CN103367690A - Temperature fuse and manufacturing method thereof - Google Patents
Temperature fuse and manufacturing method thereof Download PDFInfo
- Publication number
- CN103367690A CN103367690A CN2013101123305A CN201310112330A CN103367690A CN 103367690 A CN103367690 A CN 103367690A CN 2013101123305 A CN2013101123305 A CN 2013101123305A CN 201310112330 A CN201310112330 A CN 201310112330A CN 103367690 A CN103367690 A CN 103367690A
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- China
- Prior art keywords
- encapsulation
- thermal cutoffs
- basement membrane
- cover film
- fusable links
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
- Y02E60/00—Enabling technologies; Technologies with a potential or indirect contribution to GHG emissions mitigation
- Y02E60/10—Energy storage using batteries
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- Lining Or Joining Of Plastics Or The Like (AREA)
- Sealing Battery Cases Or Jackets (AREA)
Abstract
The objective of the present invention is to provide a temperature fuse that can be miniaturized through improving airtightness of the temperature fuse. The temperature fuse comprises a base film (12), a pair of belt-shaped terminal parts (13) which are configured to be disposed on the base film (12) in a manner that the terminal parts are disposed at a top end portion of each other and opposite to each other, a fusible body (14) which is jointed in a bridge manner between the pair of terminal parts (13), a fluxing agent (17) which is coated on the fusible body (14), and a covering thin film (15) which covers the fusible body (14) that is coated with the fluxing agent (17). A package part (16) which at least extends upward in the length direction of the temperature fuse (11) is cut off between an inner rim end (18) and an outer rim end of the package part (16), and further, the base film (12) on the cut-off surface and the covering thin film (15) are welded again.
Description
Technical field
The present invention relates to for prevent because of excess Temperature cause Thermal Cutoffs that machine breakdown uses with and manufacture method.
Background technology
In recent years, along with the development of cell phone, use more and more lithium ion battery as secondary cell.But owing to follow the heating of the deep discharge such as short circuit, battery damages or the danger of blast etc. uprises to some extent.Therefore, the serviceability temperature fuse in order to ensure the fail safe of secondary cell, but more and more higher for the demand of the miniaturization of Thermal Cutoffs and slimming.
For above-mentioned existing Thermal Cutoffs, describe with reference to the interior sight vertical view of existing Thermal Cutoffs shown in Figure 5 and the sectional view that forms with A-A line cut-away view 5 shown in Figure 6.
As shown in Figure 5 and Figure 6, in existing Thermal Cutoffs, at the basement membrane 1 that is consisted of by thermoplastic resin the pair of terminal section 2 that is made of metal plate is installed, between this portion of terminal 2, engaged fusable links 3 in the bridge joint mode, to cover the surface of fusable links 3 with flux 4 in the mode of the surface of fusable links 3 coating flux 4, make cover film 5 and basement membrane 1 overlapping in the mode that has applied the fusable links 3 of flux 4 with cover film 5 and basement membrane 1 parcel, form encapsulation 6 by cover film 5 and basement membrane 1 are carried out ultrasonic wave coating, obtain thus Thermal Cutoffs.
In Fig. 5, dot the state through the inside of cover film 5, and represent along the inside of B-B line intercepting with solid line.
Need to prove that as the formerly technical literature information that is associated with the present application, for example known have a patent documentation 1.
Technical literature formerly
Patent documentation
Patent documentation 1: TOHKEMY 2001-6508 communique.
As previously mentioned, this Thermal Cutoffs is used for the secondary cells such as mobile phone, and the bottom surface that makes Thermal Cutoffs is configured along side or the upper surface of the battery case of secondary cell more, for the width dimensions that makes Thermal Cutoffs (with the size on the direction of the length direction phase quadrature of Thermal Cutoffs) with aspect the slimming to some extent the gauge of progressive battery case adapt and it required miniaturization, and then the width dimensions that requires Thermal Cutoffs is less and can be built in the miniaturization of the Thermal Cutoffs in the battery case than the gauge of battery case.
Yet, in above-mentioned existing Thermal Cutoffs, by being carried out ultrasonic wave coating, basement membrane 1 and cover film 5 form encapsulation 6, realize thus encapsulation.Therefore, the coating material of ultrasonic wave coating becomes encapsulation 6, is difficult to the width dimensions of Thermal Cutoffs is diminished.
Its reason is, carry out deposited because ultrasonic wave coating is based on the frictional heat that ultrasonic vibration and applied pressure produce, therefore, coating material needs to obtain the width of sufficient frictional heat, but the width dimensions of coating material brings very large impact to the miniaturization of Thermal Cutoffs.
Therefore, in order to realize the miniaturization of Thermal Cutoffs, proposed to excise with blade behind the ultrasonic wave coating method of encapsulation.
But, excision encapsulation 6, the interface 8 that might expose at section 7 basement membrane 1 and cover film 5, and basement membrane 1 and cover film 5 are carried out deposited area also to diminish, thus, may lower the reliability of adhesiveness and sealing, spill flux 4 or affect the rheological parameters' change with time of flux 4.As a result, cause the deviation of the operating chacteristics of fusable links 3 to become large, affect the function of Thermal Cutoffs.
The objective of the invention is to solve above-mentioned problem, provide a kind of by improving the sealing of Thermal Cutoffs, realize the Thermal Cutoffs of miniaturization.
Summary of the invention
The present invention comprises in order to solve above-mentioned problem: the basement membrane that is made of thermoplastic resin; On basement membrane with a pair of banded portion of terminal of mode arranged opposite that the interval is set in top ends; The fusable links that between pair of terminal section, engages in the mode of bridge joint; Be coated in the flux on the fusable links; And the cover film that is consisted of by thermoplastic resin that has applied that the mode of the fusable links of flux arranges with covering, encapsulate the fusable links that has applied flux by basement membrane and cover film being carried out the encapsulation that ultrasonic wave coating forms, at least be cut off between the interior acies of encapsulation and outer edge in encapsulation that the length direction of Thermal Cutoffs extends, and the basement membrane on its section and cover film carry out welding again.
According to said structure, utilize the part of extending along the length direction of Thermal Cutoffs at least in the encapsulation that ultrasonic wave coating forms between the interior acies of encapsulation and outer edge, to be cut off, and make the basement membrane of its section and cover film again carry out welding, thus, because section carries out welding, even owing to cutting off the width that reduces encapsulation, also can not damage the sealing of basement membrane and cover film, can realize the miniaturization of Thermal Cutoffs.
Description of drawings
Fig. 1 is the interior sight vertical view of the Thermal Cutoffs of expression an embodiment of the present invention.
Fig. 2 is the sectional view of C-C line in Fig. 1.
Fig. 3 is the key diagram of manufacture method of the Thermal Cutoffs of an embodiment of the present invention.
Fig. 4 is the figure that the state after the encapsulation of the another kind of Thermal Cutoffs of an embodiment of the present invention is cut off describes.
Fig. 5 is the interior sight vertical view of existing Thermal Cutoffs.
Fig. 6 is the sectional view of A-A line in Fig. 5.
The referenced drawings symbol
11 Thermal Cutoffs, 12 basement membranes, 13 portion of terminal, 14 fusable links, 15 cover films, 16 encapsulation, 17 fluxs, 18 interior acies 19 outer edges 20 sections 21 are weld portion 22 interfaces 23 recesses again
Embodiment
Fig. 1 is the interior sight vertical view of the Thermal Cutoffs of an embodiment of the present invention.Fig. 2 is the sectional view with C-C line intercepting among Fig. 1.
In Fig. 1, Fig. 2, the thickness that is made of the nickel plate is that a pair of banded portion of terminal 13 of 0.2mm is to be fastened on the thickness that is made of PEN (hereinafter referred to as PEN) on the basement membrane 12 of 0.18mm in the mode that interval and linearity arranged opposite are set between the top ends each other.
And, make bridge joint between the above-mentioned portion of terminal 13, and engage to have by the Sn-In-Bi alloy by laser welding and consist of and fusing-off temperature is 86 ℃-101 ℃ fusable links 14.
To add the thickness that (emboss) be made of PEN be the cover film 15 of 0.12mm to embossment on basement membrane 12, portion of terminal 13 and fusable links 14, this cover film 15 utilizes ultrasonic wave coating in the mode that covers fusable links 14 and deposited at encapsulation 16 and basement membrane 12, and is filled with therein flux 17.
Need to prove, in the interior sight figure of Fig. 1, dot the inside of cover film 15, represent the part of cutting off by the D-D line with solid line.
Between the outer edge of the interior acies 18 of fusable links 14 sides and its opposition side, carry out disjunction in encapsulation 16 that the length direction of Thermal Cutoffs 11 extends and reduce width dimensions, make the again welding and form again weld portion 21 of the basement membrane 12 of the section 20 of minute having no progeny and cover film 15, consist of thus Thermal Cutoffs 11.
At this, package width (the interior acies 18 of encapsulation 16 and the distance between the section 20; W1 among Fig. 2) be 0.35mm, the width of weld portion 21 (W2 among Fig. 2) is 0.1mm again.Like this, be made as below 1/2 of package width by inciting somebody to action the width of weld portion 21 again, preferentially be made as package width below 1/3, the heat in the time of reducing again welding can realize having the Thermal Cutoffs of stabilization function to the infringement of fusable links.
When as existing Thermal Cutoffs, cutting off when basement membrane and cover film carried out the encapsulation of ultrasonic wave coating with blade, the interface of exposing basement membrane and cover film at its section, and because disjunction reduces soldered area, therefore, may damage weld strength and the sealing of encapsulation, because of spilling or the deteriorated deviation that produces the fusable links operating chacteristics of flux of flux, thereby affect the function of Thermal Cutoffs.Therefore, in the structure of existing Thermal Cutoffs, need to guarantee package width more than 0.5mm, can hinder like this miniaturization of Thermal Cutoffs.
With respect to prior art, in Thermal Cutoffs of the present invention, even cut off encapsulation 16, because being carried out welding again, the basement membrane 12 of its section 20 and cover film 15 fill up interface 22, so, can form package width below the 0.4mm, can not damage the reliability of sealing, can realize the miniaturization of Thermal Cutoffs 11.
The following describes the manufacture method of the Thermal Cutoffs of an embodiment of the present invention.
At first, shown in Fig. 3 (a), consisted of by PEN and thickness be on the basement membrane 12 of 0.18mm take the linearity arranged opposite have by the nickel plate consist of and thickness as a pair of banded portion of terminal 13 of 0.2mm, be provided with the interval between the top ends of this a pair of banded portion of terminal 13, make basement membrane 12 and portion of terminal 13 deposited and fastening.
As deposited method, can utilize hot press (HP), perhaps pass through electric current in portion of terminal 13, make portion of terminal 13 heatings, it is deposited to utilize its heat to carry out.
Then, shown in Fig. 3 (b), between portion of terminal 13, in the mode of bridge joint fusable links 14 is installed, while use the part of laser fusion fusable links 14 to come splice terminal section 13 and fusable links 14 by contacting coldplate (not shown among the figure).
Then, shown in Fig. 3 (c), cover film 15 is arranged on the basement membrane 12 shown in Fig. 3 (b), portion of terminal 13 and above the fusable links 14.
Utilize distributor the flux 17 of dissolving to be injected among the recess 23 of embossment processing, flux 17 is soft state when covering fusable links 14, and softening flux 17 applies around fusable links 14.
Secondly, circumfusion ultrasonic horn (not shown among the figure) in the part of being processed by embossment of cover film 15, by being carried out ultrasonic wave coating, basement membrane 12 and cover film 15 form encapsulation 16, and shown in Fig. 3 (d), encapsulation fusable links 14 and flux 17.
At last, shown in Fig. 3 (e), by the encapsulation 16 of having carried out ultrasonic wave coating being cut off and singualtion obtains as shown in Figure 1 and Figure 2 Thermal Cutoffs.
This cut-out is following to be carried out: for the encapsulation 16 of extending along the length direction (transverse direction among Fig. 3 (e)) of Thermal Cutoffs 11, shine CO in the mode of cutting off encapsulation 16 between the interior acies 18 of encapsulation 16 and outer edge 19
2Laser makes laser shine at a distance of the part of 0.35mm along the length direction of the Thermal Cutoffs 11 pair interior acies 18 with encapsulation 16, thereby cuts off encapsulation 16.
At this moment, for again mutually welding after making basement membrane 12 on encapsulation 16 sections and cover film 15 by the dissolving of laser heat, regulate the output of laser and cut off, and form again weld portion 21 at section 20.At this, the width of weld portion 21 is 0.1mm again, and package width (the interior acies of encapsulation and the distance between the section) is 0.35mm.
According to above-mentioned structure, when cutting off encapsulation 16, the basement membrane 12 on the section 20 and cover film 15 by the temporary transient dissolving of laser heat after, with the mode of filling up interface 22 again welding solidify and form again weld portion 21.So, even reduce to cut off encapsulation 16 package width afterwards, also can prevent from damaging adhesion and the sealing of packed part, compare with the situation that blade cuts off like that with existing Thermal Cutoffs, can dwindle package width and cut off, can make Thermal Cutoffs 11 miniaturizations.
Need to prove, when irradiating laser cuts off, cut off while preferentially blow into air.Like this, the phenomenon that the thin-film material that can prevent to gasify adheres to again simultaneously, by cooling off irradiated part, can reduce the fire damage to fusable links 14.
In addition, because fusable links 14 is mild alloys, therefore, if fusable links 14 is applied external stress when cutting off, the distortion of fusable links 14 or the phenomenon of peeling off with the junction surface of portion of terminal 13 may occur then.But utilize like that the laser heat to cut off by the present invention, can when cutting off, carry out stable production without external stress ground.
Need to prove, in the present embodiment, the technology of laser to cutting off along the encapsulation 16 of the length direction of Thermal Cutoffs 11 of utilizing has been described, but also can be as shown in Figure 4, utilize laser to along cutting off with the encapsulation 16 of the direction of the length direction quadrature of Thermal Cutoffs 11, and can obtain the action effect identical with present embodiment.
In addition, in the above-described embodiment, with basement membrane 12 and cover film 15 encapsulation fusable links 14, still, also can in the middle of basement membrane 12 and cover film 15, the intermediate film with same material encapsulate fusable links 14.
And then, in Fig. 3, after using banded basement membrane 12 and cover film 15 to encapsulate, the singualtion by cutting off encapsulation 16, but, be not limited to band shape, for example can use the basement membrane and the cover film that cut into first the regulation shape to encapsulate, the part that has encapsulated with laser cutting more also can obtain Thermal Cutoffs small-sized and that reliability is superior thus.
Industrial applicibility
Thermal Cutoffs of the present invention can obtain more small-sized Thermal Cutoffs improving sealing and do not damage in the situation of reliability, so industrially of great use.
Claims (4)
1. a Thermal Cutoffs comprises;
The basement membrane that is consisted of by thermoplastic resin;
On described basement membrane with a pair of banded portion of terminal of mode arranged opposite that the interval is set in top ends;
The fusable links that between a pair of described portion of terminal, engages in the mode of bridge joint;
Be coated in the flux on the described fusable links; And
The cover film that is consisted of by thermoplastic resin that has applied that the mode of the described fusable links of described flux arranges with covering,
Encapsulate the described fusable links that has applied described flux by described basement membrane and described cover film being carried out the encapsulation that ultrasonic wave coating forms,
Described Thermal Cutoffs is characterised in that,
At least be cut off between the interior acies of described encapsulation and outer edge in described encapsulation that the length direction of described Thermal Cutoffs extends, and the described basement membrane on its section and described cover film carry out welding again.
2. Thermal Cutoffs according to claim 1 is characterized in that:
The width of the part of welding below 1/2 of distance between the interior acies of described encapsulation and described section again.
3. Thermal Cutoffs according to claim 1 is characterized in that:
The interior acies of described encapsulation and the distance between the described section are below 0.4mm.
4. the manufacture method of a Thermal Cutoffs comprises;
On the basement membrane that is consisted of by thermoplastic resin, so that being set in top ends, interval and mutual opposed mode fix the operation of a pair of banded portion of terminal;
Bridge joint engages the operation of fusable links between a pair of described portion of terminal;
Operation at described fusable links coating flux;
On described basement membrane, in the mode that covers described fusable links cover film is carried out ultrasonic wave coating and form the operation of encapsulation; And
Cut off the operation of described encapsulation,
The manufacture method of described Thermal Cutoffs is characterised in that,
In the operation of cutting off described encapsulation, irradiating laser between the interior acies of the described encapsulation of extending along the length direction of described Thermal Cutoffs at least and the outer edge is cut off described encapsulation, and make described basement membrane and described cover film on the section again carry out welding.
Applications Claiming Priority (4)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2012-086122 | 2012-04-05 | ||
| JP2012086122 | 2012-04-05 | ||
| JP2013022892A JP2013232399A (en) | 2012-04-05 | 2013-02-08 | Temperature fuse and manufacturing method of the same |
| JP2013-022892 | 2013-02-08 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN103367690A true CN103367690A (en) | 2013-10-23 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2013101123305A Pending CN103367690A (en) | 2012-04-05 | 2013-04-02 | Temperature fuse and manufacturing method thereof |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN103367690A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107077991A (en) * | 2015-09-09 | 2017-08-18 | 上海长园维安电子线路保护有限公司 | Can reflow formula Thermal Cutoffs |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2001006508A (en) * | 1999-06-25 | 2001-01-12 | Uchihashi Estec Co Ltd | Alloy thermal fuse |
| CN1334580A (en) * | 2000-07-21 | 2002-02-06 | 松下电器产业株式会社 | Temp. fuse, battery and temp. fuse mfg. method |
| CN101763982A (en) * | 2009-12-31 | 2010-06-30 | 上海长园维安电子线路保护股份有限公司 | Thin temperature fuse with cushion layer structure and preparation method thereof |
-
2013
- 2013-04-02 CN CN2013101123305A patent/CN103367690A/en active Pending
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2001006508A (en) * | 1999-06-25 | 2001-01-12 | Uchihashi Estec Co Ltd | Alloy thermal fuse |
| CN1334580A (en) * | 2000-07-21 | 2002-02-06 | 松下电器产业株式会社 | Temp. fuse, battery and temp. fuse mfg. method |
| CN101763982A (en) * | 2009-12-31 | 2010-06-30 | 上海长园维安电子线路保护股份有限公司 | Thin temperature fuse with cushion layer structure and preparation method thereof |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107077991A (en) * | 2015-09-09 | 2017-08-18 | 上海长园维安电子线路保护有限公司 | Can reflow formula Thermal Cutoffs |
| CN107077991B (en) * | 2015-09-09 | 2019-02-12 | 上海长园维安电子线路保护有限公司 | It can reflow formula Thermal Cutoffs |
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Effective date of registration: 20151021 Address after: Japan Osaka Applicant after: PANASONIC INTELLECTUAL PROPERTY MANAGEMENT Co.,Ltd. Address before: Osaka Japan Applicant before: Matsushita Electric Industrial Co.,Ltd. |
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| C02 | Deemed withdrawal of patent application after publication (patent law 2001) | ||
| WD01 | Invention patent application deemed withdrawn after publication |
Application publication date: 20131023 |