CN103383480A - Optical fiber coupling connector and manufacturing method thereof - Google Patents

Optical fiber coupling connector and manufacturing method thereof Download PDF

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Publication number
CN103383480A
CN103383480A CN2012101356673A CN201210135667A CN103383480A CN 103383480 A CN103383480 A CN 103383480A CN 2012101356673 A CN2012101356673 A CN 2012101356673A CN 201210135667 A CN201210135667 A CN 201210135667A CN 103383480 A CN103383480 A CN 103383480A
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CN
China
Prior art keywords
circuit board
ceramic substrate
light
fiber coupling
coupling connector
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Granted
Application number
CN2012101356673A
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Chinese (zh)
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CN103383480B (en
Inventor
吴开文
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hongfujin Precision Industry Shenzhen Co Ltd
Hon Hai Precision Industry Co Ltd
Original Assignee
Hongfujin Precision Industry Shenzhen Co Ltd
Hon Hai Precision Industry Co Ltd
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Publication date
Application filed by Hongfujin Precision Industry Shenzhen Co Ltd, Hon Hai Precision Industry Co Ltd filed Critical Hongfujin Precision Industry Shenzhen Co Ltd
Priority to CN201210135667.3A priority Critical patent/CN103383480B/en
Publication of CN103383480A publication Critical patent/CN103383480A/en
Application granted granted Critical
Publication of CN103383480B publication Critical patent/CN103383480B/en
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

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Abstract

The invention discloses an optical fiber coupling connector. The optical fiber coupling connector comprises a photoelectric unit composed of a light-emitting face and a light-receiving face, a planar optical waveguide, a ceramic substrate and a circuit board. The ceramic substrate is provided with a first surface and a second surface, wherein the first surface and the second surface are arranged oppositely; the circuit board is provided with a third surface and a fourth surface, wherein the third surface and the fourth surface are arranged oppositely; the photoelectric unit is electrically arranged on the second surface of the ceramic substrate by means of COB processing, the light-emitting face and the light-receiving face are arranged towards the third surface of the circuit board; the planar optical waveguide is located on the third surface of the circuit board; a reflector unit is arranged between the ceramic substrate and the circuit board; light emitted by the light-emitting face of the photoelectric unit is reflected by the reflector unit and coupled and enters the planar optical waveguide; the light emitted by the planar optical waveguide is reflected by the reflector unit and is received by the light-receiving face of the photoelectric unit. The invention further provides a method for manufacturing the optical fiber coupling connector.

Description

Optical-fiber coupling connector and manufacture method thereof
Technical field
The present invention relates to a kind of optical-fiber coupling connector and manufacture method thereof.
Background technology
Along with the development of high in the clouds technology, the following high speed transmission system that can need more and more higher frequency range.At present the IBM mode of being devoted to the development utilization planar optical waveguide replaces traditional copper cash framework, utilizes the light transmission to interrogate at a high speed, replaces passingly to pass high speed signal by fax.
The planar optical waveguide framework that proposes at present is that laser diode or light emitting diode, photoelectric detector and respective drive is circuit integrated at a LTCC(low temperature co-fired ceramic, low-temperature co-fired ceramic substrate) on, need on LTCC, through hole be set so that the optical window of laser diode or light emitting diode and photoelectric detector is aimed at LTCC, light is changed into the light of vertical direction by a reflector element light of horizontal direction after passing LTCC, then is coupled into planar optical waveguide to grow Distance Transmission.
Due to laser diode or light emitting diode, photoelectric detector and respective drive circuit volume smaller, therefore the precision requirement of through hole is very high, will be very little except the aperture, also need simultaneously very high precision, thereby make the cost of optical-fiber coupling connector higher.
Summary of the invention
In view of this, be necessary to provide optical-fiber coupling connector and the manufacture method thereof that a kind of cost is lower, yield is higher.
a kind of optical-fiber coupling connector, comprise photovoltaic element, planar optical waveguide, ceramic substrate substrate and circuit board, described photovoltaic element has light-emitting area and sensitive surface, described ceramic substrate has relative first surface and second surface, described circuit board has the 3rd relative surface and the 4th surface, described photovoltaic element electrically be arranged on the second surface of described ceramic substrate by the COB processing procedure and described light-emitting area and sensitive surface towards the 3rd surface of described circuit board, described planar optical waveguide is positioned on the 3rd surface of described circuit board, be provided with reflector element between described ceramic substrate and described circuit board, the light that the light-emitting area of described photovoltaic element is sent is coupled into described planar optical waveguide after described reflector element reflection, the light of described planar optical waveguide outgoing is received by the sensitive surface of described photovoltaic element after described reflector element reflection.
A kind of manufacture method of optical-fiber coupling connector, described optical-fiber coupling connector comprises photovoltaic element, ceramic substrate and circuit board, have planar optical waveguide on described circuit board, the manufacture method of described optical-fiber coupling connector comprises the steps: to adopt the COB processing procedure to be arranged on the surface of described ceramic substrate described photovoltaic element; On described ceramic substrate, ball grid array is set; Overturn described ceramic substrate so that the planar optical waveguide of described photovoltaic element on described circuit board; Connect described ceramic substrate and circuit board by ball grid array.
Compared to prior art, the photovoltaic element of the optical-fiber coupling connector of the present embodiment adopts the COB processing procedure to be arranged on substrate and light-emitting area and sensitive surface all towards circuit board, do not need to arrange the higher through hole of precision on substrate thereby make, can realize the optically-coupled between photovoltaic element and planar optical waveguide, therefore, the cost of optical-fiber coupling connector is lower, is arranged on substrate because photovoltaic element adopts the COB processing procedure again, thereby makes the yield of optical-fiber coupling connector higher.
Description of drawings
Fig. 1 is the schematic diagram of embodiment of the present invention optical-fiber coupling connector.
The main element symbol description
Optical-fiber coupling connector 100
Ceramic substrate 10
First surface 11
Second surface 12
Photovoltaic element 13
Light emitting diode 130
Chip 131
Circuit board 20
The 3rd surface 21
The 4th surface 22
Planar optical waveguide 30
Reflector element 40
Lens 50
Ball grid array 60
Following embodiment further illustrates the present invention in connection with above-mentioned accompanying drawing.
Embodiment
See also Fig. 1, the optical-fiber coupling connector 100 that the embodiment of the present invention provides comprises ceramic substrate 10, circuit board 20, planar optical waveguide 30, reflector element 40 and lens 50.
Ceramic substrate 10 can be low-temperature co-fired ceramic substrate (low temperature co-fired ceramic), and it has relative first surface 11 and second surface 12, electrically is provided with photovoltaic element 13 on second surface 12.Photovoltaic element 13 comprises light emitting diode 130, chip 131 and photodiode (not shown), light emitting diode 130, chip 131 and photodiode all adopt the COB processing procedure to be arranged on ceramic substrate 10 and the sensitive surface of the light-emitting area of light emitting diode 130 and photodiode all towards circuit board 20.
Chip 131 is used for driving the electric signal that light emitting diode 130 is luminous and process photodiode output.Certainly, in other embodiments, also chip 131 can be divided into independently two, drive respectively the electric signal that light emitting diode 130 is luminous and process photodiode output.
Circuit board 20 is electrical connected by ball grid array (Ball Grid Array, BGA) 60 and ceramic substrate 10, and circuit board 20 can be printed circuit board (PCB) or flexible circuit board.Circuit board 20 has the 3rd relative 22, the three surfaces 21, the 21 and the 4th surface, surface towards the second surface 12 of ceramic substrate 10, and in other words, the 3rd surface 21 is towards the light-emitting area of light emitting diode 130 and the sensitive surface of photodiode.
Planar optical waveguide 30 is arranged on the 3rd surface 21 of circuit board 20 and is used for being coupled to realize Propagation of light rays with photovoltaic element 13.
Lens 50 and reflector element 40 are arranged between ceramic substrate 10 and circuit board 20, and reflector element 40 is positioned on the 3rd surface 21 of circuit board 20, and lens 50 are arranged on reflector element 40.
In optical-fiber coupling connector 100 transmitting optical signal processes, the light emitting diode 130 that chip 131 drives photovoltaic element 13 sends the light of basic vertical ceramic substrate 10, light incides on lens 50, become the light of substantially parallel circuit board 20 from the light of lens 50 outgoing after reflector element 40 reflections, the light of substantially parallel circuit board 20 enters planar optical waveguide 30 transmission.In like manner, incide on lens 50 after reflector element 40 reflections from the light signal of planar optical waveguide 30 outgoing, received and be converted to electric signal from the light of lens outgoing by photodiode, chip 131 is processed the signal that electric signal is transmitted to obtain optical-fiber coupling connector 100.
In manufacture process, adopt the COB processing procedure to be arranged on the second surface 12 of ceramic substrate 10 photovoltaic element 13, then ball grid array 60 is set on ceramic substrate 10, upset ceramic substrate 10 is so that the planar optical waveguide 30 of photovoltaic element 13 on circuit board 20 connects ceramic substrate 10 and circuit board 20 by ball grid array 60.
The light-emitting area of the photovoltaic element 13 of optical-fiber coupling connector 100 and sensitive surface are all towards circuit board 20, the higher through hole of precision need to be set on ceramic substrate 10, can make photovoltaic element 13 and planar optical waveguide 30 realize optically-coupled, thereby make the cost of optical-fiber coupling connector 100 lower; Be arranged on ceramic substrate 10 because photovoltaic element 13 adopts the COB processing procedure again, thereby make the yield of optical-fiber coupling connector 100 higher.
Be understandable that, those skilled in the art also can do other variation etc. and be used in design of the present invention in spirit of the present invention, as long as it does not depart from technique effect of the present invention and all can.The variation that these are done according to spirit of the present invention is within all should being included in the present invention's scope required for protection.

Claims (7)

1. optical-fiber coupling connector, comprise photovoltaic element, planar optical waveguide, ceramic substrate and circuit board, described photovoltaic element has light-emitting area and sensitive surface, described ceramic substrate has relative first surface and second surface, described circuit board has the 3rd relative surface and the 4th surface, described photovoltaic element electrically be arranged on the second surface of described ceramic substrate by the COB processing procedure and described light-emitting area and sensitive surface towards the 3rd surface of described circuit board, described planar optical waveguide is positioned on the 3rd surface of described circuit board, be provided with reflector element between described ceramic substrate and described circuit board, the light that the light-emitting area of described photovoltaic element is sent is coupled into described planar optical waveguide after described reflector element reflection, the light of described planar optical waveguide outgoing is received by the sensitive surface of described photovoltaic element after described reflector element reflection.
2. optical-fiber coupling connector as claimed in claim 1, is characterized in that, described ceramic substrate is low-temperature co-fired ceramic substrate.
3. optical-fiber coupling connector as claimed in claim 1, is characterized in that, described ceramic substrate is electrical connected by ball grid array and described circuit board.
4. optical-fiber coupling connector as claimed in claim 1, is characterized in that, has lens to converge light between described ceramic substrate and described reflector element.
5. as the described optical-fiber coupling connector of claim 1-4 any one, it is characterized in that, described circuit board is printed circuit board (PCB) or flexible PCB.
6. optical-fiber coupling connector as claimed in claim 5, is characterized in that, described photovoltaic element comprises light emitting diode and photodiode.
7. the manufacture method of an optical-fiber coupling connector, described optical-fiber coupling connector comprises photovoltaic element, ceramic substrate and circuit board, has planar optical waveguide on described circuit board, the manufacture method of described optical-fiber coupling connector comprises the steps:
Adopt the COB processing procedure to be arranged on the surface of described ceramic substrate described photovoltaic element;
On described ceramic substrate, ball grid array is set;
Overturn described ceramic substrate so that the planar optical waveguide of described photovoltaic element on described circuit board;
Connect described ceramic substrate and circuit board by ball grid array.
CN201210135667.3A 2012-05-04 2012-05-04 Optical-fiber coupling connector and manufacture method thereof Expired - Fee Related CN103383480B (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN201210135667.3A CN103383480B (en) 2012-05-04 2012-05-04 Optical-fiber coupling connector and manufacture method thereof

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN201210135667.3A CN103383480B (en) 2012-05-04 2012-05-04 Optical-fiber coupling connector and manufacture method thereof

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CN103383480A true CN103383480A (en) 2013-11-06
CN103383480B CN103383480B (en) 2016-09-14

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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN105629400A (en) * 2014-10-28 2016-06-01 富士康(昆山)电脑接插件有限公司 Photoelectric conversion device

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20020196997A1 (en) * 2001-06-26 2002-12-26 Chakravorty Kishore K. Packaging and assembly method for optical coupling
US20030002770A1 (en) * 2001-06-26 2003-01-02 Chakravorty Kishore K. Flip-chip package integrating optical and electrical devices and coupling to a waveguide on a board
CN1629671A (en) * 2003-12-17 2005-06-22 国际商业机器公司 Silicon carrier for optical interconnect modules
JP2011180276A (en) * 2010-02-26 2011-09-15 Kyocera Corp Optical transmission substrate and optical module

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20020196997A1 (en) * 2001-06-26 2002-12-26 Chakravorty Kishore K. Packaging and assembly method for optical coupling
US20030002770A1 (en) * 2001-06-26 2003-01-02 Chakravorty Kishore K. Flip-chip package integrating optical and electrical devices and coupling to a waveguide on a board
CN1629671A (en) * 2003-12-17 2005-06-22 国际商业机器公司 Silicon carrier for optical interconnect modules
JP2011180276A (en) * 2010-02-26 2011-09-15 Kyocera Corp Optical transmission substrate and optical module

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN105629400A (en) * 2014-10-28 2016-06-01 富士康(昆山)电脑接插件有限公司 Photoelectric conversion device

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