CN103361508A - High-performance copper alloy material for lead frame - Google Patents
High-performance copper alloy material for lead frame Download PDFInfo
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- CN103361508A CN103361508A CN 201210088316 CN201210088316A CN103361508A CN 103361508 A CN103361508 A CN 103361508A CN 201210088316 CN201210088316 CN 201210088316 CN 201210088316 A CN201210088316 A CN 201210088316A CN 103361508 A CN103361508 A CN 103361508A
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Abstract
The invention relates to a high-performance copper alloy material for preparing a lead frame in integrated circuit package. The material comprises the following components in percentage by weight: 0.8-3 percent of nickel, 0.1-4 percent of vanadium, 0.005-0.15 percent of magnesium, 0.03-0.5 percent of rare-earth element, and the balance of copper. The high-performance copper alloy material has the advantages that after the technical scheme is adopted, the following performance indexes through inspections are as follows: the mechanical performance at room temperature: sigma B is more than or equal to 305MPa, sigma 0.2 is more than or equal to 280MPa, and delta 5 is more than or equal to 10 percent; the mechanical performance at 350 DEG C: sigma b is more than or equal to 285MPa, sigma 0.2 is more than or equal to 220MPa, and delta 5 is more than or equal to 8 percent; and the electrical performance at 20 DEG C: rho is (2.9+/-0.1)mu omega.cm.
Description
Technical field
The present invention relates to the used for lead frame high-performance copper alloy material that a kind of manufacturing integration circuit package is used, belong to materials science field.
Background technology
Electronics and information industry is that the contemporary world technology is most advanced, the while also is a fastest industry of the technology innovation replacement.Along with large-scale integrated circuit, Internet of Things, cloud computing, mobile communication, the development of the industries such as led light source and rise, the research and development of high property copper alloy abnormity band will seem more and more important, Project Product is the key part of above-mentioned industry integrated antenna package, at present, the most of dependence on import of China, the urgent need that China's electronics and information industry is used the high-performance novel Cu alloy material has not only been satisfied in project implementation, alleviated the awkward present situation of the long-term dependence on import of this type of alloy of China, obtain simultaneously the target product with independent intellecture property, for substituting import one and the blank of filling up China's high-performance copper alloy material are done the contribution that makes new advances, fast-developing and squeeze into the international market and to play larger pushing effect to the electronics and information industry of China.
The circuit lead frame material of at present countries in the world employing is associated Jin Weizhu with copper iron phosphorus, the processing method that various countries adopt is different, take Japanese electric wire company as representative, mainly be the continuous rolling by serial concave roll, obtain the band finished product of special-shaped section.Take German company as representative, at first be to obtain the special-shaped strip blank with the milling method, and then roll out finished product with forming roll.Take French Griset company as representative, obtain the special-shaped strip blank with high-velocity forging, then by the rolling finished product that obtains of forming roll.And can not have a full house on a large scale or the performance requriements of super large-scale integration blaster fuse frame material aspect a lot of according to the Cu alloy material performance that above-mentioned materials makes.
Summary of the invention
The present invention is directed to defects, purpose is to provide a kind of used for lead frame high-performance copper alloy material of good combination property.
The technical solution used in the present invention is for this reason: the present invention includes following component: and the weight ratio of each component is: nickel 0.8-3%, vanadium 0.1-4%, magnesium 0.005-0.15%, rare earth element 0.03-0.5%, all the other are copper.
Describedly comprise following component: and the weight ratio of each component is: nickel 1-2%, vanadium 0.5-3%, magnesium 0.01-0.12%, rare earth element 0.08-0.3%, all the other are copper.
Described rare earth element is the combination of one or more in each element, the scandium element in each element, the actinium series in the group of the lanthanides.
The present invention also includes one or both in zirconium and the titanium.
Described zirconium and titanium account for the 0%-0.01% of gross weight.
Described rare earth element comprises lanthanum element and Ce elements, and its weight ratio is: lanthanum element: Ce elements=1:2-3.
Advantage of the present invention is: after adopting technique scheme, have after testing following performance index: room-temperature mechanical property: σ
b〉=305MPa σ
0.2〉=280MPa δ
5〉=10%; 350 ℃ of mechanical property: σ
b〉=285MPa σ
0.2〉=220MPa δ
5〉=8%; 20 ℃ of electric property: ρ are (2.9 ± 0.1) μ Ω cm.
Embodiment
Embodiment one:
The present invention includes following component: and the weight ratio of each component is: nickel 1%, vanadium 3%, magnesium 0.01%, rare earth element 0.3%, all the other are copper.
Described rare earth element is the combination of one or more in each element, the scandium element in each element, the actinium series in the group of the lanthanides.
The present invention also includes one or both in zirconium and the titanium.
Described zirconium and titanium account for 0.005% of gross weight.
Described rare earth element comprises lanthanum element and Ce elements, and its weight ratio is: lanthanum element: Ce elements=1:2.
Embodiment two:
The present invention includes following component: and the weight ratio of each component is: nickel 0.8%, vanadium 4%, magnesium 0.15%, rare earth element 0.03%, all the other are copper.
Rare earth element of the present invention is the combination of one or more in each element, the scandium element in each element, the actinium series in the group of the lanthanides.
The present invention also includes one or both in zirconium and the titanium, and described zirconium and titanium account for 0.01% of gross weight.
Described rare earth element comprises lanthanum element and Ce elements, and its weight ratio is: lanthanum element: Ce elements=1:3.
Embodiment three:
The present invention includes following component: and the weight ratio of each component is: nickel 3%, vanadium 0.1%, magnesium 0.005%, rare earth element 0.5%, all the other are copper.
Rare earth element of the present invention is the combination of one or more in each element, the scandium element in each element, the actinium series in the group of the lanthanides.
The present invention also includes one or both in zirconium and the titanium, and described zirconium and titanium account for 0.008% of gross weight.
Rare earth element of the present invention comprises lanthanum element and Ce elements, and its weight ratio is: lanthanum element: Ce elements=1:2.5.
Claims (6)
1. the used for lead frame high-performance copper alloy material is characterized in that, comprises following component: and the weight ratio of each component is: nickel 0.8-3%, vanadium 0.1-4%, magnesium 0.005-0.15%, rare earth element 0.03-0.5%, all the other are copper.
2. used for lead frame high-performance copper alloy material according to claim 1 is characterized in that, comprises following component: and the weight ratio of each component is: nickel 1-2%, vanadium 0.5-3%, magnesium 0.01-0.12%, rare earth element 0.08-0.3%, all the other are copper.
3. used for lead frame high-performance copper alloy material according to claim 1 is characterized in that, described rare earth element is the combination of one or more in each element, the scandium element in each element, the actinium series in the group of the lanthanides.
4. used for lead frame high-performance copper alloy material according to claim 1 is characterized in that, also includes in zirconium and the titanium one or both.
5. used for lead frame high-performance copper alloy material according to claim 4 is characterized in that, described zirconium and titanium account for the 0%-0.01% of gross weight.
6. used for lead frame high-performance copper alloy material according to claim 3 is characterized in that, described rare earth element comprises lanthanum element and Ce elements, and its weight ratio is: lanthanum element: Ce elements=1:2-3.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201210088316 CN103361508A (en) | 2012-03-30 | 2012-03-30 | High-performance copper alloy material for lead frame |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201210088316 CN103361508A (en) | 2012-03-30 | 2012-03-30 | High-performance copper alloy material for lead frame |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN103361508A true CN103361508A (en) | 2013-10-23 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN 201210088316 Pending CN103361508A (en) | 2012-03-30 | 2012-03-30 | High-performance copper alloy material for lead frame |
Country Status (1)
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| CN (1) | CN103361508A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105274389A (en) * | 2015-11-06 | 2016-01-27 | 广西南宁智翠科技咨询有限公司 | Low-resistance copper alloy wire |
| CN113755714A (en) * | 2021-06-22 | 2021-12-07 | 上海交通大学 | High-thermal-conductivity copper alloy suitable for casting process and preparation method thereof |
-
2012
- 2012-03-30 CN CN 201210088316 patent/CN103361508A/en active Pending
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105274389A (en) * | 2015-11-06 | 2016-01-27 | 广西南宁智翠科技咨询有限公司 | Low-resistance copper alloy wire |
| CN113755714A (en) * | 2021-06-22 | 2021-12-07 | 上海交通大学 | High-thermal-conductivity copper alloy suitable for casting process and preparation method thereof |
| CN113755714B (en) * | 2021-06-22 | 2022-08-19 | 上海交通大学 | High-thermal-conductivity copper alloy suitable for casting process and preparation method thereof |
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| PB01 | Publication | ||
| C02 | Deemed withdrawal of patent application after publication (patent law 2001) | ||
| WD01 | Invention patent application deemed withdrawn after publication |
Application publication date: 20131023 |