CN103367278A - Three-dimensional stacked encapsulation structure of double-face water-cooling semiconductor component with fixing devices - Google Patents
Three-dimensional stacked encapsulation structure of double-face water-cooling semiconductor component with fixing devices Download PDFInfo
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- CN103367278A CN103367278A CN201210083103XA CN201210083103A CN103367278A CN 103367278 A CN103367278 A CN 103367278A CN 201210083103X A CN201210083103X A CN 201210083103XA CN 201210083103 A CN201210083103 A CN 201210083103A CN 103367278 A CN103367278 A CN 103367278A
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- stacked
- pressuring plate
- water
- cooled
- cell board
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Abstract
Disclosed is a three-dimensional stacked encapsulation structure of a double-face water-cooling semiconductor component with fixing devices. The structure includes lamination plates, positioning devices in the lamination plates, connecting pieces in the lamination plates, wire leading terminals, substrates, temperature and pressure measurement devices and water cooling channels. The structure is characterized in that: the lamination plates are comprised by unit plates and the transformable connecting pieces; the three-dimensional stacked encapsulation structure is formed by laminating a plurality of lamination plates; a positioning device is arranged and a plurality of semiconductor components are encapsulated in each lamination plate; each lamination plate is provided with the temperature and pressure measurement devices; the upper ends and the lower ends of the lamination plates are provided with substrates; the water cooling channels are arranged in the substrates; and the encapsulation structure is provided with the semiconductor components wire leading terminals. The structure is small in size, large in power which can be integrated, and high in heat dissipation coefficient; the structure has the characteristics of shock and vibration resistance and expansion with heat and contraction with coldness; and each lamination plate is provided with the temperature and pressure measurement devices.
Description
Technical field
The present invention relates to a kind of semiconductor device, particularly a kind of 3 D intelligent encapsulating structure of the semiconductor device with the two-sided water-cooled of fixture.
Background technology
Semiconductor device especially large power semiconductor device is widely used in light current and forceful electric power field.Along with the development of power device, how to reduce the weight and volume of power device and solve the heat dissipation problem that thing followed high power density brings to be subject to extensive concern in industry.The three-dimension packaging form of semiconductor device and efficient cooling structure are designed to the key factor that the device weight and volume reduces.
At present used semiconductor element planar package and the heat sink volume and weight of aluminium alloy do not satisfy the demands in the traditional structure, on the one hand, the shared volume of planar package is larger, need a large amount of lead-in wire bindings during encapsulation, brought a large amount of lead resistances and spontaneous inductance, thereby increased the generation of heat and improved failure rate; On the other hand, traditional heat sink structure can't satisfy radiating requirements in large electrical device, and needs the heat sink structure of larger volume.Therefore adopt three-dimensional encapsulation and liquid cooling to replace the conventional package structure.
Summary of the invention
The objective of the invention is for the defective that exists in the prior art, a kind of semiconductor device 3 D intelligent encapsulating structure with the two-sided water-cooled of fixture is provided.The present invention includes: comprising: stacked pressuring plate, positioner in the stacked pressuring plate, connector in the stacked pressuring plate, lead terminal, substrate, temperature and pressure-detecting device and water-cooling channel, it is characterized in that described stacked pressuring plate is comprised of cell board and deformable connector, semiconductor element of each cell board encapsulation forms the chip of elementary cell, the size of cell board is according to packed semiconductor element setting, three-dimensional stacked encapsulating structure is comprised of four or more even number stacked pressuring plate lamination closed assembly, each stacked pressuring plate is provided with positioner and encapsulates several semiconductor elements, be bolted between the stacked pressuring plate, each stacked pressuring plate is provided with the temperature and pressure checkout gear, the outermost up and down two ends of stacked pressuring plate of finishing the lamination closed assembly are provided with substrate, be provided with cooling-water duct in the substrate, cooling water drives circulation by pump, and the overall package structure is provided with the input and output lead terminal of semiconductor element.
Both sides are equipped with the conductive buffer layer of the expansion coefficient material identical or close with silicon about the described chip.Such as molybdenum etc., also can use other electric conducting materials that satisfy instructions for use, such as aluminium, copper etc.
Described cell board periphery be provided with groove be distributed in cell board around.
The distressed structure that can in the space, compress or stretch of the three-dimensional form of springs of shrinkage distortion that the deformable connector between stacked pressuring plate and the cell board is shock resistance, anti-vibration, heat resistanceheat resistant is swollen.Or be the hinged shape structure of controlled integral body of structure reduction, namely connector and cell board junction are the mode of being articulated and connected, and can move by external force.
Stacked between described lead terminal and the stacked pressuring plate connects through bolt and nut.
Described pressure-detecting device is pressure sensor, is installed among each stacked pressuring plate.
Cooling-water duct in the described substrate is tree-like or serpentine configuration.
Described stacked pressuring plate is made by punching press, casting or forging.
Advantage of the present invention is the three-dimensional encapsulation of having realized semiconductor device, connects without lead-in wire, reduces line resistance and self inductance that wire-bonded produces, adopts two-side water cooling, has a volume little, and power that can be integrated is large, and coefficient of heat transfer is large.Simultaneously, each stacked pressuring plate can encapsulate semiconductor element any number and measure-alike or different, and the fixed structure that presets prevents that effectively semiconductor element from producing slippage when being subject to external impact, variable connector prevent device when work be subject to impacting, shake, expand with heat and contract with cold etc. and produce be out of shape in addition chip impaired, each stacked pressuring plate has the chip life consumption of temperature and pressure checkout gear in order to prevent from causing because environment for use is improper.This encapsulating structure has intelligent monitoring function, and device temperature, pressure under can the Real-Time Monitoring operating state have improved device reliability, and prolong the useful life of device, are user-friendly to.
Description of drawings
The circuit theory diagrams of Fig. 1 embodiment one;
The structural representation of Fig. 2 stacked pressuring plate A, wherein 2A is the plan structure schematic diagram, and 2B is upper TV structure schematic diagram, and 2C is main TV structure schematic diagram, and 2D is perspective view;
The structural representation of Fig. 3 stacked pressuring plate B, wherein 3A is the plan structure schematic diagram, 3B is perspective view;
The perspective view of Fig. 4 chip and conductive buffer layer sandwich structure, wherein 4A is the plan structure schematic diagram, 4B is perspective view;
Stacked pressuring plate stacked structure schematic diagram among Fig. 5 embodiment one, wherein 5A is perspective view, and 5B is the STRUCTURE DECOMPOSITION schematic diagram, and 5C is the plan structure schematic diagram;
The structural representation of base plate among Fig. 6 embodiment one, wherein 6A is perspective view, and 6B is main TV structure schematic diagram, and 6C is the sectional structure schematic diagram;
The perspective view of Fig. 7 embodiment one, wherein 7A is perspective view, and 7B is the STRUCTURE DECOMPOSITION schematic diagram, and 7C is the plan structure schematic diagram;
The structural representation of base plate among Fig. 8 embodiment two, wherein 8A is perspective view, 8B is main TV structure schematic diagram;
The perspective view of Fig. 9 embodiment two, wherein 9A is perspective view, 9B is the plan structure schematic diagram;
The structural representation of base plate among Figure 10 embodiment three, wherein 10A is perspective view, 10B is main TV structure schematic diagram;
The perspective view of Figure 11 embodiment three, wherein 11A is perspective view, 11B is the plan structure schematic diagram;
The two-dimensional representation of Figure 12 embodiment four;
The experience foreign impacts of Figure 13 embodiment four, shake or expand with heat and contract with cold etc. and cause two-dimensional representation after the distortion;
Among the figure: 1 stacked pressuring plate, 2 cell boards, 3 connectors, 4 grooves, 5 chips, 6 conductive buffer layers, 7 conducting terminals, 8 bolts hole, 9 base plates, 10 fillers.
Embodiment
Embodiment one
Further specify the present embodiment below in conjunction with accompanying drawing:
Referring to Fig. 2～Fig. 7, the present embodiment is the 3 D intelligent encapsulating structure with the semiconductor device of the two-sided water-cooled of fixture.Circuit structure diagram is referring to Fig. 1, and I1～I12 is 12 semiconductor chips, be divided into four layers stacking, every layer of three chip.This structure is by three stacked pressuring plates and two stacked pressuring plates, mutually intersects stacking forming.Referring to Fig. 2, Fig. 3.Each stacked pressuring plate contains 6 module unit plates 2.Stacked pressuring plate 1 is by punching press or forge formation, upper and lower surface all is processed with groove 4, groove 4 is that " mouth " word shape structure distribution is around cell board 2, wherein the stacked pressuring plate 1 of top layer only has lower surface fluted 4, the stacked pressuring plate 1 of the bottom only has upper surface fluted 4, groove 4 be distributed in cell board 2 around, play fixed chip 5.Chip 5 upper and lower surfaces respectively have one deck conductive buffer layer 6, are fixed together by thermocompression bonding, form sandwich structure, referring to Fig. 4.Prevent that chip 5 from breaking when exerting pressure.Chip 5 is placed in the groove of cell board 2 with the sandwich structure that conductive buffer layer 6 consists of, and the cell board groove of two different stacked pressuring plates is corresponding one by one, forms fixing chip 5.The deformable structure that connector 3 is out of shape for shock resistance, anti-vibration, the swollen shrinkage of heat resistanceheat resistant between the cell board 2.Crimping is smooth closely during the situations such as deformable piece kept being subject to foreign impacts at device, shake, expand with heat and contract with cold.Each stacked pressuring plate 1 is equipped with temperature sensor, and pressure sensor is realized Real Time Monitoring and the parameter of device are regulated, and realizes the intellectuality of encapsulating structure, improves dependability and the life-span of device.In addition, in each stacked pressuring plate 1, capacitance sensor is installed, to detect real-time height, is guaranteed that crimping is tight.Stacked pressuring plate 1 is stacked and forms complete circuit structure, referring to Fig. 5.The base plate of a built-in discrete shape water-cooling channel respectively is set, referring to Fig. 6 in the upper and lower surface of stacked structure.Baseplate material is the material with good electrical conductivity and thermal conductivity, and such as copper, aluminium silicon carbide, aluminium, steel, cast iron etc., cooling water is realized circulation in substrate by pump, thereby reaches the effect of two-sided liquid cooling.Be bolted overall structure is applied lasting pressure, realize the 3 D stereo encapsulation.Conducting terminal is realized the input and output of the signal of telecommunication.Referring to Fig. 7.
Embodiment two
Embodiment two is identical with embodiment one, and difference is that water-cooling channel is snakelike.Respectively place the substrate of a built-in snakelike water-cooling channel in the upper and lower surface of stacked structure, referring to Fig. 8.Be bolted overall structure is applied lasting pressure, referring to Fig. 9.
Embodiment three
Embodiment three is identical with embodiment one, and difference is that water-cooling channel is tree-like.Respectively place the substrate of a built-in tree-like water-cooling channel in the upper and lower surface of stacked structure, referring to Figure 10.Be bolted overall structure is applied lasting pressure, referring to Figure 11.
Embodiment four
Embodiment four is identical with embodiment one, and difference is that the connector between the cell board is the controlled integral body of structure reduction, is in particular in that this example is for articulated form, referring to Figure 12.In the distortion that produces that is subject to foreign impacts, shakes or expands with heat and contract with cold be, the hinge point movement that can thereupon deform, this moment, filler guaranteed the planarization of crimping, referring to Figure 13.
Embodiment five
Embodiment five is identical with embodiment one, and difference is the number of stacked pressuring plate, is mutually to intersect stacking forming with N+1 cell board A and N cell board B.N is even number arbitrarily.The three-dimension packaging structure that consists of encapsulates 2N layer semiconductor element altogether.
Claims (8)
1. three-dimensional stacked encapsulating structure of the semiconductor device with the two-sided water-cooled of fixture, comprise: stacked pressuring plate, positioner in the stacked pressuring plate, connector in the stacked pressuring plate, lead terminal, substrate, temperature and pressure-detecting device and water-cooling channel, it is characterized in that described stacked pressuring plate is comprised of cell board and deformable connector, semiconductor element of each cell board encapsulation forms the chip of elementary cell, the size of cell board is according to packed semiconductor element setting, three-dimensional stacked encapsulating structure is comprised of the stacked pressuring plate lamination closed assembly of four or more even number, each stacked pressuring plate is provided with positioner and encapsulates several semiconductor elements, be bolted between the stacked pressuring plate, each stacked pressuring plate is provided with the temperature and pressure checkout gear, the outermost up and down two ends of stacked pressuring plate of finishing the lamination closed assembly are provided with substrate, be provided with cooling-water duct in the substrate, cooling water drives circulation by pump, and the overall package structure is provided with the input and output lead terminal of semiconductor element.
2. the three-dimensional stacked encapsulating structure of the semiconductor device with the two-sided water-cooled of fixture according to claim 1 is characterized in that described chip is equipped with the conductive buffer layer of the expansion coefficient material identical or close with silicon in both sides up and down.
3. the three-dimensional stacked encapsulating structure of the semiconductor device with the two-sided water-cooled of fixture according to claim 1, the periphery that it is characterized in that described cell board be provided with groove be distributed in cell board around.
4. the three-dimensional stacked encapsulating structure of the semiconductor device with the two-sided water-cooled of fixture according to claim 1, the distressed structure that can in the space, compress or stretch of the three-dimensional form of springs of the shrinkage distortion that it is characterized in that the deformable connector between described stacked pressuring plate and the cell board is shock resistance, anti-vibration, heat resistanceheat resistant is swollen.
5. the three-dimensional stacked encapsulating structure of the semiconductor device with the two-sided water-cooled of fixture according to claim 1, it is characterized in that the connector between described stacked pressuring plate and the cell board is the hinged shape structure of controlled integral body of structure reduction, be that connector and cell board junction are the mode of being articulated and connected, can move by external force.
6. the three-dimensional stacked encapsulating structure of the semiconductor device with the two-sided water-cooled of fixture according to claim 1 is characterized in that stacked between described lead terminal and the stacked pressuring plate connects through bolt and nut.
7. the three-dimensional stacked encapsulating structure of the semiconductor device with the two-sided water-cooled of fixture according to claim 1 is characterized in that described pressure-detecting device is pressure sensor, is installed among each stacked pressuring plate.
8. the three-dimensional stacked encapsulating structure of the semiconductor device with the two-sided water-cooled of fixture according to claim 1 is characterized in that the cooling-water duct in the described substrate is discrete shape or tree-like or serpentine configuration.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201210083103.XA CN103367278B (en) | 2012-03-26 | 2012-03-26 | The three-dimensional stacked encapsulating structure of semiconductor device with the two-sided water-cooled of fixing device |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201210083103.XA CN103367278B (en) | 2012-03-26 | 2012-03-26 | The three-dimensional stacked encapsulating structure of semiconductor device with the two-sided water-cooled of fixing device |
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| Publication Number | Publication Date |
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| CN103367278A true CN103367278A (en) | 2013-10-23 |
| CN103367278B CN103367278B (en) | 2016-12-14 |
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| CN201210083103.XA Expired - Fee Related CN103367278B (en) | 2012-03-26 | 2012-03-26 | The three-dimensional stacked encapsulating structure of semiconductor device with the two-sided water-cooled of fixing device |
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104779228A (en) * | 2015-04-14 | 2015-07-15 | 天津大学 | Three-dimensional packaging structure and method for power semiconductor module |
| CN105772120A (en) * | 2016-03-07 | 2016-07-20 | 北京同方生物芯片技术有限公司 | Batched bonding packaging method for polymeric biochips and positioning device |
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|---|---|---|---|---|
| US6025642A (en) * | 1995-08-17 | 2000-02-15 | Staktek Corporation | Ultra high density integrated circuit packages |
| US20100133676A1 (en) * | 2007-03-30 | 2010-06-03 | Abb Technology Ltd. | A power semiconductor arrangement and a semiconductor valve provided therewith |
| CN102044527A (en) * | 2009-10-10 | 2011-05-04 | 三星半导体(中国)研究开发有限公司 | Overlapped packaging structure and manufacturing method thereof |
| CN102315184A (en) * | 2010-06-30 | 2012-01-11 | 株式会社电装 | Semiconductor device |
-
2012
- 2012-03-26 CN CN201210083103.XA patent/CN103367278B/en not_active Expired - Fee Related
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6025642A (en) * | 1995-08-17 | 2000-02-15 | Staktek Corporation | Ultra high density integrated circuit packages |
| US20100133676A1 (en) * | 2007-03-30 | 2010-06-03 | Abb Technology Ltd. | A power semiconductor arrangement and a semiconductor valve provided therewith |
| CN102044527A (en) * | 2009-10-10 | 2011-05-04 | 三星半导体(中国)研究开发有限公司 | Overlapped packaging structure and manufacturing method thereof |
| CN102315184A (en) * | 2010-06-30 | 2012-01-11 | 株式会社电装 | Semiconductor device |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104779228A (en) * | 2015-04-14 | 2015-07-15 | 天津大学 | Three-dimensional packaging structure and method for power semiconductor module |
| CN105772120A (en) * | 2016-03-07 | 2016-07-20 | 北京同方生物芯片技术有限公司 | Batched bonding packaging method for polymeric biochips and positioning device |
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| CN103367278B (en) | 2016-12-14 |
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| Date | Code | Title | Description |
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| C06 | Publication | ||
| PB01 | Publication | ||
| ASS | Succession or assignment of patent right |
Owner name: NANJING HAOSAIMI POWER TECHNOLOGY CO., LTD. Free format text: FORMER OWNER: WUHAN FINE MEMS INC. Effective date: 20141118 |
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| C41 | Transfer of patent application or patent right or utility model | ||
| COR | Change of bibliographic data |
Free format text: CORRECT: ADDRESS; FROM: 430074 WUHAN, HUBEI PROVINCE TO: 210000 NANJING, JIANGSU PROVINCE |
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| TA01 | Transfer of patent application right |
Effective date of registration: 20141118 Address after: 210000, Jiangsu, Nanjing province Zijin (Pukou) science and technology venture special community road, No. 99-173 middle Taiwan Applicant after: NANJING HIGHSEMI ELECTRIC POWER SCIENCE & TECHNOLOGY CO., LTD. Address before: 14 building, 7 building, Optics Valley Pioneer Street, East Lake Development Zone, Wuhan, Hubei, 430074 Applicant before: Wuhan FineMEMS Inc. |
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| C10 | Entry into substantive examination | ||
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| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20161214 Termination date: 20210326 |
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| CF01 | Termination of patent right due to non-payment of annual fee |