CN103389546A - Optical fiber module - Google Patents
Optical fiber module Download PDFInfo
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- CN103389546A CN103389546A CN2012101397809A CN201210139780A CN103389546A CN 103389546 A CN103389546 A CN 103389546A CN 2012101397809 A CN2012101397809 A CN 2012101397809A CN 201210139780 A CN201210139780 A CN 201210139780A CN 103389546 A CN103389546 A CN 103389546A
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- circuit board
- hole
- optical fiber
- light
- photodiode
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Abstract
Disclosed is an optical fiber module. The optical fiber module comprises a light-emitting diode and a photodiode, and further comprises a circuit board, a ceramic substrate, an optical fiber circuit board, a first reflecting unit and a second reflecting unit. The circuit board is provided with a first surface, a second surface, a first through hole and a second through hole, wherein the first surface and the second surface are oppositely arranged, and the first through hole and the second through hole are oppositely formed. The ceramic substrate is arranged on the first surface and used for bearing the light-emitting diode and the photodiode. The light-emitting diode and the photodiode are arranged towards the circuit board. The optical fiber circuit board is arranged on the second surface and comprises a flexible circuit board body, a first planar optical waveguide and a second planar optical waveguide. The first reflecting unit is arranged on the flexible circuit board body and corresponds to the first through hole so as to reflect light which is emitted by the light-emitting diode and penetrates through the first through hole to the first planar optical waveguide. The second reflecting unit is arranged on the flexible circuit board body and aligns at the second through hole so as to reflect light which is emitted by the second planar optical waveguide to enter the second through hole so as to be received by the photodiode.
Description
Technical field
The present invention relates to a kind of optical fiber module.
Background technology
Due to present interior of mobile phone core processor processing speed Fast Growth, and outside each spare part is also because the raising of core processor usefulness also is inconjunction with and drives outside spare part specification raising., as camera model, improved pixel, volume of transmitted data that also relatively must be larger; The LCD display module, promoted the LCD display pixel, makes the more careful perfection of picture, volume of transmitted data that also must be larger.
How to solve the more more substantial volume of transmitted data than in the past,, except the data transmission channel number with traditional flexible circuit board connecting line increases,, to strengthen outside transmission quantity, also utilize optical circuit board to realize.Optical circuit board replaces the copper cash on flexible circuit board to carry out transmission information with optical fiber, because optical fiber is with optical signal transmission, optical signal transmission obtains major advantage, can not be subject to Electromagnetic Interference (EMI), and ray velocity is faster than electric speed, so use optical fiber fast doubly a lot of more than adopting copper cash to transmit on data transmission.
Because encapsulation LED on printed circuit board (PCB) and photodiode are generally done with the COB processing procedure, the mode that the light-emitting area of light emitting diode and the sensitive surface of photodiode make progress, only, this mode must have extra connector that optical fiber is padded will surpass the height of light emitting diode and photodiode when optical fiber connects, to avoid light emitting diode and photodiode to be subjected to wounding or weighing wounded of optical circuit board, therefore this kind structure makes that whole height is higher and light loss is larger.
Summary of the invention
In view of this, be necessary to provide the lower optic module of loss that a kind of whole height is little and light transmits.
A kind of optical fiber module, comprise light emitting diode and photodiode, described light emitting diode has light-emitting area, described photodiode has sensitive surface, described optical fiber module also comprises: circuit board, have relative first surface and second surface, described circuit board has the first through hole and the second through hole that runs through described first surface and second surface; Ceramic substrate, be arranged on the first surface of described circuit board and be used for carrying described light emitting diode and photodiode, and described light-emitting area and sensitive surface are towards the first surface of described circuit board; Optical circuit board, be positioned at the second surface of described circuit board, and described optical circuit board comprises flexible circuit board and is arranged on the first planar optical waveguide and the second planar optical waveguide on described flexible circuit board; The first reflector element, be arranged on described flexible circuit board and corresponding described the first through hole, the light that described light emitting diode sends passes described the first through hole and incides on described the first reflector element, by the light of described the first reflector element reflection, is coupled into described the first planar optical waveguide; And second reflector element, be arranged on described flexible circuit board and aim at described the second through hole and be used for reflecting the light of described the second planar optical waveguide outgoing, passed described the second through hole by the light of described the second reflector element reflection and received by described photodiode.
Compared to prior art, the optical fiber module of the present embodiment is by arranging through hole on circuit board, and make the sensitive surface of the light-emitting area of light emitting diode and photodiode directly towards circuit board, thereby can reduce the whole height of optical circuit board, circuit board, light emitting diode and photodiode, and the unnecessary bending that can avoid optical circuit board to produce when with circuit board, being connected, reduced the loss of optical circuit board light transmission.
Description of drawings
Fig. 1 is the schematic diagram of light emitting diode and optical circuit board in embodiment of the present invention optical fiber module.
Fig. 2 is the schematic diagram of photodiode and optical circuit board in embodiment of the present invention optical fiber module.
The main element symbol description
| The |
100 |
| |
10 |
| |
11 |
| The first planar |
12 |
| The second planar |
13 |
| |
14 |
| The |
101 |
| The |
102 |
| |
20 |
| |
201 |
| |
202 |
| The first through |
21 |
| The second through |
22 |
| |
30 |
| |
31 |
| |
310 |
| |
311 |
| |
32 |
| Light- |
320 |
| Photodiode | 33 |
| |
330 |
| The |
34 |
| The |
35 |
| The |
40 |
| The |
50 |
Following embodiment further illustrates the present invention in connection with above-mentioned accompanying drawing.
Embodiment
See also Fig. 1 and Fig. 2, the optical fiber module 100 that the embodiment of the present invention provides comprises optical circuit board 10, circuit board 20, photovoltaic element 30, the first reflector element 40 and the second reflector element 50.
The first through hole 21 and the second through hole 22 be the first reflector element 40 and the second reflector elements 50 in alignment indentation 14 respectively, and corresponding the first planar optical waveguide 12 of the first reflector element 40, corresponding the second planar optical waveguide 13 of the second reflector element 50.
Certainly, in other embodiments, the first chip 34 and the second chip 35 also can integrate, and are used for driving the signal that light emitting diode 32 is luminous and processing photodiode 33 is inputted.
The first chip 34 drives light emitting diode 32 and sends the light of basic perpendicular circuit board 20, light passes the first through hole 21 and incides on the first reflector element 40, the first reflector element 40 becomes light reflection the light of substantially parallel circuit board 20, and the light of substantially parallel circuit board 20 is coupled into the first planar optical waveguide 12 and transmits.
The light of the second planar optical waveguide 13 transmission basic perpendicular circuit board 20 after the second reflector element 50 reflections enters the second through hole 22, photodiode 33 receives from the light of the second through hole 22 outgoing and is converted into electric signal exports to second chip 35, the second chips 35 these electric signal of processing to obtain the signal of the second planar optical waveguide 13 transmission.
Be understandable that, those skilled in the art also can do other variation etc. and be used in design of the present invention in spirit of the present invention, as long as it does not depart from technique effect of the present invention and all can.The variation that these are done according to spirit of the present invention, within all should being included in the present invention's scope required for protection.
Claims (7)
1. an optical fiber module, comprise light emitting diode and photodiode, and described light emitting diode has light-emitting area, and described photodiode has sensitive surface, and described optical fiber module also comprises:
Circuit board, have relative first surface and second surface, and described circuit board has the first through hole and the second through hole that runs through described first surface and second surface;
Ceramic substrate, be arranged on the first surface of described circuit board and be used for carrying described light emitting diode and photodiode, and described light-emitting area and sensitive surface are towards the first surface of described circuit board;
Optical circuit board, be positioned at the second surface of described circuit board, and described optical circuit board comprises flexible circuit board and is arranged on the first planar optical waveguide and the second planar optical waveguide on described flexible circuit board;
The first reflector element, be arranged on described flexible circuit board and corresponding described the first through hole, the light that described light emitting diode sends passes described the first through hole and incides on described the first reflector element, by the light of described the first reflector element reflection, is coupled into described the first planar optical waveguide; And
The second reflector element, be arranged on described flexible circuit board and aim at described the second through hole and be used for reflecting the light of described the second planar optical waveguide outgoing, passed described the second through hole by the light of described the second reflector element reflection and received by described photodiode.
2. optical fiber module as claimed in claim 1, is characterized in that, described light emitting diode and photodiode adopt the COB processing procedure to be arranged on described ceramic substrate.
3. optical fiber module as claimed in claim 2, is characterized in that, described ceramic substrate comprises the sidewall of base plate and vertical described base plate, and described light emitting diode and photodiode are arranged on described base plate, and described sidewall is fixed on described circuit board.
4. optical fiber module as claimed in claim 2, is characterized in that, described ceramic substrate is low-temperature co-fired ceramic substrate.
5. optical fiber module as claimed in claim 2, is characterized in that, has the groove of corresponding described the first through hole and the second through hole on described flexible circuit board, and described the first reflector element and the second reflector element are positioned at described groove.
6. optical fiber module as claimed in claim 1, is characterized in that, also is provided with the signal that chip is used for driving described lumination of light emitting diode and processes described photodiode output on described ceramic substrate.
7. optical fiber module as described in claim 1-6 any one, is characterized in that, described flexible circuit board combines with described circuit board by the hot pressing processing procedure.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201210139780.9A CN103389546B (en) | 2012-05-08 | 2012-05-08 | Optical fiber module |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201210139780.9A CN103389546B (en) | 2012-05-08 | 2012-05-08 | Optical fiber module |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN103389546A true CN103389546A (en) | 2013-11-13 |
| CN103389546B CN103389546B (en) | 2016-12-07 |
Family
ID=49533866
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201210139780.9A Expired - Fee Related CN103389546B (en) | 2012-05-08 | 2012-05-08 | Optical fiber module |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN103389546B (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107544118A (en) * | 2017-09-04 | 2018-01-05 | 中航海信光电技术有限公司 | Realize photoelectric conversion module of optical power monitoring and preparation method thereof |
| CN110213133A (en) * | 2019-06-11 | 2019-09-06 | 立讯精密工业股份有限公司 | Link loopback apparatus |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101017227A (en) * | 2006-02-07 | 2007-08-15 | 富士施乐株式会社 | Optical connector |
| US20080175530A1 (en) * | 2007-01-19 | 2008-07-24 | Jeong-Hwan Song | Photoelectronic wired flexible printed circuit board using optical fiber |
| EP2112534A1 (en) * | 2008-04-24 | 2009-10-28 | Nitto Denko Corporation | Manufacturing method of opto-electric hybrid board |
| CN101859006A (en) * | 2009-04-06 | 2010-10-13 | 日东电工株式会社 | The manufacture method of opto-electric hybrid module and the opto-electric hybrid module that obtains by this method |
| CN102129102A (en) * | 2010-01-14 | 2011-07-20 | 欣兴电子股份有限公司 | Circuit substrate and manufacture method thereof |
-
2012
- 2012-05-08 CN CN201210139780.9A patent/CN103389546B/en not_active Expired - Fee Related
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101017227A (en) * | 2006-02-07 | 2007-08-15 | 富士施乐株式会社 | Optical connector |
| US20080175530A1 (en) * | 2007-01-19 | 2008-07-24 | Jeong-Hwan Song | Photoelectronic wired flexible printed circuit board using optical fiber |
| EP2112534A1 (en) * | 2008-04-24 | 2009-10-28 | Nitto Denko Corporation | Manufacturing method of opto-electric hybrid board |
| CN101859006A (en) * | 2009-04-06 | 2010-10-13 | 日东电工株式会社 | The manufacture method of opto-electric hybrid module and the opto-electric hybrid module that obtains by this method |
| CN102129102A (en) * | 2010-01-14 | 2011-07-20 | 欣兴电子股份有限公司 | Circuit substrate and manufacture method thereof |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107544118A (en) * | 2017-09-04 | 2018-01-05 | 中航海信光电技术有限公司 | Realize photoelectric conversion module of optical power monitoring and preparation method thereof |
| CN110213133A (en) * | 2019-06-11 | 2019-09-06 | 立讯精密工业股份有限公司 | Link loopback apparatus |
Also Published As
| Publication number | Publication date |
|---|---|
| CN103389546B (en) | 2016-12-07 |
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Effective date of registration: 20171027 Address after: Shenzhen Guanlan street old village community of new Nan Xiang 3, first floor of building B 101 Patentee after: Shenzhen three dimensional Kai Tak Precision Industry Co., Ltd. Address before: 518109 Guangdong city of Shenzhen province Baoan District Longhua Town Industrial Zone tabulaeformis tenth East Ring Road No. 2 two Co-patentee before: Hon Hai Precision Industry Co., Ltd. Patentee before: Hongfujin Precise Industry (Shenzhen) Co., Ltd. |
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| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20161207 Termination date: 20200508 |
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| CF01 | Termination of patent right due to non-payment of annual fee |