed briquetting in briquetting press of packing into and obtain the mixing pieces material, the mixing pieces material is packed in drying kiln and carried out drying and processing and obtain drying the piece material, to dry the piece material joins in smelting furnace and carries out melting, obtain copper ashes and copper liquid, copper ashes is done the copper recycling, and copper liquid is cast as positive plate; The many metal-powders of waste printed circuit board: caking agent=10:0.5 ~ 10:1(quality), many metal-powders: coal dust=10:0.15 ~ 10:0.25(quality), many metal-powders: water=10:2 ~ 10:5(quality).
2. the pretreated method of a kind of many metal-powders of waste printed circuit board as claimed in claim 1 melting, is characterized in that, caking agent is comprised of wilkinite and lime, silicon in caking agent: calcium=1.5:1 ~ 2.5:1(quality).
3. the pretreated method of a kind of many metal-powders of waste printed circuit board as claimed in claim 1 melting, is characterized in that, briquetting pressure is 0.3 ~ 0.8MPa.
4. the pretreated method of a kind of many metal-powders of waste printed circuit board as claimed in claim 1 melting, is characterized in that, the drying and processing temperature is 100 ~ 150 ℃, and drying time is 12 ~ 24 hours.
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| CN201310347303.6A CN103397199B (en) | 2013-08-09 | 2013-08-09 | Pretreatment method for smelting waste circuit board polymetallic powder |
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| CN201310347303.6A CN103397199B (en) | 2013-08-09 | 2013-08-09 | Pretreatment method for smelting waste circuit board polymetallic powder |
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| CN103397199B CN103397199B (en) | 2014-10-15 |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2018120684A1 (en) * | 2016-12-29 | 2018-07-05 | 荆门市格林美新材料有限公司 | Circuit board pyrolysis product briquette and preparation method therefor |
Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4152142A (en) * | 1977-02-28 | 1979-05-01 | Kennecott Copper Corporation | Recovery of copper values from iron-containing ore materials as mined and smelted |
| CN1718784A (en) * | 2005-07-07 | 2006-01-11 | 孙涛 | Method of recovery copper, nickel and noble metal in waste water and slag by combined technology of wet method and fire method |
| CN201407662Y (en) * | 2009-04-20 | 2010-02-17 | 杭州大洲物资再生利用有限公司 | Smelting device for processing waste circuit boards |
| CN101787547A (en) * | 2010-02-09 | 2010-07-28 | 中南大学 | Method for recovering valuable metals from waste printed circuit board |
| CN101831553A (en) * | 2010-05-28 | 2010-09-15 | 北京科技大学 | Method for green recovery of waste circuit boards by cyanide-free full-wet whole set process |
| CN102719676A (en) * | 2012-06-20 | 2012-10-10 | 北京科技大学 | Method for rapidly reducing copper slags to produce iron-copper alloys in kiln in reducing atmosphere |
-
2013
- 2013-08-09 CN CN201310347303.6A patent/CN103397199B/en not_active Expired - Fee Related
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4152142A (en) * | 1977-02-28 | 1979-05-01 | Kennecott Copper Corporation | Recovery of copper values from iron-containing ore materials as mined and smelted |
| CN1718784A (en) * | 2005-07-07 | 2006-01-11 | 孙涛 | Method of recovery copper, nickel and noble metal in waste water and slag by combined technology of wet method and fire method |
| CN201407662Y (en) * | 2009-04-20 | 2010-02-17 | 杭州大洲物资再生利用有限公司 | Smelting device for processing waste circuit boards |
| CN101787547A (en) * | 2010-02-09 | 2010-07-28 | 中南大学 | Method for recovering valuable metals from waste printed circuit board |
| CN101831553A (en) * | 2010-05-28 | 2010-09-15 | 北京科技大学 | Method for green recovery of waste circuit boards by cyanide-free full-wet whole set process |
| CN102719676A (en) * | 2012-06-20 | 2012-10-10 | 北京科技大学 | Method for rapidly reducing copper slags to produce iron-copper alloys in kiln in reducing atmosphere |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2018120684A1 (en) * | 2016-12-29 | 2018-07-05 | 荆门市格林美新材料有限公司 | Circuit board pyrolysis product briquette and preparation method therefor |
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Granted publication date: 20141015 Termination date: 20210809 |