CN103387765B - Photosensitive composition for solder resist printing ink or photoresist - Google Patents
Photosensitive composition for solder resist printing ink or photoresist Download PDFInfo
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Abstract
The invention relates to a photosensitive composition for a solder resist printing ink or photoresist. The photosensitive composition includes the following components: (A) an oligomer or polymer containing at least one carboxyl and at least one carbon-carbon double bond and having molecular weight less than 100000; (B) at least one photoinitiator compound shown as a formula I, wherein R1 represents benzyl or allyl, R2 represents straight chain or branched chain C1-C4 alkyl, and R3 and R4 respectively represent a straight chain or branched chain C1-C4 alkylene, or form a C4-C6 alkylene together; (C) at least one monomer or oligomer containing carbon-carbon double bond; and (D) a coloring agent. The composition is suitable for preparation of solder resist printing ink or photoresist, especially elements of a color filter.
Description
Technical field
The present invention relates to a kind of solder mask or photoresist material photosensitive composition, said composition contains structural formula I compound as light trigger, and the coating through radiation curing can be developed by basic solution thus be retained the pattern of needs.
Background technology
1988, patent EP284561 disclosed the application of alpha-amino group ketone compounds as light trigger, finally have selected 2-dimethylamino-2-benzyl-1-(4-morphlinophenyl)-1-butanone (II) as commercially produced product.In patent document JP2678684B2, disclose the colour filter photoetching compositions using 2-dimethylamino-2-benzyl-1-(4-morphlinophenyl)-1-butanone as light trigger component, the photoetching compositions (resist) disclosed in patent WO0068740A1 containing this light trigger can be developed by basic solution; The production of composition for plasma panel containing this light trigger can developed by basic solution is disclosed in JP11149862A2.But this light trigger has an obvious deficiency to be that solubleness is little, preparation difficulty, the low-temperature stability of compound composition is poor, when especially working concentration is more than 5%.As an alternative, 2-dimethylamino-2-(4-methyl-benzyl)-1-(4-morphlinophenyl)-1-butanone (III) is commercially used, to solve the former deficiency.Although (4-methyl-benzyl-1-(4-morphlinophenyl)-1-butanone is as the alkali-developable Photocurable composition of light trigger and application thereof to disclose 2-dimethylamino-2-in patent WO2003010602, although solvability is significantly improved, maximum absorption spectrum 320nm(acetonitrile solvent), but solidify through the 405nm single wavelength light source of grating filters owing to using, both matchings are low, the effect of industrial use is still not ideal enough, is difficult to show good curing efficiency.
Summary of the invention
Present inventor is surprised to find that, the maximum absorption wavelength of structural formula I compound reaches 333nm(acetonitrile solvent), than the 318nm red shift 15nm of 2-dimethylamino-2-benzyl-1-(4-morphlinophenyl)-1-butanone, this solidifies as 405nm or LED for long wave Single wavelength photoimaging is very favorable, absorption spectrum and emmission spectrum have more multiple folding and are conducive to Energy harvesting and improve curing efficiency, in experimental formula, structural formula I compounds exhibit goes out good curing efficiency; Meanwhile, structural formula I compound, in all kinds of SOLVENTS, monomer, has good solubleness; Especially surprisingly, it is as light trigger component in photo-sensitive composition of the present invention, and structural formula I compound demonstrates sensitiveer photosensitivity, allows the amount of pigment having more vast scale in composition, be conducive to forming more gorgeous fullness of shade, in structural formula I
R
1benzyl or allyl group,
R
2straight or branched C
1-C
4alkyl,
R
3and R
4straight or branched C independently of one another
1-C
4alkyl, or form C together
4-C
6alkylidene group.
The invention provides a kind of structural formula I compound (B) and form photo-sensitive composition with other components following,
(A) alkali soluble resins, in its molecule at least containing a carboxylic group or phenolic hydroxy group and have not higher than 100000 number-average molecular weight;
(C) at least one contains the free-radical curable compound of carbon-carbon double bond;
(D) tinting material;
In this photo-sensitive composition, when being 100 parts relative to component A part by weight, B component and structural formula I compound by weight ratio are 0.1-50 part, and the part by weight of component C is 10-300 part, and the part by weight of component D is 1-100 part.
This photo-sensitive composition has showed different premium properties in the past.
More suitably alkali soluble resins (A) is oligopolymer or the polymkeric substance with 2000-100000 molecular weight, typical example is carbon-carbon double bond conjugation carboxylic acid and one or more monomer copolymers with pendant carboxylic acid group, reconnect the acrylate group with radically curing activity, wherein carbon-carbon double bond conjugation carboxylic acid is such as vinylformic acid, methacrylic acid, butenoic acid, monomethyl maleate, fumaric acid, monomethyl ester etc.; Monomer copolymer is from methyl acrylate, methyl methacrylate, butyl acrylate, n-octyl propionate, hydroxyethyl methylacrylate, polyethyleneglycol diacrylate, polypropyleneglycol diacrylate, ethyl maleate, dibutyl fumarate, alpha-methyl styrene, vinylbenzyl glycidyl ether, acrylamide, divinyl, isoprene, N-phenylmaleimide, vinyl-acetic ester.Preferred monomer copolymer example is methacrylic acid/methylmethacrylate copolymer, methacrylic acid/benzyl methacrylate/styrol copolymer; The example of other multipolymers can be novolac epoxy resin or Bisphenol A epoxides and unsaturated polybasic acid anhydride esterified polymer, and polybasic acid anhydride can be selected from: maleic anhydride, Tetra hydro Phthalic anhydride, 1,2,4 trimellitic acid 1,2-anhydrides etc.The acrylate group with radically curing activity is from epoxidation propylene acid esters difunctional compounds such as glycidyl ether-ether, epoxidation cyclohexanemethanol propionic esters.
Copolyreaction conventionally solution heated polymerizable method is carried out, the mol ratio of such as methacrylic acid/methyl methacrylate is 50: 70 to 70: 20, be dissolved in inert solvent as toluene, add thermal polymerization as 2,2 '-Diisopropyl azodicarboxylate carries out polyreaction, then the epoxidation propylene acid esters that molar weight is carboxylic acid group 10-30% is added, regulate acid number and access and have the acrylate-based of radically curing activity, the oligopolymer obtained or the acid number of polymkeric substance are suitable within the scope of 50-150mgKOH/g.
Other methods obtaining alkali soluble resins also have Epocryl and polybasic acid anhydride esterification, access carboxylic group.
The example that above-mentioned alkali soluble resins can be bought commercially has: EB9692, the EB9696 of Qing Te company, the ACA250 etc. of Daicel company.
At least containing one light trigger component (B) as shown in structural formula I compound in described photo-sensitive composition, wherein
R
1benzyl or allyl group;
R
2be selected from methyl, ethyl;
R
3and R
4be selected from independently of one another is methyl, ethyl or pentamethylene.
Preferred structural formula I compound is
(I a) 2-dimethylamino-2-benzyl-1-(4-piperidines is for phenyl)-1-butanone;
(I b) 2-piperidyl-2-allyl group-1-(4-piperidines is for phenyl)-1-butanone.
(I a) is disclosed in patent US 5077402 to these compounds, and compound (I b) with (synthesize by I a) similar method.When being 100 parts relative to component A part by weight, their Optimum is 0.1-50 part.
At least one that comprises photo-sensitive composition contains the free-radical curable compound (C) of carbon-carbon double bond, be selected from single functionality acrylate or methacrylate monomer, such as methyl acrylate, ethyl propenoate, butyl acrylate, ethyl acrylate, 2-Hydroxy ethyl acrylate, isobornyl acrylate, methyl methacrylate.Also can use silicone acrylate in addition, vinyl cyanide, acrylamide, vinyl ether as IVE, vinylbenzene, two or polyfunctionality example has ethylene glycol and polyether glycol thereof, propylene glycol and polyether glycol thereof, neopentyl glycol, the diacrylate of hexylene glycol or dihydroxyphenyl propane or two (methacrylic esters), and 4, 4,-two (2-acryl-oyloxyethoxy) diphenyl propane, Viscoat 295, pentaerythritol triacrylate or tetraacrylate, and their many ethoxylations or many propoxylated derivative, vinyl acrylate, divinylbenzene, succinic acid divinyl ester, Phthalic acid, diallyl ester, cyanacrylate or three (2-acryloyl ethyl) isocyanuric acid ester.The above-mentioned free-radical curable compound containing carbon-carbon double bond can be used individually or with the form of the mixture of any hope, preferred acrylate compounds, allyl ether series compound or its mixture.When being 100 parts relative to component A part by weight, the consumption of component (C) is 20-300 part.
Tinting material (component D) is the neccessary composition preparing spectral filter, uses phthalocyanine blue, yellow ultramarine, veridian, red pigment, titanium dioxide, carbon black etc. as required.Pigment concentration generally accounts for the 10-50% of all solids component.
Except said structure type I compound is as except light trigger, all right composite other types light trigger or aided initiating component (E), for accelerating curing speed, improve cured film stability.They be benzophenone and substitutive derivative thereof as 4-phenyl benzophenone, 4-methylthio group benzophenone, 4-(2-hydroxyethylthio) benzophenone, 4,4 '-two (diethylamino) benzophenone, UVINUL MS 40-fluoroacetic acid macrogol ester; Thioxanthone and substitutive derivative thereof are as ITX, 2,4-diethyl thioxanthones, the chloro-4-propoxythioxanthone of 1-, thioxanthone-2 formic acid macrogol ester, thioxanthone-2-fluoroacetic acid macrogol ester; Alpha-hydroxy ketone is as 2-hydroxy-2-methyl-1-phenyl-acetone; Alpha-amino group ketone is as 2-methyl-2-(4-morpholinyl)-(4-methylthio group) phenyl-1-acetone; Acylphosphanes class is as TMDPO, two (2,4,6-trimethylbenzoyl) phenyl phosphine oxide etc.; Hexaarylbisimidazolecompounds.Amine as 4-dimethyl ethyl aminobenzoate, trolamine, methyldiethanolamine or reactive amines compounds, as diethylamine and ethoxylated trimethylolpropane triacrylate affixture; Phosphorous acid ester is as triphenyl phosphite; Thio-alcohol is as spicy thioalcohol.When being 100 parts relative to component A part by weight, the consumption of component (E) is 0.05-50 part.
In photo-sensitive composition, except component (A), (B), (C), (D), at least one can also be added and there is the compound of epoxide group as heat-curable component (F) and a kind of epoxy curing promoter (G).
The compound with epoxide group can use known Thermosettable epoxy compounds as heat-curable component (F), such as aliphatic epoxy resin or aromatic epoxy resin, the BPS-200 that preferred bisphenol-s epoxy resin is produced as Japanese chemical company, bisphenol A type epoxy resin, novolac epoxy resin etc. and their partial esterification thing, in the composition relative to the component A of 100 parts of part by weight, the consumption of component (F) is 30-70 part.
When using component (F), optionally use promotor (G) good accelerative action in curing can be played as collaborative component, example has amine type accelerator, imidazoles promotor and other normally used epoxy resin hardeners, and consumption is no more than 5% of component (F) weight.
Except said components (A), (B), (C), (D), (E), (F), (G), can also use in photo-sensitive composition art technology other additives (H) of commonly using, they comprise:
Binding property for improving composition is mineral filler with one of additive becoming film hardness etc., and such as barium sulfate, ground silica, talcum powder, calcium carbonate, mica powder etc., within consumption only accounts for 30% of composition total weight;
For improving the stablizer of the shelf stability of composition, such as phenolic inhibitor, bulky amine, light absorber is as 2-(2 '-hydroxy phenyl)-benzotriazole salicylate class, triazines;
For the additive such as pigment dispersing agent, thickening material, defoamer, flow agent regulating composition stability to use, their consumption is limited to reach composition character index, and has no special requirements.
Solvent optionally component (S) can join the effect playing dilution in described photo-sensitive composition, and suitable solvent is: ketone, such as methyl ethyl ketone, pimelinketone; Hydro carbons, such as toluene, dimethylbenzene, octane, sherwood oil, petroleum naphtha; Alcohols, such as propyl carbinol, propylene glycol etc.; Glycol ethers and ester class thereof, such as propylene glycol monomethyl ether, diethylene glycol monomethyl ether, propylene glycol methyl ether acetate etc.
Above-mentioned composition keeps in Dark Place after having prepared by the production method of ink.
Use this area normally used coating technique as the present composition is evenly coated on by the methods such as spin coating, roller coat, spraying, transfer printing substrate to be coated on, glue spread comply with needed for determine, common thickness is 0.1 micron to 1 millimeter.Then make solvent evaporates by heating such as 80 DEG C of desiccating methods, and non-volatile component forms glue-line and stays on base material and (have in composition during solvent and adopt).
Next step is exposure image, if not use UV laser direct imaging method, just the mask with image is placed on glue-line, the light that ultraviolet or visible light source launch certain limit wavelength exposes through mask light transmission part to set energy, so, glue-line light part produces solidification, and crested part does not produce solidification.
Next be development, usual use alkaline aqueous solution development, the such as aqueous solution of alkali-metal oxyhydroxide, carbonate, ammoniacal liquor, also can add quantitative wetting agent where necessary if tensio-active agent, organic solvent are as pimelinketone, acetone, ethylene glycol ethyl ether etc. in the aqueous solution.Exposed film is immersed development bath of liquid or the visualization way be sprayed in exposed film is all fine by developing solution, concrete development temperature and time are depending on development effect.
Last heat treatment process can optimized image fastness, is generally toast 15-45 minute in 200-260 DEG C of hot stove.
The invention provides one makes carbon-carbon double bond compound in described photo-sensitive composition carry out photopolymerisable method, comprises by the energy wave radiation said composition within the scope of 190-550nm.Especially solidification said composition is irradiated with the LED light source that standing wave arbitrary between 365nm-405nm is long.
The invention provides a kind of method of exposure imaging, the material scribbling photo-sensitive composition of the present invention is on the surface covered through image film, carry out exposure image by the energy wave radiation said composition within the scope of 190-550nm, then uncured part photographic developer is removed.Photo-sensitive composition of the present invention can be used as photoresist material, has high sensitivity of light, is easy to be developed by alkaline aqueous solution, not swelling set, and imaging effect is clear, is suitable for making etching photoresist material, welding resistance photoresist material; Can be used for the production process material of display of organic electroluminescence or liquid-crystal display; For image display and recording materials; With the jetted ink of LED solidification; For in the production process of LCD, OLED, PDP, also can be used in the manufacture of various press plate and the production process of electronic line plate or unicircuit, can also for the formation of the barrier coat of various electronic package.
Photo-sensitive composition of the present invention is particularly suitable for being manufactured on the colour filter used in LCD manufacturing technology, uses photo-sensitive composition of the present invention as photoresist material, by known process, repeats to form three primary colors and black picture pattern, obtains complete colour filter.The base material of these colour filters can be glass or organic polymer films and ceramic plate.
Content of the present invention also comprises the colour filter manufactured with above-mentioned photo-sensitive composition.
Accompanying drawing explanation
Fig. 1 is photosensitive composition gel conversion rate cylindricality comparison diagram
Fig. 2 is different light trigger curing efficiency test result comparison diagrams
Fig. 3 is the photosensitive composition curing efficiency test result comparison diagram of different light trigger consumption
Specific embodiment
The preparation of embodiment 1 light trigger
(I a) 2-dimethylamino-2-benzyl-1-(4-piperidines is for phenyl)-1-butanone
Prepared by the method according to patent US 5077402 the 35th hurdle compound 57;
(I b) 2-piperidyl-2-allyl group-1-(4-piperidines is for phenyl)-1-butanone
According to document [Xie Chuan, fine chemistry industry, V17(4), P237-240] preparation.
Embodiment 2 light trigger solubility experiment
Testing method: take that each light trigger sample is as much as possible under 50 DEG C of heating conditions to be fully dissolved in acetone, tri (propylene glycol) diacrylate (TPGDA), 1-Methoxy-2-propyl acetate (PMA), place 24 hours for 22 DEG C, HPLC measures the content of light trigger in its clear liquid, calculate its solubleness, experimental result is in table 1.
Table 1 light trigger dissolubility data
As can be seen from the experimental result of table 1, the solvability of 2-dimethylamino-2-benzyl-1-(4-piperidines is for phenyl)-1-butanone in solvent and monomer is significantly improved relative to 2-dimethylamino-2-benzyl-1-(4-morphlinophenyl)-1-butanone, good solubility makes its compound composition easily prepare, and good stability.
The preparation of embodiment 3 alkali soluble resins
Take 30g methacrylic acid, 80g benzyl methacrylate, 20g succinic acid list (2-acryloyl-oxy ethyl ester), 20g vinylbenzene, 2.5g Diisopropyl azodicarboxylate; be dissolved in 550g propylene glycol methyl ether acetate (PMA); solution stirs 10 minutes under nitrogen protection in 70 DEG C of heating baths; obtain multipolymer viscous solution, cool stand-by.The content 20% of alkali soluble resins.
The preparation of embodiment 4 photoresist material and development
Be II by A, B, C(light trigger of filling a prescription in table 2), D(light trigger is III, its chemical name is 2-dimethylamino-2-(4-methyl-benzyl)-1-(4-morphlinophenyl)-1-butanone) weight proportion all components is made photo-sensitive composition by the preparation method of ink, liquid in mobility.
Above-mentioned liquid photosensitive composition is coated suitable for soda glass surface by application spin coating method, through 80 DEG C of bakings 10 minutes, is vapored away by solvent PMA, and measurement residuum film thickness is 3 microns.
Film is placed 21 rank ash gradient chis, and filter 200W high voltage mercury lamp light with 405nm grating filters device, film and grating distance 10cm, make exposure reach 4000mJ/cm
2.
In the 1% sodium carbonate solutions bath of 30 DEG C, soak 1min, what record can show maximumly stays film exponent number, and numeral is larger, and measured composition photo sensitivity is stronger, the photocuring rate of photoresist material and film forming properties higher.The results are shown in table 3.
Table 2 composition material proportioning table
| Formula A | Formula B | Formula C | Formula D | Source | |
| Ⅰa | 40 | Embodiment 1 | |||
| Ⅰb | 40 | Embodiment 1 | |||
| Ⅱ | 40 | Self-control | |||
| Ⅲ | 40 | Self-control | |||
| Alkali soluble resins solution | 500 | 500 | 500 | Embodiment 2 | |
| Dipentaerythritol acrylate | 50 | 50 | 50 | Cytec company | |
| Red pigment L3920 | 60 | 60 | 60 | BASF AG |
Table 3 developing result
| Formula A | Formula B | Formula C | Formula D | |
| Maximumly stay film exponent number | 8 | 9 | 6 | 6 |
Developing result display in table 3, uses the photo sensitivity of the photo-sensitive composition of light trigger I a and I b to be significantly better than using the photo-sensitive composition of light trigger II and light trigger III, improves photocuring rate and the film forming properties of photoresist material.
Embodiment 5 photo-sensitive composition gel conversion rate test experiments
By the weight proportion of fill a prescription in embodiment 4 table 2 A, C, D, all components is made photo-sensitive composition by the preparation method of ink, liquid in mobility.
Above-mentioned liquid photosensitive composition is coated suitable for soda glass surface by application spin coating method, through 80 DEG C of bakings 10 minutes, is vapored away by solvent PMA, and measurement residuum film thickness is 3 microns.
Filter 1000W respectively with 405nm grating filters device, 2000W high voltage mercury lamp light, film and grating distance 10cm, make exposure reach 4000mJ/cm
2, respectively with the belt speed of 11m/min, 6m/min, make composition completion of cure.72h is soaked in acetone after solidification.Gel conversion rate calculation formula is as follows:
Gel conversion rate test result is in table 4, and Fig. 1 is gel conversion rate cylindricality comparison diagram.
Table 4 gel conversion rate gel test result
| 1KW,11m/min | 2KW,11m/min | 2KW,6m/min | |
| Formula A | 92.67 | 94.38 | 96.44 |
| Formula C | 90.36 | 90.71 | 91.90 |
| Formula D | 91.75 | 92.74 | 94.08 |
Can be reached a conclusion by table 4 and Fig. 1: in photoresist material formula, curing efficiency from low to high light trigger order successively: light trigger II < light trigger III < light trigger I a, describes photosensitive composition provided by the present invention and has higher curing efficiency relative to the composition that original employing II, III is light trigger.
Embodiment 6 LED light source solidification photo-sensitive composition and curing efficiency test experiments
By the weight proportion of fill a prescription in embodiment 4 table 2 A, C, D, all components is made photo-sensitive composition by the preparation method of ink, liquid in mobility.
Above-mentioned liquid photosensitive composition is coated suitable for soda glass surface by application spin coating method, through 80 DEG C of bakings 10 minutes, is vapored away by solvent PMA, and measurement residuum film thickness is 3 microns, is then cured according to method below.
Solidification equipment: LEDUV solidification equipment, model: UV-101D (Beijing rock Tian Boyuan Science and Technology Co., Ltd.)
Condition of cure: operating distance: 21mm; Irradiation time: 1s
Light source: UV-LED pointolite, diameter: 10mm; Wavelength: 365nm, maximal illumination: 400mw/cm2;
395nm, maximum irradiation: 500mw/cm2
Curing efficiency characterizing method is: after irradiating 1s with pointolite, whole sheet glass is placed in acetone soln and soaks 5s, and after taking-up, measure cured film pattern diameter, its light sensitivity of the larger explanation of numerical value is high, and curing efficiency is higher, and Fig. 2 is measuring result.As can be seen from the measuring result in Fig. 2, during with LED light source solidification solder mask or photoresist material photo-sensitive composition, photosensitive composition provided by the present invention is light trigger with II, III composition has higher curing efficiency relative to existing.
The photo-sensitive composition LED curing efficiency test experiments that embodiment 7. photoinitiator levels is different
According to the photosensitive composition that to prepare with III of different content and I a be respectively light trigger of method in embodiment 6, and 365nmUV-LED pointolite is cured according to the LED curing described in embodiment 6, and the detection of efficiency is cured by its method, I a of different amounts (weight percent) is photosensitive composition and the consumption 8%(weight percent of light trigger) III be that the photosensitive composition of light trigger contrasts, the results are shown in Figure 3.Can be reached a conclusion by Fig. 3: when reaching identical state of cure in photoresist material formula, the consumption of the present invention I a only needs 2/3 of III consumption, can save the light trigger consumption of 1/3.
Claims (9)
1. solder mask or a photoresist material photo-sensitive composition, it comprises:
(A) contain at least one carboxyl or phenolic hydroxyl group in molecule, the alkali soluble resins that number-average molecular weight is less than 100000, part by weight is 100 parts;
(B) photoinitiator compound of at least one formula I:
Wherein R
1benzyl or allyl group;
R
2straight or branched C
1 C
4alkyl,
R
3and R
4straight or branched C independently of one another
1 C
4alkyl, or form C together
4 C
6alkylidene group, part by weight be 0.1 50 parts;
(C) at least one contains the free-radical curable compound of carbon-carbon double bond, part by weight be 10 300 parts; With
(D) tinting material, part by weight be 1 100 parts.
2. photo-sensitive composition according to claim 1, wherein in the compound of formula I,
R
1benzyl or allyl group;
R
2methyl, ethyl or propyl group;
R
3and R
4methyl independently of one another, ethyl or form pentylidene together.
3. photo-sensitive composition according to claim 1, the compound of its Chinese style I is:
2 Er Jia An Ji 2 Bian Ji 1 (4 piperidines for phenyl) 1 butanone;
2 Pai Ding Ji 2 Xi Bing Ji 1 (4 piperidines for phenyl) 1 butanone.
4. photo-sensitive composition according to claim 1, except component (A), (B), (C), (D), said composition contains at least one and has the compound of epoxide group as heat-curable component (F) and a kind of epoxy curing promoter (G).
5. photo-sensitive composition according to claim 1, wherein also comprises other components (H) as additive, is selected from pigment, mineral filler, dispersion agent, flow agent, defoamer, stablizer.
6. photo-sensitive composition according to claim 1, wherein also comprises volatilizable solvent composition (S).
7. scribble the material of the photo-sensitive composition of claim 1 from the teeth outwards.
8. the method for exposure imaging, is characterized in that the material of claim 7 to cover through image film, with 190 the method of energy wave radiation said composition within the scope of 550nm carry out exposure image, then uncured part photographic developer is removed.
9., with the colour filter that the photo-sensitive composition of claim 1 manufactures, wherein photo-sensitive composition comprises:
(A) contain at least one carboxyl or phenolic hydroxyl group in molecule, the alkali soluble resins that number-average molecular weight is less than 100000, part by weight is 100 parts;
(B) photoinitiator compound of at least one formula I:
Wherein R
1benzyl or allyl group,
R
2straight or branched C
1-C
4alkyl,
R
3and R
4straight or branched C independently of one another
1-C
4alkyl, or form C together
4-C
6alkylidene group, part by weight be 0.1 50 parts;
(C) at least one contains the free-radical curable compound of carbon-carbon double bond, part by weight be 10 200 parts; With
(D) tinting material, part by weight be 1 100 parts.
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| CN105567007B (en) * | 2016-02-22 | 2019-04-05 | 昆山海斯电子有限公司 | Liquid photopolymerizable solder mask and the preparation method and application thereof |
| CN109324479A (en) * | 2017-08-01 | 2019-02-12 | 北京英力科技发展有限公司 | A kind of photoetching compositions |
| CN115197632A (en) * | 2021-09-16 | 2022-10-18 | 广东硕成科技股份有限公司 | Film layer for high-copper-thickness circuit board and application thereof |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5629356A (en) * | 1987-03-26 | 1997-05-13 | Ciba Geigy Corporation | A-aminoacetophenones as photoinitiators |
| CN1971419A (en) * | 2006-11-30 | 2007-05-30 | 华南理工大学 | Liquid photo-imaging alkali developable electronic solder-proof ink and its preparing method |
| CN102020728A (en) * | 2010-11-29 | 2011-04-20 | 长沙新宇高分子科技有限公司 | Composite multi-functional-group photoinitiator |
-
2012
- 2012-05-07 CN CN201210138936.1A patent/CN103387765B/en active Active
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5629356A (en) * | 1987-03-26 | 1997-05-13 | Ciba Geigy Corporation | A-aminoacetophenones as photoinitiators |
| CN1971419A (en) * | 2006-11-30 | 2007-05-30 | 华南理工大学 | Liquid photo-imaging alkali developable electronic solder-proof ink and its preparing method |
| CN102020728A (en) * | 2010-11-29 | 2011-04-20 | 长沙新宇高分子科技有限公司 | Composite multi-functional-group photoinitiator |
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