CN103367347A - Light emitting diode packaging construction and lamps - Google Patents

Light emitting diode packaging construction and lamps Download PDF

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Publication number
CN103367347A
CN103367347A CN 201210099914 CN201210099914A CN103367347A CN 103367347 A CN103367347 A CN 103367347A CN 201210099914 CN201210099914 CN 201210099914 CN 201210099914 A CN201210099914 A CN 201210099914A CN 103367347 A CN103367347 A CN 103367347A
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CN
China
Prior art keywords
light emitting
emitting diode
plurality
lamp
substrate
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CN 201210099914
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Chinese (zh)
Inventor
张效铨
彭胜扬
蔡宗岳
郑明祥
邱建勋
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日月光半导体制造股份有限公司
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Priority to CN 201210099914 priority Critical patent/CN103367347A/en
Publication of CN103367347A publication Critical patent/CN103367347A/en

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    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42Wire connectors; Manufacturing methods related thereto
    • H01L2224/47Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805Shape
    • H01L2224/4809Loop shape
    • H01L2224/48091Arched
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42Wire connectors; Manufacturing methods related thereto
    • H01L2224/47Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481Disposition
    • H01L2224/48135Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip
    • H01L2224/48137Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip the bodies being arranged next to each other, e.g. on a common substrate
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/73Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732Location after the connecting process
    • H01L2224/73251Location after the connecting process on different surfaces
    • H01L2224/73265Layer and wire connectors

Abstract

The invention discloses a light emitting diode packaging construction and lamps. The light emitting diode packaging construction is that multiple light emitting diode chips are packaged on a substrate with flexibility. The light emitting diode packaging construction can be curved so that a hollow and cylindrical lamp wall part of a light emitting diode lamp is formed. The multiple light emitting diode chips are electrically connected with each other, of which the light emitting direction orients towards the external of the lamp wall part so that a function of 360 degrees full circumferential surface lighting is provided.

Description

发光二极管封装构造及灯具 Lamps and light emitting diode package structure

【技术领域】 TECHNICAL FIELD

[0001] 本发明是涉及一种发光二极管封装构造及灯具,特别是涉及一种由发光二极管封装构造组成的灯具。 [0001] The present invention relates to a lamp and a light emitting diode package structure, particularly to one kind of a light emitting diode lamp package structure thereof.

【背景技术】 【Background technique】

[0002] 发光二极管(Light Emitting Diode,LED)是以半导体材料制成的固态发光组件,材料使用II1-V族半导体元素(如:磷化镓(GaP)、砷化镓(GaAs)等),发光原理是将电能转换为光,也就是对化合物半导体施加电流,透过电子与电洞的结合,过剩的能量会以光的形式释出,达成发光的效果,属于冷性发光,寿命长达十万小时以上。 [0002] The light-emitting diode (Light Emitting Diode, LED) is a solid state light emitting element made of a semiconductor material, the material used II1-V semiconductor elements (eg: gallium phosphide (GaP), gallium arsenide (GaAs), etc.), light-emitting principle is converting electrical energy into light, namely applying electric current to the compound semiconductor through the combination of electrons and holes, the excess energy is released as light, to achieve the effect of light emission, light emitting is cold, long life one hundred thousand hours.

[0003] LED最大的特点在于:无须暖灯时间、反应速度快、体积小、用电省、耐震、污染低、适合量产,具高可靠度,容易配合应用上的需要制成极小或数组式的组件。 [0003] LED biggest feature is: no lamp warm time, fast response, small size, power save, seismic, low pollution, and suitable for mass production, with high reliability, easy application needs with minimal or made arrays while assembly. LED组件早期只能发出低光度的红光,之后发展出其它单色光的版本,时至今日能发出的光已遍及可见光、红外线及紫外线,光度也提高到相当的光度。 LED components can only be issued early low light red, and then develop other versions of monochromatic light can be issued today has a presence in visible, infrared and ultraviolet light, luminosity also increased to a considerable luminosity. 而其用途也由初时作为指示灯、显示板等;随着白光发光二极管的出现而续渐发展至被用作照明。 But its use is at first as a lamp, a display panel and the like; With the advent of the white LED and gradually continued to be used as a lighting development. 在追求科技进步的同时,人们也意识到环保与节能的重要性,因此以LED灯具来取代传统的照明灯具已成为科技发展的必然趋势。 In the pursuit of scientific and technological progress, and people are aware of the importance of environmental protection and energy saving, and therefore LED lighting to replace traditional lighting has become an inevitable trend of technological development.

[0004] 然而,现有单颗LED封装组件的工作电压还在数伏特左右,且其发光角度及亮度还是很有限,若要做为照明用途,通常必需在一个灯具的一柱状支撑物上立体插设组装及电性连接多个单颗LED封装组件,以提升整体灯具亮度及照明角度。 [0004] However, the conventional operating voltage of a single LED package assembly also about several volts, and its light emission angle and brightness is very limited, to use as illumination, it is often necessary in a perspective view a support pillar lamp interposed assembly and electrically connected to the plurality of single LED package assembly, in order to improve the overall brightness of lamps and illumination angle. 由于每一灯具(灯泡)包含了多个各自独立的单颗LED封装组件,因此也使得LED灯具的组装变得复杂且成本无法降低。 Since each lamp (lamp) comprising a plurality of separate single LED package components, and therefore makes the assembly of the LED lamp becomes complicated and the cost can not be reduced. 另外,LED灯具运作时会产生高温,特别是将多个单颗LED封装组件组装在一起后,LED灯具的整体散热效能低落也是一个必需克服的问题。 Furthermore, LED lamps will produce high temperature operation, especially after a number of single LED package assembly is assembled together, the overall thermal performance of the LED lamp is a low required to overcome the problem.

[0005] 故,有必要提供一种发光二极管封装构造及灯具,以解决现有技术所存在的问题。 [0005] Therefore, there is need to provide a lamp and a light emitting diode package structure, in order to solve the problems of the prior art. 【发明内容】 [SUMMARY]

[0006] 本发明的主要目的在于提供一种发光二极管灯具,其包含一呈中空柱状的灯壁部,所述灯壁部是由一发光二极管封装构造所卷曲连接而成,所述发光二极管封装构造主要包覆多个发光二极管芯片,所述多个发光二极管芯片相互电性连接且发光方向朝外,以提供一种360度全周面的照明功能,并具有良好的散热功能。 [0006] The main object of the present invention is to provide a light emitting diode lamp, the lamp comprising a hollow cylindrical wall portion of the lamp wall portion is constituted by a light emitting diode package structure is connected to each crimp, the light emitting diode package the main configuration of a plurality of light emitting diode chips coated, the plurality of light emitting diode chips are electrically connected to the light emitting direction and outwardly to provide a full 360-degree lighting function peripheral surface, and has good heat dissipation.

[0007] 本发明的次要目的在于提供一种发光二极管封装构造,通过将多个发光二极管芯片封装在一具有挠性的基板上,并且可卷曲连接形成一发光二极管灯具的一呈中空柱状的灯壁部。 [0007] The objective of the present invention is to provide a light emitting diode package structure, by a plurality of LED chips in a package having a flexible substrate and connected to form a rollable LED lamp was a hollow cylindrical lamp wall portion.

[0008] 为达成本发明的前述目的,本发明提供一种发光二极管封装构造,其包含:一具有挠性的基板、多个发光二极管芯片、多条导线及一具有挠性的透明封装层。 [0008] To achieve the above object of the present invention, the present invention provides a light emitting diode package structure, comprising: a flexible substrate, a plurality of light emitting diode chips, a plurality of flexible wires and having a transparent encapsulation layer. 所述具有挠性的基板具有至少一个芯片承载区,且形成蛇行弯绕状;所述多个发光二极管芯片设于所述基板的芯片承载区上;所述多条导线电性连接相邻的所述多个发光二极管芯片,形成电性串联或并联;及所述具有挠性的透明封装层,封装所述基板的芯片承载区、所述多个发光二极管芯片及所述多条导线。 Said flexible substrate having at least one chip carrying region, and forming a meander-shaped bent around; the plurality of LED chips disposed on the chip carrying region of the substrate; a plurality of adjacent wires electrically connecting the plurality of light emitting diode chips, are formed electrically in series or parallel; and having a flexible transparent encapsulation layer, the chip carrier package region of the substrate, the plurality of light emitting diode chips and the plurality of wires.

[0009] 再者,本发明提供另一种发光二极管灯具,其包含一中空柱状的灯壁部,所述灯壁部是由一发光二极管封装构造所卷曲连接而成。 [0009] Further, the present invention provides another light emitting diode lamp, the lamp comprising a hollow cylindrical wall portion, the wall portion is constituted by a light emitting diode package structure is connected to each crimp. 所述发光二极管封装构造包含:一具有挠性的基板、多个发光二极管芯片、多条导线及一具有挠性的透明封装层。 The light emitting diode package structure comprising: a flexible substrate, a plurality of light emitting diode chips, a plurality of flexible wires and having a transparent encapsulation layer. 其中,所述具有挠性的基板具有至少一个芯片承载区,且形成蛇行弯绕状;所述多个发光二极管芯片设于所述基板的芯片承载区上;所述多条导线电性连接相邻的所述多个发光二极管芯片,形成电性串联或并联;及所述具有挠性的透明封装层,封装所述基板的芯片承载区、所述多个发光二极管芯片及所述多条导线。 Wherein said flexible substrate having at least one chip carrying region, and forming a meander-shaped bent around; the plurality of LED chips disposed on the chip carrying region of the substrate; a plurality of wires electrically connected with adjacent to the plurality of light emitting diode chips, are formed electrically in series or parallel; and having a flexible transparent encapsulation layer, the chip carrier package region of the substrate, the plurality of light emitting diode chips and said plurality of conductors .

【附图说明】 BRIEF DESCRIPTION

[0010] 图1是本发明一实施例的发光二极管灯具的立体图。 [0010] FIG. 1 is a perspective view of a light emitting diode lamp according to an embodiment of the present invention.

[0011] 图2是本发明另一实施例的发光二极管灯具的立体图。 [0011] FIG. 2 is a perspective view of an LED lamp according to another embodiment of the present invention.

[0012] 图3A是本发明另一实施例的发光二极管封装构造的俯视图。 [0012] FIG 3A is a plan view of a light emitting diode package structure according to another embodiment of the present invention.

[0013] 图3B是本发明图3A实施例的发光二极管封装构造的局部侧剖视图。 [0013] FIG. 3B is a partial side sectional view of a light emitting diode package structure of an embodiment of the present invention in FIG. 3A.

[0014] 图4A至4F是本发明图3实施例的发光二极管封装构造的制作过程示意图。 [0014] FIGS. 4A to 4F is a manufacturing process of a light emitting diode package structure of the embodiment of the present invention, FIG. 3 FIG.

[0015] 图5是本发明另一实施例的发光二极管封装构造的俯视图。 [0015] FIG. 5 is a top plan view of an LED package structure according to another embodiment of the present invention.

[0016] 图6是本发明另一实施例的发光二极管封装构造的俯视图。 [0016] FIG. 6 is a plan view of a light emitting diode package structure according to another embodiment of the present invention.

[0017] 图7是本发明另一实施例的发光二极管封装构造的局部侧剖视图。 [0017] FIG. 7 is a partial side sectional view of a light emitting diode package structure according to another embodiment of the present invention.

[0018] 图8A是本发明另一实施例的发光二极管封装构造的俯视图。 [0018] FIG. 8A is a plan view of an LED package structure according to another embodiment of the present invention.

[0019] 图8B是本发明图8A实施例的发光二极管封装构造的局部侧剖视图。 [0019] FIG 8B is a partial side sectional view of a light emitting diode package structure according to an embodiment of the present invention, FIG. 8A.

【具体实施方式】 【Detailed ways】

[0020] 为让本发明上述目的、特征及优点更明显易懂,下文特举本发明较佳实施例,并配合附图,作详细说明如下: [0020] In order to make the present invention the above object, features and advantages become more readily apparent, several embodiments of the present invention, the following preferred embodiment and the accompanying drawings, described in detail below:

[0021] 请参照图1所示,图1是本发明一实施例的发光二极管灯具100的立体图。 [0021] Referring to FIG. 1, FIG. 1 is a perspective view of a LED lamp 100 according to an embodiment of the present invention. 本发明一实施例的发光二极管灯具100包含一呈中空柱状的灯壁部10,所述灯壁部10由一发光二极管封装构造所卷曲并连接其两侧缘而形成的,所述灯壁部10可以是圆柱状、三角柱状或其它多角柱状。 LED lamp of the present invention, an embodiment 100 comprises a hollow cylindrical wall portion of the lamp 10, the lamp wall portion 10 by a crimped and connected to the light emitting diode package structure formed by both side edges of the lamp wall portion 10 may be cylindrical, triangular prism shape or other polygonal pillar. 所述发光二极管封装构造主要包含多个发光二极管芯片12。 The light emitting diode package structure mainly comprising a plurality of light emitting diode chips 12. 因此,所述发光二极管灯具100通电后可提供一种360度全周面的照明功能。 Thus, after the LED lamp 100 may be energized to provide a full 360-degree circumferential surface of the lighting function.

[0022] 另外,如图1所示,所述发光二极管灯具100的一端(底端)可另包含一底座20,所述底座20设于所述灯壁部10的一端(底端),用以固定及电性连接于一外部电源或灯座(未绘示)。 [0022] Further, as shown in FIG. 1, one end (bottom end) of the LED lamp 100 may further comprise a base 20, the base 20 is provided at one end (bottom) wall portion 10 of the lamp, with fixed and electrically connected to an external power source or a socket (not shown). 所述底座20内也可设置电源变压/整流所需的电路板(未绘示)。 The base 20 may also be provided within the power transformer / rectifier desired circuit board (not shown). 因此,通过设置适当型式的接头及通过变压/整流,所述发光二极管灯具100即可做为一般灯具来使用。 Thus, by setting the appropriate pattern by pressure swing linker and / rectifier, the LED lamp 100 can be used as general lighting.

[0023] 再者,由于所述发光二极管灯具100的至少一端(顶端)呈开口状,因此所述多个发光二极管芯片12产生的热量可先被传导至所述灯壁部10的内侧面,接着再传导到所述发光二极管灯具100的中空内部空间,并通过所述灯壁部10的至少一开口(图中上方开口)处流出,因而可降低所述多个发光二极管芯片12产生的热量。 [0023] Further, since the LED lamp 100 of at least one end (tip) which is open, whereby said plurality of heat generated by the LED chip 12 can be conducted to the first side of the inner wall portion 10 of the lamp, followed by conduction into the hollow interior space of the LED lamp 100 and the lamp wall portion through the at least one opening 10 (the upper opening in the drawing) at the outflow, thus reducing the heat generated by the LED chip 12 of the plurality of . [0024] 请参照图2所示,图2是本发明另一实施例的发光二极管灯具IOOa的立体图。 [0024] Referring to FIG. 2, FIG. 2 is a perspective view of an LED lamp IOOa according to another embodiment of the present invention. 本发明第二实施例的发光二极管灯具IOOa相似于本发明图1实施例,并大致沿用相同图号,但本实施例的差异特征在于:所述发光二极管灯具IOOa的灯壁部IOa是呈圆锥柱状,也就是所述灯壁部IOa的一端(连接于所述底座20的底端)的直径大于其另一端(顶端)的直径。 LED lamp IOOa second embodiment of the present invention is similar to the embodiment of the present invention, FIG. 1, and FIG substantially follows the same number, but the difference of the present embodiment is characterized in that: the LED lamp IOOa lamp is conical wall portion IOa cylindrical, i.e. an end portion of the lamp wall IOa (connecting the bottom end of the base 20) has a diameter larger than the diameter of the other end (tip) of the. 因此,所述发光二极管灯具IOOa可提供更多偏向图中上方的光源分量,使得所述发光二极管灯具IOOa能更趋近于传统的灯泡式照明设备的发光型态。 Accordingly, the LED lamp can be more IOOa biased upward in FIG source components such that the LED lamp can be more close to IOOa conventional bulb type light-emitting type lighting device.

[0025] 并且,为了加强散热效果,所述灯壁部IOa上可设有多个通气槽(未绘示)。 [0025] Further, to enhance heat dissipation, the wall portion on the lamp may be provided with a plurality of vent grooves IOa (not shown). 或者,所述灯壁部IOa靠近所述底座20环状设置有多个通气孔14,以使所述发光二极管灯具IOOa产生一种烟囱效应(Stack effect) 0烟囱效应是指内部热空气沿着有倾斜坡度的空间向上抬升,造成空气加强对流的现象。 Alternatively, the lamp base wall portion 20 adjacent to the annular IOa provided with a plurality of vent holes 14, so that the LED lamp produces a chimney effect IOOa (Stack effect) 0 chimney effect refers to the internal hot air along inclined slope space lift up, causing the phenomenon strengthen air convection. 发光二极管灯具IOOa可使所述多个发光二极管芯片12产生的热量可先被传导到内部的空间,再以内部空气做为媒介通过所述灯壁部IOa顶部的开口向外散出,同时外部较冷的空气通过所述多个通气孔14补入内部空间,形成冷热空气的交换及循环,因此有效降低所述多个发光二极管芯片12产生的热量。 The LED lamp can IOOa plurality of LED chips 12 of the heat generated can be conducted to the first internal space, and then the internal air as a medium dissipated outwardly through the opening in the top wall portion IOa of the lamp, while the outer cooler air through the plurality of vent holes 14 into the interior space of complementary form and exchange circulating cold air, thus effectively reducing the amount of heat generated by the LED chip 12 of the plurality.

[0026] 综上所述,现有LED产品要做为照明用途时,通常必需在一个灯具上立体插设组装及电性连接多个单颗LED封装组件,因此使得现有LED灯具照明设备的组装复杂、成本无法降低,以及具有散热不良等问题。 [0026] In summary, the prior LED lighting purposes the product is done, it is often necessary in a fixture and the assembly is inserted perspective electrically connecting a plurality of single LED package assembly, so that the conventional LED lighting device assembly complex, the cost can not be reduced, and have poor heat dissipation issues. 本发明通过将多个发光二极管芯片12封装形成一具有挠性的发光二极管封装载板,并且由所述发光二极管封装载板卷曲连接形成一发光二极管灯具100的灯壁部10。 The present invention is formed by a plurality of LED chip packages 12 having a flexible light emitting diode package carrier, and the crimp connection by the light emitting diode package carrier wall portion 10 is formed a light emitting diode lamp 100. 所述发光二极管灯具100可提供一种360度全周面的照明功能,并具有良好的散热功能。 The LED lamp 100 can provide a full 360-degree lighting function peripheral surface, and has good heat dissipation.

[0027] 请参照图3A及图3B所示,图3A是本发明另一实施例的发光二极管封装构造200的俯视图;及图3B是图3A的发光二极管封装构造200的局部侧剖视图。 [0027] Referring to FIGS. 3A and 3B, FIG. 3A is a top view light emitting diode package structure according to another embodiment of the present invention, FIG. 200; and FIG. 3B is a partial side sectional view of a light emitting diode package structure 200 of FIG. 3A. 所述发光二极管封装构造200可进一步卷曲并连接其两侧缘,以形成图1所示的发光二极管灯具100的灯壁部10。 The light emitting diode package structure 200 may be further connected to both side edges, and crimping, the wall portion 10 to form a lamp LED lamp 100 shown in FIG. 所述发光二极管封装构造200包含一具有挠性的基板210、多个发光二极管芯片220、多条导线230、多个荧光粉层240及一具有挠性的透明封装层250。 The light emitting diode package structure 200 comprises a substrate 210 having a flexibility, a plurality of light emitting diode chips 220, a plurality of wires 230, 240 and a plurality of phosphor layers having a flexible transparent encapsulation layer 250.

[0028] 所述具有挠性的基板210具有一个(或多个)芯片承载区(未标示),且形成蛇行弯绕状;所述多个发光二极管芯片220设于所述基板210的所述蛇行弯绕状芯片承载区上;所述多条导线230电性连接相邻的所述多个发光二极管芯片220,形成蛇行弯绕状的电性串联(或并联)关系;每一所述多个发光二极管芯片220上设有一荧光粉层240,以调整所述多个发光二极管芯片220的出光颜色;所述具有挠性的透明封装层250包覆所述基板210的芯片承载区、多个发光二极管芯片220、所述多条导线及所述荧光粉层240。 [0028] The flexible substrate 210 having one (or more) chip carrying region (not shown), and is formed like a meandering bent around; the plurality of LED chips 220 disposed on the substrate 210 meander-shaped bent around the chip carrying region; 230 is electrically connected to said plurality of conductors of said plurality of light emitting diode chips 220 adjacent to, form a meander-shaped curved around electrically connected in series (or parallel) relationship; each of said plurality provided on the light emitting diode chips 220 a phosphor layer 240, to adjust the color of the plurality of light-emitting diode chip 220; 250 having a cladding layer of the flexible transparent substrate chip carrier package region 210, a plurality of LED chip 220, a plurality of wires and the phosphor layer 240.

[0029] 在本实施例中,所述多个发光二极管芯片220可以为水平式发光二极管芯片,也就是指其P极及N极两个电极是水平分设于芯片的左右两半部。 [0029] In the present embodiment, the plurality of LED chips 220 may be a horizontal type LED chip, which refers to N pole and the P pole two horizontal electrodes are divided into left and right halves of the chip. 所述导线230用以电性连接于相邻的两发光二极管220的相异电极(未绘示)的顶面,以形成电性连接,例如串联连接关系。 The top surface of conductor 230 is electrically connected to different electrodes adjacent to the two light emitting diode 220 (not shown) to form an electrical connection, for example, are connected in series relationship. 因此,所述发光二极管封装构造200通电后可提供一面光源的照明功能。 Thus, after the LED package structure 200 may provide a power source side of the lighting function.

[0030] 然而,本发明并不限制所述多个发光二极管芯片200的型式及串联方式,其可以是水平式发光二极管芯片或垂直式发光二极管芯片,其可以是电性串联、并联,或是串联与并联的组合,以设计成符合使用者需求的规格。 [0030] However, the present invention is not limited to the plurality of patterns in series and the LED chip 200, which may be a horizontal or a vertical type LED chip type LED chip, which may be electrically connected in series, parallel, or a combination of series and parallel, in order to meet the design specifications of user needs. 上述垂直式发光二极管芯片则是指其P极及N极两个电极是垂直纵向分设于芯片的上下两半部。 Said vertical-type LED chip, the P refers to the pole and the N pole is divided into two electrodes is perpendicular to the longitudinal direction of the upper and lower halves of the chip.

[0031] 另外,所述具有挠性的基板210可以是一可挠性金属层或一可挠性非金属材料层,例如铜板、镀金铜板、镀镍铜板、具氧化铝薄膜的铝板,或镀有金属薄膜的塑料板等。 [0031] Further, the flexible substrate 210 may be a flexible metal layer or a layer of flexible non-metallic material, such as copper, gold-plated copper, nickel-plated copper, aluminum with aluminum oxide thin film, plating or a plastic film with a metal plate or the like. 所述具有挠性的透明封装层250可以是一透明树脂层(例如硅胶或树脂),以提供所述发光二极管封装构造200具有挠性,以提供可塑形及定形的特性。 The flexible transparent encapsulation layer 250 may be a transparent resin layer (e.g., silica gel or resin), to provide the light emitting diode package structure 200 is flexible and shaped to provide a shaping characteristics. 所述发光二极管封装构造200的底表面可供所述发光二极管芯片220传导散热,其顶表面可供光线向外穿透射出以提供照明。 The light emitting diode package structure 200 of the bottom surface of the LED chip 220 for heat conduction, its top surface for transmission of light emitted outwardly to provide illumination. 因此,所述发光二极管封装构造200可进一步弯曲成一曲面来使用或形成本发明第一实施例的中空柱状灯壁部10,且具有朝外侧发光的功能。 Thus, the light emitting diode package structure 200 may be further bent into a curved or formed to use a first embodiment of the hollow cylindrical wall portion of the lamp embodiment 10 of the present invention and having a function of emitting light outward.

[0032] 本发明图3的发光二极管封装构造200的制作步骤参照图4A至4F说明如下: Production Step [0032] The present invention FIG 3 is a light emitting diode package structure 200 with reference to FIGS. 4A to 4F follows:

[0033] 如图4A所示,提供一承板300。 As shown in [0033] FIG. 4A, a carrier plate 300.

[0034] 如图4B所示,将一具有挠性的基板210置于所述承板300上,所述基板210具有一个或多个芯片承载区(未标示),且形成蛇行弯绕状。 As shown in [0034] FIG. 4B, a flexible substrate 210 disposed on the supporting plate 300, a substrate 210 having one or more chip carrying region (not shown), bent around and forming a serpentine shape.

[0035] 如图4C所示,将多个发光二极管芯片220,通过一胶层(未绘示)黏贴固定于所述基板210的芯片承载区上。 [0035] As shown in FIG. 4C, a plurality of light emitting diode chips 220, by an adhesive layer (not shown) is fixed to the adhesive on the chip carrier substrate region 210.

[0036] 如图4D所示,利用导线230电性连接相邻的所述多个发光二极管芯片220,形成电性串联(或并联)。 As shown in [0036] FIG. 4D, using a wire 230 electrically connecting the plurality of adjacent light-emitting diode chips 220, electrically connected in series are formed (or in parallel).

[0037] 如图4E所示,将多个荧光粉层240分别形成于所述多个发光二极管芯片220的上表面。 [0037] As shown in FIG. 4E, as a plurality of phosphor layers 240 are formed on the surface of the plurality of light-emitting diode chip 220.

[0038] 如图4F所示,以具有挠性的透明封装层250包覆所述基板210、所述多个发光二极管芯片220、所述多条导线230及所述多个荧光粉层240。 [0038] FIG. 4F, 250 having flexible transparent encapsulation layer covering the substrate 210, the plurality of light emitting diode chips 220, the wires 230 and a plurality of said plurality of phosphor layers 240.

[0039] 最后,移除所述承板300而制得如图3B所示的发光二极管封装构造200。 [0039] Finally, removal of the carrier plate 300 in the system configuration shown in FIG light emitting diode package of 3B 200. 但必要时,也可选择保留所述承板300以辅助支撑所述基板210的芯片承载区。 If necessary, however, also choose to keep the support substrate 300 to aid in chip carrying region 210 of the carrier plate.

[0040] 请参照图5所示,图5是本发明另一实施例的发光二极管封装构造的俯视图。 [0040] Referring to FIG. 5, FIG. 5 is a top plan view of an LED package structure according to another embodiment of the present invention. 本实施例的发光二极管灯具200a相似于本发明图3实施例,并大致沿用相同图号,但本实施例的差异特征在于:本实施例的发光二极管封装构造200a的轮廓是呈一扇形轮廓,也就是所述基板210a的蛇行弯绕状芯片承载区及所述多个发光二极管芯片220的排列是顺此扇形轮廓来做等尺寸比例分布。 LED lamp according to the present embodiment 200a similar to the view of the invention in Example 3, and generally follow the same drawing number, but the difference feature of this embodiment is that: a light emitting diode package structure of the present embodiment, the outline 200a is the form of a fan-shaped profile, It is arranged and the LED chip 220 of the substrate 210a meandering curved shape around a plurality of said chip carrying region is a sector along this contour size distribution ratio and the like do. 因此,本实施例的所述发光二极管封装构造200a可进一步弯曲成本发明图2所示发光二极管灯具IOOa的灯壁部10a。 Thus, the LED package structure 200a of the present embodiment may be a light emitting diode lamp further bent wall portions 10a IOOa lamp cost invention shown in FIG 2.

[0041] 请参照图6所示,图6是本发明另一实施例的发光二极管封装构造的俯视图。 [0041] Referring to FIG. 6, FIG. 6 is a plan view of an LED package structure according to another embodiment of the present invention. 本实施例的发光二极管灯具200b相似于本发明图3实施例,并大致沿用相同图号,但本实施例的差异特征在于:所述发光二极管灯具200b的所述基板210b具有单一整片大区域的芯片承载区,除了制作方便及加强散热功能外,在制作过程中也可不需要提供所述承板300,而是以所述基板210b兼做为整体承载支撑所述发光二极管灯具200b的用途。 LED lamp according to the present invention similar to the embodiment 200b of FIG. 3 embodiment of the present embodiment, and FIG substantially follows the same number, but the difference of the present embodiment is characterized in that: the substrate of the LED lamp 200b, 210b having a single large area single piece a chip carrying region, in addition to enhance heat dissipation and to facilitate production functions, in the production process may also be necessary to provide the carrier plate 300, but in the substrate also serves as an integral bearing 210b supporting the use of LED lamp 200b. 在本实施例中,由于电性连接是在所述多个发光二极管芯片220的上表面进行,因此所述基板210b除了可选用散热性佳的金属材质外,也适合选用其它可挠性的非金属材料,例如塑料板。 In the present embodiment, since the electrical connection is performed on a surface of the plurality of LED chips 220, so the choice of substrate 210b in addition to good heat dissipation metal material, but also for the use of other non-flexible metallic material such as a plastic plate.

[0042] 请参照图7所示,图7是本发明另一实施例的发光二极管封装构造200c的局部侧剖视图。 [0042] Referring to FIG. 7, FIG. 7 is a sectional view of a light emitting diode package structure according to another embodiment of the present invention in partial side 200c. 本实施例的发光二极管灯具200c相似于本发明图3的发光二极管封装构造200,并大致沿用相同图号,但差异特征在于:所述发光二极管灯具200c没有在所述发光二极管芯片220的上表面设置荧光粉层,因此若有需要对所述多个发光二极管芯片220调整发光颜色时,可改由在所述透明封装层250c内直接掺杂加入荧光粉来实现。 LED lamp 200c of the present embodiment is similar to the embodiment of the present invention, FIG 3 is a light emitting diode package structure 200, and substantially follow the same drawing number, but the difference wherein: said light emitting diode lamp without the upper surface 200c of the LED chip 220 in when the phosphor layer is provided, and therefore if necessary 220 to adjust the emission color of the plurality of LED chips, can be changed directly by the dopant in the phosphor transparent encapsulation layer 250c was added to achieve.

[0043] 请参照图8A及8B所示,图8A是本发明另一实施例的发光二极管封装构造200d的俯视图;及图8B是图8A的发光二极管封装构造200d的局部侧剖视图。 [0043] Referring to FIG. 8A and FIG. 8B, FIG. 8A is a plan view of a light emitting diode package structure according to another embodiment of the present invention, FIG 200d; and FIG. 8B is a side partial cross-sectional view of a light emitting diode package structure of FIG. 8A 200d. 本实施例的发光二极管灯具200d相似于本发明图3实施例,并大致沿用相同图号,但差异特征在于:所述发光二极管芯片220的上表面没有设置荧光粉层。 LED lamp according to the present embodiment is similar to the embodiment of FIG 200d embodiment 3 of the present invention, and FIG substantially follows the same number, but the difference characterized in that: said light emitting diode chip 220 on the surface of the phosphor layer is not provided. 另外,所述发光二极管灯具200d的所述多个发光二极管芯片220d为垂直式发光二极管芯片,也就是其P极及N极两个电极是垂直纵向分设于芯片的上下两半部。 Further, the light emitting diode lamp of the plurality of light emitting diode chips 200d 220d a vertical type LED chip, i.e., the P-pole and the N pole is divided into two electrodes is perpendicular to the longitudinal direction of the upper and lower halves of the chip. 所述基板210d由金属材质制成及包含互不相连的多个芯片承载区,并且每一所述发光二极管芯片220d分别设置在一芯片承载区上。 210d of the substrate made of a metal material and comprises a plurality of non-contiguous regions of the chip carrier, each of said light emitting diode chip and 220d are respectively provided on a chip carrying region.

[0044] 再者,所述多个发光二极管芯片220d的底面电极(未绘示)例如通过导电胶层(未标示)以电性连接所述金属材质的基板210d,再通过所述导线230d电性连接相邻的所述发光二极管芯片220d顶面的电极(未绘示)与所述基板210d。 [0044] Further, the plurality of bottom electrode 220d of the light emitting diode chip (not shown), for example, by a conductive adhesive layer (not shown) in the substrate electrically connected to the metal material 210d, and through said electrical conductor 230d the LED chip electrode 220d is connected to the adjacent top surface (not shown) with the substrate 210d. 在本实施例中,所述发光二极管构造200d具有较大面积的金属材质的所述基板210d,因此可加强散热功能。 In the present embodiment, the light emitting diode configured 200d 210d of the substrate metal material having a large area, and thus enhance heat dissipation. 并且,由于采用垂直式的所述发光二极管芯片220d,还可进一步减少所需的所述导线230d的数量,以简化结构及提高电性连接的质量。 Further, since the vertical type LED chip 22Od, it may further reduce the number of wires required to 230d, to simplify the structure and improve the quality of the electrical connection.

[0045] 本发明已由上述相关实施例加以描述,然而上述实施例仅为实施本发明的范例。 [0045] The present invention has been related to the above-described embodiments to be described, however, the above-described embodiments are merely exemplary embodiments of the present invention. 必需指出的是,已公开的实施例并未限制本发明的范围。 It must be noted that the disclosed embodiments do not limit the scope of the present invention. 相反的,包含于权利要求书的精神及范围的修改及均等设置均包括于本发明的范围内。 Conversely, comprising the claims the spirit and scope of modifications and equivalents are included within the scope provided according to the present invention.

Claims (10)

1.一种发光二极管封装构造,其特征在于:所述发光二极管封装构造包含: 一具有挠性的基板,具有至少一个芯片承载区,且形成蛇行弯绕状; 多个发光二极管芯片,设于所述基板的芯片承载区上; 多条导线,电性连接相邻的所述多个发光二极管芯片;及一具有挠性的透明封装层,包覆所述基板的芯片承载区、所述多个发光二极管芯片及所述多条导线。 1. A light emitting diode package structure, characterized in that: said light emitting diode package structure comprising: a flexible substrate having at least one chip carrying region, and forming a meander-shaped bent around; a plurality of light emitting diode chips disposed a chip carrying region of the substrate; a plurality of wires, electrically connected to the plurality of light emitting diode chips adjacent; and having a flexible transparent encapsulation layer covers the region of the chip carrier substrate, the plurality LED chips and the plurality of wires.
2.如权利要求1所述的发光二极管封装构造,其特征在于:所述发光二极管封装构造构造具有一扇形轮廓,所述多个发光二极管芯片的排列顺此扇形轮廓分布。 The LED package structure according to claim 1, wherein: said light emitting diode package structure having a sector configuration profile, the plurality of light emitting diode chips are arranged along the distribution profile of this sector.
3.如权利要求1所述的发光二极管封装构造,其特征在于:所述基板是一可挠性金属层或一可挠性非金属材料层。 The light emitting diode package structure as claimed in claim 1, wherein: the substrate is a flexible metal layer or a layer of flexible non-metallic material.
4.一种发光二极管灯具,其特征在于:所述发光二极管灯具包含一呈中空柱状的灯壁部,所述灯壁部是由一发光二极管封装构造所卷曲连接而成,其中所述发光二极管封装构造包含: 一具有挠性的基板,具有至少一个芯片承载区; 多个发光二极管芯片,设于所述基板的芯片承载区上; 多条导线,电性连接相邻的所述多个发光二极管芯片;及一具有挠性的透明封装层,包覆所述基板的芯片承载区、所述多个发光二极管芯片及所述多条导线。 4. A light emitting diode lamp, wherein: said light emitting diode lamp comprising a lamp as a hollow cylindrical wall portion, the wall portion is constituted by a light emitting diode package structure formed by the crimp connector, wherein said light emitting diode package structure comprising: a flexible substrate having at least one chip carrying region; a plurality of light emitting diode chips disposed on the chip carrying region of the substrate; a plurality of wires electrically connecting the plurality of adjacent light emitting diode chip; and having a flexible transparent encapsulation layer covers the region of the chip carrier substrate, the plurality of light emitting diode chips and the plurality of wires.
5.如权利要求4所述的发光二极管灯具,其特征在于:所述发光二极管灯具的一端另包含一底座,所述灯壁部呈圆锥柱状,所述灯壁部连接所述底座的一端的直径大于其另一端的直径。 The light emitting diode lamp according to claim 4, wherein: one end of the light emitting diode lamp further comprises a base portion of the lamp wall at one end a conical columnar shape, a wall portion of the lamp is connected to the base diameter larger than the diameter of the other end.
6.如权利要求4所述的发光二极管灯具,其特征在于:所述灯壁部上设有多个通气槽。 LED lamp as claimed in claim 4, characterized in that: said lamp is provided with a plurality of vent grooves on the wall portion.
7.如权利要求4所述的发光二极管灯具,其特征在于:所述灯壁部靠近所述底座环状设有多个通气孔。 The light emitting diode lamp according to claim 4, wherein: the lamp near the base portion of the annular wall is provided with a plurality of vent holes.
8.如权利要求4所述的发光二极管灯具,其特征在于:所述基板是一可挠性金属层或一可挠性非金属材料层。 The light emitting diode lamp according to claim 4, wherein: the substrate is a flexible metal layer or a layer of flexible non-metallic material.
9.如权利要求4所述的发光二极管灯具,其特征在于:所述基板形成蛇行弯绕状。 The light emitting diode lamp according to claim 4, wherein: said substrate is formed around the meandering curved shape.
10.如权利要求4所述的发光二极管灯具,其特征在于:所述基板包含互不相连的多个所述芯片承载区,并且每一所述发光二极管芯片分别设置在所述芯片承载区上;以及所述多个发光二极管芯片的底面电极电性连接金属材质的所述基板,再通过所述导线电性连接相邻的所述发光二极管芯片顶面的电极与所述基板。 10. The LED lamp according to claim 4, wherein: said substrate comprises a plurality of non-contiguous region of the chip carrier, and each of the LED chips are disposed on the chip carrying region ; substrate and the bottom electrode of the plurality of light emitting diode chip is electrically connected to the metal material, and then through the wire is electrically connected to the adjacent top surface of the light emitting diode chip and the substrate electrode.
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