CN103382345A - Preparation method of high temperature resistant epoxy insulating coating - Google Patents

Preparation method of high temperature resistant epoxy insulating coating Download PDF

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CN103382345A
CN103382345A CN2013101577810A CN201310157781A CN103382345A CN 103382345 A CN103382345 A CN 103382345A CN 2013101577810 A CN2013101577810 A CN 2013101577810A CN 201310157781 A CN201310157781 A CN 201310157781A CN 103382345 A CN103382345 A CN 103382345A
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resin
epoxy
temperature resistant
epoxy resin
powder
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XINZHOU TECHNOLOGY Co Ltd
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XINZHOU TECHNOLOGY Co Ltd
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Abstract

The invention relates to a monocomponent high temperature resistant epoxy insulating coating and its preparation method. The monocomponent high temperature resistant epoxy insulating coating comprises the following components: by weight, 10-15% of various epoxy resins, 30-40% of epoxy modified phenolic resin, 5-10% of amino resin, 20-25% of an inorganic filler and 25-30% of a solvent. The prepared coating has good self-leveling performance, filler dispersibility and storage stability, can be solidified at 150 DEG C to form a film, requires a simple preparation method, and is convenient to construct. The solidified film of the coating has high adhesion, high heat resistance (heat distortion temperature is 250-320 DEG C) and good insulating properties (average thickness is 0.05mm and insulation breakdown is 1.2-1.5kV), and also has excellent mechanical properties.

Description

A kind of preparation method of fire resistant epoxy insulation compound
Technical field
The present invention relates to a kind of preparation method of high-temperature resistant one-component epoxy insulation coating, particularly can solidify in the short period at lower temperature, and the coating preparation technology of filming and having good high temperature insulation characteristic.
  
Background technology
Epoxy resin, resol and aminoresin are all until present widely used resin in the electrically insulating material production field, and the characteristics of oneself are respectively arranged on aspect insulating property.
Epoxy resin has that sticking power is high, and hardness is high, the characteristics that acid-fast alkali-proof is good, and high temperature insulation reaches the F level, but weathering resistance and snappiness are also poor, therefore use separately to be restricted aspect insulating material.
Resol has thermotolerance, water tolerance, chemical proofing, electrical insulating property and mechanical property preferably, therefore occupy critical role in electrical insulation part and electrical insulating coating production field, but the temperature that is heating and curing is higher, and set time is longer, and high temperature insulation characteristic is also not very very good.
Aminoresin comprises by urea or trimeric cyanamide and formaldehyde reaction and the resin and the resin derivative that obtain, and these resins all tint permanence are good, and hardness is high, arc resistance is good especially, but harder and crisp, sticking power is relatively poor, and thermotolerance is also not very better than epoxy resin and resol.
Epoxy resin and epoxy modified phenolic resin have epoxy group(ing), aromatic ring and aliphatics ring in molecule, so the consistency of these two kinds of resins is very good, can be with polyamine or anhydride reaction and solidify.
Aminoresin has in molecule-NH-and a small amount of-NH 2Therefore chain can be used as the solidifying agent of epoxy resin and epoxy modified phenolic resin.
Described three kinds of mixed with resin are got up, and can obtain except every kind of more original advantages of resin, also have the insulating material of unique electric and mechanical property.
Introduce some mineral fillers in above-mentioned resin compound, for example, silicon dioxide powder, silica powder, glass powder, ceramics powder, mica powder etc. can improve the high-temperature insulation of coating, also improve the mechanical property of coating.
Summary of the invention
The technical problem of solution required for the present invention is to provide a kind of preparation method of heat-proof epoxy insulation compound.The method coating preparation process is very simple, and easy construction does not need hot setting, in 150 ℃ of lower short periods, the energy film-forming, can economize the energy, reduces production costs, improve economy, and do not use the larger low molecule organic amine curing agent of toxicity, be conducive to environmental protection.
Fire resistant epoxy insulation compound provided by the invention is by after epoxy resin, epoxy modified phenolic resin, aminoresin and solvent process mixed dissolution, adds mineral filler fully to disperse in this resin solution, then wins through filtering.Its desired raw material and weight percent proportioning are:
Epoxy resin 10.0-15.0
Epoxy modified phenolic resin 30.0-40.0
Aminoresin 5.0-10.0
Mineral filler 20.0-25.0
Solvent 25.0-30.0
Wherein above-mentioned epoxy resin is bisphenol A epoxide resin, bisphenol-s epoxy resin, bisphenol F epoxy resin, N, one or both in N-diglycidyl para hydroxybenzene amine tetraglycidel ether epoxy resin, Hydrogenated Bisphenol A diglycidyl ether epoxy resin, epoxy equivalent (weight) is 190-200g/eq.
Above-mentioned epoxy modified phenolic resin is one or both in epoxidation lacquer resins, epoxidation line style cresol-novolak resin, epoxidation line style phenolic aldehyde-phenolic aldehyde copolymer resin, and epoxy equivalent (weight) is 175-190g/eq.
Above-mentioned aminoresin is one or both in high etherify melamine formaldehyde resin, trimeric cyanamide-urea formaldehyde copolymer resin, trimeric cyanamide-phenolic aldehyde copolymer resin.
Above-mentioned mineral filler is two or more in silicon dioxide powder, silica powder, glass powder, ceramics powder, mica powder, talcum powder, and particle diameter is the 1250-1500 order.
Above-mentioned solvent is by ethanol, Virahol, propyl carbinol, acetone, methyl ethyl ketone, the alcohol that methyl iso-butyl ketone (MIBK) is selected and the mixed solvent of ketone, and alcohol is 4:1 with the blending ratio of ketone.
fire resistant epoxy insulation compound preparation process provided by the invention is, with epoxy resin, epoxy modified phenolic resin, after aminoresin and solvent add in dispersion tank, open dispersion machine and control rotating speed at 400Rad/min, all resins fully dissolve, treating that resin dissolves fully becomes transparent viscous solution, then improve dispersing speed to 800Rad/min, add mineral filler, after this continue to improve the rotating speed of dispersion machine to 1400Rad/min, fully stir 40min, treat that the coating fineness reaches 60 microns, strong stirring disperses to finish, reduce dispersing speed to 500Rad/min, stirring at low speed 10min, then stop stirring, discharging after filtration.
The test of film performance can be carried out by the following method
Test is coated with feed liquid is sprayed on steel plate through surface grinding, after being coated with the feed liquid Self-leveling, dry 30min under 50 ℃, continue to improve temperature to 150 ℃, be heating and curing after 2h, can be used as test sample, test film performance, heat-drawn wire and breakdown voltage.
Embodiment
[table 1]
Figure DEST_PATH_GDA0000364382290000031
Implementation column 1
proportioning according to above-mentioned table 1, with bisphenol A epoxide resin 20.0g, epoxidation lacquer resins 70.0g, high etherify melamine formaldehyde resin 16.0g and solvent (ethanol: after methyl ethyl ketone=4:1) 51.0g adds in dispersion tank, open dispersion machine and control rotating speed at 400Rad/min, all resins fully dissolve, treating that resin dissolves fully becomes transparent viscous solution, then improve dispersing speed to 800Rad/min, add anti-settling agent 3.0g, talcum powder 10.0g and mica powder 30.0g, after this continue to improve the rotating speed of dispersion machine to 1400Rad/min, fully stir 40min, treat that the coating fineness reaches 60 microns, strong stirring disperses to finish, reduce dispersing speed to 500Rad/min, stirring at low speed 10min, then stop stirring, discharging after filtration.
Implementation column 2
proportioning according to above-mentioned table 1, with bisphenol-s epoxy resin 20.0g, epoxidation lacquer resins 60.0g, high etherify melamine formaldehyde resin 10.0g and solvent (propyl carbinol: after acetone=4:1) 60.0g adds in dispersion tank, open dispersion machine and control rotating speed at 400Rad/min, all resins fully dissolve, treating that resin dissolves fully becomes transparent viscous solution, then improve dispersing speed to 800Rad/min, add anti-settling agent 4.0g, talcum powder 20.0g and mica powder 26.0g, after this continue to improve the rotating speed of dispersion machine to 1400Rad/min, fully stir 40min, treat that the coating fineness reaches 60 microns, strong stirring disperses to finish, reduce dispersing speed to 500Rad/min, stirring at low speed 10min, then stop stirring, discharging after filtration.
Implementation column 3
proportioning according to above-mentioned table 1, with Hydrogenated Bisphenol A diglycidyl ether epoxy resin 20.0g, epoxidation lacquer resins 80.0g, high etherify melamine formaldehyde resin 10.0g and solvent (ethanol: after methyl ethyl ketone=4:1) 50.0g adds in dispersion tank, open dispersion machine and control rotating speed at 400Rad/min, all resins fully dissolve, treating that resin dissolves fully becomes transparent viscous solution, then improve dispersing speed to 800Rad/min, add anti-settling agent 2.0g, talcum powder 10.0g and mica powder 28.0g, after this continue to improve the rotating speed of dispersion machine to 1400Rad/min, fully stir 40min, treat that the coating fineness reaches 60 microns, strong stirring disperses to finish, reduce dispersing speed to 500Rad/min, stirring at low speed 10min, then stop stirring, discharging after filtration.
Implementation column 4
proportioning according to above-mentioned table 1, with N, N-diglycidyl para hydroxybenzene amine tetraglycidel ether epoxy resin 20.0g, epoxidation lacquer resins 70.0g, high etherify melamine formaldehyde resin 10.0g and solvent (Virahol: after acetone=4:1) 51.0g adds in dispersion tank, open dispersion machine and control rotating speed at 400Rad/min, all resins fully dissolve, treating that resin dissolves fully becomes transparent viscous solution, then improve dispersing speed to 800Rad/min, add anti-settling agent 3.0g, talcum powder 12.0g and mica powder 34.0g, after this continue to improve the rotating speed of dispersion machine to 1400Rad/min, fully stir 40min, treat that the coating fineness reaches 60 microns, strong stirring disperses to finish, reduce dispersing speed to 500Rad/min, stirring at low speed 10min, then stop stirring, discharging after filtration.
Implementation column 5
proportioning according to above-mentioned table 1, with bisphenol F epoxy resin 30.0g, epoxidation lacquer resins 60.0g, high etherify melamine formaldehyde resin 16.0g and solvent (Virahol: after methyl ethyl ketone=4:1) 50.0g adds in dispersion tank, open dispersion machine and control rotating speed at 400Rad/min, all resins fully dissolve, treating that resin dissolves fully becomes transparent viscous solution, then improve dispersing speed to 800Rad/min, add anti-settling agent 2.0g, talcum powder 10.0g, ceramics powder 6.0g and mica powder 26.0g, after this continue to improve the rotating speed of dispersion machine to 1400Rad/min, fully stir 40min, treat that the coating fineness reaches 60 microns, strong stirring disperses to finish, reduce dispersing speed to 500Rad/min, stirring at low speed 10min, then stop stirring, discharging after filtration.
Implementation column 6
proportioning according to above-mentioned table 1, with bisphenol A epoxide resin 20.0g, N, N-diglycidyl para hydroxybenzene amine tetraglycidel ether epoxy resin 10.0g, epoxidation lacquer resins 60.0g, high etherify melamine formaldehyde resin 18.0g and solvent (Virahol: after acetone=4:1) 50.0g adds in dispersion tank, open dispersion machine and control rotating speed at 400Rad/min, all resins fully dissolve, treating that resin dissolves fully becomes transparent viscous solution, then improve dispersing speed to 800Rad/min, add anti-settling agent 2.0g, talcum powder 10.0g and mica powder 30.0g, after this continue to improve the rotating speed of dispersion machine to 1400Rad/min, fully stir 40min, treat that the coating fineness reaches 60 microns, strong stirring disperses to finish, reduce dispersing speed to 500Rad/min, stirring at low speed 10min, then stop stirring, discharging after filtration.
Implementation column 7
proportioning according to above-mentioned table 1, with bisphenol-s epoxy resin 24.0g, Hydrogenated Bisphenol A diglycidyl ether epoxy resin 6.0g, epoxidation lacquer resins 60.0g, high etherify melamine formaldehyde resin 12.0g and solvent (propyl carbinol: after methyl ethyl ketone=4:1) 50.0g adds in dispersion tank, open dispersion machine and control rotating speed at 400Rad/min, all resins fully dissolve, treating that resin dissolves fully becomes transparent viscous solution, then improve dispersing speed to 800Rad/min, add anti-settling agent 2.0g, talcum powder 10.0g and mica powder 36.0g, after this continue to improve the rotating speed of dispersion machine to 1400Rad/min, fully stir 40min, treat that the coating fineness reaches 60 microns, strong stirring disperses to finish, reduce dispersing speed to 500Rad/min, stirring at low speed 10min, then stop stirring, discharging after filtration.
Implementation column 8
proportioning according to above-mentioned table 1, with bisphenol A epoxide resin 20.0g, epoxidation lacquer resins 60.0g, high etherify melamine formaldehyde resin 10.0g, trimeric cyanamide-phenolic aldehyde copolymer resin 4.0g and solvent (propyl carbinol: after methyl iso-butyl ketone (MIBK)=4:1) 60.0g adds in dispersion tank, open dispersion machine and control rotating speed at 400Rad/min, all resins fully dissolve, treating that resin dissolves fully becomes transparent viscous solution, then improve dispersing speed to 800Rad/min, add anti-settling agent 4.0g, talcum powder 10.0g and mica powder 32.0g, after this continue to improve the rotating speed of dispersion machine to 1400Rad/min, fully stir 40min, treat that the coating fineness reaches 60 microns, strong stirring disperses to finish, reduce dispersing speed to 500Rad/min, stirring at low speed 10min, then stop stirring, discharging after filtration.
Implementation column 9
proportioning according to above-mentioned table 1, with bisphenol A epoxide resin 20.0g, epoxidation lacquer resins 60.0g, trimeric cyanamide-phenolic aldehyde copolymer resin 20.0g and solvent (ethanol: after methyl ethyl ketone=4:1) 51.0g adds in dispersion tank, open dispersion machine and control rotating speed at 400Rad/min, all resins fully dissolve, treating that resin dissolves fully becomes transparent viscous solution, then improve dispersing speed to 800Rad/min, add anti-settling agent 3.0g, talcum powder 10.0g and mica powder 36.0g, after this continue to improve the rotating speed of dispersion machine to 1400Rad/min, fully stir 40min, treat that the coating fineness reaches 60 microns, strong stirring disperses to finish, reduce dispersing speed to 500Rad/min, stirring at low speed 10min, then stop stirring, discharging after filtration.
Implementation column 10
proportioning according to above-mentioned table 1, with bisphenol-s epoxy resin 20.0g, epoxidation line style cresol-novolak resin 70.0g, high etherify melamine formaldehyde resin 18.0g and solvent (Virahol: after acetone=4:1) 50.0g adds in dispersion tank, open dispersion machine and control rotating speed at 400Rad/min, all resins fully dissolve, treating that resin dissolves fully becomes transparent viscous solution, then improve dispersing speed to 800Rad/min, add anti-settling agent 2.0g, talcum powder 6.0g, ceramics powder 10g and mica powder 24.0g, after this continue to improve the rotating speed of dispersion machine to 1400Rad/min, fully stir 40min, treat that the coating fineness reaches 60 microns, strong stirring disperses to finish, reduce dispersing speed to 500Rad/min, stirring at low speed 10min, then stop stirring, through filtering discharging.
The film performance evaluation result of implementation column 1-10 shows at table 2.
[table 2]
as described in Table 2, test-results explanation bisphenol-s epoxy resin and N, N-diglycidyl para hydroxybenzene amine tetraglycidel ether epoxy resin can improve the thermotolerance of filming, and these two kinds of words that mixed with resin is got up, the thermotolerance of filming is higher, but fragility increases simultaneously, Hydrogenated Bisphenol A diglycidyl ether epoxy resin and bisphenol F epoxy resin can prevent effectively that the fragility of filming from increasing, in coating, the interpolation of epoxidation line style cresol-novolak resin more is conducive to improve snappiness and the high temperature insulation characteristic of filming than epoxidation lacquer resins, and high etherify melamine formaldehyde resin or trimeric cyanamide-phenolic aldehyde copolymer resin are conducive to improve snappiness and the arc resistance of filming.Test-results also illustrates introduces some anticorrosion mineral dyes in vanish system, especially ceramics powder and mica powder or its mixture, can improve the high-temperature insulation performance that epoxy resin is filmed.
  

Claims (7)

1. a high-temperature resistant one-component epoxy insulation coating, is characterized in that consisting of epoxy resin, epoxy modified phenolic resin, aminoresin, mineral filler and solvent.
2. the preparation method of a high-temperature resistant one-component epoxy insulation coating, is characterized in that specific as follows
According to the weight percent proportioning, add epoxy resin 10-15%, epoxy phenolics 30-40%, aminoresin 5-10% and solvent 25-30% in dispersion cup, then open dispersion machine and control rotating speed at 400Rad/min, all resins are fully dissolved.
Until resin dissolve fully become transparent viscous solution after, improve dispersing speed to 800Rad/min, add mineral filler, the rotating speed that then continues to improve dispersion machine fully stirs 40min to 1400Rad/min.
After strong stirring disperses to finish, reduce dispersing speed to 500Rad/min, stirring at low speed 10min.
Then stop stirring, through filtering discharging.
3. high-temperature resistant one-component epoxy insulation coating according to claim 1, it is characterized in that described epoxy resin comprises bisphenol A epoxide resin, bisphenol-s epoxy resin, bisphenol F epoxy resin, N, one or both in N-diglycidyl para hydroxybenzene amine tetraglycidel ether epoxy resin, Hydrogenated Bisphenol A diglycidyl ether epoxy resin, epoxy equivalent (weight) is 190-200g/eq.The general structure formula of described epoxy resin is as follows
Figure DEST_PATH_FDA00003543527100011
In formula, R is aromatic ring or aliphatics ring, and X is C, N, S, and Y is H, CH 3, O.
4. high-temperature resistant one-component epoxy insulation coating according to claim 1, is characterized in that the structure of described epoxy modified phenolic resin is as follows
Figure DEST_PATH_FDA00003543527100012
In formula, R ' is H or CH 3
The epoxy equivalent (weight) of described epoxy modified phenolic resin is 175-190g/eq.
5. single component high-temp epoxy insulation compound according to claim 1, is characterized in that described aminoresin comprises one or both in high etherify melamine formaldehyde resin, urea melamine formaldehyde resin, melamine resin.
6. high-temperature resistant one-component epoxy insulation coating according to claim 1 is characterized in that described mineral filler comprises two or more in silicon dioxide powder, silica powder, glass powder, ceramics powder, mica powder, talcum powder.
7. high-temperature resistant one-component epoxy insulation preparation method for coating according to claim 2, it is characterized in that described solvent comprises the mixed solvent of fatty alcohol and aliphatic ketone, for example, ethanol, Virahol, propyl carbinol, acetone, methyl ethyl ketone, methyl iso-butyl ketone (MIBK) etc.
CN2013101577810A 2013-05-02 2013-05-02 Preparation method of high temperature resistant epoxy insulating coating Pending CN103382345A (en)

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Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN105255328A (en) * 2015-10-27 2016-01-20 国网山东省电力公司临沂供电公司 Bi-component waterborne epoxy anticorrosive paint for steel structure
CN106810992A (en) * 2017-02-15 2017-06-09 盘锦群益管道防腐有限公司 High-temperature resistant one-component coating
CN112126318A (en) * 2020-09-29 2020-12-25 肇庆亿图化工有限公司 Novel bisphenol A-free in-tank anticorrosive paint for metal packaging container
CN112321799A (en) * 2020-11-04 2021-02-05 黄山新佳精细材料有限公司 Epoxy resin for high-hardness and low-temperature curing type powder coating and preparation method thereof
WO2021036316A1 (en) * 2019-08-23 2021-03-04 常州市碳索新材料科技有限公司 High-voltage insulation flame-retardant powder coating and preparation method therefor

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1052877A (en) * 1991-02-04 1991-07-10 中国科学院西安光学精密机械研究所 High-temperature-resistant composite insulating coating
CN101328377A (en) * 2007-06-20 2008-12-24 铜联商务咨询(上海)有限公司 Copper heat interchanger anti-corrosive paint for gas fittings and processing method thereof

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1052877A (en) * 1991-02-04 1991-07-10 中国科学院西安光学精密机械研究所 High-temperature-resistant composite insulating coating
CN101328377A (en) * 2007-06-20 2008-12-24 铜联商务咨询(上海)有限公司 Copper heat interchanger anti-corrosive paint for gas fittings and processing method thereof

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
赵小玲等: "酚醛树脂的高性能化改性研究新进展", 《塑料科技》 *

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN105255328A (en) * 2015-10-27 2016-01-20 国网山东省电力公司临沂供电公司 Bi-component waterborne epoxy anticorrosive paint for steel structure
CN106810992A (en) * 2017-02-15 2017-06-09 盘锦群益管道防腐有限公司 High-temperature resistant one-component coating
WO2021036316A1 (en) * 2019-08-23 2021-03-04 常州市碳索新材料科技有限公司 High-voltage insulation flame-retardant powder coating and preparation method therefor
CN112126318A (en) * 2020-09-29 2020-12-25 肇庆亿图化工有限公司 Novel bisphenol A-free in-tank anticorrosive paint for metal packaging container
CN112321799A (en) * 2020-11-04 2021-02-05 黄山新佳精细材料有限公司 Epoxy resin for high-hardness and low-temperature curing type powder coating and preparation method thereof

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